WO2012018123A1 - 異方導電性接着フィルムおよび硬化剤 - Google Patents
異方導電性接着フィルムおよび硬化剤 Download PDFInfo
- Publication number
- WO2012018123A1 WO2012018123A1 PCT/JP2011/067977 JP2011067977W WO2012018123A1 WO 2012018123 A1 WO2012018123 A1 WO 2012018123A1 JP 2011067977 W JP2011067977 W JP 2011067977W WO 2012018123 A1 WO2012018123 A1 WO 2012018123A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- adhesive film
- anisotropic conductive
- formula
- conductive adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Definitions
- the present invention relates to an anisotropic conductive adhesive film having excellent low-temperature connectivity and excellent peel strength reliability in electrical connection of fine patterns, a method for producing a connection structure using the same, and a curing agent.
- An anisotropic conductive adhesive film is a film in which conductive particles are dispersed in an insulating adhesive, in other words, connection between a liquid crystal display and an IC chip or TCP (Tape Carrier Package), FPC (Flexible Printed Circuit) and It is a connection member that is used to easily connect to TCP or FPC and printed wiring board. For example, it is widely used for connection between liquid crystal display of notebook personal computer or mobile phone and control IC. Recently, it is also used for flip chip mounting in which an IC chip is directly mounted on a printed circuit board or a flexible wiring board.
- An anisotropic conductive adhesive film is mainly made of a thermosetting binder resin from the viewpoint of connection reliability.
- An epoxy resin is mainly used as the curable resin, and tertiary amines or imidazoles which are anionic polymerization type curing agents are mainly used as the curing agent. Furthermore, it is known to enhance storage stability by macroencapsulating tertiary amines or imidazoles.
- a cationic curing agent has been proposed as a curing agent that can be cured at a lower temperature than such an anionic polymerization curing agent (Patent Document 1).
- a method (Patent Document 2) in which a stabilizer is blended in order to achieve both low-temperature curability and storage stability is known.
- Patent Documents 3 and 4 Furthermore, there has been proposed a method for reducing the influence of impurity ions by using an organic boron compound as a counter ion of a cationic curing agent in a cationic curable resin composition.
- the problem to be solved by the present invention is to provide a highly reliable anisotropic conductive adhesive film that is excellent in low-temperature connectivity and hardly deteriorates in peel strength in electrical connection between opposing wiring circuits. is there.
- Another object of the present invention is to provide a cationic curing agent having both storage stability and low temperature curability.
- an anisotropic conductive adhesive film having excellent low-temperature connectivity and peel strength reliability can be obtained by the following composition, and make the present invention. It came.
- the present invention is as follows.
- Q is a substituted or unsubstituted naphthylmethyl group, and the sum of Hammett constants of 1 to 5 substituents of A is ⁇ 0.3 to 0.
- Anisotropic conductive adhesive film is a substituted or unsubstituted naphthylmethyl group, and the sum of Hammett constants of 1 to 5 substituents of A is ⁇ 0.3 to 0.
- Q is a substituted or unsubstituted benzyl group, and the sum of Hammett constants of 1 to 5 substituents of A is 0 to +0.5.
- Direction conductive adhesive film is a substituted or unsubstituted benzyl group, and the sum of Hammett constants of 1 to 5 substituents of A is 0 to +0.5.
- A represents the general formula (4): ⁇ In Formula (4), R 1 is a methyl group, an acetyl group, a phenoxycarbonyl group, a benzyloxycarbonyl group, a benzoyl group or a 9-fluorenylcarbonyl group, and R 2 and R 3 are hydrogen, halogen, Or an alkyl group having 1 to 6 carbon atoms. ⁇ The anisotropic conductive adhesive film as described in [1] which is group represented by these.
- R 1 is an acetyl group, a phenoxycarbonyl group, a benzyloxycarbonyl group, or a benzoyl group
- R 2 and R 3 are hydrogen or a methyl group, Anisotropic conductive adhesive film.
- Q represents the general formula (3): ⁇ In Formula (3), R 5 is hydrogen, methyl, methoxy or halogen.
- R 5 is hydrogen, methyl, methoxy or halogen.
- connection structure including a step of heating and pressurizing a pair of electronic circuit boards having a corresponding electrode arrangement through the anisotropic conductive adhesive film according to any one of [1] to [13] Manufacturing method.
- An anisotropic conductive film comprising an organic binder having an epoxy group, a cation generator and conductive particles, wherein the epoxy group reaction rate at 80 ° C. for 10 seconds is less than 10%, and 140 ° C.
- the present invention has an effect that, in electrical connection between opposing circuits, the low-temperature connectivity is excellent and the peel strength is hardly lowered. Moreover, the cationic hardening
- an anisotropic conductive film including an organic binder having an epoxy group, a cation generator, and conductive particles, the epoxy group reaction rate at 80 ° C. for 10 seconds is less than 10%, and An anisotropic conductive adhesive film having an epoxy group reaction rate of 80% or more at 140 ° C. for 10 seconds.
- the epoxy group reaction rate at 80 ° C. for 10 seconds is preferably less than 10%, more preferably less than 5%, still more preferably less than 2%.
- the storage stability is good and it is difficult to be affected by heat at the time of temporary attachment to a circuit board.
- the epoxy group reaction rate at 140 ° C. for 10 seconds is preferably 80% or more, more preferably 85% or more, still more preferably 90% or more, and particularly preferably 95% or more.
- the epoxy group reaction rate at 140 ° C. for 10 seconds is 80% or more, the connection resistance value and the peel strength are good, and the reliability after connection is also stabilized.
- the epoxy group reaction rate can be measured by measuring the epoxy group absorbance ratio by the FT-IR method.
