WO2011152625A3 - Wafer polishing apparatus - Google Patents

Wafer polishing apparatus Download PDF

Info

Publication number
WO2011152625A3
WO2011152625A3 PCT/KR2011/003747 KR2011003747W WO2011152625A3 WO 2011152625 A3 WO2011152625 A3 WO 2011152625A3 KR 2011003747 W KR2011003747 W KR 2011003747W WO 2011152625 A3 WO2011152625 A3 WO 2011152625A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing apparatus
wafer polishing
wafer
polishing
polishing part
Prior art date
Application number
PCT/KR2011/003747
Other languages
French (fr)
Other versions
WO2011152625A2 (en
Inventor
Sang Min An
Original Assignee
Lg Siltron Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Siltron Inc. filed Critical Lg Siltron Inc.
Priority to EP11789983.1A priority Critical patent/EP2577718A2/en
Priority to JP2013513104A priority patent/JP2013527624A/en
Publication of WO2011152625A2 publication Critical patent/WO2011152625A2/en
Publication of WO2011152625A3 publication Critical patent/WO2011152625A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

Provided is a wafer polishing apparatus. The wafer polishing apparatus comprises a first polishing part and a second polishing part. The first polishing part is disposed at a position higher than a top surface of a wafer and configured to be rotated on a first rotation axis. The second polishing part is disposed at a position lower than a bottom surface of the wafer and configured to be rotated on a second rotation axis.
PCT/KR2011/003747 2010-06-01 2011-05-23 Wafer polishing apparatus WO2011152625A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP11789983.1A EP2577718A2 (en) 2010-06-01 2011-05-23 Wafer polishing apparatus
JP2013513104A JP2013527624A (en) 2010-06-01 2011-05-23 Wafer polisher

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100051685A KR101089480B1 (en) 2010-06-01 2010-06-01 Wafer polishing apparatus
KR10-2010-0051685 2010-06-01

Publications (2)

Publication Number Publication Date
WO2011152625A2 WO2011152625A2 (en) 2011-12-08
WO2011152625A3 true WO2011152625A3 (en) 2012-04-19

Family

ID=45022523

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/003747 WO2011152625A2 (en) 2010-06-01 2011-05-23 Wafer polishing apparatus

Country Status (5)

Country Link
US (1) US20110294406A1 (en)
EP (1) EP2577718A2 (en)
JP (1) JP2013527624A (en)
KR (1) KR101089480B1 (en)
WO (1) WO2011152625A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5988765B2 (en) * 2012-08-13 2016-09-07 ダイトエレクトロン株式会社 Wafer chamfering method, wafer chamfering apparatus, and jig for angle adjustment
JP6045542B2 (en) * 2014-09-11 2016-12-14 信越半導体株式会社 Semiconductor wafer processing method, bonded wafer manufacturing method, and epitaxial wafer manufacturing method
CN108436684A (en) * 2018-05-30 2018-08-24 郑州博钰特超硬材料制品有限公司 A kind of grinding device for processing of stone
KR102126073B1 (en) * 2018-07-12 2020-06-23 주식회사 영도 Edge polishing apparatus for processing object
CN115256096A (en) * 2022-07-06 2022-11-01 无锡新瑞驰科技有限公司 Motor core surface burring device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003127051A (en) * 2001-10-23 2003-05-08 Yac Co Ltd Wafer edge polishing method and device
JP2003151925A (en) * 2001-11-12 2003-05-23 Yac Co Ltd Apparatus for wafer-edge polishing processing
JP2010034429A (en) * 2008-07-31 2010-02-12 Sumco Corp Method of polishing periphery of semiconductor wafer and apparatus thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081493A (en) * 1994-06-17 1996-01-09 Shin Etsu Handotai Co Ltd Mirror finished surface polishing method for wafer chamfering part and mirror finished surface polishing device
JP3010572B2 (en) * 1994-09-29 2000-02-21 株式会社東京精密 Wafer edge processing equipment
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
JP3510584B2 (en) * 2000-11-07 2004-03-29 スピードファム株式会社 Peripheral polishing device for disk-shaped workpiece
JP2002329687A (en) * 2001-05-02 2002-11-15 Speedfam Co Ltd Apparatus and method of polishing periphery of device wafer
JP2002367939A (en) * 2001-06-05 2002-12-20 Speedfam Co Ltd Method for fabricating semiconductor device and apparatus for removing unwanted film on periphery thereof
EP1810321B1 (en) * 2004-10-15 2014-01-01 Ebara Corporation Polishing apparatus and polishing method
JP2007088143A (en) * 2005-09-21 2007-04-05 Elpida Memory Inc Edge grinding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003127051A (en) * 2001-10-23 2003-05-08 Yac Co Ltd Wafer edge polishing method and device
JP2003151925A (en) * 2001-11-12 2003-05-23 Yac Co Ltd Apparatus for wafer-edge polishing processing
JP2010034429A (en) * 2008-07-31 2010-02-12 Sumco Corp Method of polishing periphery of semiconductor wafer and apparatus thereof

Also Published As

Publication number Publication date
JP2013527624A (en) 2013-06-27
EP2577718A2 (en) 2013-04-10
US20110294406A1 (en) 2011-12-01
KR101089480B1 (en) 2011-12-07
WO2011152625A2 (en) 2011-12-08

Similar Documents

Publication Publication Date Title
USD626978S1 (en) Grinding wheel
USD712199S1 (en) Wine aerator
USD674499S1 (en) Acupressure pad
USD673247S1 (en) Plug for a bathtub
USD631128S1 (en) Floating water fountain
USD731418S1 (en) Charge interrupting device
SG11201402224WA (en) Polishing pad with foundation layer and polishing surface layer
USD658014S1 (en) Combined cup and closure
USD680628S1 (en) Sink stopper
USD794730S1 (en) Panel for training ball
USD684321S1 (en) Eyeglass attachable face shield
SG10201505004QA (en) Soft polishing pad for polishing a semiconductor substrate
USD672239S1 (en) Extendable pour spout
EP2596689A4 (en) Microelectronic elements with post-assembly planarization
TWM387925U (en) Suction device
HK1201100A1 (en) Planarized semiconductor particles positioned on a substrate
WO2011152625A3 (en) Wafer polishing apparatus
EP2629322B8 (en) Power device manufacture on the recessed side of a thinned wafer
WO2013022624A3 (en) Two-part plastic retaining ring
EP2641268A4 (en) Polishing pad comprising transmissive region
USD686707S1 (en) Strainer for a bathtub drain
EP2660004A4 (en) Diamond surface polishing method
USD696740S1 (en) Putting apparatus
USD769444S1 (en) Adapter device
USD671804S1 (en) Empanada utensil

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11789983

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2011789983

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2013513104

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE