WO2011153961A1 - Qfn封装器件切割用烧结金属基金刚石锯刀的制备方法 - Google Patents

Qfn封装器件切割用烧结金属基金刚石锯刀的制备方法 Download PDF

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WO2011153961A1
WO2011153961A1 PCT/CN2011/075590 CN2011075590W WO2011153961A1 WO 2011153961 A1 WO2011153961 A1 WO 2011153961A1 CN 2011075590 W CN2011075590 W CN 2011075590W WO 2011153961 A1 WO2011153961 A1 WO 2011153961A1
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saw blade
cutting
sintered metal
diamond saw
metal
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PCT/CN2011/075590
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English (en)
French (fr)
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南俊马
徐可为
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西安交通大学
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Priority to US13/703,348 priority Critical patent/US9221153B2/en
Publication of WO2011153961A1 publication Critical patent/WO2011153961A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/006—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds being carbides
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/008—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds other than carbides, borides or nitrides

Definitions

  • the invention relates to the field of manufacturing superhard material tools, in particular to a high-performance metal-based diamond composite material for semiconductor QFN (Quad Flat No-lead) packaged device and a preparation method thereof for high-precision thin saw blade products.
  • QFN Quad Flat No-lead
  • the QFN package is one of the mainstream technologies in today's high-end semiconductor package testing, and has obvious advantages in the development of IC devices toward high-density integration, reduced form factor, enhanced heat dissipation, and improved electrical performance.
  • the QFN package substrate is molded by a copper guide frame and a resin-based polymer, which encapsulates one or more chip dies arranged in a stacked or tiling manner and associated interconnect leads, and has an overall thickness of 0.8-1.0. Within the range of mm.
  • the copper guide frame is about 0.2mm thick, and the surface is usually coated with 0.02mm thick tin or nickel alloy; the polymer has a thickness of 0.6-0.8 mm, and the inorganic filler such as Si 2 0 3 or Al 2 0 3 particles is filled with epoxy resin. Composition.
  • the saw blade is a diamond tool similar to a grinding wheel. It is mainly composed of diamond abrasive grains and a binder carcass. It is usually installed on a special dicing machine and relies on a saw blade.
  • the exposed diamond particles are linearly cut to the package substrate to obtain a single chip whose cutting quality meets the requirements of use, and the outer shape is usually changed within 3x3-7x7mm.
  • the tolerances such as the shape and size of a single chip and related defects such as chipping and scratching are the basic control indicators of the online cutting quality, which are easy to implement under normal conditions.
  • the key is to control the longitudinal extent of the copper leads in the thickness direction (Burr burrs) and the lateral extent in the cutting direction (Smearing smears).
  • the current industry general requirement is Burr ⁇ 50 m, Smearing
  • ⁇ 1/3-1/2 Pitch pays attention to the changes of these two indicators, mainly because the former affects the adaptability of each chip and the test connector. If the adapter is not properly adapted, the normal test cannot be performed smoothly. The second product; the latter may lead to short circuit of the interconnect line, damage the function that the chip should have. If the cutting heat generated during the cutting process is too large, the copper lead, especially the tin plating layer, may be softened or burnt, which may cause the chip to be scrapped, which should be strictly eliminated. Thermosetting resin-based diamond saw blades are the only choice for cutting QFN packaged devices in the industry today.
  • the disadvantages of the resin-based sawing knife itself are particularly obvious, mainly in two aspects.
  • the carcass has very limited holding force on the diamond, and it is affected by its own anti-wear property.
  • the particles are easily peeled off prematurely, resulting in excessive wear and tear.
  • the length of the cut is seriously insufficient, and the number of kilometers is up and down, but less than half. Does not help to reduce production costs.
  • the feed rate of the workpiece subjected to the resin-based saw blade is usually set within the range of 35-45 mm/s. If this setting is exceeded, the cutting quality of the chip will be reduced, and the saw blade will be worn or even cause abnormal failure. These are due to the characteristics of the carcass composition material.
  • Resin-based saw blades are limited by their own material properties and their preparation process. It is difficult to increase the cutting efficiency and extend the service life. Therefore, it is necessary to seek and develop new substitutes to promote the cutting of QFN packaged devices. Upgrade of saw blade products.
  • the sintered metal-based saw blade has the advantage that the metal matrix is almost alloyed by hot press sintering, and the elastic mold is imparted by the strengthening effect of forming a metal compound having a complicated lattice structure.
  • the mechanical properties of large amount, high yield strength and strong wear resistance enhance the tight packing of the metal carcass and the diamond particles, establishing a strong holding mechanism between the two, and there is no obvious gap between the metal carcass and the diamond.
  • the surface of the diamond detachment pit is almost smooth and smooth.
  • This combination mechanism not only firmly holds the diamond particles, but also promotes the formation of a high cutting edge, which ensures the sharpness of the saw cutting, and along the direction of rotation, it is easy to form a large chip pocket in front of the diamond cutting edge. , effectively prevents debris from clogging and enhances cooling and cooling capability.
  • the invention is based on the semiconductor high-end package testing field, and the IC chip package which is generally formed by injection molding of a copper guiding frame and a polymer polymer for the QFN packaging technology, in order to overcome the working condition of the saw cutting method, in order to overcome the existing Technical shortcomings and deficiencies, aiming to provide a sintered gold
  • the method for preparing a base diamond saw blade, the sintered metal-based diamond saw blade obtained by the method has the characteristics of long service life and high cutting efficiency.
