WO2012009839A1 - 单面电路板及其制作方法 - Google Patents

单面电路板及其制作方法 Download PDF

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Publication number
WO2012009839A1
WO2012009839A1 PCT/CN2010/002145 CN2010002145W WO2012009839A1 WO 2012009839 A1 WO2012009839 A1 WO 2012009839A1 CN 2010002145 W CN2010002145 W CN 2010002145W WO 2012009839 A1 WO2012009839 A1 WO 2012009839A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
wire
led
sided circuit
flat
Prior art date
Application number
PCT/CN2010/002145
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English (en)
French (fr)
Inventor
王定锋
徐文红
Original Assignee
Wang Dingfeng
Xu Wenhong
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Application filed by Wang Dingfeng, Xu Wenhong filed Critical Wang Dingfeng
Publication of WO2012009839A1 publication Critical patent/WO2012009839A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • the invention belongs to the circuit board industry, and two layers of thermosetting adhesive layers are simultaneously heat-pressed on both sides of the juxtaposed flat conductors to form a single-sided circuit board.
  • the flat conductors are cut off and need to be disconnected.
  • the bridge connection is connected by printed conductive ink and/or soldered conductors.
  • it can be drilled directly at the solder joint position or punched with a die to be mounted in detail.
  • the invention can produce a circuit board without etching, and has a short production process and high efficiency compared with the conventional manufacturing circuit board, and is a very environmentally-friendly, energy-saving and material-saving new technology. Background technique
  • the invention is based on the characteristics of a circuit board with a large amount of a large number of circuit tubes, and the flat conductors are directly used to produce a production circuit board, which can be used in the field of LEDs, and is widely used in various LED products. Low manufacturing costs, high efficiency, and environmentally friendly. Summary of the invention
  • the invention is characterized in that two layers of thermosetting adhesive layers are simultaneously heat-pressed on both sides of the juxtaposed flat wires to form a single-sided circuit board, and in the final molding, the position where the flat wires need to be disconnected is removed.
  • the two juxtaposed flat wires are formed into a circuit layer.
  • the bridge connection is made by printing conductive ink and/or a detailed conductor. When it is necessary to mount the jack component, it can be drilled directly by drilling at the solder joint position or by punching with a die.
  • the invention can make a circuit board without etching, has a short production process and high efficiency compared with the conventional manufacturing circuit board, and is a very environmentally-friendly, energy-saving and material-saving new technology.
  • thermosetting adhesive While the flat conductor is to be disconnected, the two layers of thermosetting adhesive are also cut away from the same size or approximately sized window. Confirmation According to the present invention, there is provided a method of forming a single-sided circuit board by using two layers of a thermosetting adhesive layer simultaneously heat-pressed on both sides of a juxtaposed flat conductor, comprising:
  • thermosetting glue Two layers of insulating layer with thermosetting glue, one layer or two layers of insulating layer with thermosetting glue pre-opened with window;
  • Bridge connection is achieved by printing conductive ink or soldering conductors.
  • the hole is drilled or punched directly at the location of the solder joint for the interposer soldering of the component.
  • thermoset insulating layer while the flat conductor is to be broken, the two layers of the thermoset insulating layer are also cut away from the same size or approximately sized window.
  • the two layers of the thermosetting adhesive layer are epoxy glass substrate + thermosetting glue, phenolphthalein substrate + thermosetting glue, polyimide substrate + thermosetting Glue, metal substrate + thermosetting glue, or ceramic substrate + thermosetting glue.
  • the flat wire is a copper wire, a copper clad aluminum wire, a copper clad steel wire, a copper tinned wire, a copper nickel plated gold wire, an iron tinned wire or a steel tinned wire.
  • the ablation process is selected from the group consisting of die cutting, drilling, drilling and milling, laser ablation, and wire cutter cutting.
  • the single-sided circuit board fabricated by the method is a flexible circuit board or a rigid circuit board.
  • the juxtaposed flat conductors are juxtaposed in parallel.
  • the invention also provides a single-sided circuit board made in accordance with the method of the present invention.
  • the single-sided circuit board is used for an LED strip, an LED lighting module, an LED guardrail tube, an LED neon, an LED fluorescent tube or an LED Christmas light.
