WO2012005051A1 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- WO2012005051A1 WO2012005051A1 PCT/JP2011/060957 JP2011060957W WO2012005051A1 WO 2012005051 A1 WO2012005051 A1 WO 2012005051A1 JP 2011060957 W JP2011060957 W JP 2011060957W WO 2012005051 A1 WO2012005051 A1 WO 2012005051A1
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- WIPO (PCT)
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- electronic component
- external electrode
- line
- conductor
- main line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
Definitions
- the present invention relates to an electronic component, and more particularly to an electronic component incorporating a directional coupler.
- a chip-type directional coupler (hereinafter simply referred to as a directional coupler) described in Patent Document 1 is known.
- a laminated structure is configured by laminating a plurality of rectangular electrode substrates.
- a U-shaped stripline electrode (hereinafter simply referred to as a main line) serving as a main line
- a U-shaped stripline electrode (hereinafter simply referred to as a subline) serving as a subline. )
- the main line is provided on an electrode substrate different from the sub line. That is, the main line and the sub line are arranged in the stacking direction.
- an external electrode to which the main line and the sub line are connected is provided on the side surface of the laminated structure.
- the directional coupler described in Patent Document 1 has a problem that it is difficult to manufacture when trying to reduce the size. More specifically, in the directional coupler, external electrodes are formed on the side surfaces of the laminated structure. Therefore, the external electrode is formed by applying a conductive paste after cutting the mother laminated structure to obtain a laminated structure. Therefore, when the directional coupler is further miniaturized, it is necessary to apply a conductive paste to a small laminated structure, so that it is difficult to form an external electrode.
- the directional coupler described in Patent Document 1 has a problem that the degree of coupling between the main line and the sub line is low. More specifically, each of the main line and the sub line is provided on a single-layer electrode substrate and is coupled to each other in the stacking direction. Therefore, in order to increase the degree of coupling between the main line and the sub-line, it is only necessary to form a thin layer between the main line and the sub-line and bring the main line and the sub-line as close as possible in the stacking direction. However, the degree of coupling between the main line and the sub line cannot be increased because there is a limit that allows the dielectric layer to be thin due to processing limitations.
- an object of the present invention is to provide an electronic component in which an external electrode can be easily formed and a main line and a sub line can be coupled with a high degree of coupling.
- An electronic component includes a stacked body formed by stacking a plurality of insulator layers, and a first spiral portion having a first central axis parallel to the stacking direction.
- a first external electrode and a second external electrode which are provided on at least one end face of the laminate located at both ends in the direction and are electrically connected to both ends of the main line, respectively.
- a third external electrode and a fourth electrode provided on at least one end face of the laminated body located at both ends in the laminating direction and electrically connected to both ends of the sub-line.
- An external electrode of the main line The second region and is where the first area provided sub-line is provided, that overlap in the stacking direction, characterized.
- the external electrode can be easily formed, and the main line and the sub line can be coupled with a high degree of coupling.
- FIG. 1 is a perspective view of an electronic component 10a according to the embodiment.
- FIG. 2 is an exploded perspective view of the electronic component 10a according to the embodiment.
- the stacking direction of the electronic component 10a is defined as the z-axis direction, and when viewed in plan from the z-axis direction, the direction along the long side of the electronic component 10a is defined as the x-axis direction, and the short side of the electronic component 10a
- the direction along is defined as the y-axis direction.
- the x axis, the y axis, and the z axis are orthogonal to each other.
- the electronic component 10a includes a laminate 12, external electrodes 14 (14a to 14d), a main line ML, and a sub line SL.
- the laminated body 12 has a rectangular parallelepiped shape, and includes a main line ML and a sub line SL.
- the surfaces located on the positive direction side and the negative direction side in the z-axis direction are referred to as end surfaces S1 and S2.
- surfaces positioned on the positive side and the negative side in the y-axis direction are referred to as an upper surface S3 and a lower surface S4.
- the surface located in each of the positive direction side and negative direction side of x-axis direction is set as side surface S5, S6.
- the lower surface S4 is a mounting surface. That is, when the electronic component 10a is mounted on the circuit board, the lower surface S4 faces the mounting surface of the circuit board.
