WO2011145874A2 - Capteur d'humidité ayant un élément chauffant et un élément de circuit de lecture à l'intérieur de celui-ci - Google Patents

Capteur d'humidité ayant un élément chauffant et un élément de circuit de lecture à l'intérieur de celui-ci Download PDF

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Publication number
WO2011145874A2
WO2011145874A2 PCT/KR2011/003654 KR2011003654W WO2011145874A2 WO 2011145874 A2 WO2011145874 A2 WO 2011145874A2 KR 2011003654 W KR2011003654 W KR 2011003654W WO 2011145874 A2 WO2011145874 A2 WO 2011145874A2
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WO
WIPO (PCT)
Prior art keywords
substrate
humidity sensor
ceramic
heater
humidity
Prior art date
Application number
PCT/KR2011/003654
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English (en)
Korean (ko)
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WO2011145874A3 (fr
Inventor
강문식
Original Assignee
(주) 미코엠에스티
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Publication of WO2011145874A2 publication Critical patent/WO2011145874A2/fr
Publication of WO2011145874A3 publication Critical patent/WO2011145874A3/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity

Definitions

  • Embodiments of the present invention relate to a humidity sensor with a built-in heater. More particularly, the present invention relates to a thin film type humidity sensor with a built-in heater.
  • Humidity sensors are used in various fields such as home appliances such as refrigerators, humidifiers and dryers, or humidity control devices such as automobiles and buildings.
  • a thin film type humidity sensor such as a capacitive type or a resistive type may be mounted on a printed circuit board and used.
  • the capacitive humidity sensor may be completed by forming a lower electrode on an upper portion of the substrate, forming a moisture sensitive layer on the lower electrode, and forming an upper electrode on the moisture sensitive layer, and the dielectric constant of the moisture sensitive layer according to humidity. Change can be used to measure humidity.
  • the resistive humidity sensor may be completed by forming a first electrode and a second electrode spaced apart from each other on a substrate, and forming a moisture sensitive layer on the first and second electrodes.
  • the resistance type humidity sensor may measure humidity by using a change in resistance of the moisture sensitive layer according to humidity.
  • a read circuit element such as a read out integrated circuit (ROIC) connected to the electrodes is required for humidity measurement because it is provided on the same plane as the humidity sensing unit including the electrodes or separately mounted on the printed circuit board.
  • ROIC read out integrated circuit
  • Embodiments of the present invention have been made to solve the problems described above, and an object thereof is to provide a humidity sensor in which a heater and a readout circuit element are embedded.
  • a humidity sensor includes a ceramic substrate having a structure in which a plurality of ceramic layers are stacked and having a lower cavity, a heater embedded between the ceramic layers, and the ceramic substrate. And a humidity sensing unit disposed on an upper surface of the substrate, and a read circuit device disposed in the lower cavity of the ceramic substrate and connected to the humidity sensing unit.
  • the ceramic substrate may include an upper substrate in which the heater is embedded and a lower substrate having the lower cavity.
  • a plurality of first conductive patterns connected to the readout circuit element may be formed on a lower surface of the upper substrate, and the first conductive patterns may pass through the upper via contact through the upper substrate. It may be connected to the humidity sensing unit by.
  • the lower cavity may pass through the lower substrate to expose a portion of the lower surface of the upper substrate.
  • a plurality of second conductive patterns connected to the readout circuit element may be formed on a lower surface of the upper substrate, and the second conductive patterns may pass through the lower substrate. Can be connected to the
  • first contact pads connected to the lower via contacts may be formed on a lower surface of the lower substrate.
  • the upper substrate may include stacked first and second upper ceramic layers, and the heater may be disposed between the first and second upper ceramic layers.
  • third conductive patterns connected to the heater may be formed between the first and second upper ceramic layers, and side surfaces of the ceramic substrate may be connected to the third conductive patterns, respectively.
  • the side patterns may extend downwards.