  • the planar structure and cross-sectional structure of the single-sided circuit board are as shown, for example, in FIG. 1 or 2.
  • the circuit board structure of the patch is: the first layer is: substrate 1, second The layers are: line conductive layer 2, the third layer is: solder mask (cover film) 3, the fourth layer is: components and short conductive layers 4, 5, 7 (as shown in Figure 1).
  • the structure of the circuit board of the plug-in is that the first layer is: component and short-circuit conductive layer 9, 10, 11, the second layer is: substrate 1, the third layer is: line conductive layer 2, the fourth layer is: resistance Solder layer (cover film) 3. (as shown in picture 2)
  • the conductive ink is a conductive metallic ink such as conductive carbon oil or conductive silver oil or conductive copper oil.
  • the single-sided circuit board produced by the method is characterized in that: the width of the same flat wire can be the same.
  • the width of the different flat wires may be the same or different. All flat conductors are arranged side by side or preferably in a parallel arrangement.
  • the flat wires in the single-sided circuit board fabricated by the method are all made in a non-etching manner.
  • the flat wire may be formed by calendering with a round wire or by metal foil, metal plate or metal tape.
  • Figure 1 is a plan view and cross-sectional structure of a chip board
  • Figure 2 is a plan view and cross-sectional structural view of the plug-in board.
  • Figure 3 is a schematic view of a cut flat conductor.
  • Figure 4 is a schematic view of a juxtaposed slot die.
  • Figure 5 is a cross-sectional view of the juxtaposed slot die.
  • Figure 6 is a parallel conductor wiring diagram.
  • Fig. 7 is a schematic view showing the vacuum suction fixing when the flat wires are juxtaposed.
  • Figure 8 is a schematic view of a juxtaposed flat wire attached to an insulating layer with a thermosetting adhesive.
  • Figure 9 is a schematic view of a juxtaposed flat wire attached to an insulating layer with a thermosetting adhesive on the other side.
  • Figure 10 is a schematic view of the printed conductive ink.
  • Figure A in Figure 11 is a schematic view of the position where the flat wire needs to be cut off.
  • Figure B in Figure 11 is a schematic illustration of the component fillet holes drilled or punched at the solder joint locations.
  • Figure 12 is a schematic view of a rigid circuit board after soldering the LED and its components.
  • Figure 13 is a schematic diagram of the flexible circuit board floating LED and its components. Part number
  • Fabrication of flat conductors Use copper foil strip cutting or flat conductors 2 to flatten copper wires to a certain width and thickness (see Figure 3).
  • Parallel groove mold making Using the mirror stainless steel plate to etch or machine the parallel groove 13 (Fig. 4) with the width of the line (flat wire 2), the groove depth is flat The wire thickness is shallower ( Figure 5).
  • the insulating substrate 1 with thermosetting glue and the mold plate with the flat wire 2 are overlapped and heat-pressed (pre-pressed) for 5 to 10 seconds to adhere the insulating substrate 1 with the thermosetting glue and the juxtaposed flat wire 2 Put them together ( Figure 8) and remove the mold.
  • the top cover film 3 also an insulating substrate with thermosetting glue
  • the pre-compressed insulating substrate with thermosetting adhesive 1, top cover film 3 and flat wire 2 are heat-pressed 150 to 180 ° C for 90 to 180 seconds, firmly fixing the line, using Hengda PCB
  • the press is pressed at 150 ° C to 180 ° C for 30 to 120 minutes to effect curing bonding of the flat wire and the substrate (see Figure 9).
  • the shape is cut, take ⁇ or V-CUT, complete the production.
  • Parallel groove mold making The mirrored stainless steel plate is etched or machined to form a juxtaposed groove 13 (Fig. 3) which is consistent with the line width.
  • the depth of the groove 13 can be compared with the flat wire 2 The thickness is shallower ( Figure 4).
  • flat wire juxtaposition arrangement pre-designed to have a parallel groove mold with the width of the flat wire 2, the flat wire 2 is juxtaposed and fixed in the groove 13 (as shown in Figure 6), vacuuming through the vacuum tube 14 Inspiratory fixation (Figure 7).