- the laminated body 12 is configured by laminating the insulating layers 16 (16a to 16h) so that they are arranged in this order from the positive direction side to the negative direction side in the z-axis direction. Thereby, the laminated body 12 is mounted on the circuit board so that the z-axis direction is parallel to the mounting surface of the circuit board.
- Each of the insulator layers 16 has a rectangular shape and is made of a dielectric material.
- the surface on the positive side in the z-axis direction of the insulator layer 16 is referred to as a front surface
- the surface on the negative direction side in the z-axis direction of the insulator layer 16 is referred to as a back surface.
- External electrodes 14a and 14b are provided on the end surface S1 of the multilayer body 12 as shown in FIG. That is, it is provided on the surface of the insulator layer 16a.
- the external electrode 14a is located on the positive side in the x-axis direction with respect to the external electrode 14b.
- the external electrodes 14a and 14b are provided only on the end surface S1 of the multilayer body 12, and are not provided on the upper surface S3, the lower surface S4, and the side surfaces S5 and S6 of the multilayer body 12.
- the external electrodes 14c and 14d are provided on the end surface S2 of the multilayer body 12, as shown in FIG. That is, it is provided on the back surface of the insulator layer 16h.
- the external electrode 14c is located on the positive side in the x-axis direction with respect to the external electrode 14d.
- the external electrodes 14c and 14d are provided only on the end surface S2 of the multilayer body 12, and are not provided on the upper surface S3, the lower surface S4, and the side surfaces S5 and S6 of the multilayer body 12.
- the main line ML is connected between the external electrodes 14a and 14b, and has a spiral portion Sp1 and via-hole conductors b1, b7 to b12 as shown in FIG.
- the spiral portion Sp1 is a signal line having a spiral shape that turns clockwise when viewed in plan from the positive side in the z-axis direction and proceeds from the positive direction side to the negative direction side in the z-axis direction. . That is, the spiral portion Sp1 has a central axis Ax1 parallel to the z-axis direction.
- the spiral portion Sp1 includes signal conductors 18 (18a to 18f) and via hole conductors b2 to b6.
- Each of the signal conductors 18 is made of a conductive material, and is produced by bending a linear conductor.
- the upstream end of the signal conductor 18 in the clockwise direction is referred to as an upstream end
- the downstream end of the signal conductor 18 in the clockwise direction is referred to as an upstream end. Called the downstream end.
- the via-hole conductors b2 to b6 pass through the insulator layers 16b to 16f in the z-axis direction, and connect the signal conductors 18 to each other. More specifically, the via-hole conductor b2 connects the downstream end of the signal conductor 18a and the upstream end of the signal conductor 18b.
- the via-hole conductor b3 connects the downstream end of the signal conductor 18b and the upstream end of the signal conductor 18c.
- the via-hole conductor b4 connects the downstream end of the signal conductor 18c and the upstream end of the signal conductor 18d.
- the via-hole conductor b5 connects the downstream end of the signal conductor 18d and the upstream end of the signal conductor 18e.
- the via-hole conductor b6 connects the downstream end of the signal conductor 18e and the upstream end of the signal conductor 18f.
- the via-hole conductor b1 passes through the insulator layer 16a in the z-axis direction, and the end on the positive side in the z-axis direction of the spiral portion Sp1 (that is, the upstream end of the signal conductor 18a) ) And the external electrode 14a.
- each of the via-hole conductors b7 to b12 penetrates the insulator layers 16f, 16e, 16d, 16c, 16b, and 16a in the z-axis direction, and the negative direction of the spiral portion Sp1 in the z-axis direction
- the side end (that is, the downstream end of the signal conductor 18f) and the external electrode 14b are connected.
- the via-hole conductors b7 to b12 are connected to each other to constitute one via-hole conductor.
- the main line ML is electrically connected between the external electrodes 14a and 14b. As shown in FIG. 2, the main line ML is provided in a region A1 where the insulator layers 16a to 16g are provided.
- the sub line SL is connected between the external electrodes 14c and 14d, and constitutes a directional coupler by being electromagnetically coupled to the main line ML. As shown in FIG. 2, the sub-line SL has a spiral portion Sp2 and via-hole conductors b20, b21, b26 to b31.