  • the thickness of the second upper ceramic layer positioned between the heater and the humidity sensing unit may be about 30 ⁇ m to 300 ⁇ m.
  • the upper substrate may include first, second and third upper ceramic layers sequentially stacked, and the heater may be disposed between the second and third ceramic layers. have.
  • a third conductive pattern may be formed between the first and second upper ceramic layers, and a second upper via contact connecting the heater and the third conductive pattern through the second upper ceramic layer may be formed.
  • a fourth conductive pattern connected to the heater may be formed between the second and third upper ceramic layers, and side patterns connected to the third and fourth conductive patterns, respectively, may be formed on the side of the ceramic substrate. Can be extended.
  • second contact pads connected to the side patterns may be formed on a bottom surface of the lower substrate.
  • the humidity sensing unit may include an upper electrode, a lower electrode, and a moisture sensitive layer disposed between the upper and lower electrodes.
  • the readout circuit device may be mounted to the ceramic substrate through a plurality of solder bumps.
  • the readout circuit element may be packaged by resin in the lower cavity.
  • the heater is disposed in the ceramic substrate, the heat transfer efficiency to the humidity sensing unit disposed on the ceramic substrate can be greatly improved, and thus the power consumption of the humidity sensor is greatly increased. Can be reduced.
  • the read circuit element is disposed in the ceramic heater together with the heater, the size of the humidity sensor can be greatly reduced.
  • FIG. 1 is a schematic cross-sectional view for explaining a humidity sensor according to an embodiment of the present invention.
  • FIG. 2 is a schematic exploded perspective view illustrating the ceramic substrate and the humidity sensing unit illustrated in FIG. 1.
  • FIG. 3 is a schematic bottom view for describing a lower surface of the upper substrate shown in FIG. 1.
  • FIG. 4 is a schematic diagram illustrating a humidity sensor according to another embodiment of the present invention.
  • FIG. 5 and 6 are schematic plan views for explaining the heater shown in FIG.
  • the element When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not.
  • Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the invention are not to be described as limited to the particular shapes of the areas described as the illustrations, but include deviations in the shapes, and the areas described in the figures are entirely schematic and their shapes. Are not intended to describe the precise shape of the region nor are they intended to limit the scope of the invention.
  • FIG. 1 is a schematic cross-sectional view illustrating a humidity sensor according to an embodiment of the present invention
  • FIG. 2 is a schematic exploded perspective view illustrating the ceramic substrate and the humidity sensing unit shown in FIG. 1
  • FIG. 3 is FIG. 1. It is a schematic bottom view for demonstrating the lower surface of the upper substrate shown to
  • the humidity sensor 100 may use a ceramic substrate 102 having a structure in which a plurality of ceramic layers are stacked.
  • the ceramic substrate 102 may be manufactured by firing a plurality of ceramic green sheets including alumina (Al 2 O 3 ).
  • the ceramic substrate 102 includes an upper substrate 110 composed of a plurality of upper ceramic layers 112, 114 and at least one lower ceramic layer, for example, first and second lower ceramic layers 122, 124 as shown. ) May include a lower substrate 120 having a two-layer structure.
  • the humidity sensor 100 includes a humidity sensing unit 130 disposed on an upper surface of the ceramic substrate 102 and a heater 104 and a read circuit device (ROIC device) 106 embedded in the ceramic substrate 102. It may include.
  • the heater 104 may be used to heat the humidity sensing unit 130. That is, when the temperature around the humidity sensor 100 is lowered below the freezing point, it may be used to maintain the humidity sensing unit 130 at room temperature or about 25 ° C. to about 40 ° C. to prevent freezing. .
  • a plate-shaped electric resistance heater 104 having a zigzag shape or a meandering structure may be provided in the ceramic substrate 102.
  • the structure of the heater 104 may be variously changed, and thus the scope of the present invention will not be limited.