  • a method for preparing a sintered metal-based diamond saw blade for cutting a QFN package device is mainly carried out in the following steps.
  • the metal matrix carcass is prepared in a ratio of 95 to 98 parts by weight of the metal powder and 2 to 5 parts by weight of the inorganic filler, wherein the metal powder is composed of Cu, Co and Sn, and the inorganic filler is composed of particulate SiC and Al 2 O 3 .
  • the diamond particles subjected to sieving and descaling are added, and after stirring for 2-3 hours, a mixture of uniform composition and uniform distribution of diamond is obtained, and then The granulation process results in a particle composite having an average size of less than 1 mm.
  • the diamond has a particle size of 25-75 ⁇ and a concentration of 45-78%.
  • the above mixture is uniformly distributed in a steel mold, sealed, placed under a press and subjected to a pressure of 50-75 MPa to obtain a formed compact, which is placed in a graphite or steel mold for hot pressing sintering after inspection.
  • the hot pressing mold and the blank workpiece are integrally moved into the sintering furnace, and passed under the process conditions of heating rate of 50-70 ° C / min, sintering temperature of 600-800 ° C, pressing pressure of 25-35 MPa, and holding pressure holding time of 6-8 min.
  • the sintered metal-based diamond saw blade blank was prepared by hot pressing and uncooled to room temperature.
  • the inner hole and the outer circle are machined to the required size by a slow wire machine to meet the assembly requirements; the double-sided grinding machine is used to reduce the thickness of the saw blank to the required thickness with free SiC abrasive. Finally, a diamond saw blade that meets the size requirements is produced.
  • the metal-based diamond saw blade prepared by the hot press sintering technology has the advantages of simple process flow and stable product quality.
  • a strong interfacial metallurgical bond between the metal and the diamond is formed by the chemical reaction, which enhances the holding force of the carcass on the diamond particles, so that the abrasive grains are not easily peeled off prematurely in the cutting processing device, thereby effectively improving The service life of metal-based diamond saw blades.
  • a method for preparing a sintered metal-based diamond saw blade for cutting a QFN package device is carried out according to the following steps:
  • a metal carcass is prepared in a ratio of 98 parts by weight of the metal powder and 2 parts by weight of the inorganic filler, wherein the metal powder is composed of 25 parts by weight of Cu, 8 parts by weight of Sn, and 65 parts by weight of Co, and the inorganic filler is composed of 1 part by weight of granular SiC and 1 part by weight of Al 2 0 3 ;
  • the above metal powder and inorganic filler are placed in a vortex mixer and stirred for 3.5 hours to homogenize, and then added to the sieve for descaling.
  • the diamond particles were stirred for 2 hours to obtain a mixture of uniform composition and uniform diamond.
  • the diamond particles had a volume percent concentration of 50%, a particle size of 45 ⁇ M, and a metal powder particle size of 325 mesh.
  • the above mixture is evenly distributed in the steel mold grinding tool, sealed and placed on the press plate of the press, raised to contact with the upper pressing plate and applied with a pressure of 50 MPa and held for 3 s to obtain a shaped compact, and then the forming pressure is applied.
  • the blank is placed in a graphite mold.
  • the hot pressing mold and the whole workpiece are moved into the sintering furnace, and the hot pressing sintering process is set according to the process parameters of the molding pressure 30 MPa, the heating rate 50 ° C / min, the sintering temperature 600 ° C, the holding pressure holding time 8 min, and the hot pressing sintering is prepared.
  • the metal sintered diamond saw blade blank was finally unloaded and air cooled to room temperature.
  • Shape cutting After removing the burr from the saw blank, the inner hole and the outer circle are machined to the required size by a slow wire machine to meet the assembly requirements, wherein the inner hole has an accuracy of H5 and the outer circle tolerance is ⁇ 0.005 mm ; the thickness is reduced: Using a double-sided grinding machine to reduce the thickness of the saw blade to the required thickness and accuracy ⁇ 0.003 mm with free SiC abrasive, and finally to obtain a diamond saw blade that meets the size requirements.
  • the QFN packaged chip was cut on a special dicing machine with a saw blade, and the chip size was 6x6x0.75mm. Under the condition of spindle speed 25Krpm, feed rate 30mm/s and cooling water flow rate 2.0L/min, the on-line cutting quality index of the chip is fully satisfied, especially the burr in the thickness direction is less than 15 ⁇ , on the side of the The extension is less than a quarter of the lead pitch. After repeated tests, the average effective cutting length is 1900m, which is more than 2.3 times that of the user's current resin-based saw blade.
  • a method for preparing a sintered metal-based diamond saw blade for cutting a QFN package device is carried out according to the following steps:
  • a metal matrix carcass is prepared in a ratio of 95 parts by weight of the metal powder and 5 parts by weight of the inorganic filler, wherein the metal powder includes 28 parts by weight of Cu, 7 parts by weight of Sn, 60 parts by weight of Co, and the inorganic filler includes 2 parts by weight of SiC and 3 parts by weight of Al 2 0 3; secondly, the above metal
  • the powder and the inorganic filler were placed in a vortex mixer for 4 hours to be homogenized, and then the diamond particles subjected to sieving and descaling were added, and after stirring for 2 hours, a mixture of uniform components and uniform diamond was obtained.
  • the diamond particles had a volume percent concentration of 60%, a particle size of 55 ⁇ m, and a metal powder particle size of 400 mesh.
