WO2011135867A1 - 検査装置および検査方法 - Google Patents
検査装置および検査方法 Download PDFInfo
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- WO2011135867A1 WO2011135867A1 PCT/JP2011/002512 JP2011002512W WO2011135867A1 WO 2011135867 A1 WO2011135867 A1 WO 2011135867A1 JP 2011002512 W JP2011002512 W JP 2011002512W WO 2011135867 A1 WO2011135867 A1 WO 2011135867A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70641—Focus
Definitions
- the present invention relates to an inspection apparatus and an inspection method for inspecting a semiconductor substrate exposed by an exposure apparatus.
- an FEM wafer As a method for obtaining an optimum focus condition and dose amount (exposure amount) of an exposure apparatus, a method using a wafer (hereinafter referred to as an FEM wafer) exposed by changing the focus or dose amount for each shot by the exposure apparatus is known.
- an FEM wafer a wafer
- a position where the shape (line width) of the pattern changes according to the change in focus is measured with an electron microscope (CD-SEM).
- CD-SEM electron microscope
- a graph showing the change (vertical axis) of the line width relative to the change (horizontal axis) hereinafter referred to as a line width reference focus curve
- the focus value that maximizes the line width is defined as the best focus, and the focus value that maximizes the line width in the line width reference focus curve is obtained. Specifically, a plurality of line widths corresponding to changes in focus are measured at the same dose, and a line width reference focus curve is obtained using an average value of the measured line widths. A focus value at which the line width is maximum in the curve is obtained as an optimum focus condition (best focus) of the exposure apparatus.
- the position where the pattern shape (line width) changes according to the change in dose is measured with an electron microscope (CD-SEM), and the change in line width (vertical axis) relative to the change in dose (horizontal axis).
- the graph shown (hereinafter referred to as a line width reference dose curve) is obtained.
- a dose amount at which the designed line width can be obtained in the line width reference dose curve is obtained as an optimum dose amount (best dose amount) of the exposure apparatus.
- the present invention has been made in view of such a problem, and an object thereof is to provide an apparatus and a method capable of setting a focus condition and an exposure amount with high accuracy in a short time.
- an inspection apparatus includes an illumination unit that can illuminate a pattern formed by exposure with illumination light, a detection unit that detects reflected light from the illuminated pattern, and a plurality of detection units.
- an illumination unit that can illuminate a pattern formed by exposure with illumination light
- a detection unit that detects reflected light from the illuminated pattern
- a plurality of detection units In a range where at least a part of the first change condition, which is a change condition of the detection result of the pattern formed under the first exposure condition, with respect to the first exposure condition overlaps the range of the first exposure condition.
- an arithmetic unit that calculates a deviation between the first change condition and the second change condition.
- the exposure condition is at least one of a focus and an exposure amount.
- the inspection apparatus further includes a storage unit that stores the first change degree, and calculates the deviation based on the first change state stored in the storage unit.
- the comparison is performed using pattern matching between the first change condition and the second change condition.
- the first exposure condition is determined based on a measurement result of a measurement apparatus capable of measuring a pattern shape.
- the pattern formed under the first exposure condition is illuminated by an exposure apparatus adjusted based on the calculated deviation to obtain the first change degree.
- the detection unit detects the reflected light of a plurality of portions in a pattern formed by one exposure.
- the illumination unit collectively illuminates the illumination light that is a light beam substantially parallel to the entire surface of the substrate on which the pattern is formed, and the detection unit irradiates the illumination light. The light from the entire surface of the substrate is detected at once.
- the detection unit detects diffracted light generated by the pattern of the substrate by being irradiated with the illumination light.
- the illumination unit irradiates the surface of the substrate with substantially linearly polarized light as the illumination light, and the detection unit vibrates substantially orthogonally to the vibration direction of the substantially linearly polarized light reflected by the substrate.
- the direction polarization component is detected.
- information based on the calculated deviation is output so as to be input to the exposure apparatus.
- the inspection apparatus includes a film thickness measurement unit that measures a film thickness of the resist film before exposing the pattern, and the calculation unit is based on the film thicknesses respectively measured by the film thickness measurement unit. Then, the comparison is corrected.
- the film thickness measurement unit measures the film thickness based on regular reflection light from the resist film illuminated by the illumination unit.
- the film thickness measuring unit measures the film thickness based on regular reflection light from the resist film illuminated with light of a plurality of wavelengths.
- the inspection method prepares a first change condition that is a change condition with respect to the first exposure condition of reflected light obtained from a pattern formed under a plurality of first exposure conditions. Illuminating a pattern formed under a plurality of second exposure conditions whose intervals are known at least partially overlapping a range of one exposure condition, detecting reflected light from the illuminated pattern, A second change degree that is a change degree of the detection result with respect to the second exposure condition is obtained, and a deviation between the first change degree and the second change degree is obtained.
- the exposure condition is at least one of a focus and an exposure amount.
- the deviation is obtained by using pattern matching between the first change condition and the second change condition.
- the detection is performed at a plurality of portions in a pattern formed by one exposure.
- information based on the deviation is output to an exposure apparatus that forms a pattern under the second exposure condition.
- the film thickness is obtained based on the regular reflection light from the illuminated resist film.
- the resist film is illuminated with light of a plurality of wavelengths, and the film thickness is obtained based on regular reflection light from the resist film.
- the focus condition and the exposure amount can be set accurately in a short time.
- FIG. 1 It is a figure which shows an example of a FEM wafer. It is the figure which compared the wafer exposed on the same conditions with the different exposure apparatus. It is a figure which shows an example of a reference
- the surface inspection apparatus of this embodiment is shown in FIG. 1, and the surface of a semiconductor wafer 10 (hereinafter referred to as wafer 10), which is a semiconductor substrate, is inspected by this apparatus.
- the surface inspection apparatus 1 of the present embodiment includes a stage 5 that supports a substantially disk-shaped wafer 10, and the wafer 10 that is transferred by a transfer device (not shown) is placed on the stage 5. It is placed and fixed and held by vacuum suction.
- the stage 5 supports the wafer 10 so that the wafer 10 can rotate (rotate within the surface of the wafer 10) with the rotational axis of symmetry of the wafer 10 (the central axis of the stage 5) as the rotation axis. Further, the stage 5 can tilt (tilt) the wafer 10 around an axis along the surface of the wafer 10 (an axis substantially perpendicular to a plane formed by the optical axis of incident light and the optical axis of reflected light). The incident angle of illumination light can be adjusted.
- the surface inspection apparatus 1 further includes an illumination system 20 that irradiates illumination light as parallel light onto the surface of the wafer 10 supported by the stage 5, and reflected light, diffracted light, etc. from the wafer 10 when irradiated with illumination light.
- a light receiving system 30 that collects light
- an imaging device 35 that receives light collected by the light receiving system 30 and detects an image on the surface of the wafer 10, an image processing unit 40, a storage unit 41, and a film thickness calculating unit 50.
- the illumination system 20 includes an illumination unit 21 that emits illumination light, and an illumination-side concave mirror 25 that reflects the illumination light emitted from the illumination unit 21 toward the surface of the wafer 10.
- the illumination unit 21 includes a light source unit 22 such as a metal halide lamp or a mercury lamp, a light control unit 23 that extracts light having a predetermined wavelength from the light from the light source unit 22 and adjusts the intensity, and a light control unit 23
- the light guide fiber 24 is configured to guide light to the illumination-side concave mirror 25 as illumination light.