  • thermosetting glue insulating substrate with thermosetting glue
  • mold plate with flat wire 2 Use the bottom cover film 1 with thermosetting glue (insulating substrate with thermosetting glue) and the mold plate with flat wire 2 to overlap and press (preload) for 5 to 10 seconds, so that the bottom cover film 1 and Place the flat wires 2 together (see Figure 8) and remove the mold.
  • the top surface of the window will be pre-opened
  • cover film 3 also an insulating substrate with thermosetting glue
  • the pre-compressed bottom cover film 1, the top cover film 3 and the flat wire 2 are heated at 150 ° C to 180 ° C for 90 to 180 seconds, firmly fixed the line, and then used in the oven at 120 ° C to Bake and cure for 45 minutes to 90 minutes at 160 ° C ( Figure 9).

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

单面电路板及其制作方法 技术领域
本发明属于电路板行业， 分别用两层带热固胶的绝缘层同时热压 在并置的扁平导线的两面， 制成单面电路板， 在最后成型时， 切除掉 扁平导线需要断开的位置， 使两条并置的扁平线形成电路层。 过桥连 接采用印刷导电油墨和 /或焊接导体来连接。 当需要安装插孔元件时， 就直接在焊点位置上钻孔或者用模具冲孔， 就可详接安装。 本发明无 需蚀刻就能制作电路板， 与传统的制作电路板相比， 生产流程短， 效 率高， 并且是一种十分环保的、 节能的、 省材料的新技术。 背景技术
传统的电路板导线通常都是覆铜板蚀刻出线路， 或者是采取激光 和铣刀切割去除不需要的铜制出线路。 但是， 前者成本高且污染很严 重， 而后者效率太低， 无法大批量生产。
本发明是根据一些线路筒单用量大的电路板的特点直接采取并 置的扁平导线制作生产电路板，可以用于 LED领域， 而且广泛用于各 种 LED产品。 制造成本低、 效率高， 而且十分环保。 发明内容
本发明是一种分别用两层带热固胶的绝缘层同时热压在并置的 扁平导线的两面， 制成单面电路板， 在最后成型时， 切除掉扁平导线 需要断开的位置， 使两条并置的扁平线形成电路层。 过桥连接采用印 刷导电油墨和 /或详接导体来连接。 当需要安装插孔元件时， 就直接在 焊点位置上钻孔或者用模具沖孔， 就可焊接安装。 本发明无需蚀刻就 能制作电路板， 与传统的制作电路板相比， 生产流程短， 效率高， 并 且是一种十分环保的、 节能的、 省材料的新技术。
本发明在切除扁平导线需断开位置的同时， 两层带热固胶的绝缘 层也被切除相同大小或近似尺寸的窗口。 确认本 根据本发明，提供了一种用两层带热固胶的绝缘层同时热压在并 置的扁平导线的两面， 制成单面电路板的方法， 包括：
两层带热固胶的绝缘层， 其中一层或者是两层都预先开有窗口的 带热固胶的绝缘层；
在最后成型时， 切除扁平导线需断开的位置， 以形成单面电路板 的线路层；
采用印刷导电油墨或者焊接导体来实现过桥连接。
根据本发明的一优选实施方式， 当需要安装插孔元件时， 直接在 焊点位置上钻孔或者冲孔， 以进行元件的插装焊接。
根据本发明的另一优选实施方式， 切除扁平导线需断开位的同 时， 两层带热固胶的绝缘层也被切除相同大小或近似尺寸的窗口。