  • the above mixture is evenly distributed in a steel mold, sealed, placed on a press plate under the press, raised to contact with the upper platen and applied with a pressure of 55 MPa and held for 3 s to obtain a formed compact, and then the formed compact is placed In the graphite mold.
  • the hot pressing mold and the whole workpiece are moved into the sintering furnace, and the hot pressing sintering process is set according to the process parameters of the molding pressure 35 MPa, the heating rate of 60 ° C / min, the sintering temperature of 650 ° C, and the holding pressure holding time of 7 min, and the hot pressing sintering system is adopted.
  • a metal sintered diamond saw blade blank was obtained, and finally air-cooled to room temperature.
  • Shape cutting After removing the burr from the saw blank, the inner hole and the outer circle are machined to the required size by a slow wire machine to meet the assembly requirements, wherein the inner hole has an accuracy of H5 and the outer circle tolerance is ⁇ 0.005 mm ; the thickness is reduced: The saw blade blank was ground to a desired thickness and accuracy of ⁇ 0.003 mm using a double-sided free SiC abrasive on a precision grinding machine to finally produce a diamond saw blade that meets the dimensional requirements.
  • the prepared saw blade was cut on a special slitter to cut the QFN package chip, and the chip size was 6x6x0.75mm.
  • the on-line cutting quality index of the chip is fully satisfied, especially the burr size in the thickness direction is 16 ⁇ on average.
  • the extension is less than a quarter of the lead pitch.
  • the average effective cutting length is 2100m, which is more than 2.5 times that of the user's current resin-based saw blade.
  • a method for preparing a sintered metal-based diamond saw blade for cutting a QFN package device is carried out according to the following steps:
  • a metal carcass is prepared in a ratio of 97 parts by weight of the metal powder and 3 parts by weight of the inorganic filler, wherein the metal powder includes 32 parts by weight of Cu, 6 parts by weight of Sn, 59 parts by weight of Co, and the inorganic filler includes 1 Parts by weight of SiC and 2 parts by weight of Al 2 O 3;
  • the above metal powder and inorganic filler are placed in a vortex mixer and mixed by wet mixing for 4.5 hours to homogenize, and then sieved and descaled diamond particles are added. After stirring for 2.5 hours, a mixture of uniform components and uniform diamond was obtained.
  • the diamond particles had a volume percent concentration of 70%, a particle size of 65 ⁇ m, and a metal powder particle size of 325 mesh.
  • the above mixture is evenly distributed in a steel mold, sealed, placed on a lower press plate of a cold press, raised to contact with the upper press plate and subjected to a pressure of 60 MPa and held for 2 s to obtain a formed compact, and then the formed compact is placed In the graphite mold.
  • the hot pressing mold and the whole workpiece are moved into the sintering furnace, and the hot pressing sintering process is set according to the process parameters of the molding pressure 30 MPa, the heating rate 50 ° C / min, the sintering temperature 700 ° C, the holding pressure holding time 6 min, and the hot pressing sintering is prepared.
  • the metal sintered diamond saw blade blank was finally unloaded and air cooled to room temperature.
  • Shape cutting After removing the burr from the saw blank, the inner hole and outer circle are machined to the required size by the slow wire machine to meet the assembly requirements, wherein the inner hole precision is H5 and the outer circle tolerance is ⁇ 0.005mm ;
  • Thickness reduction grinding the saw blank with suspended free SiC abrasive on a double-sided grinding machine to the required thickness With a degree and accuracy of ⁇ 0.003mm, the diamond saw blade that meets the dimensional requirements is finally produced.
  • a method for preparing a sintered metal-based diamond saw blade for cutting a QFN package device is carried out according to the following steps:
  • a metal matrix carcass is prepared in a ratio of 96 parts by weight of the metal powder and 4 parts by weight of the inorganic filler, wherein the metal powder includes 36 parts by weight of Cu, 5 parts by weight of Sn, and 55 parts by weight of Co, and the inorganic filler includes 2 parts by weight of SiC and 2 parts by weight of Al 2 O 3;
  • the above metal powder and inorganic filler are placed in a vortex mixer for 4 hours to be homogenized, and then sieved and descaled diamond particles are added. After stirring for 2 hours, a mixture of uniform composition and uniform diamond was obtained.
  • the diamond particles have a volume percent concentration of 75%, a particle size of 75 ⁇ m, and a metal powder particle size of 400 mesh.
  • the above mixture is evenly distributed in a steel mold, sealed, placed on a press plate under the press, raised to contact with the upper platen and subjected to a pressure of 70 MPa and held for 2 s to obtain a shaped compact, and then the formed compact is placed In the graphite mold.
  • the hot pressing mold and the whole workpiece are moved into the sintering furnace, and the molding pressure is 30 MPa, and the heating rate is increased.
  • the process parameters of 65 ° C / min, sintering temperature 750 ° C, holding temperature retention time of 6 min set the hot pressing sintering process, the diamond sintered diamond saw blade blank was prepared by hot pressing sintering, and finally uncooled to room temperature.
  • Shape processing After removing the burr from the saw blank, the inner hole and the outer circle are machined to the required size by a slow wire machine to meet the assembly requirements, wherein the inner hole has an accuracy of H5 and the outer circle tolerance is ⁇ 0.005 mm.
  • Thickness reduction The saw blank was ground with a free SiC abrasive on a double-sided grinding machine to a desired thickness and accuracy of ⁇ 0.003 mm, and finally a diamond saw blade meeting the dimensional requirements was produced.