- the light from the light source unit 22 passes through the light control unit 23, and illumination light having a predetermined wavelength (for example, a wavelength of 248 nm) is emitted from the light guide fiber 24 to the illumination side concave mirror 25, and from the light guide fiber 24.
- the illumination light emitted to the illumination-side concave mirror 25 is held on the stage 5 as a parallel light beam by the illumination-side concave mirror 25 because the exit portion of the light guide fiber 24 is disposed on the focal plane of the illumination-side concave mirror 25.
- the surface of the wafer 10 is irradiated. The relationship between the incident angle and the exit angle of the illumination light with respect to the wafer 10 can be adjusted by tilting the stage 5 and changing the mounting angle of the wafer 10.
- an illumination-side polarizing filter 26 is provided between the light guide fiber 24 and the illumination-side concave mirror 25 so as to be able to be inserted into and removed from the optical path, and as shown in FIG.
- An inspection using the diffracted light (hereinafter referred to as a diffraction inspection for the sake of convenience) is performed in the extracted state, and as shown in FIG. 2, polarized light (structural complex) is inserted with the illumination side polarization filter 26 inserted in the optical path.
- An inspection using a change in polarization state due to refraction hereinafter referred to as a PER inspection for convenience) is performed (details of the illumination-side polarizing filter 26 will be described later).
- the outgoing light (diffracted light or reflected light) from the surface of the wafer 10 is collected by the light receiving system 30.
- the light receiving system 30 is mainly composed of a light receiving side concave mirror 31 disposed to face the stage 5, and emitted light (diffracted light or reflected light) collected by the light receiving side concave mirror 31 is imaged by the imaging device 35. An image of the wafer 10 is formed on the surface.
- a light receiving side polarizing filter 32 is provided between the light receiving side concave mirror 31 and the imaging device 35 so as to be inserted into and extracted from the optical path. As shown in FIG. 1, the light receiving side polarizing filter 32 is removed from the optical path. In this state, the diffraction inspection is performed, and as shown in FIG. 2, the PER inspection is performed with the light receiving side polarizing filter 32 inserted in the optical path (details of the light receiving side polarizing filter 32 will be described later). To do).
- the imaging device 35 photoelectrically converts the image of the surface of the wafer 10 formed on the imaging surface to generate an image signal, and outputs the image signal to the image processing unit 40.
- the image processing unit 40 generates a digital image of the wafer 10 based on the image signal of the wafer 10 input from the imaging device 35.
- Image data of a non-defective wafer is stored in advance in an internal memory (not shown) of the image processing unit 40.
- the image processing unit 40 When the image processing unit 40 generates an image (digital image) of the wafer 10, the image data of the wafer 10 is stored. And the image data of the non-defective wafer are compared to inspect for defects (abnormalities) on the surface of the wafer 10.
- the inspection result by the image processing unit 40 and the image of the wafer 10 at that time are output and displayed by an image display device (not shown). Further, the image processing unit 40 can set the focus condition or the dose amount (exposure amount) of the exposure device 60 by using data relating to the exposure device 60 stored in the storage unit 41 (details will be described later). To do).
- a predetermined mask pattern is projected and exposed on the uppermost resist film by the exposure device 60, and the wafer 10 is developed by a developing device (not shown), and then a wafer cassette (not shown) by a transfer device (not shown). Or it is conveyed on the stage 5 from a developing device. At this time, the wafer 10 is transferred onto the stage 5 in a state where the alignment is performed with reference to the pattern or outer edge (notch, orientation flat, etc.) of the wafer 10. As shown in FIG. 3, a plurality of chip regions 11 (shots) are arranged vertically and horizontally (in the XY directions in FIG. 3) on the surface of the wafer 10, and each chip region 11 has a semiconductor pattern as a semiconductor pattern. A repeating pattern 12 such as a line pattern or a hole pattern is formed. Further, the exposure apparatus 60 is electrically connected to the surface inspection apparatus 1 of the present embodiment through a cable or the like, although detailed illustration is omitted.
- the film thickness calculation unit 50 also obtains the film thickness of a thin film such as a resist film or a silicon oxide film from the image data of the wafer 10 generated by the image processing unit 40 (details will be described later).
- a measurement condition holding unit 48 and a reflectance data calculation unit 49 are electrically connected to the film thickness calculation unit 50.
- the measurement condition holding unit 48 includes the incident angle of the illumination light on the wafer 10, the spectral intensity (intensity for each wavelength) of the illumination light emitted from the illumination unit 21, and the spectral sensitivity (sensitivity for each wavelength) of the imaging device 35. ) And the complex refractive index for each wavelength of the substrate (for example, Si) and the thin film of the wafer 10 are stored.
- the complex refractive index for each wavelength of the base material of the wafer 10 and the complex refractive index for each wavelength of the substance constituting the single-layer thin film formed on the base material of the wafer 10 are, for example, ellipsometry
- the measurement can be made in advance by measuring at least one reference point (for example, the center position of the wafer 10) of the wafer 10 by using a refractive index measuring device or the like. Then, based on the complex refractive index for each wavelength specified in this way and the incident angle of illumination light on the wafer 10, the reflectance data calculation unit 49 performs illumination by the illumination system 20 shown in FIG.
- the reflectance including interference of reflected light from the front surface and the back surface of the thin film can be calculated.
- the complex refractive index of the base material (for example, Si) of the wafer 10 and the material of the single layer film (for example, SiO 2 ) is substituted into the thin film interference type corresponding to the angle condition described above, and the film thickness is 1070 nm to For the range of 1370 nm, for example, the film thickness is changed in increments of 10 nm, and the reflectance is calculated when the illumination light is changed to h-line (wavelength 405 nm), g-line (436 nm), e-line (546 nm), etc.
- the result can be held in the reflectance table 51 of the film thickness calculator 50.
- FIG. 13 shows a reflectance curve obtained by calculating the reflectance from a silicon dioxide thin film having a film thickness indicated by the horizontal axis for illumination lights having wavelengths of 405 nm, 436 nm, and 546 nm, respectively. It is indicated by a thick broken line and a thin dashed line.
- the geometric film thickness of the thin film at the above-described at least one reference point is measured by, for example, a film thickness measuring machine prepared separately, and these measurement results are held in the film thickness data holding unit 56, It can also be used for correction of film thickness measurement based on reflectance.
- the illumination side polarizing filter 26 and the light receiving side polarizing filter 32 are removed from the optical path as shown in FIG. Then, the wafer 10 is transferred onto the stage 5 by a transfer device (not shown). In addition, position information (notch, orientation flat or alignment mark) of a pattern formed on the surface of the wafer 10 is acquired by an alignment mechanism (not shown) during the conveyance, and the wafer 10 is placed at a predetermined position on the stage 5. Can be placed in a predetermined direction.
- the stage 5 is rotated so that the illumination direction on the surface of the wafer 10 matches the pattern repetition direction (in the case of a line pattern, orthogonal to the line), the pattern pitch is set to P, and the wafer 10
- the wavelength of the illumination light applied to the surface of the light is ⁇
- the incident angle of the illumination light is ⁇ 1
- the emission angle of the nth-order diffracted light is ⁇ 2
- the following equation (1) is satisfied from the Huygens principle. Setting is performed (tilt stage 5).
- the illumination system 20 irradiates the surface of the wafer 10 with illumination light.
- the light from the light source unit 22 in the illumination unit 21 passes through the dimming unit 23 and passes through a predetermined wavelength (for example, a wavelength of 248 nm or an emission line spectrum of mercury).
- a predetermined wavelength for example, a wavelength of 248 nm or an emission line spectrum of mercury.