根据本发明的另一优选实施方式， 上述两层带热固胶的绝缘层是 环氧玻纤基材 +热固胶、 酚趁基材 +热固胶、 聚酰亚胺基材 +热固胶、 金属基材 +热固胶， 或陶瓷基材 +热固胶。
才艮据本发明的另一优选实施方式， 所述扁平导线为铜线、 铜包铝 线、 铜包钢线、 铜镀锡线、 铜镀镍金线、 铁镀锡线或钢镀锡线。
根据本发明的另一优选实施方式， 所述切除加工选自模具冲切、 钻孔、 钻铣、 激光切除和线切割机切除。
根据本发明的另一优选实施方式， 所述方法制作的单面电路板是 柔性电路板或者是刚性电路板。
根据本发明的另一优选实施方式， 所述并置的扁平导线是平行地 并置的。
本发明还提供了根据本发明的方法制作的单面电路板。
根据本发明的另一优选实施方式， 所述单面电路板用于 LED灯 带， LED发光模组、 LED护栏管、 LED霓虹灯、 LED日光灯管或 LED 圣诞灯。
根据本发明的一实施例， 单面电路板的平面结构和横截面结构例 如如图 1或 2所示。 贴片的电路板结构是， 第一层为： 基材 1， 第二 层为： 线路导电层 2， 第三层为： 阻焊层 (覆盖膜) 3 , 第四层为： 元件 及短接导电层 4、 5、 7(如图 1所示)。 插件的电路板的结构是， 第一层 为： 元件及短接导电层 9、 10、 11， 第二层为： 基材 1， 第三层为： 线路导电层 2， 第四层为： 阻焊层 (覆盖膜) 3。 （如图 2所示）
根据本发明的一实施例， 导电油墨是导电碳油或者导电银油或者 导电铜油等导电金属油墨。
根据本发明的一实施例， 所述的方法制作的单面电路板， 其特点 是： 同一条扁平导线的宽度可以是一样的。 不同的扁平导线的宽度可 以相同， 也可以不相同。 所有的扁平导线都是并置布置或者优选是平 行布置的。
根据本发明的一实施例， 所述的方法制作的单面电路板里的扁平 导线全都是非蚀刻的方式做出来的。 该扁平导线可以是用圓线压延制 成、 或是用金属箔、 金属板、 金属带分切制成的。 附图说明
通过结合以下附图阅读本说明书， 本发明的特征、 目的和优点将 变得更加显而易见， 在附图中：
图 1为贴片电路板的平面结构和横截面结构图
图 2为插件电路板的平面结构和横截面结构图。
图 3为切割制作的扁平导线的示意图。
图 4为并置槽模具的示意图。
图 5为并置槽模具横截面图。
图 6为扁平导线并置布线图。
图 7为扁平导线并置布置时抽真空吸气固定的示意图。
图 8为并置扁平线粘贴在一面带热固胶的绝缘层上的示意图。 图 9为并置扁平线粘贴在另一面带热固胶的绝缘层上的示意图。 图 10为印刷导电油墨后的示意图。
图 11中的图 A为切除掉扁平孚线需要断开的位置的示意图， 图 11中的图 B为在焊点位置上钻孔或者沖孔的元件焊脚孔的示意图。 图 12为刚性电路板焊接 LED及其元件后的示意图。
图 13为软性电路板浮接 LED及其元件后的示意图。 部件标号
1 基材； 2 扁平导线； 3 阻焊层（覆盖膜或阻焊油墨） ； 4、 贴 片电阻； 5、 贴片 LED灯； 6、 锡焊； 7、 贴片过桥导体； 4-7、 贴片型 电路板的元件及短接导电层； 8 电源焊接点； 9、 插件电阻； 10、 插 件 LED灯； 11、 插件过桥导体； 12、 锡焊； 9-12、 插件电路板的元件 及短接导电层； 13 平行沟槽； 14抽真空管； 15、 印刷的导电油墨
Figure imgf000006_0001
缘基材上制作单面电路板的方法的具体实施例进行更详细的描述。
但是， 本领域技术人员应当理解， 以下所述仅是举例说明和描述 一些优选实施方式， 其它一些类似的或等同的实施方式同样也可以用 来实施本发明。
(一） 刚性电路板的制作
1. 扁平导线的制作：采取铜箔分条切割制作或者是用扁平导线压 延机压延铜线成一定宽度和厚度的扁平导线 2(如图 3)。
2. 并置槽模具制作： 用镜面不锈刚板采用蚀刻或机加工的方法， 加工出与线路（扁平导线 2 )宽度一致的并置沟槽 13(如图 4), 沟槽深 度比扁平导线厚度浅一些 (如图 5)。
3.扁平导线并置布置： 预先设计制作好具有与扁平导线宽度一致 的并置槽模具，把扁平导线并置布置固定在槽里 (如图 6)， 固定釆用通 过抽真空管 14来抽真空吸气固定 (如图 7)。
