WO2011155730A3 - Hybrid cooling apparatus for computer components - Google Patents

Hybrid cooling apparatus for computer components Download PDF

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Publication number
WO2011155730A3
WO2011155730A3 PCT/KR2011/004090 KR2011004090W WO2011155730A3 WO 2011155730 A3 WO2011155730 A3 WO 2011155730A3 KR 2011004090 W KR2011004090 W KR 2011004090W WO 2011155730 A3 WO2011155730 A3 WO 2011155730A3
Authority
WO
WIPO (PCT)
Prior art keywords
water
computer components
cooling
cooling apparatus
heat
Prior art date
Application number
PCT/KR2011/004090
Other languages
French (fr)
Korean (ko)
Other versions
WO2011155730A2 (en
Inventor
이광로
Original Assignee
Lee Kwang-Ro
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100076913A external-priority patent/KR101006767B1/en
Priority claimed from KR1020110013649A external-priority patent/KR101036170B1/en
Application filed by Lee Kwang-Ro filed Critical Lee Kwang-Ro
Publication of WO2011155730A2 publication Critical patent/WO2011155730A2/en
Publication of WO2011155730A3 publication Critical patent/WO2011155730A3/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Abstract

The present invention relates to a hybrid cooling apparatus for computer components, and more particularly, to a hybrid cooling apparatus for computer components which uses the combined cooling effects of air cooling and water cooling, as well as the cooling effects obtained through the heat of vaporization, in order to extend the life of computer components by more effectively dissipating heat emitted from computer components such as the CPU (Central Processing Unit), the GPU, the north bridge, and the south bridge. Also, a hybrid cooling apparatus according to another embodiment of the present invention comprises an evaporation panel (130) adjacent to the water discharge port (113) within the case (110) of the water tank (100), and a portion of the water that is circulated through the water discharge port (113) into the case (110) is evaporated on the evaporation panel (130). Accordingly, the temperature of the water that has absorbed heat from the heat dissipating main body (200) is lowered, so as to prevent the reduction in cooling efficiency when the water is re-supplied to the heat dissipating main body (200).
PCT/KR2011/004090 2010-06-11 2011-06-03 Hybrid cooling apparatus for computer components WO2011155730A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20100055444 2010-06-11
KR10-2010-0055444 2010-06-11
KR1020100076913A KR101006767B1 (en) 2010-06-11 2010-08-10 Multi-cooling apparatus for computer's part
KR10-2010-0076913 2010-08-10
KR1020110013649A KR101036170B1 (en) 2011-02-16 2011-02-16 Multi-cooling apparatus for computer's part
KR10-2011-0013649 2011-02-16

Publications (2)

Publication Number Publication Date
WO2011155730A2 WO2011155730A2 (en) 2011-12-15
WO2011155730A3 true WO2011155730A3 (en) 2012-03-29

Family

ID=45098504

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/004090 WO2011155730A2 (en) 2010-06-11 2011-06-03 Hybrid cooling apparatus for computer components

Country Status (1)

Country Link
WO (1) WO2011155730A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106547327B (en) * 2016-11-07 2019-03-12 湖南文理学院 The cooling device of intelligent control cabinet
CN109710043B (en) * 2018-12-06 2022-04-26 鹤壁职业技术学院 Computer heat abstractor
CN113163665B (en) * 2020-12-22 2022-06-10 潍坊工程职业学院 Wind-water integrated fan heater for computer cabinet
CN113757854A (en) * 2021-09-14 2021-12-07 盐城市力马空调工程有限公司 Combined type air conditioning unit with double cooling systems
CN114115484B (en) * 2021-12-11 2023-08-25 烟台市青方电子科技有限公司 Dustproof network server with high heat dissipation performance
CN114551380B (en) * 2022-02-22 2022-12-16 江苏晶曌半导体有限公司 Chip heat dissipation device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786778A (en) * 1993-09-20 1995-03-31 Fujitsu Ltd Cooling equipment
KR20030019849A (en) * 2002-02-08 2003-03-07 쿨랜스코리아 주식회사 The water cooling system for electronic device
JP2006039916A (en) * 2004-07-27 2006-02-09 Internatl Business Mach Corp <Ibm> Electronic apparatus having cooling configuration, cooling structure, and method for cooling electronic apparatus
KR20100001505A (en) * 2008-06-27 2010-01-06 한국기계연구원 Embeded cooling system for computer based thermoelectric module
JP2010016045A (en) * 2008-07-01 2010-01-21 Fujitsu Ltd Liquid cooling system, liquid cooling system component, and cooling method of electronic device
KR20100003923U (en) * 2008-10-06 2010-04-15 마지승 Radiation member structure for cooling device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786778A (en) * 1993-09-20 1995-03-31 Fujitsu Ltd Cooling equipment
KR20030019849A (en) * 2002-02-08 2003-03-07 쿨랜스코리아 주식회사 The water cooling system for electronic device
JP2006039916A (en) * 2004-07-27 2006-02-09 Internatl Business Mach Corp <Ibm> Electronic apparatus having cooling configuration, cooling structure, and method for cooling electronic apparatus
KR20100001505A (en) * 2008-06-27 2010-01-06 한국기계연구원 Embeded cooling system for computer based thermoelectric module
JP2010016045A (en) * 2008-07-01 2010-01-21 Fujitsu Ltd Liquid cooling system, liquid cooling system component, and cooling method of electronic device
KR20100003923U (en) * 2008-10-06 2010-04-15 마지승 Radiation member structure for cooling device

Also Published As

Publication number Publication date
WO2011155730A2 (en) 2011-12-15

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