- the diffracted light diffracted on the surface of the wafer 10 is collected by the light-receiving-side concave mirror 31 and reaches the image pickup surface of the image pickup device 35 to form an image (diffraction image) of the wafer 10.
- the imaging device 35 photoelectrically converts the image of the surface of the wafer 10 formed on the imaging surface to generate an image signal, and outputs the image signal to the image processing unit 40.
- the image processing unit 40 generates a digital image of the wafer 10 based on the image signal of the wafer 10 input from the imaging device 35.
- the image processing unit 40 generates an image (digital image) of the wafer 10
- the image data of the wafer 10 and the image data of the non-defective wafer are compared to inspect for defects (abnormality) on the surface of the wafer 10. To do. Then, the inspection result by the image processing unit 40 and the image of the wafer 10 at that time are output and displayed by an image display device (not shown).
- the image processing unit 40 has the same tendency, and therefore, when setting the same pattern for a plurality of exposure apparatuses 60, the image processing unit 40 sets the focus condition and the dose amount (exposure amount) set in the first exposure apparatus 60. ) Data can be used to set the focus condition and the dose amount for the second and subsequent exposure apparatuses 60. A method for setting the same process for a plurality of exposure apparatuses 60 will be described with reference to the flowchart shown in FIG. First, as shown in FIG.
- a repetitive pattern (in this embodiment, a line pattern) is formed by changing the focus and dose amount of the exposure apparatus 60 step by step for each exposure shot at preset values.
- the wafer (hereinafter referred to as FEM wafer 10a) is created (step S101).
- FEM wafer 10a The wafer (hereinafter referred to as FEM wafer 10a) is created (step S101).
- the exposure and development are performed while changing the focus and the dose in a matrix for each exposure shot.
- the thick frame in the center in FIG. 8 is a reference shot (for example, a shot that is exposed with a focus condition and a dose amount that is optimal in design), and changes in the focus condition and dose amount in each shot with respect to the reference shot are hatched. It is expressed by shading.
- step S102 When the FEM wafer 10a is created, when setting is performed for the first exposure apparatus 60 (YES in step S102), all shots are taken at five locations for each exposure shot using an electron microscope (CD-SEM). , The line width of the line pattern formed on the surface of the FEM wafer 10a is measured by the first exposure apparatus 60 (step S103). It should be noted that it is preferable to select a part where the pattern shape (line width) changes in accordance with changes in focus and dose as the part where the line width is measured. In addition, if necessary, a portion where the pattern shape (line width) changes in response to only the focus change may be selected, or the pattern shape (line width) in response to only the dose change. You may make it choose the location where changes.
- a graph showing the change of the line width (vertical axis) with respect to the change of focus (horizontal axis) at the five measurement points in the exposure shot (Line width reference focus curve) is obtained manually (step S104).
- the line width reference focus curve is obtained by measuring the line width (or roughness) corresponding to the change in focus at the same dose amount (preferably the best dose amount).
- a wafer having a plurality of shots having the same focus and dose is used, a plurality of line widths (or roughnesses) are measured for a plurality of shots having the same focus and dose.
- the line width reference focus curve is obtained using the average value of.
- the focus value at which the line width is maximum (or minimum in the case of roughness) is defined as the best focus
- the focus value at which the line width is maximum in the line width reference focus curve is defined as the exposure apparatus. It is obtained as 60 optimum focus conditions (best focus). Thereby, it is possible to set optimum focus conditions at five locations in the exposure shot for the first exposure apparatus 60.
- the line width reference focus curve can be obtained by sending data from an electron microscope (CD-SEM) to a computer (not shown), and obtaining a graph and optimum focus conditions by the least square method or the like.
- the line width of the line pattern is measured using an electron microscope (CD-SEM)
- the change in the line width (vertical axis) with respect to the change in dose (horizontal axis) is measured for the five measurement points in the exposure shot.
- the graph shown (line width reference dose curve) is obtained manually.
- the line width reference dose curve is obtained by measuring the line width corresponding to the change in the dose amount at the same focus (preferably the best focus).
- the dose amount at which the designed line width is obtained in the line width reference dose curve is obtained as the optimum dose amount (best dose amount) of the exposure apparatus 60.
- the focus condition and the dose amount thus obtained are input to the first exposure apparatus 60 manually, for example.
- the line width reference dose curve can also be obtained by sending data from an electron microscope (CD-SEM) to a computer (not shown) and obtaining the graph and the optimum dose amount by the least square method or the like.
- the optimum focus condition and the optimum dose amount can be input to the exposure apparatus 60 using communication means (cable or wireless).
- the second and subsequent exposure apparatuses are used using the surface inspection apparatus 1 of the present embodiment.
- the entire surface of the FEM wafer 10a on which the line pattern is formed by 60 is imaged (step S105).
- the FEM wafer 10a is transported onto the stage 5, the illumination system 20 irradiates the surface of the FEM wafer 10a with illumination light, and the imaging device 35 photoelectrically converts the diffraction image of the FEM wafer 10a.
- the image signal is generated by conversion, and the image signal is output to the image processing unit 40.
- the diffraction condition search is a tilt in which the tilt angle of the stage 5 is changed stepwise in an angle range other than regular reflection to acquire an image at each tilt angle, and the image becomes bright, that is, diffracted light is obtained. It refers to the function that calculates the angle.
- the azimuth angle (attitude of the exposed pattern with respect to the illumination direction of the illumination light) of the FEM wafer 10a is arranged so that the illumination direction coincides with the repeated direction of the exposed pattern (in the case of a line pattern, the direction orthogonal to the line). ing.
- the surface inspection apparatus 1 of the present embodiment is used in advance to achieve the optimal state as in the case of the diffraction inspection.
- the entire surface of the FEM wafer 10a on which the line pattern is formed is imaged by the set first exposure apparatus 60.
- the image processing unit 40 of the surface inspection apparatus 1 is appropriate for each of the five measurement positions in the exposure shot.
- a graph (hereinafter referred to as a reference focus curve) showing the change (vertical axis) of the brightness (signal intensity) of the diffracted light from the line pattern with respect to the focus change (horizontal axis) in the dose amount is obtained and stored in the storage unit 41.
- a reference focus curve showing the change (vertical axis) of the brightness (signal intensity) of the diffracted light from the line pattern with respect to the focus change (horizontal axis) in the dose amount is obtained and stored in the storage unit 41.
- the image processing unit 40 is directed to the change in focus (horizontal axis) at five measurement points in the exposure shot.
- a graph showing the change (vertical axis) of the luminance (signal intensity) of the diffracted light from the line pattern (hereinafter referred to as a sample focus curve) is obtained (step S106).
- a sample focus curve is obtained at the same dose amount (best dose amount).
- a plurality of brightnesses (signal intensity) of diffracted light from the line pattern corresponding to the change in focus are measured, and an average value of the measured brightness values (signal strengths) is obtained.
- the sample focus curve is obtained at the same dose amount (best dose amount).
- each FEM wafer 10a is created with the same setting by the same type of different exposure apparatus 60, it is formed on the surface of the FEM wafer 10a by the apparatus, as shown in comparison in FIGS. 9A and 9B.
- a difference in shape occurs in the line pattern (that is, a difference in luminance (signal intensity) of diffracted light from the line pattern).
- the difference in line pattern caused by the same type of different apparatus is caused by the change in the state of the pattern according to the change in focus and dose vertically and horizontally (see FIG. In the case of 9 (b), it appears in a form offset to the right with respect to FIG. 9 (a).
