WO2011155730A3 - 컴퓨터부품용 복합냉각장치 - Google Patents
컴퓨터부품용 복합냉각장치 Download PDFInfo
- Publication number
- WO2011155730A3 WO2011155730A3 PCT/KR2011/004090 KR2011004090W WO2011155730A3 WO 2011155730 A3 WO2011155730 A3 WO 2011155730A3 KR 2011004090 W KR2011004090 W KR 2011004090W WO 2011155730 A3 WO2011155730 A3 WO 2011155730A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- water
- computer components
- cooling
- cooling apparatus
- heat
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
본 발명은 컴퓨터부품용 복합냉각장치에 관한 것으로, 더욱 상세하게는 공랭식 냉각효과와 수냉식 냉각효과 이외에도 기화열을 이용한 냉각효과까지 복합적으로 구비함에 따라서 예를 들어 시피유(CPU; 중앙처리유닛), 지피유(GPU), 노스브리지(north bridge), 사우스브리지(south bridge)와 같은 컴퓨터부품으로부터 발열되는 열을 보다 효과적으로 냉각하도록 함으로써 컴퓨터부품의 수명이 더욱 향상될 수 있도록 하는 컴퓨터부품용 복합냉각장치에 관한 것이다. 또한 본 발명의 또 다른 실시예에 따른 복합냉각장치는 수조(100)의 케이스(110) 내부에 배수포트(113)에 인접되는 증발패널(130)이 구비되어, 배수포트(113)를 통해 케이스(110)의 내부로 순환된 물의 일부가 증발패널(130)에서 증발된다. 따라서, 방열기본체(200)에서 열을 흡수한 물의 온도를 낮추어 물이 방열기본체(200)로 재차 공급될 때 냉각효율이 떨어지게 되는 것을 방지할 수 있는 장점이 있다.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100055444 | 2010-06-11 | ||
KR10-2010-0055444 | 2010-06-11 | ||
KR1020100076913A KR101006767B1 (ko) | 2010-06-11 | 2010-08-10 | 컴퓨터부품용 복합냉각장치 |
KR10-2010-0076913 | 2010-08-10 | ||
KR10-2011-0013649 | 2011-02-16 | ||
KR1020110013649A KR101036170B1 (ko) | 2011-02-16 | 2011-02-16 | 컴퓨터부품용 복합냉각장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011155730A2 WO2011155730A2 (ko) | 2011-12-15 |
WO2011155730A3 true WO2011155730A3 (ko) | 2012-03-29 |
Family
ID=45098504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/004090 WO2011155730A2 (ko) | 2010-06-11 | 2011-06-03 | 컴퓨터부품용 복합냉각장치 |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2011155730A2 (ko) |
Families Citing this family (6)
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CN106547327B (zh) * | 2016-11-07 | 2019-03-12 | 湖南文理学院 | 智能控制机箱的冷却装置 |
CN109710043B (zh) * | 2018-12-06 | 2022-04-26 | 鹤壁职业技术学院 | 一种计算机散热装置 |
CN113163665B (zh) * | 2020-12-22 | 2022-06-10 | 潍坊工程职业学院 | 一种计算机柜用风水一体式扇热器 |
CN113757854A (zh) * | 2021-09-14 | 2021-12-07 | 盐城市力马空调工程有限公司 | 一种双冷却***的复合式空调机组 |
CN114115484B (zh) * | 2021-12-11 | 2023-08-25 | 烟台市青方电子科技有限公司 | 一种高散热性能的防尘型网络服务器 |
CN114551380B (zh) * | 2022-02-22 | 2022-12-16 | 江苏晶曌半导体有限公司 | 一种芯片散热装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786778A (ja) * | 1993-09-20 | 1995-03-31 | Fujitsu Ltd | 冷却装置 |
KR20030019849A (ko) * | 2002-02-08 | 2003-03-07 | 쿨랜스코리아 주식회사 | 전자장치의 수냉식 냉각 시스템 |
JP2006039916A (ja) * | 2004-07-27 | 2006-02-09 | Internatl Business Mach Corp <Ibm> | 冷却構造を備えた電子機器、冷却構造物、および電子機器の冷却方法 |
KR20100001505A (ko) * | 2008-06-27 | 2010-01-06 | 한국기계연구원 | 열전소자를 이용한 컴퓨터 내장형 냉각장치 |
JP2010016045A (ja) * | 2008-07-01 | 2010-01-21 | Fujitsu Ltd | 液冷システム、液冷システム部品、及び電子装置の冷却方法 |
KR20100003923U (ko) * | 2008-10-06 | 2010-04-15 | 마지승 | 냉각장치용 방열구조 |
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2011
- 2011-06-03 WO PCT/KR2011/004090 patent/WO2011155730A2/ko active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786778A (ja) * | 1993-09-20 | 1995-03-31 | Fujitsu Ltd | 冷却装置 |
KR20030019849A (ko) * | 2002-02-08 | 2003-03-07 | 쿨랜스코리아 주식회사 | 전자장치의 수냉식 냉각 시스템 |
JP2006039916A (ja) * | 2004-07-27 | 2006-02-09 | Internatl Business Mach Corp <Ibm> | 冷却構造を備えた電子機器、冷却構造物、および電子機器の冷却方法 |
KR20100001505A (ko) * | 2008-06-27 | 2010-01-06 | 한국기계연구원 | 열전소자를 이용한 컴퓨터 내장형 냉각장치 |
JP2010016045A (ja) * | 2008-07-01 | 2010-01-21 | Fujitsu Ltd | 液冷システム、液冷システム部品、及び電子装置の冷却方法 |
KR20100003923U (ko) * | 2008-10-06 | 2010-04-15 | 마지승 | 냉각장치용 방열구조 |
Also Published As
Publication number | Publication date |
---|---|
WO2011155730A2 (ko) | 2011-12-15 |
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