  • the QFN packaged chip was cut on a special dicing machine with a saw blade, and the chip size was 6x6x0.75mm. Under the cutting conditions of spindle rotation speed of 25Krpm, feed speed of 50mm/s and cooling water flow rate of 2.0L/min, the on-line cutting quality index of the chip is fully satisfied, especially in the thickness direction, the burr of the lead is less than 20 ⁇ , and it is laterally extended. The amount does not exceed 30 ⁇ , and it has been repeatedly tested that the average effective cutting length can reach 2500m on average, which is more than three times that of the user's current resin-based saw blade.

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Description

QFN封装器件切割用烧结金属基金刚石锯刀的制备方法 技术领域
本发明涉及超硬材料工具制造领域， 特别涉及一种半导体 QFN (Quad Flat No-lead) 封装器件切割用高性能金属基金刚石复合材料及其高精度薄 型锯刀产品的制备方法。 背景技术
QFN封装是当今半导体高端封装测试领域内的主流技术之一， 在 IC器 件朝着高密度集成、 减小外形尺寸、 增强散热能力、 提高电学性能的发展方 向上具有明显优势。
QFN 封装基板是由铜引导框与树脂类聚合物模压注塑而成， 其内包封 了一个或多个以堆叠或平铺排布的芯片晶粒及其相关的互连引线， 总体厚度 在 0.8-1.0mm范围内。 其中铜引导框厚约 0.2mm， 表面通常覆镀 0.02mm 厚的锡或镍合金； 聚合物厚度为 0.6-0.8 mm, 并由环氧树脂填充无机填料 如 Si203或 Al203颗粒构成。 IC芯片晶粒经 QFN封装后， 为能获得在终端设备上的应用， 必须进行 每个独立功能芯片的单体化分割加工， 这是半导体产业链迄今不可逾越的一 道重要作业工序。
锯式切割是当前执行此工序的主导方法，所用锯刀是一种类似于砂轮片 的金刚石工具， 主要由金刚石磨粒和结合剂胎体组成， 通常被安装在专用划 片机上， 依靠锯刀刃部出露的金刚石颗粒对封装基板实施线性切割， 以获得 切割质量符合使用要求的单体芯片，其外形尺寸通常在 3x3-7x7mm内变化。 基于终端使用要求， 单个芯片的形状、 尺寸等公差及其相关的崩边、 划 痕等缺陷作为在线切割质量的基本控制指标， 通常工况下均易实现。但关键 是控制在厚度方向上铜引线的纵向伸出量（Burr毛刺）和在切割方向上的横 向延展量 （Smearing拖尾）。 目前行业大体要求是 Burr<50 m， Smearing
< 1/3-1/2 Pitch 如此看重这两项指标的变化， 主要是前者影响每个芯片与 测试连接器的适配性， 如适配不良也就无法顺利实施正常的测试， 从而视为 次品； 而后者则有可能导致互联线的短路， 损坏芯片应具有的使用功能。 此 外切割过程中如产生的切削热过大， 则可能导致铜引线特别是锡镀层软化乃 至烧熔， 从而使得芯片报废， 这是应严格杜绝的现象。 热固性树脂基金刚石锯刀作为当今业界切割 QFN 封装器件的唯一选 择， 有其显著的优点， 主要表现在径向与侧面良好的匹配磨损， 呈现近乎平 直过渡的刃部形貌， 保证了芯片的几何外形及尺寸要求， 并具有很强的金刚 石自锐能力， 切割锋利， 抑制了铜引线毛刺、 拖尾及翻边的产生与增大， 且 易形成较高的出刃度和较大的容屑空间， 有利于冷却及排屑， 不易堵塞， 防 止了因磨削过热而产生的粘刀或烧熔现象。
但从半导体封测产业发展需求看， 与目前行业普遍使用烧结金属基金刚 石锯刀切割 BGA ( Ball Grid Array) 封装体相比， 树脂基锯刀本身存在的弊 端尤为明显， 主要表现在两方面， 一是胎体对金刚石把持力非常有限， 并受 其自身抗磨性差的影响， 颗粒极易过早剥落， 导致磨损消耗过快， 切割长度 严重不足， 多则千米上下， 少则不过半数， 无助于降低生产成本。 常以提高 金刚石浓度 080%) 和增大颗粒尺寸 （45-75μΓΠ ) 延长使用寿命， 但收效 甚微； 另一是容易产生崩刃或脆裂等现象， 限制了切割效率的提升。 在实际 生产中，树脂基锯刀所承受的工件进给速度通常设定在 35-45mm/s范围内， 超过此设定， 轻则导致芯片切割质量下降， 重则加快锯刀磨损甚至引起异常 失效。 这些都缘于胎体组成材料的特性。
树脂基锯刀受限于自身料性及其制备工艺，在提高切割效率和延长使用 寿命方面难有更大的提升空间， 故有必要寻求并开发新的替代品， 以推动 QFN封装器件切割用锯刀产品的升级换代。