- This difference is the deviation of the focus and the dose amount in the second and subsequent exposure apparatuses 60 with respect to the first exposure apparatus 60. Conversely, if this deviation is corrected and set, It can be seen that appropriate focus conditions and dose amounts can be set for the second and subsequent exposure apparatuses 60 by using the focus condition and dose data set in the exposure apparatus 60 of the second exposure apparatus.
- the image processing unit 40 of the surface inspection apparatus 1 compares the reference focus curve stored in the storage unit 41 with the sample focus curve to thereby optimize the focus condition and the dose amount for the second and subsequent exposure apparatuses 60.
- FIG. 10 shows an example of the reference focus curve CV1 and the sample focus curve CV2.
- a quaternary expression can be used as an expression of approximate curves of the reference focus curve CV1 and the sample focus curve CV2.
- the difference between the reference focus curve CV1 and the sample focus curve CV2 caused by the same type of different apparatus is that the horizontal axis direction is caused by the focus shift, and the vertical axis direction is caused by the dose shift. This is because although the luminance (signal intensity) changes as the dose changes, only the focus curve moves in the luminance direction, and the tendency of focus and luminance change does not change.
- the image processing unit 40 uses image processing based on pattern matching to fit the reference focus curve CV1 to the sample focus curve CV2 so as to have the best correlation as shown in FIG.
- the reference focus curve CV1 and the sample focus curve CV2 are approximated by a predetermined function (for example, a quartic function), and the function that approximates the reference focus curve CV1 is fixed and the sample focus curve is fixed.
- a function approximating CV2 is moved in the horizontal axis direction, and the position where the sum of the squares of the differences between the two functions in the vertical axis is the smallest is determined as the position where the correlation is the best. In FIG.
- the image processing unit 40 obtains movement amounts in the horizontal axis direction and the vertical axis direction when the reference focus curve CV1 is fitted to the sample focus curve CV2.
- the amount of movement in the horizontal axis direction at this time is the focus shift of the second and subsequent (target) exposure apparatuses 60 with respect to the first exposure apparatus 60, and the amount of movement in the vertical axis direction is the shift of the dose amount.
- the resulting luminance value is the focus shift of the second and subsequent (target) exposure apparatuses 60 with respect to the first exposure apparatus 60.
- the image processing unit 40 sets the focus condition obtained by adding the movement amount (focus shift) of the reference focus curve CV1 in the horizontal axis to the focus condition set in the second and subsequent exposure apparatuses 60. This is obtained as the optimum focus condition (best focus) of the (target) exposure apparatus 60.
- the image processing unit 40 sets a dose amount obtained by adding a movement amount in the vertical axis direction of the reference focus curve CV1 (a shift in dose amount) to the dose amount set in the first exposure apparatus 60.
- the optimum dose amount (best dose amount) of the subsequent (target) exposure apparatus 60 is obtained. Note that it is preferable to obtain in advance a correlation between a change in dose and a change in luminance.
- the FEM wafer 10a is imaged using the surface inspection apparatus 1 of the present embodiment, and the optimum focus condition and dose amount of the second and subsequent exposure apparatuses 60 are automatically determined by the image processing unit 40.
- the focus condition and the dose amount thus obtained are output from the image processing unit 40 to the second and subsequent exposure apparatuses 60 (target), for example.
- each FEM wafer may be made to obtain each focus curve.
- the matrix of each FEM wafer is set so as to cancel the influence of conditions other than the focus condition (or dose).
- step S101 before the exposure by the exposure apparatus 60, the film thickness of the resist film of the wafer before exposure, which becomes the FEM wafer 10a, is measured using the surface inspection apparatus 1 of the present embodiment (
- step S106 the image processing unit 40 sets the optimum focus condition and dose amount for the second and subsequent exposure apparatuses 60.
- step S106 the target wafer input from the film thickness calculation unit 50 is set. It is preferable to correct the focus condition and the dose amount using the film thickness data. Specifically, the brightness of the sample focus curve CV2 according to the variation of the film thickness of the wafer exposed to the second and subsequent exposure apparatuses 60 with respect to the film thickness of the wafer exposed to the first exposure apparatus 60. (Vertical axis) is corrected.
- Step S107 a confirmation wafer (not shown) on which a line pattern (repeated pattern) is formed by the exposure apparatus 60 set to the optimum focus condition and dose amount is created. At this time, all exposure shots are exposed and developed with the best focus and the best dose.
- the line width of the line pattern formed on the surface of the confirmation wafer (not shown) is measured using an electron microscope (CD-SEM), and the set focus It is confirmed whether the conditions and the dose amount are appropriate (step S108). It should be noted that it is preferable to select a part where the pattern shape (line width) changes in accordance with changes in focus and dose as the part where the line width is measured.
- step S109 When the confirmation by the electron microscope (CD-SEM) is completed, when the setting of the focus condition and the dose amount is not completed for all the exposure apparatuses 60 (NO in step S109), the process returns to step S101, and all the exposure apparatuses When the setting for 60 is completed (YES in step S109), the setting of the focus condition and the dose amount is finished.
- CD-SEM electron microscope
- the image processing unit 40 can periodically obtain the fluctuation state of the focus and the dose amount in the exposure apparatus 60 using the reference focus curve data stored in the storage unit 41. Therefore, a method for periodically measuring the fluctuation state of the focus and the dose amount in the plurality of exposure apparatuses 60 will be described with reference to the flowchart shown in FIG.
- the FEM wafer 10a is created by the exposure apparatus 60 set as described above, and the entire surface of the FEM wafer 10a is imaged using the surface inspection apparatus 1 of the present embodiment, as in the case of diffraction inspection. (Step S201).
- the image processing unit 40 changes the focus (at five measurement points in the exposure shot).
- a graph (hereinafter referred to as a condition focus curve) showing the change (vertical axis) of the brightness (signal intensity) of the diffracted light from the line pattern with respect to the horizontal axis is obtained (step S202).
- a condition focus curve showing the change (vertical axis) of the brightness (signal intensity) of the diffracted light from the line pattern with respect to the horizontal axis is obtained (step S202).
- a plurality of brightnesses (signal intensity) of diffracted light from the line pattern corresponding to the change in focus are measured, and an average value of the measured brightness values (signal strengths) is obtained. Use to find the condition focus curve.
- the line pattern formed on the surface of the FEM wafer 10a by the apparatus is usually different. Should not occur. However, when the condition of the exposure apparatus 60 changes for some reason, the focus condition and the dose amount in the exposure apparatus 60 change, and the state of the line pattern formed on the surface of the FEM wafer 10a changes. When the entire surface of the FEM wafer 10a is imaged by the surface inspection apparatus 1 of the present embodiment, when the condition of the exposure apparatus 60 changes for some reason, the pattern state change corresponding to the change in focus and dose amount is offset vertically and horizontally. Appears in shape. Therefore, if the deviation of the focus and the dose amount is obtained using the reference focus curve used in the previous setting, the fluctuation state of the focus and the dose amount in the exposure apparatus 60 can be obtained.
- the image processing unit 40 compares the reference focus curve and the condition focus curve stored in the storage unit 41 to determine the fluctuation state of the focus and the dose amount in the exposure apparatus 60.
- the reference focus curve and the condition focus curve stored in the storage unit 41 to determine the fluctuation state of the focus and the dose amount in the exposure apparatus 60.
- a formula of the approximate curve of a condition focus curve a quartic formula can be used, for example.
- the image processing unit 40 uses the image processing based on pattern matching to fit the reference focus curve so as to have the best correlation with the condition focus curve.