  • the heater 104 may have a size corresponding to the humidity sensing unit 130 as a whole, and thus the humidity sensing unit 130 may be uniformly heated as a whole. That is, since the humidity sensing unit 130 may be maintained at a uniform temperature as a whole by the heater 104, the humidity sensing function of the humidity sensing unit 130 may be greatly improved.
  • a thin film type humidity sensor chip may be used.
  • Capacitive humidity sensor chip including) may be used.
  • the lower electrode 132 and the upper electrode 136 may be formed of a material including gold, chromium, and the like.
  • the moisture sensitive layer 134 may be a polymer material having a dielectric constant that changes according to a change in humidity. It may be made of polyimide. That is, the humidity sensing unit 130 may sense the humidity of the surroundings by using the capacitance change according to the dielectric constant change of the polyimide.
  • a resistance type humidity sensor chip may be used as the humidity sensing unit 130.
  • first and second electrodes spaced apart from each other may be disposed on the ceramic substrate 102, and a moisture sensitive layer may be disposed on the first and second electrodes.
  • the heater 104 may be buried between the upper ceramic layers 112 and 114.
  • the upper substrate 110 may include a stacked first upper ceramic layer 112 and a second upper ceramic layer 114, and the heater 104 may include the first upper ceramic layer 112. ) And the second upper ceramic layer 114.
  • the lower substrate 120 may have a lower cavity 126, and the readout circuit device 106 may be disposed in the lower cavity 126 to be electrically connected to the humidity sensing unit 130.
  • the lower cavity 126 may be formed to penetrate the lower substrate 120 as shown as an example, and a portion of the lower surface of the upper substrate 110 through the lower cavity 126, for example, as shown, a central portion of the lower surface of the upper substrate 110 may be exposed.
  • the read circuit device 106 may be mounted on a central portion of the lower surface of the upper substrate 110 exposed through the lower cavity 126.
  • the lower cavity 126 may be formed to penetrate only a portion of the lower substrate 120, for example, the first lower ceramic layer 122.
  • the lower substrate may be composed of laminated first, second and third lower ceramic layers, in which case the lower cavity is the first and second lower ceramic layers except for the uppermost layer, that is, the third lower ceramic layer. It may be formed to penetrate through them.
  • a plurality of first conductive patterns 140 and a plurality of second conductive patterns 142 may be disposed between the upper substrate 110 and the lower substrate 120, for example, on the lower surface of the upper substrate 110.
  • the first and second conductive patterns 140 and 142 may be electrically connected to the read circuit device 106.
  • the readout circuit device 106 may be connected to the first and second conductive patterns 140 and 142 of the upper substrate 110 through a plurality of solder bumps 108.
  • the first and second conductive patterns 140 and 142 may function as wires for signal transmission.
  • the read circuit element 106 may be packaged by a resin. That is, the solder circuit 108 is connected to the first and second conductive patterns 140 and 142 using the solder bumps 108 and then epoxy. Resin 128 may be injected into the lower cavity 126 to package the read circuit device 106.
  • the first conductive patterns 140 may be connected to the lower and upper electrodes 132 and 136 of the humidity sensing unit 130 by upper via contacts 150 penetrating the upper substrate 110, respectively. have.
  • the humidity sensing unit 130 is the ceramic substrate 102 along the side of the first connection terminal 132A extending from the lower electrode 132 and the moisture sensitive layer 134 from the upper electrode 136.
  • second connecting terminals 136A extending on an upper surface of the upper via contacts 150, and the upper via contacts 150 may be connected to the first and second connecting terminals 132A and 136A, respectively.
  • the upper electrode 136 may have a predetermined pattern so that the moisture sensitive layer 134 is exposed.
  • the upper electrode 134 may have a mesh shape as shown.
  • the shape of the upper electrode 134 may be variously changed, and thus the scope of the present invention will not be limited.
  • the first and second connection terminals 132A and 136A extend in different directions, the shape and extension direction of the first and second connection terminals 132A and 136 may be different from each other. The scope of the present invention will not be limited by this.
