WO2011155730A3 - Hybrid cooling apparatus for computer components - Google Patents
Hybrid cooling apparatus for computer components Download PDFInfo
- Publication number
- WO2011155730A3 WO2011155730A3 PCT/KR2011/004090 KR2011004090W WO2011155730A3 WO 2011155730 A3 WO2011155730 A3 WO 2011155730A3 KR 2011004090 W KR2011004090 W KR 2011004090W WO 2011155730 A3 WO2011155730 A3 WO 2011155730A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- water
- computer components
- cooling
- cooling apparatus
- heat
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The present invention relates to a hybrid cooling apparatus for computer components, and more particularly, to a hybrid cooling apparatus for computer components which uses the combined cooling effects of air cooling and water cooling, as well as the cooling effects obtained through the heat of vaporization, in order to extend the life of computer components by more effectively dissipating heat emitted from computer components such as the CPU (Central Processing Unit), the GPU, the north bridge, and the south bridge. Also, a hybrid cooling apparatus according to another embodiment of the present invention comprises an evaporation panel (130) adjacent to the water discharge port (113) within the case (110) of the water tank (100), and a portion of the water that is circulated through the water discharge port (113) into the case (110) is evaporated on the evaporation panel (130). Accordingly, the temperature of the water that has absorbed heat from the heat dissipating main body (200) is lowered, so as to prevent the reduction in cooling efficiency when the water is re-supplied to the heat dissipating main body (200).
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100055444 | 2010-06-11 | ||
KR10-2010-0055444 | 2010-06-11 | ||
KR1020100076913A KR101006767B1 (en) | 2010-06-11 | 2010-08-10 | Multi-cooling apparatus for computer's part |
KR10-2010-0076913 | 2010-08-10 | ||
KR1020110013649A KR101036170B1 (en) | 2011-02-16 | 2011-02-16 | Multi-cooling apparatus for computer's part |
KR10-2011-0013649 | 2011-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011155730A2 WO2011155730A2 (en) | 2011-12-15 |
WO2011155730A3 true WO2011155730A3 (en) | 2012-03-29 |
Family
ID=45098504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/004090 WO2011155730A2 (en) | 2010-06-11 | 2011-06-03 | Hybrid cooling apparatus for computer components |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2011155730A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106547327B (en) * | 2016-11-07 | 2019-03-12 | 湖南文理学院 | The cooling device of intelligent control cabinet |
CN109710043B (en) * | 2018-12-06 | 2022-04-26 | 鹤壁职业技术学院 | Computer heat abstractor |
CN113163665B (en) * | 2020-12-22 | 2022-06-10 | 潍坊工程职业学院 | Wind-water integrated fan heater for computer cabinet |
CN113757854A (en) * | 2021-09-14 | 2021-12-07 | 盐城市力马空调工程有限公司 | Combined type air conditioning unit with double cooling systems |
CN114115484B (en) * | 2021-12-11 | 2023-08-25 | 烟台市青方电子科技有限公司 | Dustproof network server with high heat dissipation performance |
CN114551380B (en) * | 2022-02-22 | 2022-12-16 | 江苏晶曌半导体有限公司 | Chip heat dissipation device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786778A (en) * | 1993-09-20 | 1995-03-31 | Fujitsu Ltd | Cooling equipment |
KR20030019849A (en) * | 2002-02-08 | 2003-03-07 | 쿨랜스코리아 주식회사 | The water cooling system for electronic device |
JP2006039916A (en) * | 2004-07-27 | 2006-02-09 | Internatl Business Mach Corp <Ibm> | Electronic apparatus having cooling configuration, cooling structure, and method for cooling electronic apparatus |
KR20100001505A (en) * | 2008-06-27 | 2010-01-06 | 한국기계연구원 | Embeded cooling system for computer based thermoelectric module |
JP2010016045A (en) * | 2008-07-01 | 2010-01-21 | Fujitsu Ltd | Liquid cooling system, liquid cooling system component, and cooling method of electronic device |
KR20100003923U (en) * | 2008-10-06 | 2010-04-15 | 마지승 | Radiation member structure for cooling device |
-
2011
- 2011-06-03 WO PCT/KR2011/004090 patent/WO2011155730A2/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0786778A (en) * | 1993-09-20 | 1995-03-31 | Fujitsu Ltd | Cooling equipment |
KR20030019849A (en) * | 2002-02-08 | 2003-03-07 | 쿨랜스코리아 주식회사 | The water cooling system for electronic device |
JP2006039916A (en) * | 2004-07-27 | 2006-02-09 | Internatl Business Mach Corp <Ibm> | Electronic apparatus having cooling configuration, cooling structure, and method for cooling electronic apparatus |
KR20100001505A (en) * | 2008-06-27 | 2010-01-06 | 한국기계연구원 | Embeded cooling system for computer based thermoelectric module |
JP2010016045A (en) * | 2008-07-01 | 2010-01-21 | Fujitsu Ltd | Liquid cooling system, liquid cooling system component, and cooling method of electronic device |
KR20100003923U (en) * | 2008-10-06 | 2010-04-15 | 마지승 | Radiation member structure for cooling device |
Also Published As
Publication number | Publication date |
---|---|
WO2011155730A2 (en) | 2011-12-15 |
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