- One embodiment of the present invention is an organic binder containing a cationically polymerizable substance; 0.01 to 15 parts by mass of the general formula (1) with respect to 100 parts by mass of the organic binder containing the cationically polymerizable substance: ⁇ In Formula (1), A is a substituted phenyl group, Q is a substituted or unsubstituted naphthylmethyl group or a substituted or unsubstituted benzyl group, and R 4 is an alkyl group having 1 to 6 carbon atoms. , And Y ⁇ represents the general formula (2): [In Formula (2), X is respectively independently fluorine, chlorine, or bromine. ] An anion represented by ⁇ An anisotropic conductive adhesive film containing 0.1 to 20% by volume of conductive particles with respect to the total volume of the organic binder containing the cationic polymerizable substance.
- A is a phenyl group having 1 to 5 substituents, and the sum of Hammett constants of the 1 to 5 substituents is ⁇ 0.3 to 0, Q is preferably a substituted or unsubstituted naphthylmethyl group.
- A is a phenyl group having 1 to 5 substituents, and the sum of Hammett constants of the 1 to 5 substituents is 0 to +0.5, and Q is preferably a substituted or unsubstituted benzyl group.
- Hammett's rule is a 1935 L.S. method for discussing quantitatively the effect of substituents on the reaction or equilibrium of benzene derivatives.
- P. A rule of thumb proposed by Hammett which is widely accepted today.
- the Hammett constant determined by Hammett's rule includes a ⁇ p value and a ⁇ m value, and these values can be found in many general books. For example, J. et al. A. Dean ed., “Lange's Handbook of Chemistry”, 12th edition, 1979 (McGraw-Hill) or “Chemical Domain”, No. 122, pages 96-103, 1979 (Nankodo), Chem. Rev. 1991, Vol. 91, pages 165-195.
- each substituent is limited or explained by Hammett's substituent constant.
- each substituent is limited to only a substituent having a known value that can be found in the above-mentioned book. It is not to be understood that it should be understood that the values also include substituents that would fall within the range when measured according to Hammett's law, even though the values are not described in the literature.
- the Hammett constant When the Hammett constant is negative, it indicates that the substituent is an electron donating substituent.
- Q is a substituted or unsubstituted naphthylmethyl group, and the phenyl group substituent Hammett
- the sum of the Hammett constants is more preferably ⁇ 0.27 to 0, and even more preferably ⁇ 0.25 to 0.
- the Hammett constant When the Hammett constant is positive, it indicates that the substituent is an electron-withdrawing substituent.
- Q is a substituted or unsubstituted benzyl group, and the Hammett constant of the substituent of the phenyl group When the sum is 0 to +0.5, it is possible to achieve both good cation generation and appropriate storage stability.
- the sum of the Hammett constants is preferably 0 to +0.4, more preferably 0 to +0.35, and even more preferably 0 to +0.30.
- the sum of Hammett constants of these substituents is preferably in the range of ⁇ 0.2 to +0.2. It is more preferably in the range of ⁇ 0.15 to +0.15, and further preferably in the range of ⁇ 0.1 to +0.1. When it is in the range of ⁇ 0.2 to +0.2, it is preferable because both cation generation and storage stability can be achieved.
- One embodiment of the present invention is an organic binder containing a cationic polymerizable substance; 0.01 to 15 parts by mass of the following general formula (5) with respect to 100 parts by mass of the organic binder component containing the cationic polymerizable substance:
- R 1 represents a methyl group, an acetyl group, a phenoxycarbonyl group, a benzyloxycarbonyl group, a benzoyl group, or a 9-fluorenylcarbonyl group
- R 2 and R 3 represent hydrogen, halogen, or An alkyl group having 1 to 6 carbon atoms
- R 4 is an alkyl group having 1 to 6 carbon atoms
- Q is the following general formula (3):
- R 5 is hydrogen, methyl, methoxy or halogen
- Y ⁇ represents the following general formula (2): [In Formula (2),
- the cation generator used in the present invention may have any structure as long as it is represented by the above general formula (1) or (5), but generates a cation species at 50 ° C. or higher from the viewpoint of storage stability. Is preferred.
- the cation species generated by the thermal decomposition of the cation generator of the present invention may have any structure as long as the reactivity with the cationic polymerizable substance is sufficient, but benzyl cation species, ⁇ -naphthyl cation species, ⁇ -Naphthyl cation species or acyl cation species are preferred. From the viewpoint of connection formation, it is preferable that at least one species is an acyl cation species. Furthermore, it is particularly preferable that the cation species to be generated are at least two or more containing an acyl cation species.
- the counter anion of the cation generator may have the structure of the formula (2), but a fluorine compound is particularly preferable from the viewpoint of impurity ions.
- the content of the cation generator in the anisotropic conductive adhesive film of the present invention is 0.01 to 15 parts by mass, preferably 0.5 to 100 parts by mass with respect to 100 parts by mass of the organic binder containing the cationic polymerizable substance. 5 parts by mass.
- the content of the cation generator is less than 0.01 parts by mass, the curing becomes insufficient, sufficient electrical connectivity cannot be obtained, and when the content of the cation generator exceeds 15 parts by mass, storage is performed. Sex is reduced.
- the cation scavenger used in the present invention may have any structure as long as it reacts with a cation species generated by thermal decomposition of the cation generator, but a thiourea compound, 4-alkylthiophenol compound, and 4-hydroxy One or more selected from the group consisting of phenyl-dialkylsulfonium salts are preferred.
- Examples of the cation scavenger are shown below.
- Examples of the thiourea compound include ethylene thiourea, N, N′-dibutylthiourea, and trimethylthiourea.
- Examples of the 4-alkylthiophenol compound include 4-methylthiophenol, 4-ethylthiophenol, 4-butylthiophenol and the like.
- Examples of the 4-hydroxyphenyldialkylsulfonium salt include 4-hydroxyphenyldimethylsulfonium methyl sulfate, 4-hydroxyphenyl-dibutylsulfonium methyl sulfate, and the like.
- the content of the cation scavenger in the anisotropic conductive adhesive film of the present invention is 0.1 to 20 parts by mass with respect to 100 parts by mass of the cation generator.