- the image processing unit 40 obtains movement amounts in the horizontal axis direction and the vertical axis direction when the reference focus curve is fitted to the condition focus curve.
- the amount of movement in the horizontal axis direction at this time is a focus shift of the exposure apparatus 60 according to the change in condition, and the amount of movement in the vertical axis direction is a luminance value resulting from the shift of the dose amount.
- the image processing unit 40 obtains the focus fluctuation amount from the movement amount of the reference focus curve in the horizontal axis direction, and obtains the dose fluctuation amount from the movement amount of the reference focus curve in the vertical axis direction.
- the FEM wafer 10a is imaged using the surface inspection apparatus 1 of the present embodiment, and the fluctuation state of the focus and the dose amount in the exposure apparatus 60 is automatically determined by the image processing unit 40. It is not necessary to measure the line width or the like of the line pattern using -SEM), and the variation state of the focus and the dose amount in the plurality of exposure apparatuses 60 can be measured in a short time.
- the reference focus curve CV1 obtained in the first time can be used after the second time, it is not necessary to measure the pattern exposed by the first exposure apparatus using an electron microscope (CD-SEM). .
- step S203 When the fluctuation amount of the focus and the fluctuation amount of the dose amount are obtained, if the measurement is not completed for all the exposure apparatuses 60 (NO in step S203), the process returns to step S201, and the measurement is completed for all the exposure apparatuses 60. Then (in the case of YES in step S203), the measurement of the fluctuation state of the focus and the dose amount in the plurality of exposure apparatuses 60 is finished.
- step S201 before the exposure by the exposure apparatus 60, the film thickness of the resist film of the wafer before exposure, which becomes the FEM wafer 10a, is measured using the surface inspection apparatus 1 of the present embodiment (
- step S202 the film thickness of the wafer as a target input by the image processing unit 40 from the film thickness calculation unit 50 when measuring the fluctuation state of the focus and the dose amount in the plurality of exposure apparatuses 60 in step S202.
- the brightness (vertical axis) of the condition focus curve is corrected in accordance with the variation of the wafer film thickness at the time of state measurement with respect to the wafer film thickness at the time of setting.
- the variation in luminance (signal intensity) due to the variation in film thickness is corrected, so that the variation state of the focus and the dose amount in the plurality of exposure apparatuses 60 can be accurately measured.
- the case where the film thickness of a thin film (resist film) formed on the surface of a wafer (not shown) before exposure is measured using the surface inspection apparatus 1 of the present embodiment will be described.
- the wafer before exposure is transferred onto the stage 5 as in the case of the diffraction inspection.
- the stage 5 is tilted so that the light receiving system 30 can receive the regular reflection light of the illumination light on the wafer surface.
- illumination light is irradiated onto the surface of the wafer for five types of illumination wavelengths (for example, 546 nm, 436 nm, 405 nm, 313 nm, and 248 nm).
- illumination light having any one of the five types of wavelengths is applied as a parallel light flux to the surface of the wafer.
- the specularly reflected light from the wafer surface is collected by the light-receiving side concave mirror 31 and reaches the image pickup surface of the image pickup device 35 to form an image (specular reflection image) of the wafer before exposure.
- the imaging device 35 photoelectrically converts the wafer image formed on the imaging surface for each of the five types of illumination wavelengths to generate an image signal, and outputs the image signal to the image processing unit 40.
- the image processing unit 40 generates a digital image of the wafer before exposure based on the image signal input from the imaging device 35 and outputs the digital image to the film thickness calculation unit 50.
- the fitting calculation process performed by the film thickness calculation unit 50 will be described.
- the angle condition used for the calculation of the reflectance curve described above for the entire region of the reflected image of the wafer to be imaged It is possible to apply a thin film interference type to which is applied. Accordingly, as described below, a film thickness that gives a combination of reflectivities indicated by the gradation values of each pixel included in the reflected image at each wavelength input to the film thickness calculation unit 50 is set to reflectivity.
- FIG. 14 is a flowchart showing the fitting calculation process.
- the reflectance calculation unit 52 uses the gradation value of the pixel at the reference position included in the reflection image generated by the image processing unit 40, the spectral intensity of the illumination light stored in the measurement condition holding unit 48, and the imaging device 35.
- the spectral sensitivity sensitivity for each wavelength
- the reflected light at the reference position R ( ⁇ 1), R) at the wavelengths ( ⁇ 1, ⁇ 2,...)
- ⁇ 2 ⁇ 2
- the correction value calculation unit 54 searches the reflectance table 51 for the estimated film thickness that gives the reflectance calculated in step S301, and the estimated film thickness obtained and the actually measured film held in the film thickness data holding unit 56. A correction value is calculated for each wavelength from the thickness (step S302).
- the correction value calculation unit 54 finds, for example, film thickness candidates (for example, C1 to C4) corresponding to the intersection of the reflectance curve corresponding to the wavelength ⁇ 1 and a straight line indicating the actual reflectance of the wavelength ⁇ 1 at the reference point, Of these film thickness candidates, the difference between the measured value t closest to the measured value t of the geometric thickness and the measured value t can be set as a correction value ⁇ ⁇ 1 when determining the film thickness from the reflectance of the wavelength. it can.
- the illumination value is switched, and the correction value calculation unit 54 calculates the correction value ⁇ corresponding to each wavelength.
- the reflectance calculation unit 52 performs the same processing as in step S301 described above on the basis of the gradation value of each pixel included in the reflected image stored for each wavelength of illumination light in the image storage unit 47.
- the reflectance of the wavelength is calculated (step S303) and used for processing by the candidate extraction unit 53.
- step S302 the intersection between the reflectance calculated for each wavelength and the reflectance curve indicated by the reflectance data held in the reflectance table 51 for the corresponding wavelength is obtained.
- at least one film thickness candidate is extracted for each wavelength (step S304).
- the film thickness candidates extracted in this way are corrected by the correction processing unit 55 using the correction values corresponding to the respective wavelengths described above (step S305), and then passed to the error calculation unit 57.
- the error calculator 57 receives from the correction processor 55, for example, a set of film thickness candidates ⁇ C ( ⁇ 1) corresponding to the respective wavelengths ( ⁇ 1, ⁇ 2, ⁇ 3...) Corresponding to the respective wavelengths ( ⁇ 1, k2, k3, etc ) 1 , ..., C ( ⁇ 1) k1 ⁇ , ⁇ C ( ⁇ 2) 1 , ..., C ( ⁇ 2) k2 ⁇ , ⁇ C ( ⁇ 3) 1 , ..., C ( ⁇ 3) k3 ⁇ , ....
- the error calculation unit 57 selects the film thickness candidates (C ⁇ 1 , C ⁇ 2 , C) selected from each set for each possible combination when taking one element from each set. (3 ) is used to calculate an error E expressed by the following equation (2) (step S306).
- the determination processing unit 58 receives the calculation result by the error calculation unit 57 described above, detects a combination of film thickness candidates having the smallest error value, and, for example, calculates the average value of the film thickness candidates included in this combination from the reflectance.
- the obtained film thickness measurement value is specified (step S307).
- the film thickness measurement value specified by the determination processing unit 58 is held in the film thickness data holding unit 56 corresponding to the pixel position in the reflected image.
- step S308 it is determined whether or not film thickness measurement values have been obtained for all the pixels included in the reflection image of the wafer before exposure (step S308). If the determination is NO, the processing from step S303 to step S307 described above is repeated for each pixel included in the reflected image.