4. 用带热固胶的绝缘基材 1和布有扁平导线 2的模具板重叠热 压（预压） 5至 10秒钟， 使带热固胶的绝缘基材 1和并置扁平线 2粘 贴在一起 (如图 8)， 拿掉模具。 将预先开好窗口的顶面覆盖膜 3 (也是 带热固胶的绝缘基材） ， 对位贴在扁平导线 2的另一面， 热压（同样 是预压） 5至 10秒钟， 再两面都覆上离型膜。 最后， 同时对预压在一 起的带热固胶的绝缘基材 1、 顶面覆盖膜 3和扁平导线 2热压 150 至 180°C， 90至 180秒， 牢固固定线路， 用恒达的 PCB压合机 150°C 至 180°C 30至 120分钟压， 实现扁平导线和基材的固化粘合 (参见图 9所示)。
5、 印刷文字， 此工艺为传统工艺， 在此不作细述。
6、 印刷过桥连接导电油墨 15 , 120°C至 160°C固化 45分钟至 90 分钟 (如图 10)。
7、 用锣机在扁平导线 2需断开的位置锣成镂空的窗口， 而使扁 平导线断开。 （如图 11A所示)。
8、 对焊点进行 OSP处理
9、 焊接 LED及其它元件 (；如图 12)。
10、 外型分切， 采取锣或者 V-CUT, 完成制作。
(二）软性电路板的制作
1.扁平导线制作， 采取铜箔分条切割制作或者是用扁平导线压延 机压延铜线成一定宽度和厚度的扁平导线 2(如图 2)。
2.并置槽模具制作： 用镜面不锈刚板采用蚀刻或机加工的方法， 加工出与线路宽度一致的并置沟槽 13(如图 3)， 沟槽 13的深度可以比 扁平导线 2的厚度浅一些 (如图 4)。
3、 扁平导线并置布置： 预先设计制作好具有与扁平导线 2宽度 一致的并置槽模具， 把扁平导线 2并置布置固定在槽 13里 (如图 6), 通过抽真空管 14来抽真空吸气固定 （如图 7)。
4、 用带热固胶的底面覆盖膜 1 (带热固胶的绝缘基材）和布有扁 平导线 2的模具板重叠热压（预压） 5至 10秒钟， 使底面覆盖膜 1和 并置扁平线 2粘贴在一起 (如图 8)，拿掉模具。将预先开好窗口的顶面 覆盖膜 3 (也是带热固胶的绝缘基材） ， 对位贴在扁平导线 2的另一 面， 热压 （同样是预压） 5至 10秒钟， 再两面都覆上离型膜。 最后， 同时对预压在一起的底面覆盖膜 1、 顶面覆盖膜 3和扁平导线 2热压 150°C至 180°C , 90至 180秒， 牢固固定线路， 再用烤箱在 120°C至 160°C的条件下， 烘烤固化 45分钟至 90分钟 (如图 9)。
5、 印刷文字， 此工艺为传统工艺， 在此不作细述。
5、 用模具沖切除掉扁平导线需要断开的位置 (如图 UA)。
6、 对焊点进行 OSP处理。
7、 悍接元件及过桥连接导体 (如图 13所示)。
8、 用刀模分切成所需单件产品 (如图 1)。
以上结合附图将方法具体实施例对本发明进行了详细的描述。但 是， 本领域技术人员应当理解， 以上所述仅仅是举例说明和描述一些 具体实施方式， 对本发明的范围， 尤其是权利要求的范围， 并不具有 任何限制。

Claims

权 利 要 求 书
1、一种分别用两层带热固胶的绝缘层同时热压在并置的扁平导线的 两面来制作单面电路板的方法， 包括：
同时在所述并置的扁平导线的两面分别热压上一层带热固胶的绝缘 层；
在最后成型时， 切除扁平导线需断开的位置， 以形成单面电路板的 线路层； 和
采用印刷导电油墨和 /或焊接导体来实现过桥连接， 在焊点位置安装 焊接电子元器件。
2、 根据权利要求 1 所述的方法， 其特征在于， 当需要安装插装元 件时， 直接在焊点位置上钻孔或者冲孔， 以进行元件的插装焊接。
3、 根据上述权利要求中任一项所述的方法， 其特征在于， 切除扁平 导线需断开位的同时， 两层带热固胶的绝缘层也被切除相同大小的窗口。
4、 根据上述权利要求中任一项所述的方法， 其特征在于， 所述带热 固胶的绝缘层是环氧玻纤基材 +热固胶、 酚 基材 +热固胶、 聚酰亚胺基 材 +热固胶、 金属基材 +热固胶， 或陶瓷基材 +热固胶。
5、 根据上述权利要求中任一项所述的方法， 其特征在于， 所述扁平 导线为铜线、 铜包铝线、 铜包钢线、 铜镀锡线、 铜镀镍金线、 铁镀锡线 或钢镀锡线。
6、 根据上述权利要求中任一项所述的方法， 其特征在于：
所述切除加工选自模具沖切、 钻孔、 钻铣、 激光切除和线切割机切 除。
7、 根据上述权利要求中任一项所述的方法， 其特征在于： 所述方法 制作的单面电路板是柔性电路板或者是刚性电路板。