- the content of the cation scavenger is 0.5 to 10 parts by mass with respect to 100 parts by mass of the cation generator.
- the content of the cation scavenger is less than 0.1 parts by mass, the connection reliability is lowered, and when it exceeds 20 parts by mass, the connectivity is lowered.
- the conductive particles contained in the anisotropic conductive adhesive film of the present invention is 0.1 to 20% by volume, preferably 0.5 to 15% by volume, based on the total volume of the organic binder. Preferably, it is 1 to 10% by volume.
- the conductive particles are metal particles such as gold, silver, copper, nickel, silver, lead, tin, or alloys made thereof, such as particles such as solder and silver-copper alloys, conductive particles such as carbon, and conductive materials thereof.
- the surface is coated with a conductive material using glass, ceramics, or plastic particles, which are conductive particles or non-conductive particles, as nuclei. Particles obtained by metal plating on plastic particles are particularly preferable because they have excellent connection reliability due to elastic deformation.
- Plastic particles include epoxy resin, styrene resin, silicone resin, acrylic resin, polyolefin resin, melamine resin, benzoguanamine resin, urethane resin, phenol resin, polyester resin, crosslinked divinylbenzene, NBR, SBR, and other polymers. Species or a combination of two or more nuclei can be used. These plastic particles may contain an inorganic substance such as silicon oxide. By forming Ni plating on these plastic particles by a method such as electroless plating, conductive particles can be obtained, and it is also possible to form a metal layer other than Ni such as gold on the Ni plating. .
- the surface of the core is coated with an insulating material, and when pressed, the internal conductive particles eliminate the insulating layer on the surface and allow contact with the connected circuit. It is valid. When such conductive particles are used, it is easy to prevent a short circuit between adjacent terminals, and it can also be used in the case of a connected circuit having a narrow terminal interval.
- the particle size of the conductive particles is preferably from 0.1 to 20 ⁇ m, more preferably from 1 to 10 ⁇ m, and even more preferably from 2 to 8 ⁇ m. If the particle size is less than 0.1 ⁇ m, the connection is likely to be unstable due to variations in the surface roughness of the connected terminals, and if it exceeds 20 ⁇ m, a short circuit between adjacent terminals is likely to occur.
- the standard deviation of the average particle diameter of the conductive particles is preferably as small as possible, preferably 50% or less of the average particle diameter, more preferably 20% or less, still more preferably 10% or less, and particularly preferably 5% or less.
- a known method such as a Coulter counter can be used for the measurement of the average particle diameter of the conductive particles.
- insulating particles may be used in combination as long as the connection resistance is not impaired.
- the conductive particles may be localized in the thickness direction of the anisotropic conductive adhesive film by a method of laminating a plurality of layers.
- a known method can be used, but a solvent evaporation method, a spray drying method, a coacervation method, and an interfacial polymerization method are preferably used.
- the cationically polymerizable substance in the organic binder component is an acid polymerizable or acid curable substance, such as an epoxy resin, polyvinyl ether, or polystyrene.
- the cationic polymerizable substance may be used alone or in combination of two or more.
- an epoxy resin is preferable.
- the epoxy resin is preferably a compound having two or more epoxy groups in one molecule. Specifically, a compound having a glycidyl ether group, a glycidyl ester group or an alicyclic epoxy group, a compound obtained by epoxidizing a double bond in the molecule, or a compound having two or more of these substituents is more preferable. Furthermore, a resorcinol type epoxy resin may be used to improve environmental resistance.
- the organic binder component is composed of a binder resin and a cationic polymerizable substance
- the binder resin that can be mixed with the cationic polymerizable substance is a thermoplastic resin, a thermosetting resin reactive with an epoxy resin, or the like.
- Thermoplastic resins that can be mixed with cationically polymerizable substances are compatible with cationically polymerizable substances such as phenoxy resin, polyvinyl acetal resin, polyvinyl butyral resin, alkylated cellulose resin, polyester resin, acrylic resin, urethane resin, and polyethylene terephthalate resin. It is resin with.
- a resin having a polar group such as a hydroxyl group or a carboxyl group is preferable because of excellent compatibility with the cationic polymerizable resin.
- the cationically polymerizable substance functions as an organic binder component together with the binder resin after being polymerized or cured by a cation.
- the organic binder component used in the present invention can further contain other components.
- other components include insulating particles, fillers, softeners, accelerators, anti-aging agents, colorants, flame retardants, thixotropic agents, coupling agents, and ion trapping agents.
- these maximum diameters are preferably less than the average particle diameter of the conductive particles.
- the coupling agent a ketimine group, vinyl group, acrylic group, amino group, epoxy group, or isocyanate group-containing silane coupling agent is preferable from the viewpoint of improving adhesiveness.
- the content of other components is preferably 50 parts by mass or less, more preferably 20% by mass or less, relative to the organic binder component.
- a solvent When mixing an organic binder and components such as a cation generator, a cation scavenger and conductive particles, a solvent can be used as necessary.
- the solvent include methyl ethyl ketone, methyl isobutyl ketone, toluene, xylene, ethyl acetate, butyl acetate, ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, and the like.
- the anisotropic conductive adhesive film of the present invention may be a single layer film or a film in which a plurality of films are laminated. When laminating a plurality of films, it is also possible to laminate films that do not contain conductive particles.
- a coating liquid is prepared by previously mixing conductive particles, a cation generator, an organic binder, and, if necessary, a cation scavenger in a solvent, and then a separator. It can be produced by applying the coating liquid on the top by applicator coating or the like and volatilizing the solvent in an oven.
- a laminating method is preferable.
- a method of laminating using a heat roll is exemplified.
- the temperature of the hot roll is preferably lower than the temperature at which the cation generator generates cationic species.
- separator used for the anisotropic conductive adhesive film examples include films of polyethylene, polypropylene, polystyrene, polyester, PET, PEN, nylon, vinyl chloride, polyvinyl alcohol, and the like.