- the verification processing unit 59 performs the process of verifying the continuity of the film thickness distribution (step S309).
- the verification processing unit 59 for example, the film thickness measurement value t (xi, yi) obtained corresponding to the target pixel indicated by the coordinates (xi, yi) included in the reflection image of the wafer before exposure. And the difference between the film thickness measurement values obtained corresponding to the surrounding pixels.
- the difference between the measured value of the surrounding film thickness and the measured film thickness value corresponding to the target pixel is compared with a predetermined threshold value, and if the difference is equal to or less than the threshold value, the verification processing unit 59 determines the film thickness corresponding to the target pixel value.
- the measurement value is determined to have continuity with the surrounding film thickness measurement value, and the verification process ends.
- the verification processing unit 59 is far from the target pixel. Therefore, the film thickness measurement value is corrected.
- the verification processing unit 59 detects a combination with the smallest error obtained by the error calculation unit 57 next to the combination detected in step S307 described above, and averages the film thickness candidates included in this combination.
- the film thickness measurement value is corrected using the value, and the continuity with the film thickness measurement value corresponding to the surrounding pixels can be verified again.
- the verification processing unit 59 displays the corrected film thickness measurement value. Writing to the film thickness data holding unit 56 ends the verification process.
- the film thickness data obtained by performing the fitting process individually for each pixel is verified based on the result corresponding to the neighboring pixels, and the abnormal value is detected and corrected. be able to.
- the film thickness data held in the film thickness data holding unit 56 and corrected for abnormal values is output to the image processing unit 40, thereby performing image processing. It is used for each process in the unit 40.
- the image processing unit 40 uses the focus condition or the dose amount data set in the first exposure apparatus 60 to perform exposure by the second and subsequent exposure apparatuses 60.
- the focus conditions and the dose amounts for the plurality of exposure apparatuses 60 can be set in a short time. It can be set with high accuracy.
- the image processing unit 40 determines the reference focus curve that is a correlation between the focus variation and the pattern variation in the first exposure apparatus 60, and the focus variation and pattern in the second and subsequent exposure apparatuses 60.
- the image processing unit 40 determines the reference focus curve that is a correlation between the focus variation and the pattern variation in the first exposure apparatus 60, and the focus variation and pattern in the second and subsequent exposure apparatuses 60.
- the focus condition or the dose amount for the second and subsequent exposure apparatuses 60 can be easily set in a short time. At this time, by using image processing based on pattern matching, it is possible to accurately set the focus condition and the dose amount for the second and subsequent exposure apparatuses 60.
- the image processing unit 40 determines the exposure apparatus based on the difference between the condition focus curve, which is the correlation between the focus fluctuation and the pattern fluctuation in the exposure apparatus 60 after setting, and the reference focus curve used for the above setting. Since the fluctuation state of the focus and the dose amount at 60 is obtained, the fluctuation state of the focus and the dose amount in the plurality of exposure apparatuses 60 (conditions of the plurality of exposure apparatuses 60) can be measured in a short time. At this time, by using image processing based on pattern matching, it is possible to accurately set the fluctuation state of the focus and the dose amount in the plurality of exposure apparatuses 60.
- the image pickup device 35 picks up the entire surface of the wafer in a lump, it is possible to set the focus condition and the dose amount in a shorter time.
- the wavelength of the illumination light is preferably a deep ultraviolet wavelength such as 248 nm or 313 nm (j-line).
- a portion where the pattern shape (line width) changes with high sensitivity in accordance with the change of the focus regardless of the change of the dose is obtained, the focus curve or the like is obtained, the focus condition is set, etc. May be performed with higher accuracy. Also, select the location where the pattern shape (line width) changes with high sensitivity according to the change in the dose amount regardless of the focus change, and the line pattern brightness (signal intensity) against the change in the dose amount (horizontal axis) It is also possible to obtain a graph (dose curve) or the like showing the change (vertical axis) and to set the dose amount with higher accuracy.
- the focus conditions and the dose amount are set using the diffracted light generated on the wafer surface.
- the present invention is not limited to this, and regular reflection generated on the wafer surface is possible. You may make it utilize the change of the state of light or polarization.
- the repeated pattern 12 is a resist pattern (line pattern) in which a plurality of line portions 2 ⁇ / b> A are arranged at a constant pitch P along the short direction (X direction). . Further, a space 2B is provided between the adjacent line portions 2A. In addition, the arrangement direction (X direction) of the line portions 2A is referred to as “repeating direction of the repeating pattern 12”.
- the design value of the line width D A of the line portion 2A in the repetitive pattern 12 is set to 1 ⁇ 2 of the pitch P. If repeated pattern 12 is formed as the design value, the line width D B of the line width D A and the space portion 2B of the line portion 2A are equal, the volume ratio of the line portion 2A and the space portion 2B is substantially 1: 1 In contrast, when the exposure focus at the time of forming the repeating pattern 12 (or dose) deviates from an appropriate value, the pitch P does not change, with the line width D A of the line portion 2A becomes different from a design value , becomes different even with the line width D B of the space portion 2B, the volume ratio of the line portion 2A and the space portion 2B is substantially 1: deviates from 1.
- the PER inspection performs an abnormality inspection of the repetitive pattern 12 by using a change in the volume ratio between the line portion 2A and the space portion 2B in the repetitive pattern 12 as described above.
- the ideal volume ratio (design value) is 1: 1.
- the change in the volume ratio is caused by the deviation of the exposure focus (or dose) from the appropriate value, and appears for each shot area of the wafer 10.
- the volume ratio can also be referred to as the area ratio of the cross-sectional shape.
- the illumination side polarizing filter 26 and the light receiving side polarizing filter 32 are inserted on the optical path.
- the stage 5 tilts the wafer 10 to an inclination angle at which the regular reflection light from the wafer 10 irradiated with the illumination light can be received by the light receiving system 30, and stops at a predetermined rotational position.
- the repeating direction of the repeating pattern 12 on the wafer 10 is held so as to be inclined by 45 degrees with respect to the vibration direction of the illumination light (linearly polarized light L) on the surface of the wafer 10. This is because the amount of light for inspection of the repeated pattern 12 is maximized.
- the angle is 22.5 degrees or 67.5 degrees, the inspection sensitivity is increased.
- an angle is not restricted to these, It can set to an arbitrary angle direction.
- the illumination-side polarizing filter 26 is disposed between the light guide fiber 24 and the illumination-side concave mirror 25, and its transmission axis is set to a predetermined direction, and the light from the illumination unit 21 is linearly set according to the transmission axis. Extract polarized light.
- the illumination-side concave mirror 25 is a semiconductor substrate by converting the light transmitted through the illumination-side polarization filter 26 into a parallel light flux.
- the wafer 10 is illuminated.
- the light emitted from the light guide fiber 24 becomes p-polarized linearly polarized light L (see FIG. 5) via the illumination-side polarizing filter 26 and the illumination-side concave mirror 25, and is applied to the entire surface of the wafer 10 as illumination light. Irradiated.
- the traveling direction of the linearly polarized light L (the direction of the principal ray of the linearly polarized light L reaching an arbitrary point on the surface of the wafer 10) is substantially parallel to the optical axis.
- the linearly polarized light L incident on the wafer 10 is p-polarized light, as shown in FIG. 5, the repeating direction of the repeated pattern 12 is the incident surface of the linearly polarized light L (the traveling direction of the linearly polarized light L on the surface of the wafer 10).
- the angle formed by the vibration direction of the linearly polarized light L on the surface of the wafer 10 and the repeating direction of the repeating pattern 12 is also set to 45 degrees.