- the spiral portion Sp2 is a signal line having a spiral shape that advances from the negative side in the z-axis direction to the positive side while turning counterclockwise when viewed from the positive side in the z-axis direction. is there. That is, the spiral portion Sp2 has a central axis Ax2 parallel to the z-axis direction. As shown in FIG. 2, the center axis Ax2 coincides with the center axis Ax1 when viewed in plan from the z-axis direction. As a result, the spiral portion Sp1 and the spiral portion Sp2 overlap each other when viewed in plan from the z-axis direction.
- the spiral portion Sp2 is composed of signal conductors 19 (19a to 19e) and via hole conductors b22 to b25.
- Each of the signal conductors 19 is made of a conductive material, and is produced by bending a linear conductor.
- the upstream end of the signal conductor 19 in the counterclockwise direction is referred to as an upstream end
- the downstream end of the signal conductor 19 in the counterclockwise direction is referred to as an upstream end. This part is called the downstream end.
- the via-hole conductors b22 to b25 penetrate the insulator layers 16f, 16e, 16d, and 16c in the z-axis direction, and connect the signal conductors 19 to each other. More specifically, the via-hole conductor b22 connects the downstream end of the signal conductor 19a and the upstream end of the signal conductor 19b. The via-hole conductor b23 connects the downstream end of the signal conductor 19b and the upstream end of the signal conductor 19c. The via-hole conductor b24 connects the downstream end of the signal conductor 19c and the upstream end of the signal conductor 19d. The via-hole conductor b25 connects the downstream end of the signal conductor 19d and the upstream end of the signal conductor 19e.
- the via-hole conductors b20 and b21 penetrate the insulator layers 16h and 16g in the z-axis direction, and end portions on the negative direction side in the z-axis direction of the spiral portion Sp2 (that is, signal conductors) 19a is connected to the external electrode 14c.
- the via-hole conductors b20 and b21 constitute a single via-hole conductor by being connected to each other.
- each of the via-hole conductors b26 to b31 passes through the insulator layers 16h, 16g, 16f, 16e, 16d, and 16c in the z-axis direction, and the positive direction in the z-axis direction of the spiral portion Sp2
- the side end (that is, the downstream end of the signal conductor 19e) and the external electrode 14d are connected.
- the via-hole conductors b26 to b31 constitute one via-hole conductor by being connected to each other.
- the sub line SL is electrically connected between the external electrodes 14c and 14d.
- the sub line SL is provided in a region A2 where the insulator layers 16c to 16h are provided.
- the region A1 and the region A2 overlap in the z-axis direction.
- the signal lines 18b, 18c, 18d, 18e, and 18f and the signal lines 19e, 19d, 19c, 19b, and 19a are provided on the same insulator layer 16.
- the external electrode 14a is used as an input port
- the external electrode 14b is used as a main output port
- the external electrode 14c is used as a monitor output port
- the external electrode 14d is 50 ⁇ terminated. Used as a port.
- a ceramic green sheet to be the insulator layer 16 is prepared.
- via-hole conductors b1 to b12 and b20 to b31 are formed on each of the ceramic green sheets to be the insulator layer 16.
- the ceramic green sheet to be the insulator layer 16 is irradiated with a laser beam to form a via hole.
- the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.
- a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied on the surface of the ceramic green sheet to be the insulator layers 16b to 16g by a screen printing method or a photolithography method.
- the signal conductors 18 and 19 are formed by coating by a method.
- the via holes may be filled with a conductive paste.
- the conductivity is mainly composed of Ag, Pd, Cu, Au, and alloys thereof.
- the external electrodes 14a to 14d are formed by applying the paste by a method such as screen printing or photolithography.
- each ceramic green sheet is laminated.
- the ceramic green sheets to be the insulator layers 16a to 16h are laminated and pressure-bonded one by one so as to be arranged in this order from the positive direction side to the negative direction side in the z-axis direction.
- a mother laminated body is formed by the above process.
- the mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like.
- the mother laminate is cut with a cutting blade to obtain a laminate 12 having a predetermined size. Thereafter, the unfired laminate 12 is subjected to binder removal processing and firing.
- the fired laminated body 12 is obtained through the above steps.
- the laminated body 12 is chamfered by barrel processing.
- Ni plating / Sn plating is applied to the surface of the external electrode 14.