- Preferred resins for the protective film include polypropylene and PET.
- the separator is preferably subjected to surface treatment such as fluorine treatment, Si treatment or alkyd treatment.
- the film thickness of the separator is preferably 20 ⁇ m or more and 100 ⁇ m or less.
- the anisotropic conductive adhesive film of the present invention is slit to a desired width and wound in a reel shape as necessary.
- the anisotropic conductive adhesive film of the present invention can be suitably used for connection between a liquid crystal display and TCP, TCP and FPC, FPC and printed wiring board, or flip chip mounting in which an IC chip is directly mounted on a substrate.
- a manufacturing method of a connection structure using an anisotropic conductive adhesive film includes a step of heating and pressurizing a pair of electronic circuit boards having a corresponding electrode arrangement through the anisotropic conductive adhesive film of the present invention.
- a circuit board such as a glass substrate in which a circuit and an electrode are formed by ITO wiring or metal wiring or the like, and a position where the electrode of the circuit board is paired
- a circuit member such as an IC chip on which electrodes are formed is prepared, and the anisotropic conductive adhesive film of the present invention is attached to a position where the circuit member is arranged on the circuit board, and then the circuit board and the circuit member are respectively attached.
- the electrodes may be connected by thermocompression bonding after aligning the positions of the electrodes so as to form a pair.
- the heating and pressing conditions are preferably, for example, heating and pressing at a temperature of 30 ° C. to 80 ° C. and a pressure of 0.1 MPa to 1 MPa for 0.5 seconds to 3 seconds.
- thermocompression bonding is performed at a temperature range of 120 ° C. or higher and 180 ° C. or lower (more preferably 130 ° C. or higher and 170 ° C. or lower, most preferably 140 ° C. or higher and 160 ° C. or lower). It is preferable to heat and pressurize in the pressure range below (more preferably 0.5 MPa to 40 MPa) for 3 seconds to 15 seconds (more preferably 4 seconds to 12 seconds).
- the temperature difference is more preferably 100 ° C. or less, and even more preferably 70 ° C. or less.
- the temperature difference between the substrates can be measured by placing thermocouples on the opposing connection substrates.
- Example 1 30 g of alicyclic epoxy resin composed of 1,2,3,4-butanetetracarboxylic acid and 3-cyclohexaneoxide-1-methanol ester, 15 g of bisphenol A liquid epoxy resin, 3,4-epoxycyclohexylmethyl-3, 5 g of 4-epoxycyclohexanecarboxylate and 50 g of phenoxy resin having an average molecular weight of 25,000 were dissolved in a mixed solvent of toluene-ethyl acetate (1 to 1) to obtain a solution having a solid content of 50%.
- the resin component 100 in terms of solid mass ratio, 4-benzyloxycarbonyloxyphenyl-o-methylbenzylmethylsulfonium, tetrakis (pentafluorophenyl) borate and N, N′-diethylthiourea were added so that the total was 2, and benzoguanamine
- Example 2 Aside from using 4-acetyloxyphenyl-benzyl-methylsulfonium tetrakis (pentafluorophenyl) borate in place of 4-benzyloxycarbonyloxyphenyl-o-methylbenzylmethylsulfonium tetrakis (pentafluorophenyl) borate in Example 1 Obtained an anisotropic conductive film in the same manner as in Example 1.
- Example 3 Instead of 4-benzyloxycarbonyloxyphenyl-o-methylbenzylmethylsulfonium tetrakis (pentafluorophenyl) borate in Example 1, 4-benzoyloxyphenyl-o-methylbenzyl-methylsulfonium tetrakis (pentafluorophenyl) borate was used. An anisotropic conductive film was obtained in the same manner as in Example 1 except that it was used.
- Example 4 Instead of 4-benzyloxycarbonyloxyphenyl-o-methylbenzylmethylsulfonium tetrakis (pentafluorophenyl) borate in Example 1, 4-phenoxycarbonyloxyphenyl-benzyl-methylsulfonium tetrakis (pentafluorophenyl) borate was used. Except for the above, an anisotropic conductive film was obtained in the same manner as in Example 1.
- Example 5 Instead of 4-benzyloxycarbonyloxyphenyl-o-methylbenzyl-methylsulfonium tetrakis (pentafluorophenyl) borate in Example 1, 4-methoxyphenyl- ⁇ -naphthylmethylmethylsulfonium tetrakis (pentafluorophenyl) borate is used. Then, an anisotropic conductive film was obtained in the same manner as in Example 1 except that 4-hydroxyphenyldimethylsulfonium methyl sulfate was used in place of N, N′-diethylthiourea.
- Example 6 In place of 4-benzyloxycarbonyloxyphenyl-o-methylbenzyl-methylsulfonium tetrakis (pentafluorophenyl) borate in Example 1, 4-acetyloxyphenylbenzylmethylsulfonium tetrakis (pentafluorophenyl) borate was used, and bisphenol was used. An anisotropic conductive film was obtained in the same manner as in Example 1 except that 15 g of resorcin type epoxy resin was used instead of 15 g of A type liquid epoxy resin.
- Example 7 4-acetyloxy 2-methylphenylbenzylmethylsulfonium tetrakis (pentafluorophenyl) borate was used in place of 4-benzyloxycarbonyloxyphenyl-o-methylbenzyl-methylsulfonium tetrakis (pentafluorophenyl) borate in Example 1
- An anisotropic conductive film was obtained in the same manner as in Example 1 except that.
- An anisotropic conductive film with a width of 2 mm is temporarily pasted on a polycarbonate film substrate (surface resistance 200 ⁇ / sq) with a thickness of 200 ⁇ m on which an indium oxide-zinc oxide (IZO) thin film is formed on the entire surface, and a 2.5 mm width crimping head After pressing at 50 ° C., 0.3 MPa and 3 seconds, the polyethylene terephthalate base film is peeled off.