8、 根据上述权利要求任一项所述的方法， 其特征在于， 所述并置的 扁平导线是平行地并置的。
9、 根据上述权利要求任一项所述的方法， 其特征在于， 所述的单面 电路板里的扁平导线全都是非蚀刻的方式做出来的， 其特点是： 不论是 刚性电路板或软性电路板， 其阻焊层都是覆盖膜。
10、 一种根据上述权利要求中任一项制作的单面电路板， 其特征在 于， 所述单面电路板用于 LED灯带， LED发光模组、 LED护栏管、 LED 霓虹灯、 LED日光灯管或 LED圣诞灯等。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10288231B2 (en) 2017-05-08 2019-05-14 Ledvance Gmbh Non-etched wiring board for LED applications

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869756B (zh) * 2015-06-10 2018-01-23 金达(珠海)电路版有限公司 一种镂空板的制作方法
CN112437551A (zh) * 2019-08-24 2021-03-02 王定锋 一种新型蚀刻铜包铝线的导线电路板及其制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230547A (ja) * 2000-02-15 2001-08-24 Ibiden Co Ltd 配線板の製造方法
CN1731919A (zh) * 2004-08-05 2006-02-08 三星电机株式会社 以并行方式制造pcb的方法
JP2007300040A (ja) * 2006-05-08 2007-11-15 Matsushita Electric Ind Co Ltd 縦型チップコンデンサ用座板の製造方法
CN101769469A (zh) * 2008-12-31 2010-07-07 佳必琪国际股份有限公司 发光二极管灯条及其制造方法
CN101769468A (zh) * 2008-12-31 2010-07-07 佳必琪国际股份有限公司 全覆式发光二极管灯条及其制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193081A (ja) * 1987-10-01 1989-04-12 Nippon Kokuen Kogyo Kk フレキシブルテープコネクター部材の製造法
US5890282A (en) * 1996-08-12 1999-04-06 Leveque; Denis J. Making an integrated control and panel assembly
CN100483019C (zh) * 2002-02-07 2009-04-29 林原 贴合式灯条装置及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230547A (ja) * 2000-02-15 2001-08-24 Ibiden Co Ltd 配線板の製造方法
CN1731919A (zh) * 2004-08-05 2006-02-08 三星电机株式会社 以并行方式制造pcb的方法
JP2007300040A (ja) * 2006-05-08 2007-11-15 Matsushita Electric Ind Co Ltd 縦型チップコンデンサ用座板の製造方法
CN101769469A (zh) * 2008-12-31 2010-07-07 佳必琪国际股份有限公司 发光二极管灯条及其制造方法
CN101769468A (zh) * 2008-12-31 2010-07-07 佳必琪国际股份有限公司 全覆式发光二极管灯条及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10288231B2 (en) 2017-05-08 2019-05-14 Ledvance Gmbh Non-etched wiring board for LED applications

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