- the linearly polarized light L changes into the repeated pattern 12 so as to cross the repeated pattern 12 diagonally with the vibration direction of the linearly polarized light L on the surface of the wafer 10 inclined by 45 degrees with respect to the repeated direction of the repeated pattern 12. It will be incident.
- the specularly reflected light reflected on the surface of the wafer 10 is collected by the light receiving side concave mirror 31 of the light receiving system 30 and reaches the image pickup surface of the image pickup device 35. At this time, the light is linearly reflected by the structural birefringence in the repetitive pattern 12.
- the polarization state of the polarized light L changes.
- the light receiving side polarizing filter 32 is disposed between the light receiving side concave mirror 31 and the imaging device 35, and the direction of the transmission axis of the light receiving side polarizing filter 32 is orthogonal to the transmission axis of the illumination side polarizing filter 26 described above. Is set (cross Nicole state).
- the light receiving side polarizing filter 32 extracts a polarization component (for example, an s-polarized component) whose vibration direction is substantially perpendicular to the linearly polarized light L from the regular reflected light from the wafer 10 (repeated pattern 12), and the imaging device. 35.
- a reflected image of the wafer 10 is formed on the imaging surface of the imaging device 35 with a polarized light component whose vibration direction is substantially perpendicular to the linearly polarized light L of the regular reflected light from the wafer 10.
- the illumination side polarizing filter 26 and the light receiving side polarizing filter 32 are inserted on the optical path, and the wafer is then transferred by a not-shown transfer apparatus. 10 is conveyed onto the stage 5.
- the positional information of the pattern formed on the surface of the wafer 10 is acquired by an alignment mechanism (not shown) during the transfer, and the wafer 10 is placed at a predetermined position on the stage 5 in a predetermined direction. Can do.
- the stage 5 tilts the wafer 10 at an inclination angle at which the regular reflection light from the wafer 10 irradiated with the illumination light can be received by the light receiving system 30, stops at a predetermined rotational position, and repeats on the wafer 10.
- the repeating direction of the pattern 12 is held so as to be inclined by 45 degrees with respect to the vibration direction of the illumination light (linearly polarized light L) on the surface of the wafer 10.
- the surface of the wafer 10 is irradiated with illumination light.
- the light emitted from the light guide fiber 24 of the illumination unit 21 passes through the illumination-side polarizing filter 26 and the illumination-side concave mirror 25 and is p-polarized linearly polarized light L.
- the entire surface of the wafer 10 is irradiated as illumination light.
- the specularly reflected light reflected from the surface of the wafer 10 is collected by the light-receiving-side concave mirror 31 and reaches the image pickup surface of the image pickup device 35 to form an image (reflected image) of the wafer 10.
- the polarization state of the linearly polarized light L changes due to the structural birefringence in the repeating pattern 12, and the light receiving side polarizing filter 32 causes the linearly polarized light L and the vibration direction of the regular reflected light from the wafer 10 (repeating pattern 12).
- a reflected image of the wafer 10 is formed on the imaging surface of the imaging device 35 with a polarized light component that is substantially perpendicular to the linearly polarized light L of the regular reflected light from the wafer 10.
- the imaging device 35 photoelectrically converts an image (reflected image) of the surface of the wafer 10 formed on the imaging surface to generate an image signal, and outputs the image signal to the image processing unit 40.
- the image processing unit 40 generates a digital image of the wafer 10 based on the image signal of the wafer 10 input from the imaging device 35.
- the image processing unit 40 generates an image (digital image) of the wafer 10
- the image data of the wafer 10 and the image data of the non-defective wafer are compared to inspect for defects (abnormality) on the surface of the wafer 10.
- the luminance information (signal intensity) of the reflection image of the non-defective wafer is considered to indicate the highest luminance value.
- the inspection result by the image processing unit 40 and the image of the wafer 10 at that time are output and displayed by an image display device (not shown).
- the image processing unit 40 uses a wafer image that has been exposed and developed under conditions in which the focus and dose of the exposure apparatus 60 are changed for each shot, and a reference focus curve or sample focus due to the polarization of the exposure apparatus 60. A curve can be obtained. Then, if the movement amounts in the horizontal axis direction and the vertical axis direction when the reference focus curve is fitted to the sample focus curve are obtained, as in the case of diffracted light, the second and subsequent exposure apparatuses 60 optimum focus conditions and doses can be set accurately in a short time. Specifically, in step S105 of the flowchart shown in FIG.
- the surface of the FEM wafer 10a is irradiated with linearly polarized light L as illumination light, and the imaging device 35 photoelectrically converts the reflected image of the FEM wafer 10a to generate an image signal.
- the image signal may be output to the image processing unit 40.
- the image processing unit 40 can obtain the condition focus curve due to the polarization of the exposure device 60 by performing illumination and imaging of the wafer in the same manner as in the PER inspection. It is possible to accurately measure the fluctuation state of the focus and the dose amount at 60 in a short time.
- the surface of the FEM wafer 10a is irradiated with linearly polarized light L as illumination light, and the imaging device 35 photoelectrically converts the reflected image of the FEM wafer 10a to generate an image signal.
- the image signal may be output to the image processing unit 40.
- the FEM wafer 10a that has been exposed and developed under the condition that the focus and the dose of the exposure apparatus 60 are changed for each shot is used.
- the present invention is not limited to this. A plurality of wafers exposed and developed under the condition that the focus and dose of 60 are changed for each wafer may be used.
- the same process is set for a plurality of (solidly different) exposure apparatuses 60.
- the present invention is not limited to this.
- the same exposure apparatus 60 can be set for a predetermined process.
- the present invention can also be applied to a case where a setting for another process is performed after the setting is performed, and then a setting for the same process as the predetermined process is performed again (at a time different from the above). .
- the thickness of the thin film (resist film) formed on the surface of the wafer before exposure is measured.
- the present invention is not limited to this, and the thin film on the wafer surface after exposure is measured. The thickness may be measured.
- a stage that supports a semiconductor substrate that is exposed by an exposure apparatus and has a predetermined pattern formed on a surface film
- an irradiation unit that irradiates illumination light onto the surface of the semiconductor substrate supported by the stage
- the illumination Detected by the detection unit using a detection unit that detects light from the surface of the semiconductor substrate irradiated with light and a reference focus condition or a reference exposure amount set in the exposure apparatus From the information on the light from the surface of the semiconductor substrate exposed by the exposure device that is temporally or solidly different from the exposure device, the adjustment value of the focus condition or exposure amount for the exposure device that is temporally or solidly different
- a film thickness measuring unit for measuring the film thickness of each of the films, and the setting calculation unit corrects the adjustment value based on the film thicknesses respectively measured by the film
- a storage unit that stores a first correlation that is a correlation between a change in focus condition or exposure amount in the exposure apparatus and a change in the pattern formed by exposure by the exposure apparatus.
- the setting calculation unit further includes a surface from the surface of the semiconductor substrate exposed by changing a focus condition or an exposure amount for each shot by the exposure device detected by the detection unit, which is temporally or solidly different. From the light information, the correlation between the variation of the focus condition or the exposure amount in the exposure apparatus different in time or solid and the change in the pattern formed by exposure by the exposure apparatus different in time or solid A second correlation is obtained, and the adjustment value is calculated based on a difference between the second correlation and the first correlation stored in the storage unit. It is preferable to perform out.
- the difference between the second correlation and the first correlation is obtained using image processing based on pattern matching.