- IZO indium oxide-zinc oxide
- a flexible printed wiring board (material polyimide resin, thickness 25 ⁇ m) having 200 circuits composed of gold-plated copper wiring (gold plating thickness 0.3 ⁇ m) having a wiring width of 80 ⁇ m, a wiring pitch of 150 ⁇ m and a thickness of 18 ⁇ m was temporarily connected to the peeling surface. Thereafter, pressure is applied by pressure at 130 ° C., 8 seconds, and 0.9 MPa using a 1.5 mm wide pressure bonding head. After crimping, the resistance value between adjacent terminals is measured with a four-terminal resistance meter to obtain the connection resistance value.
- the pressure-bonded flexible printed wiring board is cut into a width of 10 mm, and the 90 ° peel strength is measured using an Instron. The pulling speed was 50 mm / min. The measured value is the peel strength. Judgment criteria are shown below. ⁇ : The peel strength is 700 g / cm or more ⁇ : The peel strength is 500 g / cm or more and less than 700 g / cm ⁇ : The peel strength is less than 500 g / cm
- the pressure-bonded printed wiring board is held at 85 ° C. and 85% relative humidity for 100 hours, and then subjected to a cycle test ( ⁇ 40 ° C., 100 ° C., 30 minutes each, 1 hour 1 cycle) for 100 cycles, and then 25 After leaving at 1 ° C. for 1 hour, the peel strength is measured.
- the criteria for environmental resistance are shown below.
- the peel strength is 70% or more of the initial value
- ⁇ The peel strength is 50% or more and less than 70% of the initial value
- ⁇ The peel strength is less than 50% of the initial value
- the anisotropic conductive film is put in a sealed container and stored at 25 ° C. for 2 weeks, and then the peel strength is measured.
- the criteria for storage stability are shown below.
- the peel strength is 70% or more of the initial value
- ⁇ The peel strength is 50% or more and less than 70% of the initial value
- ⁇ The peel strength is less than 50% of the initial value
- reaction rate measurement The epoxy group reaction rate is measured by the epoxy group absorbance ratio by the FT-IR method.
- a 2 mm wide, 20 mm long anisotropic conductive adhesive film formed on a film substrate is sandwiched between 30 ⁇ m thick Teflon (registered trademark) tapes, and a pressure heating head with a width of 2.5 mm is used for 10 seconds, 0.
- a sample pressed at 3 MPa is prepared.
- FT-IR measurement is performed before and after pressure bonding, and the epoxy group reaction rate is calculated from the absorbance ratio before and after pressure bonding.
- the methyl group absorption intensity is used as an internal standard, and the reaction rate is calculated by the following formula.
- Reaction rate (%) (1 ⁇ ((a / b) / (A / B))) ⁇ 100
- Table 2 shows the sum of Hammett constants of the substituents of the phenyl group in the above formula (1).
- the examples using the present invention have a lower decrease in peel strength after storage and a lower decrease in peel strength after the environmental resistance test than in the comparative example, and good connection resistance. Show.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
該カチオン重合性物質を含む有機バインダー100質量部に対して、0.01~15質量部の一般式(1):
該カチオン重合性物質を含む有機バインダーの全体積に対して、0.1~20体積%の導電性粒子;
を含む異方導電性接着フィルム。
該カチオン重合性物質を含む有機バインダーの全体積に対して、0.1~20体積%の導電性粒子を含む異方導電性接着フィルムである。
本発明に用いるカチオン発生剤は、上記一般式(1)または(5)で示されるものであれば、いかなる構造でもよいが、保存安定性の点から、50℃以上でカチオン種を発生するものが好ましい。
本発明に用いるカチオン捕捉剤は、カチオン発生剤の熱分解により発生するカチオン種と反応するものであれば、いかなる構造のものでもよいが、チオ尿素化合物、4-アルキルチオフェノール化合物、及び4-ヒドロキシフェニル-ジアルキルスルホニウム塩から成る群から選択される1種以上であることが好ましい。
本発明の異方導電性接着フィルムに含まれる導電性粒子は、有機バインダーの全体積に対して、0.1~20体積%であり、好ましくは、0.5~15体積%であり、更に好ましくは、1~10体積%である。導電性粒子の含有量が、20体積%を超える場合は、隣接する端子間の絶縁性が不十分になり、0.1体積%未満である場合は、接続性が低下する。導電性粒子は、金、銀、銅、ニッケル、銀、鉛、錫などの金属粒子、またはそれらから成る合金、例えば、はんだ、銀銅合金等の粒子、カーボンなどの導電性粒子、それらの導電性粒子または非導電性粒子であるガラス、セラミックス、プラスティック粒子を核として表面に導電性材料を被覆したものである。プラスティック粒子に金属めっきした粒子は弾性変形により接続信頼性に優れるため、特に好ましい。