  • the second conductive patterns 142 may be connected to the lower via contacts 160 penetrating the lower substrate 120, and the lower via contacts 160 may be formed on the lower surface of the lower substrate 120.
  • First contact pads 180 to be connected may be formed.
  • the first contact pads 180 may be electrically connected to wires of the printed circuit board when the humidity sensor 100 is mounted on a printed circuit board (not shown).
  • Third conductive patterns 144 connected to the heater 104 may be formed between the first and second upper ceramic layers 112 and 114.
  • Side patterns 170 connected to the third conductive patterns 144 may be formed on side surfaces of the ceramic substrate 102, and the side patterns 170 may be formed on the third conductive patterns 144. It may extend downwards from the ends of the.
  • Second contact pads 182 connected to the side patterns 170 may be formed on the bottom surface of the lower substrate 120, and the third conductive patterns 144 and the side patterns 170 may be formed. ) May be used as wires for applying power to the heater 104.
  • the second contact pads 182 may be electrically connected to the wirings of the printed circuit board when the humidity sensor 100 is mounted on the printed circuit board.
  • the heater 104, the first, second and third conductive patterns 140, 142, and 144, the upper via contacts 150, the lower via contacts 160, the side patterns 170, and the first and first The two contact pads 180 and 182 may be formed using the same material. This is for co-firing ceramic green sheets (not shown) having a plurality of via contact holes and / or through holes and conductive pastes formed on the ceramic green sheets by a screen printing process.
  • the second contact pads 180 and 182 may be formed of a conductive material including tungsten, silver, palladium, platinum, or the like.
  • the heater 104 may be made of a material different from the other elements in consideration of electrical resistance.
  • the heater 104 since the heater 104 is embedded in the upper substrate 110 and the read circuit element 106 is disposed in the lower cavity 126, the read circuit element And the humidity sensing unit may be disposed on the same plane and the size of the humidity sensor 100 may be greatly reduced as compared with the prior art in which a heater is disposed around the humidity sensing unit.
  • the heater 104 since the heater 104 is disposed below the humidity sensing unit 130, the heat transfer efficiency to the humidity sensing unit 130 may be greatly improved, and thus power consumption may be greatly reduced.
  • the thickness of the upper and / or lower ceramic layers 112, 114, 122, 124, in particular, the thickness of the second upper ceramic layer 114 between the heater 104 and the humidity sensing unit 130 may be about 30 to 300 ⁇ m. It is preferable. This is because leakage current may be generated when the thickness of the second upper ceramic layer 114 is less than about 30 ⁇ m, and heat transfer efficiency exceeding about 300 ⁇ m may be reduced. That is, by appropriately adjusting the thickness of the second upper ceramic layer 114 within the above range, it is possible to generate an effect of reducing power consumption by preventing leakage current and improving heat transfer efficiency.
  • first and second lower ceramic green sheets to be used as the lower substrate 120 and first and second upper ceramic green sheets to be used as the upper substrate 110 are prepared.
  • the first and second lower ceramic green sheets are properly drilled to form lower cavity 126 and lower via contact holes, and the first and second upper ceramics are also formed to form upper via contact holes.
  • a plurality of humidity sensors may be simultaneously manufactured using the first and second lower ceramic green sheets and the first and second upper ceramic green sheets.
  • via holes may be formed in the ceramic green sheets to form the side patterns 170, and the via holes may be commonly used by adjacent humidity sensors.
  • the via holes may be formed in the first upper ceramic green sheet and the first and second lower ceramic green sheets.
  • a screen printing process may be performed on the respective ceramic green sheets.
  • a conductive paste for forming the heater 104 and the third conductive patterns 144 may be coated on an upper surface of the first upper ceramic green sheet, and the first and second conductive patterns may be coated on a lower surface of the first ceramic green sheet.
  • a conductive paste for forming the fields 140 and 142 may be applied.
  • a conductive paste for forming the first and second contact pads 180 and 182 may be coated on the bottom surface of the first lower ceramic green sheet.