- the external electrode 14 can be easily formed. More specifically, in the electronic component 10a, the external electrode 14 is provided on the end surfaces S1 and S2 of the multilayer body 12. Therefore, the external electrode 14 can be formed on the ceramic green sheet before lamination by a method such as screen printing. That is, it is not necessary to form the external electrode 14 on the small laminated body 12 after cutting. Therefore, the external electrode 14 can be easily formed.
- the main line ML and the sub line SL can be coupled with a high degree of coupling. More specifically, in the electronic component 10a, as shown in FIG. 2, the region A1 where the main line ML is provided and the region A2 where the sub line SL is provided overlap in the z-axis direction. For this reason, a portion where the main line ML and the sub line SL are close to each other becomes long. As a result, the main line ML and the sub line SL can be coupled with a high degree of coupling.
- the central axis Ax1 and the central axis Ax2 overlap when viewed in plan from the z-axis direction. Therefore, most of the electric field and magnetic field generated in the main line ML pass through the sub line SL, and most of the electric field and magnetic field generated in the sub line SL pass through the main line ML. As a result, the main line ML and the sub line SL can be coupled with a higher degree of coupling.
- the signal conductor 18 that forms the spiral portion Sp1 of the main line ML and the signal conductor 19 that forms the spiral portion Sp2 of the sub-line SL are formed on the same insulator layer. Accordingly, stray capacitance between the signal conductors 18 and 19 can be reduced. Therefore, it is possible to prevent the signal conductor 18 and the signal conductor 19 from being coupled capacitively and deteriorating the isolation characteristics.
- FIG. 3 is an external perspective view of the electronic components 10b to 10d according to the modification.
- FIG. 4 is an exploded perspective view of the electronic component 10b according to the first modification.
- the laminated body 12 is provided with external electrodes 14a to 14d.
- external electrodes 14e and 14f are provided in addition to the external electrodes 14a to 14d.
- a ground conductor 22 (22a, 22b) is provided in the multilayer body 12 in addition to the main line ML and the sub line SL.
- the external electrode 14e is provided on the end surface S1 so as to be sandwiched between the external electrodes 14a and 14b.
- the external electrode 14f is provided on the end surface S2 so as to be sandwiched between the external electrodes 14c and 14d.
- An insulator layer 16i is provided between the insulator layer 16a and the insulator layer 16b.
- the insulator layer 16i is provided with via-hole conductors b41 and b42.
- the via hole conductor b41 connects the via hole conductor b1 and the via hole conductor b2.
- the via hole conductor b42 connects the via hole conductor b11 and the via hole conductor b12.
- the ground conductor 22a has a rectangular shape and is provided on the surface of the insulator layer 16i.
- the ground conductor 22a is connected to the external electrode 14e by a via-hole conductor b43 provided in the insulator layer 16a.
- the via-hole conductors b41 and b42 are insulated.
- An insulator layer 16j is provided between the insulator layer 16g and the insulator layer 16h.
- the insulator layer 16j is provided with via-hole conductors b44 and b45.
- the via-hole conductor b44 connects the via-hole conductor b20 and the via-hole conductor b21.
- the via hole conductor b45 connects the via hole conductor b30 and the via hole conductor b31.
- the ground conductor 22b has a rectangular shape and is provided on the surface of the insulator layer 16j.
- the ground conductor 22b is connected to the external electrode 14f by via-hole conductors b46 and b47 provided in the insulator layers 16j and 16h.
- the via-hole conductors b44 and b45 are insulated.
- the external electrode 14a is used as an input port
- the external electrode 14b is used as a main output port
- the external electrode 14c is used as a monitor output port
- the external electrode 14d is 50 ⁇ terminated.
- the external electrodes 14e and 14f are used as ground ports.
- the spiral portions Sp1 and Sp2 are sandwiched by the ground conductors 22a and 22b from both sides in the z-axis direction. Therefore, it is possible to suppress noise from entering the spiral portions Sp1 and Sp2.
- the impedances of the main line ML and the sub line SL can be set to desired values, respectively.
- FIG. 5 is an exploded perspective view of the electronic component 10c according to the second modification.
- FIG. 6 is a circuit diagram of an electronic component 10c according to the second modification.