有機バインダー成分中のカチオン重合性物質は、酸重合性、または、酸硬化性の物質であり、例えば、エポキシ樹脂、ポリビニルエーテル、ポリスチレンなどである。前記カチオン重合性物質は、単独で使用するか、又は2種以上併用してもよい。
本発明に用いられる有機バインダー成分には、更に、その他の成分を含有することができる。その他の成分としては、絶縁粒子、充填剤、軟化剤、促進剤、老化防止剤、着色剤、難燃化剤、チキソトロピック剤、カップリング剤、イオントラップ剤等が挙げられる。絶縁粒子及び充填剤等の固形の成分の場合、これらの最大径は導電性粒子の平均粒径未満であることが好ましい。カップリング剤としては、ケチミン基、ビニル基、アクリル基、アミノ基、エポキシ基又はイソシアネート基含有シランカップリング剤が、接着性の向上の点から好ましい。
本発明の異方導電性接着フィルムは、単層のフィルムであっても、複数のフィルムを積層したフィルムであってもよい。複数のフィルムを積層する場合、導電性粒子を含まないフィルムを積層することも可能である。
異方導電性接着フィルムを用いた接続構造体の製造方法は、対応する電極配置を有する一対の電子回路基板を本発明の異方導電性接着フィルムを介して加熱及び加圧する工程を含む。例えば、本発明の異方導電性接着フィルムを用いた接続方法としては、ITO配線又は金属配線等によって回路と電極を形成したガラス基板等の回路基板と、回路基板の電極と対を成す位置に電極を形成したICチップ等の回路部材とを準備し、回路基板上の回路部材を配置する位置に、本発明の異方導電性接着フィルムを貼り付け、次に、回路基板と回路部材をそれぞれの電極が互いに対を成すように位置を合わせた後、熱圧着して接続する方法が挙げられる。
各基板の温度差は、相対する接続基板上にそれぞれ熱電対を乗せて測定することができる。
1,2,3,4-ブタンテトラカルボン酸と3-シクロヘキサンオキシド-1―メタノールのエステルから成る脂環式エポキシ樹脂30g、ビスフェノールA型液状エポキシ樹脂15g、3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキサンカルボキシレート5g、平均分子量25,000のフェノキシ樹脂50gをトルエン-酢酸エチルの混合溶剤(1対1)に溶解し、固形分50%の溶液を得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-アセチルオキシフェニル-ベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用した以外は、実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-ベンゾイルオキシフェニル-o-メチルベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用した以外は、実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-フェノキシカルボニルオキシフェニル-ベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用した以外は、実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-メトキシフェニル-β-ナフチルメチルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用し、N,N’-ジエチルチオ尿素に換えて、4-ヒドロキシフェニルジメチルスルホニウム メチルサルフェートを使用した以外は、実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-アセチルオキシフェニルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用し、ビスフェノールA型液状エポキシ樹脂15gに換えて、レゾルシン型エポキシ樹脂15gを使用した以外は、実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-アセチルオキシ2-メチルフェニルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用した以外は、実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、p-ヒドロキシフェニル-ベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用し、N,N’-ジエチルチオ尿素を配合しないこと以外は実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-メトキシカルボニルオキシフェニル-ベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用し、N,N’-ジエチルチオ尿素を配合しないこと以外は実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジルメチルスルホニウム ヘキサフルオロホスフェートを使用した以外は実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-ヒドロキシフェニル-α-ナフチルメチル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用した以外は、実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-アセチルオキシフェニル-α-ナフチルメチル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートを使用した以外は、実施例1と同様にして異方導電性フィルムを得た。
実施例1の4-ベンジルオキシカルボニルオキシフェニル-o-メチルベンジルメチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートに換えて、4-シアノフェニル-ベンジル-メチルスルホニウム テトラキス(ペンタフルオロフェニル)ボレートとした以外は、実施例1と同様にして異方導電性フィルムを得た。
全面に酸化インジウム-酸化亜鉛(IZO)の薄膜を形成した厚み200μmのポリカーボネートフィルム基板(表面抵抗200Ω/sq)上に幅2mmの異方導電性フィルムを仮貼りし、2.5mm幅の圧着ヘッドを用いて50℃、0.3MPa及び3秒間で加圧した後、ポリエチレンテレフタレートのベースフィルムを剥離する。剥離面へ、配線幅80μm、配線ピッチ150μm及び厚み18μmの金めっき銅配線(金めっき厚み0.3μm)から成る回路200本を有するフレキシブルプリント配線板(材質ポリイミド樹脂、厚み25μm)を仮接続した後、1.5mm幅の圧着ヘッドを用いて、130℃、8秒及び0.9MPaで加圧して圧着する。圧着後、隣接端子間の抵抗値を四端子法の抵抗計で測定し、接続抵抗値とする。
圧着したフレキシブルプリント配線板を幅10mmに切断し、インストロンを用いて90°ピール強度を測定する。引っ張り速度50mm/分で行った。測定値を剥離強度とする。判定基準を以下に示す。
α:剥離強度が700g/cm以上のもの
β:剥離強度が500g/cm以上700g/cm未満のもの
γ:剥離強度が500g/cm未満のもの
圧着したプリント配線板を85℃及び85%相対湿度の環境下で100時間保持し、次いで、サイクル試験(-40℃、100℃、各30分、1サイクル1時間)100サイクルを行い、その後25℃で1時間放置後、前記剥離強度を測定する。
耐環境性の判定基準を以下に示す。
α:剥離強度が初期値の70%以上であるもの
β:剥離強度が初期値の50%以上70%未満であるもの
γ:剥離強度が初期値の50%未満であるもの
異方導電性フィルムを密閉容器に入れ、25℃で2週間保存した後、前記剥離強度を測定する。保存安定性の判定基準を以下に示す。
α:剥離強度が初期値の70%以上であるもの
β:剥離強度が初期値の50%以上70%未満であるもの
γ:剥離強度が初期値の50%未満であるもの
エポキシ基反応率の測定は、エポキシ基吸光度比をFT-IR法により測定する。フィルム基材上に形成された2mm幅、20mm長の異方導電性接着フィルムを30μm厚みのテフロン(登録商標)テープに挟み込み、幅2.5mmの加圧加熱ヘッドを用いて10秒、0.3MPaで圧着したサンプルを作製する。圧着前後のFT-IR測定を行い、圧着前後の吸光度比よりエポキシ基反応率を算出する。エポキシ基の吸光度比の算出方法は、内部標準としてメチル基吸収強度を用い、以下の計算式で反応率を算出する。
A:圧着前のエポキシ基吸収強度
B:圧着前のメチル基吸収強度
a:圧着後のエポキシ基吸収強度
b:圧着後のメチル基吸収強度
α:80%以上であるもの