  • upper and lower via contact holes and via holes formed in each of the ceramic green sheets may be filled with a conductive paste.
  • the ceramic green sheets are stacked, the ceramic green sheets are co-fired to form a ceramic substrate 102.
  • a plurality of humidity sensing units 130 may be formed on the molded ceramic substrate 102.
  • the lower conductive material layer is patterned through a photolithography process to form a plurality of lower electrodes 132.
  • a moisture sensitive layer 134 is formed on the ceramic substrate 102 and the lower electrodes 132.
  • a polyimide film may be used as the moisture sensitive layer 134, and the polyimide film may be formed by applying a liquid polyimide on the ceramic substrate 102 and then curing it.
  • the moisture sensitive layer 134 may be patterned through a photolithography process.
  • an upper conductive material layer is formed on the ceramic substrate 102 and the moisture sensitive layer 134, and then the upper conductive material layer is patterned by a photolithography process to form upper electrodes 136.
  • a plurality of humidity sensing units 130 may be formed on the ceramic substrate 102.
  • the read circuit elements 106 are mounted in the lower cavities 126 of the ceramic substrate 102 using the solder bumps 108, and then epoxy resins are formed in the lower cavities 126.
  • the read circuit elements 106 may be packaged by injecting 128.
  • the plurality of humidity sensors 100 may be individualized by cutting the ceramic substrate 102.
  • a cutting process may be performed to divide the via contacts (not shown) formed in the falling holes, thereby forming the side patterns 170 on the side surfaces of the adjacent humidity sensors 100. have.
  • the ceramic substrate 102 is used to replace the heater 104 and the second contact pads 182 in place of the side patterns 170. It may have separate via contacts (not shown) for connecting.
  • the cutting process may be performed before performing the co-firing process.
  • FIG. 4 is a schematic configuration diagram illustrating a humidity sensor according to another exemplary embodiment of the present invention
  • FIGS. 5 and 6 are schematic plan views illustrating the heater illustrated in FIG. 4.
  • the humidity sensor 200 may include a ceramic substrate 202 in which the heater 204 and the readout circuit element 206 are embedded.
  • the ceramic substrate 202 has a lower substrate having an upper substrate 210 in which the heater 204 is embedded and a lower cavity 226 in which the read circuit element 206 is packaged by an epoxy resin 228. 220 may be included.
  • the upper substrate 210 may include first, second and third upper ceramic layers 212, 214, and 216 sequentially stacked, and the heater 204 may be disposed between the second and third upper ceramic layers 214, 216. Can be placed in.
  • the lower substrate 220 may include first and second lower ceramic layers 222 and 224 on which the lower cavity 226 is formed.
  • a humidity sensing unit 230 including a lower electrode 232, a moisture sensitive layer 234, and an upper electrode 236 may be disposed on an upper surface of the ceramic substrate 202, and the humidity sensing unit 230 may be
  • the read via element 206 may be connected to the upper via contacts 250 and the first conductive patterns 240.
  • the read circuit device 206 may be connected to the wirings of the printed circuit board through the second conductive patterns 242, the lower via contacts 260, and the first contact pads 280.
  • the heater 204 may have a spiral structure having a circular shape 204A or a polygonal shape, for example, a rectangular shape 204B, as shown in FIGS. 5 and 6.
  • a third conductive pattern 244 may be formed between the first and second upper ceramic substrates 212 and 214, and the third conductive pattern 244 may form the second upper ceramic substrate 214.
  • the second upper via contact 252 may be connected to a central portion of the heater 204.
  • a fourth conductive pattern 246 connected to the edge of the heater 204 may be formed between the second and third upper ceramic substrates 214 and 216.
  • the third and fourth conductive patterns 244 and 246 are formed on the bottom surface of the ceramic substrate 202 through side patterns 270 formed on the side of the ceramic substrate 202. And 282, respectively.