与树脂基锯刀相比， 烧结金属基锯刀的优势在于通过热压烧结， 金属胎 体几乎达到合金化程度，借助形成具有复杂点阵结构的金属化合物起到的强 化作用， 赋予了弹性模量大、 屈服强度高、 抗磨性强等力学特性， 从而增强 了金属胎体与金刚石颗粒的紧密包镶， 建立了两者之间的强力把持机制， 金 属胎体与金刚石结合处无明显缝隙， 金刚石脱落坑表面近乎平整光滑。 这种 结合机制不仅牢固的地把持了金刚石颗粒， 也促使其形成高的出刃度， 保证 了锯刀切割的锋利性， 且沿着旋转方向， 易在金刚石切削刃前形成较大的容 屑槽， 有效地防止了碎屑堵塞并增强了冷却散热能力。
因此， 探索该类锯刀的配方构成体系及其与之相适应制备技术， 在保证 芯片在线切割质量的前提下， 大幅提高加工效率或延长使用寿命， 将有利于 降低生产成本。 正是基于此应用背景， 提出本发明对支撑 IC封测产业发展 具有重要意义。 发明内容
本发明立足向半导体高端封装测试领域， 针对 QFN封装技术普遍以铜 引导框架与高分子聚合物注塑模压而成的 IC芯片封装体， 在满足锯式切割 方法的工况要求下， 为了克服现有技术的缺点和不足， 旨在提供一种烧结金 属基金刚石锯刀的制备方法，使用该方法制得的烧结金属基金刚石锯刀具有 使用寿命长、 切割效率高等特点。
为了实现上述发明目的， 本发明所采用以下技术方案：
一种 QFN封装器件切割用烧结金属基金刚石锯刀的制备方法， 主要按 以下歩骤进行。
( 1 ) 组成设计与配制
按照 95-98重量份金属粉末和 2-5重量份无机填料的配比配制金属基胎 体， 其中金属粉末由 Cu、 Co和 Sn组成， 无机填料由颗粒状 SiC和 Al203 组成。 将上述混合料置于混料机中湿混搅拌 3-5h使其均匀化后， 加入经过 筛分除垢的金刚石颗粒，搅拌 2-3h后获得成分均匀及金刚石均布的混合料， 再经制粒工序获得平均尺寸小于 1 mm的颗粒复合体。 其中金刚石的粒度为 25-75μΓΠ , 浓度为 45-78%。
(2) 冷压预成形
将上述混合料均布于钢制模具中， 封盖后放于压机下并施加 50-75MPa 的压力制得成形压坯， 经检验后置于石墨或钢制模具中以备热压烧结。
(3) 热压烧结
将热压模具连同毛坯工件整体移入烧结炉内，在升温速率 50-70°C/min、 烧结温度 600-800°C， 压制压力 25-35MPa、 保温保压时间 6-8min的工艺 条件下通过热压烧结制成烧结金属基金刚石锯刀毛坯， 卸载空冷至室温。
(4) 加工成型
锯刀毛坯去除毛刺后利用慢走丝机床将其内孔、外圆加工到所需尺寸以 满足装配需要； 利用双面磨床以游离 SiC磨料减薄锯刀毛坯到要求的厚度， 最终制得满足尺寸要求的金刚石锯刀。
与业界通用的 QFN封装器件切割用树脂基金刚石锯刀的制备方法相比 较， 通过热压烧结技术制备金属基金刚石锯刀具有工艺流程简单、 产品质量 稳定的特点。 藉助热压烧结工艺优势， 经化学反应在金属和金刚石之间形成 牢固的界面冶金结合， 增强胎体对金刚石颗粒的把持力， 使磨粒在切割加工 器件不易过早脱落， 从而有效的提高了金属基金刚石锯刀的使用寿命。 具体实施方式
下面结合实施例对本发明进行详细说明。 实施例 1
一种 QFN封装器件切割用烧结金属基金刚石锯刀的制备方法， 按以下 歩骤进行：
( 1 ) 组成设计与配制
首先， 按 98重量份的金属粉末和 2重量份的无机填料的配比配制金属 胎体， 其中金属粉末由 25重量份的 Cu、 8重量份的 Sn、 65重量份的 Co 组成， 无机填料由 1重量份的粒状 SiC和 1重量份的 Al203组成； 其次， 将 上述金属粉末和无机填料置于涡流混料机中湿混搅拌 3.5h使其均匀化， 然 后加入经过筛分除垢金刚石颗粒， 搅拌 2h后获得成分均匀及金刚石均布的 混合料。 金刚石颗粒的体积百分比浓度为 50%， 粒度为 45μΓΠ， 金属粉末粒 度为 325目。
(2) 冷压预成形
将上述混合料均匀布于钢模磨具中， 封盖后放于压机的压板上， 提升至 与上压板接触并施加 50MPa的压力并保压 3s制得成形压坯，然后将成形压 坯置于石墨模具中。
(3) 热压烧结
将热压模具连同工件整体移入烧结炉内， 按模压压力 30MPa、 升温速 率 50°C/min、 烧结温度 600°C、 保温保压时间 8min的工艺参数设置热压烧 结工艺，通过热压烧结制备金属烧结金刚石锯刀毛坯，最后卸载空冷至室温。
(4) 加工成型
外形切割： 锯刀毛坯去除毛刺后利用慢走丝机床将其内孔、 外圆加工到 所需尺寸以满足装配需要， 其中内孔精度为 H5， 外圆公差为 ±0.005mm; 厚度减薄：利用双面磨床以游离 SiC磨料减薄锯刀毛坯到要求的厚度及 精度 ±0.003mm， 最终制得满足尺寸要求的金刚石锯刀。
用制成的锯刀在专用划切机上切割 QFN 封装芯片， 切得芯片尺寸为 6x6x0.75mm。在主轴转速 25Krpm、进给速度 30mm/s、冷却水流量 2.0L/min 的工况条件下， 完全满足芯片在线切割质量指标， 特别是在其厚度方向上的 毛刺小于 15μίΠ， 在其侧边的延展量小于四分之一引线间距， 经反复测试认 定平均有效切割长度为 1900m， 是用户现用树脂基锯刀的 2.3倍以上。
实施例 2
一种 QFN封装器件切割用烧结金属基金刚石锯刀的制备方法， 按以下 歩骤进行：
( 1 ) 组成设计与配制
首先， 按 95重量份的金属粉末和 5重量份的无机填料的配比配制金属 基胎体， 其中金属粉末包括 28重量份的 Cu、 7重量份的 Sn、 60重量份的 Co, 无机填料包括 2重量份的 SiC和 3重量份的 Al203; 其次， 将上述金属 粉末和无机填料置于涡流混料机中湿混搅拌 4h使其均匀化， 再加入经过筛 分除垢的金刚石颗粒， 搅拌 2h后获得成份均匀及金刚石均布的混合料。 金 刚石颗粒的体积百分比浓度为 60%，粒度为 55μηι，金属粉末粒度为 400目。