β:50%以上80%未満であるもの
γ:50%未満であるもの
α:10%未満であるもの
β:10%以上20%未満であるもの
γ:20%以上であるもの
Claims (17)
- カチオン重合性物質を含む有機バインダー;
該カチオン重合性物質を含む有機バインダー100質量部に対して、0.01~15質量部の一般式(1):
該カチオン重合性物質を含む有機バインダーの全体積に対して、0.1~20体積%の導電性粒子;
を含む異方導電性接着フィルム。 - 式(1)において、Qは置換若しくは無置換ナフチルメチル基であり、Aの1~5個の置換基のハメット定数の和は-0.3~0である、請求項1に記載の異方導電性接着フィルム。
- 式(1)において、Qは置換若しくは無置換ベンジル基であり、Aの1~5個の置換基のハメット定数の和は0~+0.5である、請求項1に記載の異方導電性接着フィルム。
- 式(4)において、R1は、アセチル基、フェノキシカルボニル基、ベンジルオキシカルボニル基又はベンゾイル基であり、そしてR2及びR3は水素又はメチル基である、請求項4に記載の異方導電性接着フィルム。
- 式(3)においてR5は水素又はメチル基である、請求項6に記載の異方導電性接着フィルム。
- 式(1)においてR4はメチル基である、請求項6または7に記載の異方導電性接着フィルム。
- 式(2)においてXはフッ素である、請求項6~8のいずれか1項に記載の異方導電性接着フィルム。
- 前記カチオン発生剤より発生するカチオン種と反応するカチオン捕捉剤を前記カチオン発生剤の100質量部に対して0.1~20質量部含む、請求項1~5のいずれか1項に記載の異方導電性接着フィルム。
- 前記カチオン捕捉剤は、チオ尿素化合物、4-アルキルチオフェノール化合物及び4-ヒドロキシフェニル-ジアルキルスルホニウム塩から成る群から選択される1種以上である、請求項10に記載の異方導電性接着フィルム。
- 前記カチオン発生剤より発生するカチオン種が、少なくとも2種以上である、請求項1~5のいずれか1項に記載の異方導電性接着フィルム。
- 前記有機バインダーはレゾルシン型エポキシ樹脂を含む、請求項1~5のいずれか1項に記載の異方導電性接着フィルム。
- 対応する電極配置を有する一対の電子回路基板を請求項1~5のいずれか1項に記載の異方導電性接着フィルムを介して加熱及び加圧する工程を含む、接続構造体の製造方法。
- 請求項14に記載の製造方法により得られた接続構造体。
- エポキシ基を有する有機バインダー、カチオン発生剤及び導電性粒子を含む異方導電性フィルムであって、80℃、10秒でのエポキシ基反応率が10%未満であり、かつ140℃、10秒でのエポキシ基反応率が80%以上である異方導電性接着フィルム。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180038913.7A CN103081236B (zh) | 2010-08-06 | 2011-08-05 | 各向异性导电性粘接膜及固化剂 |
KR1020137001516A KR101456396B1 (ko) | 2010-08-06 | 2011-08-05 | 이방 도전성 접착 필름 및 경화제 |
JP2012527790A JP5373973B2 (ja) | 2010-08-06 | 2011-08-05 | 異方導電性接着フィルムおよび硬化剤 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-176883 | 2010-08-06 | ||
JP2010176883 | 2010-08-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012018123A1 true WO2012018123A1 (ja) | 2012-02-09 |
Family
ID=45559618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/067977 WO2012018123A1 (ja) | 2010-08-06 | 2011-08-05 | 異方導電性接着フィルムおよび硬化剤 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5373973B2 (ja) |
KR (1) | KR101456396B1 (ja) |
CN (1) | CN103081236B (ja) |
TW (1) | TWI424041B (ja) |
WO (1) | WO2012018123A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013229314A (ja) * | 2012-03-30 | 2013-11-07 | Sekisui Chem Co Ltd | 導電材料、接続構造体及び接続構造体の製造方法 |
JP2014031451A (ja) * | 2012-08-03 | 2014-02-20 | Asahi Kasei E-Materials Corp | 熱カチオン発生剤組成物、熱硬化性組成物、及び異方導電性接続材料 |
JP2015164103A (ja) * | 2014-02-28 | 2015-09-10 | 住友金属鉱山株式会社 | 積層セラミックコンデンサ内部電極用導電性ペーストおよびその製造方法、ならびに、積層セラミックコンデンサ |
JPWO2015046333A1 (ja) * | 2013-09-27 | 2017-03-09 | 株式会社ダイセル | 半導体積層用接着剤組成物 |
US10189781B2 (en) | 2013-09-25 | 2019-01-29 | Asahi Kasei E-Materials Corporation | Onium salt and composition comprising the same |
US10964440B2 (en) | 2016-02-22 | 2021-03-30 | Dexerials Corporation | Anisotropic conductive film |
KR20220058949A (ko) | 2019-12-13 | 2022-05-10 | 데쿠세리아루즈 가부시키가이샤 | 접착제 조성물, 접착 필름 및 접속 구조체 |
KR20230153475A (ko) | 2021-06-03 | 2023-11-06 | 데쿠세리아루즈 가부시키가이샤 | 접착제 조성물, 접착 필름, 접속 구조체 및 접속 구조체의 제조 방법 |
KR20240010091A (ko) | 2016-02-22 | 2024-01-23 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101712703B1 (ko) * | 2014-07-18 | 2017-03-06 | 삼성에스디아이 주식회사 | 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000336109A (ja) * | 1999-05-26 | 2000-12-05 | Nippon Soda Co Ltd | 触媒組成物及び硬化性組成物 |
JP2002161146A (ja) * | 2000-11-24 | 2002-06-04 | Asahi Kasei Corp | 異方導電性フィルム |
JP2010132614A (ja) * | 2008-12-05 | 2010-06-17 | Sony Chemical & Information Device Corp | 新規なスルホニウムボレート錯体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100483565B1 (ko) * | 1999-02-08 | 2005-04-15 | 히다치 가세고교 가부시끼가이샤 | 회로접속재료 |
JP2002363506A (ja) * | 2001-05-29 | 2002-12-18 | Three M Innovative Properties Co | 紫外線活性化型接着フィルム |
TWI327151B (en) * | 2002-12-17 | 2010-07-11 | Sony Chemicals Corp | Processes for producing resin particles and anisotropically electroconductive adhesive |
KR100662175B1 (ko) * | 2004-12-31 | 2006-12-27 | 제일모직주식회사 | 옥세탄 화합물을 함유하는 이방 도전성 접착재료 |