  • the side pattern 270 connected to the third conductive pattern 244 may be formed on side surfaces of the first upper ceramic layer 212 and the lower substrate 220 and the fourth conductive pattern 246.
  • Side patterns 270 connected to the first and second upper ceramic layers 212 and 214 may be formed on the side surfaces of the lower substrate 220.
  • a heater for heating the humidity sensing unit and a read circuit device connected to the humidity sensing unit may be disposed in a ceramic substrate.
  • the heater may be formed to correspond to the humidity sensing unit as a whole, the humidity sensing unit may be uniformly heated as a whole, thereby further improving the humidity sensing function of the humidity sensing unit.
  • the first and second upper ceramic layers or the first, second and third upper ceramic layers are used, but the number of the upper ceramic layers may be variously changed as necessary.
  • the scope of the present invention will not be limited by this. Also, from the same point of view, the number of lower ceramic layers will not limit the scope of the present invention.
  • the heater is disposed in the ceramic substrate, the heat transfer efficiency to the humidity sensing unit disposed on the ceramic substrate is greatly improved. Therefore, the power consumption of the humidity sensor can be greatly reduced.

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Abstract

L'invention porte sur un capteur d'humidité ayant un élément chauffant et un élément de circuit de lecture à l'intérieur de celui-ci, dans lequel capteur une unité de détection d'humidité est disposée sur une surface supérieure d'un substrat en céramique ayant une structure dans laquelle une pluralité de couches en céramique sont stratifiées. L'élément chauffant est disposé entre les couches en céramique sous l'unité de détection d'humidité afin de maintenir l'unité de détection d'humidité à la température ambiante, et l'élément de circuit de lecture est disposé à l'intérieur d'une cavité qui est formée dans une partie inférieure du substrat en céramique. Par conséquent, il est possible d'améliorer le rendement de transfert thermique vers l'unité de détection d'humidité, et de réduire la taille du capteur d'humidité.
PCT/KR2011/003654 2010-05-17 2011-05-17 Capteur d'humidité ayant un élément chauffant et un élément de circuit de lecture à l'intérieur de celui-ci WO2011145874A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100046150A KR20110126466A (ko) 2010-05-17 2010-05-17 히터와 판독 회로 소자가 내장된 습도 센서
KR10-2010-0046150 2010-05-17

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WO2011145874A2 true WO2011145874A2 (fr) 2011-11-24
WO2011145874A3 WO2011145874A3 (fr) 2012-04-19

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KR102612215B1 (ko) * 2016-08-31 2023-12-12 엘지이노텍 주식회사 가스 센싱 모듈 및 이를 포함하는 센싱 장치
KR102627436B1 (ko) * 2016-09-19 2024-01-22 엘지이노텍 주식회사 가스 센싱 모듈, 가스 센싱 장치 및 이의 제조 방법
KR102035089B1 (ko) * 2018-10-17 2019-10-23 (주)멤스칩 히터 내장형 습도센서 및 그 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08505234A (ja) * 1993-10-19 1996-06-04 ゲンナディエビチ ウサノフ，ユリー 湿度センサ
JP2006153512A (ja) * 2004-11-25 2006-06-15 Matsushita Electric Works Ltd 湿度センサ
JP2008039508A (ja) * 2006-08-03 2008-02-21 Denso Corp 湿度センサ
JP2008039550A (ja) * 2006-08-04 2008-02-21 Denso Corp 湿度センサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08505234A (ja) * 1993-10-19 1996-06-04 ゲンナディエビチ ウサノフ，ユリー 湿度センサ
JP2006153512A (ja) * 2004-11-25 2006-06-15 Matsushita Electric Works Ltd 湿度センサ
JP2008039508A (ja) * 2006-08-03 2008-02-21 Denso Corp 湿度センサ
JP2008039550A (ja) * 2006-08-04 2008-02-21 Denso Corp 湿度センサ

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KR20110126466A (ko) 2011-11-23

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