- the illumination unit diffracts light with the pattern of the semiconductor substrate exposed by the exposure device that is temporally or solidly different. So that the illumination light is irradiated on the surface of the semiconductor substrate exposed by the exposure apparatus that is temporally or solidly different, and the detection unit is irradiated with the illumination light to cause the illumination of the semiconductor substrate.
- the diffracted light generated in a pattern is detected, the setting calculation unit calculates the adjustment value from information of the diffracted light detected by the detection unit, and the film thickness measurement unit measures the film thickness.
- the illumination unit irradiates the surface of the semiconductor substrate exposed by the exposure device and the exposure device that is temporally or solidly different, and the detection unit Detecting regularly reflected light from the surface of the semiconductor substrate irradiated with light, the film thickness measuring unit, we are preferable to measure the film thickness from the positive reflected light information detected in the detection unit.
- the illumination unit applies the illumination light to the surface of the semiconductor substrate exposed by the exposure device that is temporally or solidly different.
- the detection unit detects a change in the polarization due to structural birefringence in the pattern of the semiconductor substrate irradiated with the polarization, and the setting calculation unit detects the detection unit with the detection unit.
- the adjustment value is calculated from the change in the polarized light
- the illumination unit irradiates the illumination light onto the surface of the semiconductor substrate exposed by the exposure apparatus and the exposure apparatus that is temporally or solidly different
- the detection unit detects specular reflection light from the surface of the semiconductor substrate irradiated with the illumination light
- the film thickness measurement unit detects the film thickness from information on the specular reflection light detected by the detection unit. May be measured.
- DESCRIPTION OF SYMBOLS 1 Surface inspection apparatus 5 Stage 10 Wafer (10a FEM wafer) 20 Illumination system (illumination part) 30 Light-receiving system 35 Imaging device (detection unit) 40 Image processing unit (setting operation unit and measurement operation unit) 41 Storage Unit 50 Film Thickness Calculation Unit 60 Exposure Apparatus
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Abstract
Description
前記膜厚測定部が前記膜厚を測定するとき、前記照明部は、前記露光装置および前記時間的若しくは固体的に異なる露光装置により露光される前記半導体基板の表面に前記照明光を照射し、前記検出部は、前記照明光が照射された前記半導体基板の表面からの正反射光を検出し、前記膜厚測定部は、前記検出部に検出された前記正反射光の情報から前記膜厚を測定するようにしてもよい。
10 ウェハ(10a FEMウェハ) 20 照明系(照明部)
30 受光系 35 撮像装置(検出部)
40 画像処理部(設定演算部および測定演算部)
41 記憶部
50 膜厚算出部
60 露光装置
Claims (22)
- 露光により形成されたパターンを照明光で照明可能な照明部と、
前記照明されたパターンからの反射光を検出する検出部と、
複数の第1の露光条件で形成されたパターンの検出結果の前記第1の露光条件に対する変化具合である第1の変化具合と、前記第1の露光条件の範囲と少なくとも一部が重複する範囲で間隔が既知な複数の第2の露光条件で形成されたパターンを照明し、該パターンからの反射光の検出結果の前記第2の露光条件に対する変化具合である第2の変化具合とを比較し、前記第1の変化具合と前記第2の変化具合のずれを算出する演算部とを、
備えて構成されることを特徴とする検査装置。 - 前記露光条件はフォーカスおよび露光量の少なくとも一方であることを特徴とする請求項1に記載の検査装置。
- 前記第1の変化具合を記憶する記憶部をさらに備え、
前記記憶部に記憶された前記第1の変化具合に基づいて前記ずれの算出を行うことを特徴とする請求項1もしくは2に記載の検査装置。 - 前記第1の変化具合と前記第2の変化具合とのパターンマッチングを利用して前記比較が行われることを特徴とする請求項1~3のいずれか一項に記載の検査装置。
- 前記第1の露光条件は、パターンの形状を測定可能な測定装置の測定結果に基づいて決められていることを特徴とする請求項1~4のいずれか一項に記載の検査装置。
- 前記算出されたずれに基づいて調整された露光装置により前記第1の露光条件で形成されたパターンを照明し、前記第1の変化具合を求めることを特徴とする請求項1~5のいずれか一項に記載の検査装置。
- 前記検出部は、1回の露光で形成されるパターン内の複数の部分の前記反射光を検出することを特徴とする請求項1~6のいずれか一項に記載の検査装置。
- 前記照明部は、前記パターンが形成された前記基板の表面全体に略平行な光束である前記照明光を一括で照明し、
前記検出部は、前記照明光が照射された前記基板の表面全体からの光を一括で検出することを特徴とする請求項1~7のいずれか一項に記載の検査装置。 - 前記検出部は、前記照明光が照射されて前記基板の前記パターンで発生した回折光を検出することを特徴とする請求項1~8のいずれか一項に記載の検査装置。
- 前記照明部は、前記照明光として略直線偏光を前記基板の表面に照射し、
前記検出部は、前記基板で反射した略直線偏光の振動方向と略直交する振動方向の偏光成分を検出することを特徴とする請求項1~9のいずれか一項に記載の検査装置。 - 前記算出されたずれに基づく情報を露光装置に入力可能に出力することを特徴とする請求項1~10のいずれか一項に記載の検査装置。
- 前記パターンを露光する前のレジスト膜の膜厚を測定する膜厚測定部を備え、
前記演算部は、前記膜厚測定部においてそれぞれ測定された前記膜厚に基づいて、前記比較の補正を行うことを特徴とする請求項1~11のいずれか一項に記載の検査装置。 - 前記膜厚測定部は、前記照明部で照明された前記レジスト膜からの正反射光に基づいて膜厚を測定することを特徴とする請求項12に記載の検査装置。
- 前記膜厚測定部は、複数の波長の光でそれぞれ照明された前記レジスト膜からの正反射光に基づいて膜厚を測定することを特徴とする請求項12もしくは13に記載の検査装置。
- 複数の第1の露光条件で形成されたパターンから得られる反射光の前記第1の露光条件に対する変化具合である第1の変化具合を準備し、
前記第1の露光条件の範囲と少なくとも一部が重複する範囲で間隔が既知な複数の第2の露光条件で形成されたパターンを照明し、
前記照明されたパターンからの反射光を検出し、
前記第2の露光条件に対する前記検出の結果の変化具合である第2の変化具合を求め、
前記第1の変化具合と前記第2の変化具合のずれを求めることを特徴とする検査方法。 - 前記露光条件はフォーカスおよび露光量の少なくとも一方であることを特徴とする請求項15に記載の検査方法。
- 前記第1の変化具合と前記第2の変化具合とのパターンマッチングを利用して前記ずれを求めることを特徴とする請求項15もしくは16に記載の検査方法。
- 1回の露光で形成されるパターン内の複数の部分で前記検出を行うことを特徴とする請求項15~17のいずれか一項に記載の検査方法。
- 前記ずれに基づく情報を前記第2の露光条件でパターンを形成した露光装置に出力することを特徴とする請求項15~18のいずれか一項に記載の検査方法。
- 前記パターンを露光する前のレジスト膜の膜厚で、求めたずれを補正することを特徴とする請求項15~19のいずれか一項に記載の検査方法。
- 照明された前記レジスト膜からの正反射光に基づいて膜厚を求めることを特徴とする請求項20に記載の検査方法。
- 前記レジスト膜を複数の波長の光でそれぞれ照明し、前記レジスト膜からの正反射光に基づいて前記膜厚を求めることを特徴とする請求項20もしくは21に記載の検査方法。
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