(2) 冷压预成形
将上述混合料均匀布于钢模中， 封盖后放于压机下压板上， 提升至与上 压板接触并施加 55MPa的压力并保压 3s制得成形压坯，然后将成形压坯置 于石墨模具中。
(3) 热压烧结
将热压模具连同工件整体移入烧结炉内， 按模压压力 35MPa、 升温速 率 60°C/min、 烧结温度 650°C、 保温保压时间 7min的工艺参数设置热压烧 结工艺，通过热压烧结制得金属烧结金刚石锯刀毛坯，最后卸载空冷至室温。
(4) 成型加工
外形切割： 锯刀毛坯去除毛刺后利用慢走丝机床将其内孔、 外圆加工到 所需尺寸以满足装配需要， 其中内孔精度为 H5， 外圆公差为 ±0.005mm; 厚度减薄：在精密磨床上利用双面游离 SiC磨料将锯刀毛坯研磨减薄至 所需厚度及精度 ±0.003mm， 最终制得满足尺寸要求的金刚石锯刀。
将制成的锯刀在专用划切机上切割 QFN 封装芯片， 切得芯片尺寸为 6x6x0.75mm 。 在主轴转速 25Krpm、 进给速度 40mm/s、 冷却水流量 2.0 L/min的切割条件下， 完全满足芯片在线切割质量指标， 特别是在其厚度方 向上的毛刺大小平均为 16μΓΠ， 在其侧向的延展量小于四分之一引线间距， 经反复测试认定平均有效切割长度为 2100m， 是用户现用树脂基锯刀的 2.5 倍以上。 实施例 3
一种 QFN封装器件切割用烧结金属基金刚石锯刀的制备方法， 按以下 歩骤进行：
( 1 ) 组成设计与配制
首先， 按 97重量份的金属粉末和 3重量份的无机填料的配比配制金属 胎体，其中金属粉末包括 32重量份的 Cu、 6重量份的 Sn、 59重量份的 Co, 无机填料包括 1重量份的 SiC和 2重量份的 Al203; 其次， 将上述金属粉末 和无机填料置于涡流混料机中湿混搅拌 4.5h使其均匀化， 再加入经过筛分 除垢的金刚石颗粒， 搅拌 2.5h后获得成分均匀及金刚石均布的混合料。 金 刚石颗粒的体积百分比浓度为 70%，粒度为 65μηι，金属粉末粒度为 325目。
(2) 冷压预成形
将上述混合料均匀布于钢模中， 封盖后放于冷压机下压板上， 提升至与 上压板接触并施加 60MPa的压力并保压 2s制得成形压坯，然后将成形压坯 置于石墨模具中。
(3) 热压烧结
将热压模具连同工件整体移入烧结炉内， 按模压压力 30MPa、 升温速 率 50°C/min、 烧结温度 700°C、 保温保压时间 6min的工艺参数设置热压烧 结工艺，通过热压烧结制备金属烧结金刚石锯刀毛坯，最后卸载空冷至室温。
(4) 加工成型
外形切割： 锯刀毛坯去除毛刺后利用慢走丝机床将其内孔、 外圆加工到 所需尺寸以满足装配需要， 其中内孔精度为 H5， 外圆公差为 ±0.005mm;
厚度减薄：在双面磨床上用悬浮游离 SiC磨料研磨锯刀毛坯至要求的厚 度及精度 ±0.003mm， 最终制得满足尺寸要求的金刚石锯刀。
将制成的锯刀在专用划切机上切割 QFN 封装芯片， 切得芯片尺寸为
6x6x0.75mm 。 在主轴转速 25Krpm、 进给速度 45mm/s、 冷却水流量
2.0L/min的切割条件下， 完全满足芯片在线切割质量指标， 特别是在其厚度 方向上的毛刺小于 20μηι， 在其侧向延展量不超过 30μηι， 经反复测试认定 平均有效切割长度为 2300m， 是用户现用树脂基锯刀的 2.8倍以上。
实施例 4
一种 QFN封装器件切割用烧结金属基金刚石锯刀的制备方法， 按以下 歩骤进行：
( 1 ) 组成设计与配制
首先， 按 96重量份的金属粉末和 4重量份的无机填料的配比配制金属 基胎体， 其中金属粉末包括 36重量份的 Cu、 5重量份的 Sn、 55重量份的 Co, 无机填料包括 2重量份的 SiC和 2重量份的 Al203; 其次， 将上述金属 粉末和无机填料置于涡流混料机中湿混搅拌 4h使其均匀化， 再加入经过筛 分除垢的金刚石颗粒， 搅拌 2h后获得成分均匀及金刚石均布的混合料。 金 刚石颗粒的体积百分比浓度为 75%，粒度为 75μηι，金属粉末粒度为 400目。
(2) 冷压预成形
将上述混合料均匀布于钢模中， 封盖后放于压机下压板上， 提升至与上 压板接触并施加 70MPa的压力并保压 2s制得成形压坯，然后将成形压坯置 于石墨模具中。
(3) 热压烧结
将热压模具连同工件整体移入烧结炉内， 按模压压力 30MPa、 升温速 率 65°C/min， 烧结温度 750°C， 保温保压时间 6min的工艺参数设置热压烧 结工艺， 通过热压烧结制备金刚石烧结金刚石锯刀毛坯， 最后卸载空冷至室 温。
(4 ) 加工成型
外形加工： 锯刀毛坯去除毛刺后用慢走丝机床将其内孔、 外圆加工到所 需尺寸以满足装配需要， 其中内孔精度为 H5， 外圆公差为 ±0.005mm。
厚度减薄：在双面磨床上用游离 SiC磨料研磨锯刀毛坯至所需厚度及精 度 ±0.003mm， 最终制得满足尺寸要求的金刚石锯刀。
用制成的锯刀在专用划切机上切割 QFN 封装芯片， 切得芯片尺寸为 6x6x0.75mm 。 在主轴转速 25Krpm、 进给速度 50mm/s、 冷却水流量 2.0L/min的切割条件下， 完全满足芯片在线切割质量指标， 特别是在其厚度 方向上引线的毛刺小于 20μηι， 在其侧向延展量不超过 30μηι， 经反复测试 认定平均有效切割长度平均可达 2500m， 是用户现用树脂基锯刀的 3倍以 上。

Claims

权利要求书
1、 一种 QFN封装器件切割用烧结金属基金刚石锯刀的制备方法， 其特 征在于： 该方法按以下歩骤进行：