- the electronic component 10 b only the main line ML, the sub line SL, and the ground conductor 22 are provided in the multilayer body 12.
- capacitors C1 to C3 are provided in addition to the main line ML, the sub line SL, and the ground conductor 22.
- Insulator layers 16k and 16l are provided between the insulator layer 16i and the insulator layer 16b.
- the insulator layer 16k is provided with via hole conductors b47 and b48.
- Via-hole conductors b49 and b50 are provided in the insulating layer 16l.
- the via hole conductors b47 and b49 connect the via hole conductor b41 and the via hole conductor b2.
- the via-hole conductors b48 and b50 connect the via-hole conductor b42 and the via-hole conductor b11.
- Capacitor conductors 24a and 24b are provided on the surface of the insulator layer 16k. Capacitor conductors 24a and 24b constitute capacitors C1 and C2 by facing the ground conductor 22a, respectively. Further, the capacitor conductors 24a and 24b are connected to the via-hole conductors b41 and b42, respectively. Thereby, the capacitors C1 and C2 are connected between both ends of the spiral portion Sp1 and the external electrode 14e, respectively.
- a capacitor conductor 26 is provided on the surface of the insulator layer 16l.
- the capacitor conductor 26 constitutes a capacitor C3 by facing the capacitor conductors 24a and 24b. Thereby, the capacitor C3 is connected in parallel to the spiral portion Sp1, as shown in FIG.
- the capacitors C1 to C3 as described above constitute a ⁇ -type low-pass filter. Thereby, it can suppress that noise generate
- FIG. 7 is an exploded perspective view of an electronic component 10d according to a third modification.
- FIG. 8 is a circuit diagram of an electronic component 10d according to a third modification.
- resistors R1 and R2 are provided in the multilayer body 12 in addition to the main line ML, the sub line SL, and the ground conductor 22, as shown in FIGS.
- Insulator layers 16k and 16l are provided between the insulator layer 16g and the insulator layer 16j.
- the insulator layer 16k is provided with via-hole conductors b51 and b52 and a connection conductor 30.
- Via-hole conductors b53 and b54 are provided in the insulating layer 16l.
- the via hole conductors b51 and b53 connect the via hole conductor b21 and the via hole conductor b44.
- the via-hole conductors b52 and b54 and the connection conductor 30 connect the via-hole conductor b30 and the via-hole conductor b45.
- Resistance conductors 32a and 32b to be resistors R1 and R2 are provided on the surface of the insulator layer 16l.
- Each of the resistance conductors 32a and 32b is made of a high resistance material and has a meander shape.
- One ends of the resistance conductors 32a and 32b are connected to the via-hole conductors b51 and b52, respectively.
- the other ends of the resistance conductors 32a and 32b are connected to each other.
- the other end 18 of the resistance conductors 32a and 32b is connected to the ground conductor 22b by a via-hole conductor b55 provided in the insulator layer 16k.
- the resistors R1 and R2 are respectively provided between both ends of the spiral portion Sp2 and the external electrode 14f.
- connection portion between the external electrode 14c and the sub line SL is connected to the ground electrode 14f by the resistor R1
- the connection portion between the external electrode 14d and the sub line SL is connected to the ground electrode 14f by the resistor R2.
- the resistors R1 and R2 function as an attenuator and can attenuate signals output to the monitor output port and the 50 ⁇ termination port to a predetermined value.
- FIG. 9 is an exploded perspective view of an electronic component 10e according to a fourth modification.
- a signal conductor 19f and via-hole conductors b32 and b33 are added to the electronic component 10a.
- the signal conductor 19f constitutes a part of the sub line SL, and is a linear conductor provided on the insulator layer 16b. That is, the signal conductor 19f is provided on the same insulator layer 16b as the signal conductor 18a.
- the upstream end of the signal conductor 19 in the counterclockwise direction is referred to as an upstream end
- the downstream end of the signal conductor 19 in the counterclockwise direction is referred to as an upstream end. This part is called the downstream end.
- the via-hole conductors b32 and b33 penetrate the insulator layer 16b in the z-axis direction.
- the via-hole conductor b32 connects the downstream end of the signal conductor 19e and the upstream end of the signal conductor 19f.