JP2008303167A (ja) * | 2007-06-07 | 2008-12-18 | Sony Chemical & Information Device Corp | 新規なスルホニウムボレート錯体 |
JP5533568B2 (ja) * | 2009-11-05 | 2014-06-25 | 日立化成株式会社 | 熱重合系開始剤システム及び接着剤組成物 |
-
2011
- 2011-08-05 KR KR1020137001516A patent/KR101456396B1/ko not_active IP Right Cessation
- 2011-08-05 JP JP2012527790A patent/JP5373973B2/ja not_active Expired - Fee Related
- 2011-08-05 WO PCT/JP2011/067977 patent/WO2012018123A1/ja active Application Filing
- 2011-08-05 CN CN201180038913.7A patent/CN103081236B/zh not_active Expired - Fee Related
- 2011-08-05 TW TW100128063A patent/TWI424041B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000336109A (ja) * | 1999-05-26 | 2000-12-05 | Nippon Soda Co Ltd | 触媒組成物及び硬化性組成物 |
JP2002161146A (ja) * | 2000-11-24 | 2002-06-04 | Asahi Kasei Corp | 異方導電性フィルム |
JP2010132614A (ja) * | 2008-12-05 | 2010-06-17 | Sony Chemical & Information Device Corp | 新規なスルホニウムボレート錯体 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013229314A (ja) * | 2012-03-30 | 2013-11-07 | Sekisui Chem Co Ltd | 導電材料、接続構造体及び接続構造体の製造方法 |
JP2014031451A (ja) * | 2012-08-03 | 2014-02-20 | Asahi Kasei E-Materials Corp | 熱カチオン発生剤組成物、熱硬化性組成物、及び異方導電性接続材料 |
US10189781B2 (en) | 2013-09-25 | 2019-01-29 | Asahi Kasei E-Materials Corporation | Onium salt and composition comprising the same |
JPWO2015046333A1 (ja) * | 2013-09-27 | 2017-03-09 | 株式会社ダイセル | 半導体積層用接着剤組成物 |
US10047257B2 (en) | 2013-09-27 | 2018-08-14 | Daicel Corporation | Adhesive agent composition for multilayer semiconductor |
JP2015164103A (ja) * | 2014-02-28 | 2015-09-10 | 住友金属鉱山株式会社 | 積層セラミックコンデンサ内部電極用導電性ペーストおよびその製造方法、ならびに、積層セラミックコンデンサ |
US10964440B2 (en) | 2016-02-22 | 2021-03-30 | Dexerials Corporation | Anisotropic conductive film |
KR20240010091A (ko) | 2016-02-22 | 2024-01-23 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 |
KR20220058949A (ko) | 2019-12-13 | 2022-05-10 | 데쿠세리아루즈 가부시키가이샤 | 접착제 조성물, 접착 필름 및 접속 구조체 |
KR20230153475A (ko) | 2021-06-03 | 2023-11-06 | 데쿠세리아루즈 가부시키가이샤 | 접착제 조성물, 접착 필름, 접속 구조체 및 접속 구조체의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN103081236A (zh) | 2013-05-01 |
TW201217481A (en) | 2012-05-01 |
TWI424041B (zh) | 2014-01-21 |
CN103081236B (zh) | 2016-03-09 |
KR20130041121A (ko) | 2013-04-24 |
JP5373973B2 (ja) | 2013-12-18 |
JPWO2012018123A1 (ja) | 2013-10-28 |
KR101456396B1 (ko) | 2014-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5373973B2 (ja) | 異方導電性接着フィルムおよび硬化剤 | |
US8273207B2 (en) | Method for connecting electronic part and joined structure | |
TWI654264B (zh) | 導電性塗料及使用其之屏蔽封裝體之製造方法 | |
KR101391696B1 (ko) | 이방 전도성 조성물 및 필름 | |
CN101775259A (zh) | 一种防静电的耐高温聚酰亚胺胶带 | |
JP2015167106A (ja) | 異方導電性フィルム及び接続構造体 | |
JP5760702B2 (ja) | 電子機器用接着剤組成物および電子機器用接着剤シート | |
JP2002097443A (ja) | 接着剤組成物及びこれを用いた回路接続材料並びに接続体 | |
JP2003049145A (ja) | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着シート | |
JP3589422B2 (ja) | 異方導電性フィルム | |
JP6326867B2 (ja) | 接続構造体の製造方法及び接続構造体 | |
JP7462408B2 (ja) | 接着剤組成物、接着フィルム及び接続構造体 | |
JP2002327162A (ja) | 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 | |
KR102098758B1 (ko) | 회로 접속 재료 | |
JP2012097226A (ja) | 異方導電性接着フィルム及び接続構造体 | |
JP2005197032A (ja) | 異方導電性フィルム | |
JP2009001661A (ja) | 接着剤及び接合体 | |
JP2012146881A (ja) | 硬化剤付き回路基板 | |
KR101189622B1 (ko) | 안트라센계 에폭시 수지를 포함하는 이방 도전성 접착재료및 이를 이용하는 회로접속 구조체 | |
JP5577599B2 (ja) | 回路接続用フィルム接着剤の製造法 | |
JP5046581B2 (ja) | 回路接続用接着剤 | |
JP2004352785A (ja) | 異方導電性接着剤 | |
JP2006291220A (ja) | 異方導電性接着剤および異方導電性接着剤フィルム | |
KR20020089870A (ko) | 실리콘 중간체를 포함하는 이방성 도전성 필름 | |
JP2012099404A (ja) | 異方導電性フィルム及び接続構造体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201180038913.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11814748 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2012527790 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20137001516 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11814748 Country of ref document: EP Kind code of ref document: A1 |