( 1 ) 组成设计与配制
QFN 封装器件切割用烧结金属基金刚石锯刀由金属胎体和金刚石颗粒 组成， 其中上述金属胎体由金属粉末和超细无机填料组成； 先将组成金属胎 体的各种金属粉末和超细无机填料置于混料机中湿混搅拌 3-5h，然后加入经 过处理的金刚石颗粒， 搅拌 1-2h后获得成份均匀及磨粒均布的混合料；
(2) 冷压预成形
将上述混合料均匀布于钢模中， 然后在压机上施压制得成形压坯， 样品 经检验合格后， 将其置于石墨模具中；
(3) 热等压烧结
将石墨模具连同工件整体移入烧结炉内热压烧结， 制成烧结金属基金刚 石锯刀毛坯；
(4) 加工成型
锯刀毛坯去毛刺后用慢走丝机床进行内孔、 外圆切割， 再用双面游离研 磨工艺进行减薄加工， 最终得到满足厚度要求的超薄锯刀。
2、按照权利要求 1所述的一种 QFN封装器件切割用烧结金属基金刚石 锯刀的制备方法， 其特征在于： 将成分均匀及磨粒均布的混合料置于钢模中 冷压的工艺条件为： 压力 50-75MPa， 保压时间 1 -3s。
3、按照权利要求 1所述的一种 QFN封装器件切割用烧结金属基金刚石 锯刀的制备方法， 其特征在于： 将热压模具连同工件整体移入烧结炉内热压 烧结的工艺条件为： 模压压力 25-35MPa， 烧结温度 600-800 °C， 升温速率 50-70 °C/min , 保温保压时间 6-8min， 冷却方式： 炉冷或空冷。
4、按照权利要求 1所述的一种 QFN封装器件切割用烧结金属基金刚石 锯刀的制备方法， 其特征在于： 所述金刚石锯刀由金刚石颗粒和金属基胎体 组成； 金刚石颗粒履行切割功能， 其体积百分浓度为 45-78%， 粒度为 25-75μηΐ ο
5、按照权利要求 4所述的一种 QFN封装器件切割用烧结金属基金刚石 锯刀的制备方法， 其特征在于： 所述金刚石颗粒履行切割功能， 其体积百分 浓度为 50-70%， 粒度为 55-75μηι。
6、按照权利要求 2所述的一种 QFN封装器件切割用烧结金属基金刚石 锯刀的制备方法，其特征在于：所述金属胎体是对金刚石颗粒实施把持功用， 由 95-98重量份的金属粉末和 2-5重量份的无机填料组成。
7、按照权利要求 6所述的一种 QFN封装器件切割用烧结金属基金刚石 锯刀的制备方法， 其特征在于： 所述金属胎体由 25-38重量份的 Cu、 3-8重 量份的 Sn和 55-68重量份的 Co组成。
8、按照权利要求 6所述的一种 QFN封装器件切割用烧结金属基金刚石 锯刀的制备方法， 其特征在于： 所述超细无机填料分别是 1 -4重量份的粒状 SiC和 1 -4重量份的粒状 Al203。
9、按照权利要求 1所述的一种 QFN封装器件切割用烧结金属基金刚石 锯刀的制备方法， 其特征在于： 所述烧结金属基金刚石锯刀用于半导体 QFN 封装器件的单体化分割加工。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104807942A (zh) * 2015-05-12 2015-07-29 广西壮族自治区梧州食品药品检验所 一种同时测定固体保健食品中非法添加的多种化学药物的方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101879597B (zh) * 2010-06-11 2011-12-07 西安交通大学 Qfn封装器件切割用金属烧结型金刚石锯刀制备方法
CN102323214A (zh) * 2011-07-22 2012-01-18 福建万龙金刚石工具有限公司 一种金刚石刀具的生产工艺
CN103817327B (zh) * 2013-03-19 2015-09-16 泉州市大坤贸易有限责任公司 一种金属粉末的压制成型装置及工艺
CN104128606A (zh) * 2014-08-20 2014-11-05 丹阳市德源精密工具有限公司 一种金刚石锯片的制备方法
CN104907564B (zh) * 2015-05-25 2017-05-03 陕西理工学院 Ti3SiC2‑Co基金刚石超薄锯片材料的制备方法
CN105798307B (zh) * 2016-05-03 2018-02-13 西安点石超硬材料发展有限公司 基于ic封装器件切割用层压金属基金刚石锯刀及制造方法
CN106378714B (zh) * 2016-10-14 2019-10-22 苏州赛尔科技有限公司 一种qfn高质量切割用超薄树脂划片刀及其制备方法
CN108422334A (zh) * 2018-03-12 2018-08-21 河南科恩超硬材料技术有限公司 光纤阵列v型槽金刚石切割砂轮的制造方法
CN108428856B (zh) * 2018-03-30 2023-10-31 苏州清陶新能源科技有限公司 一种全固态锂离子电池界面改善热压工艺
CN109483422A (zh) * 2018-12-28 2019-03-19 江苏华东砂轮有限公司 一种砂轮冷热压一次成型工艺
CN113319751B (zh) * 2021-05-18 2023-01-10 珠海市巨海科技有限公司 金属结合剂金刚石砂轮制造方法和金属结合剂金刚石砂轮制造设备
CN114472895A (zh) * 2021-12-31 2022-05-13 苏州赛尔科技有限公司 一种qfn用金属烧结金刚石超薄切割片及制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6800018B2 (en) * 2002-02-12 2004-10-05 Saint-Gobain Abrasives Technology Company Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device