- the via-hole conductor b33 connects the downstream end of the signal conductor 19f and the via-hole conductor b26.
- the signal conductors 18a, 18b, 18c, 18d, 18e, and 18f and the signal conductors 19f, 19e, 19d, 19c, 19b, and 19a are provided on the same insulator layer 16. That is, in the electronic component 10e, the signal conductor 19 is provided on all the insulator layers 16 on which the signal conductor 18 is provided.
- the signal conductor 19 is provided on all the insulator layers 16 on which the signal conductor 18 is provided. Therefore, the main line ML and the sub line SL are coupled with a higher degree of coupling.
- FIG. 10 is an exploded perspective view of an electronic component 10f according to a fifth modification.
- both ends of the main line ML are connected to the external electrodes 14a and 14d, respectively. Further, both ends of the sub line SL are connected to the external electrodes 14b and 14c, respectively. That is, in the electronic component 10f, both ends of the main lines ML and SL are drawn out to the end faces S1 and S2 facing each other.
- the electronic components 10a to 10f shown in the embodiment are not limited to the configurations described above, and can be changed within the scope of the gist.
- the central axes Ax1 and Ax2 overlap with each other when viewed in plan from the z-axis direction.
- the central axes Ax1 and Ax2 do not need to coincide and overlap.
- the degree of coupling between the main line SL and the sub-line ML is set to a desired value by adjusting the distance between the center axes Ax1 and Ax2 without matching the center axes Ax1 and Ax2. You may adjust freely to the state.
- the external electrodes 14a and 14b are provided on the end surface S1 and the external electrodes 14c and 14d are provided on the end surface S2.
- the arrangement of the external electrodes 14a to 14d is not limited thereto. At least one of the external electrodes 14a and 14b may be provided on the end surface S2, and at least one of the external electrodes 14c and 14d may be provided on the end surface S1.
- the present invention is useful for electronic components, and is particularly excellent in that an external electrode can be easily formed and a main line and a sub-line can be coupled with a high degree of coupling.
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Abstract
Description
以下に、本発明の実施形態に係る電子部品の構成について図面を参照しながら説明する。図1は、実施形態に係る電子部品10aの斜視図である。図2は、実施形態に係る電子部品10aの分解斜視図である。以下、電子部品10aの積層方向をz軸方向と定義し、z軸方向から平面視したときに、電子部品10aの長辺に沿った方向をx軸方向と定義し、電子部品10aの短辺に沿った方向をy軸方向と定義する。x軸、y軸及びz軸は互いに直交している。
次に、電子部品10aの製造方法について図1及び図2を参照しながら説明する。
以上のように構成された電子部品10aでは、外部電極14を容易に形成できる。より詳細には、電子部品10aでは、外部電極14は、積層体12の端面S1,S2に設けられている。そのため、積層前のセラミックグリーンシートに対してスクリーン印刷等の方法により外部電極14を形成することができる。すなわち、カット後の小さな積層体12に外部電極14を形成する必要がない。そのため、外部電極14を容易に形成することができる。
以下に、第1の変形例に係る電子部品10bについて図面を参照しながら説明する。図3は、変形例に係る電子部品10b~10dの外観斜視図である。図4は、第1の変形例に係る電子部品10bの分解斜視図である。
以下に、第2の変形例に係る電子部品10cについて図面を参照しながら説明する。図5は、第2の変形例に係る電子部品10cの分解斜視図である。図6は、第2の変形例に係る電子部品10cの回路図である。
