WO2012016422A8 - 保温桶及具有该保温桶的立式热处理装置 - Google Patents

保温桶及具有该保温桶的立式热处理装置 Download PDF

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Publication number
WO2012016422A8
WO2012016422A8 PCT/CN2011/001010 CN2011001010W WO2012016422A8 WO 2012016422 A8 WO2012016422 A8 WO 2012016422A8 CN 2011001010 W CN2011001010 W CN 2011001010W WO 2012016422 A8 WO2012016422 A8 WO 2012016422A8
Authority
WO
WIPO (PCT)
Prior art keywords
barrel
heat retention
heat
retention barrel
treatment apparatus
Prior art date
Application number
PCT/CN2011/001010
Other languages
English (en)
French (fr)
Other versions
WO2012016422A1 (zh
Inventor
董金卫
赵燕平
赵星梅
钟华
林松
Original Assignee
北京七星华创电子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京七星华创电子股份有限公司 filed Critical 北京七星华创电子股份有限公司
Priority to US13/701,972 priority Critical patent/US20130075053A1/en
Publication of WO2012016422A1 publication Critical patent/WO2012016422A1/zh
Publication of WO2012016422A8 publication Critical patent/WO2012016422A8/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/0056—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using solid heat storage material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Furnace Charging Or Discharging (AREA)
PCT/CN2011/001010 2010-08-05 2011-06-17 保温桶及具有该保温桶的立式热处理装置 WO2012016422A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/701,972 US20130075053A1 (en) 2010-08-05 2011-06-17 Heat retention barrel and vertical heat treatment apparatus provided with heat retention barrel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2010102466224A CN101969021A (zh) 2010-08-05 2010-08-05 保温桶及具有该保温桶的立式热处理装置
CN201010246622.4 2010-08-05

Publications (2)

Publication Number Publication Date
WO2012016422A1 WO2012016422A1 (zh) 2012-02-09
WO2012016422A8 true WO2012016422A8 (zh) 2012-05-03

Family

ID=43548156

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/001010 WO2012016422A1 (zh) 2010-08-05 2011-06-17 保温桶及具有该保温桶的立式热处理装置

Country Status (3)

Country Link
US (1) US20130075053A1 (zh)
CN (1) CN101969021A (zh)
WO (1) WO2012016422A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101969021A (zh) * 2010-08-05 2011-02-09 北京七星华创电子股份有限公司 保温桶及具有该保温桶的立式热处理装置
CN103791714B (zh) * 2014-02-20 2015-11-04 北京七星华创电子股份有限公司 一种立式炉的保温桶
CN110736345B (zh) * 2018-07-18 2021-01-29 北京北方华创微电子装备有限公司 用于SiC高温氧化工艺的工艺腔室及热处理炉

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127365A (en) * 1990-02-27 1992-07-07 Kabushiki Kaisha Toshiba Vertical heat-treatment apparatus for semiconductor parts
JP2947604B2 (ja) * 1990-09-28 1999-09-13 東京エレクトロン株式会社 熱処理炉
US5308955A (en) * 1991-07-11 1994-05-03 Tokyo Electron Sagami Kabushiki Kaisha Vertical heat treatment apparatus with vented heat insulation cover means
JP3125199B2 (ja) * 1993-03-18 2001-01-15 東京エレクトロン株式会社 縦型熱処理装置
US5662470A (en) * 1995-03-31 1997-09-02 Asm International N.V. Vertical furnace
US6902395B2 (en) * 2002-03-15 2005-06-07 Asm International, N.V. Multilevel pedestal for furnace
US7651569B2 (en) * 2006-02-28 2010-01-26 Asm International N.V. Pedestal for furnace
JP2008004851A (ja) * 2006-06-23 2008-01-10 Tokyo Electron Ltd 石英製品のベーク方法及び記憶媒体
CN101969021A (zh) * 2010-08-05 2011-02-09 北京七星华创电子股份有限公司 保温桶及具有该保温桶的立式热处理装置

Also Published As

Publication number Publication date
US20130075053A1 (en) 2013-03-28
CN101969021A (zh) 2011-02-09
WO2012016422A1 (zh) 2012-02-09

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