JP2006062009A (ja) * 2004-08-25 2006-03-09 Mitsubishi Materials Corp レジンボンド薄刃砥石
US7086394B2 (en) * 2004-02-17 2006-08-08 Nexedge Corp. Grindable self-cleaning singulation saw blade and method
CN101510527A (zh) * 2009-03-13 2009-08-19 西安点石超硬材料发展有限公司 半导体芯片bga封装体锯式切割用薄型金属基金刚石切割片及其制造方法
CN101870008A (zh) * 2010-06-11 2010-10-27 西安点石超硬材料发展有限公司 基于锯式切割qfn封装基板的烧结金属基金刚石锯刀
CN101879597A (zh) * 2010-06-11 2010-11-10 西安交通大学 Qfn封装器件切割用金属烧结型金刚石锯刀制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4655795A (en) * 1983-02-28 1987-04-07 Ex-Cell-O Corporation Abrasive tool for honing
DE4033214A1 (de) * 1990-10-19 1992-04-23 Hilti Ag Schneid- und bohrelemente
US5313742A (en) * 1991-01-11 1994-05-24 Norton Company Highly rigid composite shaped abrasive cutting wheel
ES2176764T3 (es) * 1996-09-04 2002-12-01 Anglo Operations Ltd Procedimiento de fabricacion de un producto abrasivo de union metalica.
US6056795A (en) * 1998-10-23 2000-05-02 Norton Company Stiffly bonded thin abrasive wheel
US6200208B1 (en) * 1999-01-07 2001-03-13 Norton Company Superabrasive wheel with active bond
CN1128703C (zh) * 2001-08-13 2003-11-26 江苏理工大学 复合基金刚石圆锯片刀头
CN1295064C (zh) * 2004-02-17 2007-01-17 河南黄河旋风股份有限公司 金刚石锯片及其制作方法
CN1318185C (zh) * 2005-06-16 2007-05-30 西安交通大学 金属基超薄金刚石切割片真空钎焊制造方法
CN101036945A (zh) * 2006-03-14 2007-09-19 中南大学 一种适用于亚洲红石材的锯片刀头制备方法
WO2010002832A2 (en) * 2008-07-02 2010-01-07 Saint-Gobain Abrasives, Inc. Abrasive slicing tool for electronics industry

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6800018B2 (en) * 2002-02-12 2004-10-05 Saint-Gobain Abrasives Technology Company Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device
US7086394B2 (en) * 2004-02-17 2006-08-08 Nexedge Corp. Grindable self-cleaning singulation saw blade and method
JP2006062009A (ja) * 2004-08-25 2006-03-09 Mitsubishi Materials Corp レジンボンド薄刃砥石
CN101510527A (zh) * 2009-03-13 2009-08-19 西安点石超硬材料发展有限公司 半导体芯片bga封装体锯式切割用薄型金属基金刚石切割片及其制造方法
CN101870008A (zh) * 2010-06-11 2010-10-27 西安点石超硬材料发展有限公司 基于锯式切割qfn封装基板的烧结金属基金刚石锯刀
CN101879597A (zh) * 2010-06-11 2010-11-10 西安交通大学 Qfn封装器件切割用金属烧结型金刚石锯刀制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104807942A (zh) * 2015-05-12 2015-07-29 广西壮族自治区梧州食品药品检验所 一种同时测定固体保健食品中非法添加的多种化学药物的方法

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