以下に、第3の変形例に係る電子部品10dについて図面を参照しながら説明する。図7は、第3の変形例に係る電子部品10dの分解斜視図である。図8は、第3の変形例に係る電子部品10dの回路図である。
以下に、第4の変形例に係る電子部品10eについて図面を参照しながら説明する。図9は、第4の変形例に係る電子部品10eの分解斜視図である。
以下に、第5の変形例に係る電子部品10fについて図面を参照しながら説明する。図10は、第5の変形例に係る電子部品10fの分解斜視図である。
前記実施形態に示した電子部品10a~10fは、説明した構成に限らず、その要旨の範囲内において変更可能である。
Ax1,Ax2 中心軸
C1~C3 コンデンサ
ML 主線路
R1,R2 抵抗器
SL 副線路
Sp1,Sp2 螺旋状部
10a~10f 電子部品
12 積層体
14a~14f 外部電極
16a~16l 絶縁体層
Claims (8)
- 複数の絶縁体層が積層されることにより構成されている積層体と、
積層方向に平行な第1の中心軸を有する第1の螺旋状部を有する主線路と、
前記主線路と電磁気的に結合することにより方向性結合器を構成し、かつ、積層方向に平行な第2の中心軸を有する第2の螺旋状部を有する副線路と、
積層方向の両端に位置している前記積層体の少なくともいずれか一方の端面に設けられ、かつ、前記主線路の両端のそれぞれに電気的に接続されている第1の外部電極及び第2の外部電極と、
積層方向の両端に位置している前記積層体の少なくともいずれか一方の端面に設けられ、かつ、前記副線路の両端のそれぞれに電気的に接続されている第3の外部電極及び第4の外部電極と、
を備えており、
前記主線路が設けられている第1の領域と前記副線路が設けられている第2の領域とは、積層方向において重なっていること、
を特徴とする電子部品。 - 前記第1の螺旋状部と前記第2の螺旋状部とは、積層方向から平面視したときに、重なっていること、
を特徴とする請求項1に記載の電子部品。 - 前記第1の中心軸と前記第2の中心軸とは、積層方向から平面視したときに、重なっていること、
を特徴とする請求項2に記載の電子部品。 - 前記第1の外部電極及び前記第2の外部電極は、前記積層体の一方の端面に設けられており、
前記第3の外部電極及び前記第4の外部電極は、前記積層体の他方の端面に設けられていること、
を特徴とする請求項1ないし請求項3のいずれかに記載の電子部品。 - 前記積層体の端面に設けられている第5の外部電極と、
前記第1の螺旋状部の両端と前記第5の外部電極との間にそれぞれ接続されている第1のコンデンサ及び第2のコンデンサと、
を更に備えていること、
を特徴とする請求項1ないし請求項4のいずれかに記載の電子部品。 - 前記積層体の端面に設けられている第6の外部電極と、
前記第2の螺旋状部の両端と前記第6の外部電極との間にそれぞれ接続されている第1の抵抗器及び第2の抵抗器を、
更に備えていること、
を特徴とする請求項1ないし請求項4のいずれかに記載の電子部品。 - 前記第1の螺旋状部は、第1の信号導体及び第1のビアホール導体が接続されることにより構成されており、
前記第2の螺旋状部は、第2の信号導体及び第2のビアホール導体が接続されることにより構成されており、
前記第1の信号導体の少なくとも一部と前記第2の信号導体の少なくとも一部とは、同じ前記絶縁体層上に設けられていること、
を特徴とする請求項1ないし請求項6いずれかに記載の電子部品。 - 前記複数の絶縁体層の積層方向と回路基板の実装面とが平行となるように回路基板上に実装されること、
を特徴とする請求項1ないし請求項7のいずれかに記載の電子部品。
Priority Applications (3)
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JP2012523789A JP5477469B2 (ja) | 2010-07-06 | 2011-05-12 | 電子部品 |
CN201180032970.4A CN102971905B (zh) | 2010-07-06 | 2011-05-12 | 电子元器件 |
US13/721,144 US8629735B2 (en) | 2010-07-06 | 2012-12-20 | Electronic component |
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JP2010153994 | 2010-07-06 | ||
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US13/721,144 Continuation US8629735B2 (en) | 2010-07-06 | 2012-12-20 | Electronic component |
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WO2012005051A1 true WO2012005051A1 (ja) | 2012-01-12 |
Family
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PCT/JP2011/060957 WO2012005051A1 (ja) | 2010-07-06 | 2011-05-12 | 電子部品 |
Country Status (5)
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US (1) | US8629735B2 (ja) |
JP (1) | JP5477469B2 (ja) |
CN (1) | CN102971905B (ja) |
TW (1) | TWI488354B (ja) |
WO (1) | WO2012005051A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11281338B2 (en) | 2017-03-28 | 2022-03-22 | Flatfrog Laboratories Ab | Touch sensing apparatus and method for assembly |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8358179B2 (en) * | 2009-09-10 | 2013-01-22 | Stats Chippac, Ltd. | Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing |
JP5545369B2 (ja) * | 2010-07-06 | 2014-07-09 | 株式会社村田製作所 | 方向性結合器 |
CN102350672A (zh) * | 2011-10-09 | 2012-02-15 | 伊川县电业局 | 一种可扩大扭矩的助力扳手 |
US20150042412A1 (en) * | 2013-08-07 | 2015-02-12 | Qualcomm Incorporated | Directional coupler circuit techniques |
JP2022043432A (ja) * | 2020-09-04 | 2022-03-16 | 株式会社村田製作所 | 方向性結合器 |
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US20050062557A1 (en) * | 2003-09-24 | 2005-03-24 | Kang Nam Ig | Laminated ceramic coupler |
JP2006191221A (ja) * | 2005-01-04 | 2006-07-20 | Murata Mfg Co Ltd | 方向性結合器 |
US20090128255A1 (en) * | 2007-11-20 | 2009-05-21 | Stmicroelectronics (Tours) Sas | Integrated bidirectional coupler |
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JPH05152814A (ja) | 1991-11-27 | 1993-06-18 | Murata Mfg Co Ltd | チツプ型方向性結合器 |
JP2656000B2 (ja) * | 1993-08-31 | 1997-09-24 | 日立金属株式会社 | ストリップライン型高周波部品 |
JP2642890B2 (ja) | 1994-12-21 | 1997-08-20 | 日立金属株式会社 | 積層型3dB方向性結合器 |
DE69518424T2 (de) * | 1995-10-18 | 2001-03-08 | Koninklijke Philips Electronics N.V., Eindhoven | Verschlüsselungsschaltung für dimmbare Leuchtstofflampen |
JPH11220409A (ja) * | 1998-01-30 | 1999-08-10 | Murata Mfg Co Ltd | アンテナ複合部品 |
JP4360044B2 (ja) * | 2001-05-02 | 2009-11-11 | 株式会社村田製作所 | 積層型方向性結合器 |
US6686812B2 (en) * | 2002-05-22 | 2004-02-03 | Honeywell International Inc. | Miniature directional coupler |
JP5545369B2 (ja) * | 2010-07-06 | 2014-07-09 | 株式会社村田製作所 | 方向性結合器 |
-
2011
- 2011-05-12 CN CN201180032970.4A patent/CN102971905B/zh not_active Expired - Fee Related
- 2011-05-12 JP JP2012523789A patent/JP5477469B2/ja not_active Expired - Fee Related
- 2011-05-12 WO PCT/JP2011/060957 patent/WO2012005051A1/ja active Application Filing
- 2011-05-23 TW TW100117927A patent/TWI488354B/zh not_active IP Right Cessation
-
2012
- 2012-12-20 US US13/721,144 patent/US8629735B2/en not_active Expired - Fee Related
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US5742210A (en) * | 1997-02-12 | 1998-04-21 | Motorola Inc. | Narrow-band overcoupled directional coupler in multilayer package |
JPH11127005A (ja) * | 1997-08-21 | 1999-05-11 | Hitachi Metals Ltd | 積層型方向性結合器 |
US20050062557A1 (en) * | 2003-09-24 | 2005-03-24 | Kang Nam Ig | Laminated ceramic coupler |
JP2006191221A (ja) * | 2005-01-04 | 2006-07-20 | Murata Mfg Co Ltd | 方向性結合器 |
US20090128255A1 (en) * | 2007-11-20 | 2009-05-21 | Stmicroelectronics (Tours) Sas | Integrated bidirectional coupler |
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US11281338B2 (en) | 2017-03-28 | 2022-03-22 | Flatfrog Laboratories Ab | Touch sensing apparatus and method for assembly |
Also Published As
Publication number | Publication date |
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TWI488354B (zh) | 2015-06-11 |
JPWO2012005051A1 (ja) | 2013-09-02 |
CN102971905B (zh) | 2015-01-14 |
CN102971905A (zh) | 2013-03-13 |
US20130106529A1 (en) | 2013-05-02 |
TW201203685A (en) | 2012-01-16 |
JP5477469B2 (ja) | 2014-04-23 |
US8629735B2 (en) | 2014-01-14 |
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