WO2011124205A3 - Verpackung für metall-keramik-substrate sowie verfahren zum verpacken solcher substrate - Google Patents
Verpackung für metall-keramik-substrate sowie verfahren zum verpacken solcher substrate Download PDFInfo
- Publication number
- WO2011124205A3 WO2011124205A3 PCT/DE2011/000354 DE2011000354W WO2011124205A3 WO 2011124205 A3 WO2011124205 A3 WO 2011124205A3 DE 2011000354 W DE2011000354 W DE 2011000354W WO 2011124205 A3 WO2011124205 A3 WO 2011124205A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- package
- metal
- substrates
- packaging
- ceramic substrate
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
- 238000001465 metallisation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
- A23C9/00—Milk preparations; Milk powder or milk powder preparations
- A23C9/12—Fermented milk preparations; Treatment using microorganisms or enzymes
- A23C9/13—Fermented milk preparations; Treatment using microorganisms or enzymes using additives
- A23C9/1307—Milk products or derivatives; Fruit or vegetable juices; Sugars, sugar alcohols, sweeteners; Oligosaccharides; Organic acids or salts thereof or acidifying agents; Flavours, dyes or pigments; Inert or aerosol gases; Carbonation methods
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
- A23C9/00—Milk preparations; Milk powder or milk powder preparations
- A23C9/12—Fermented milk preparations; Treatment using microorganisms or enzymes
- A23C9/13—Fermented milk preparations; Treatment using microorganisms or enzymes using additives
- A23C9/137—Thickening substances
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
- A23C9/00—Milk preparations; Milk powder or milk powder preparations
- A23C9/152—Milk preparations; Milk powder or milk powder preparations containing additives
- A23C9/1524—Inert gases, noble gases, oxygen, aerosol gases; Processes for foaming
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23F—COFFEE; TEA; THEIR SUBSTITUTES; MANUFACTURE, PREPARATION, OR INFUSION THEREOF
- A23F5/00—Coffee; Coffee substitutes; Preparations thereof
- A23F5/24—Extraction of coffee; Coffee extracts; Making instant coffee
- A23F5/243—Liquid, semi-liquid or non-dried semi-solid coffee extract preparations; Coffee gels; Liquid coffee in solid capsules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B5/00—Packaging individual articles in containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, jars
- B65B5/08—Packaging groups of articles, the articles being individually gripped or guided for transfer to the containers or receptacles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
- B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
- B65D81/2007—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas under vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
- A23C2210/00—Physical treatment of dairy products
- A23C2210/30—Whipping, foaming, frothing or aerating dairy products
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
- A23C2270/00—Aspects relating to packaging
- A23C2270/05—Gelled or liquid milk product, e.g. yoghurt, cottage cheese or pudding being one of the separate layers of a multilayered soft or liquid food product
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
- A23V2002/00—Food compositions, function of food ingredients or processes for food or foodstuffs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/02—Articles partially enclosed in folded or wound strips or sheets, e.g. wrapped newspapers
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Polymers & Plastics (AREA)
- Food Science & Technology (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Microbiology (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Vacuum Packaging (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/639,261 US9434509B2 (en) | 2010-04-07 | 2011-03-30 | Package for metal-ceramic substrate and method for packing such substrates |
HU1200739A HU230528B1 (hu) | 2010-04-07 | 2011-03-30 | Fém-kerámia szubsztrátum csomagolás, valamint ilyen szubsztrátumok csomagolására szolgáló eljárás |
JP2013503000A JP5794438B2 (ja) | 2010-04-07 | 2011-03-30 | 金属−セラミック基板の包装並びにそのような基板の包装方法 |
KR1020127026454A KR101905197B1 (ko) | 2010-04-07 | 2011-03-30 | 금속-세라믹 기판용 패키지 및 이러한 기판의 패키징 방법 |
CN201180017250.0A CN102939646B (zh) | 2010-04-07 | 2011-03-30 | 金属陶瓷基底的封装以及用于封装这种基底的方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010014138.0 | 2010-04-07 | ||
DE102010014138 | 2010-04-07 | ||
DE102010018668A DE102010018668B4 (de) | 2010-04-07 | 2010-04-28 | Verpackungseinheit für Metall-Keramik-Substrate |
DE102010018668.6 | 2010-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011124205A2 WO2011124205A2 (de) | 2011-10-13 |
WO2011124205A3 true WO2011124205A3 (de) | 2012-02-23 |
Family
ID=44544004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2011/000354 WO2011124205A2 (de) | 2010-04-07 | 2011-03-30 | Verpackung für metall-keramik-substrate sowie verfahren zum verpacken solcher substrate |
Country Status (7)
Country | Link |
---|---|
US (1) | US9434509B2 (de) |
JP (1) | JP5794438B2 (de) |
KR (1) | KR101905197B1 (de) |
CN (1) | CN102939646B (de) |
DE (1) | DE102010018668B4 (de) |
HU (1) | HU230528B1 (de) |
WO (1) | WO2011124205A2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011106104B4 (de) * | 2011-06-09 | 2014-04-10 | Otto Bock Healthcare Products Gmbh | Verfahren zum Herstellen bestückter Leiterplatten |
KR101695576B1 (ko) * | 2015-12-22 | 2017-01-11 | 재단법인 다차원 스마트 아이티 융합시스템 연구단 | 입력 패턴 및 출력 패턴이 분리 가능한 파워 앰프 모듈 패키지 및 그 패키징 방법 |
US11262130B1 (en) * | 2017-12-14 | 2022-03-01 | Kolorfusion International Inc. | System and method for heat and pressure treatment |
EP3664128B1 (de) | 2018-12-06 | 2021-03-31 | Heraeus Deutschland GmbH & Co. KG | Verpackungseinheit für substrate |
EP3664129B1 (de) | 2018-12-06 | 2022-02-02 | Heraeus Deutschland GmbH & Co. KG | Verpackungseinheit für ein substrat |
EP3664130B1 (de) | 2018-12-06 | 2022-02-02 | Heraeus Deutschland GmbH & Co. KG | Verpackungseinheit für ein substrat |
US20200395234A1 (en) * | 2019-06-12 | 2020-12-17 | Intel Corporation | Multi-component trays for transporting integrated circuit dice |
WO2021066845A1 (en) * | 2019-10-04 | 2021-04-08 | Hewlett-Packard Development Company, L.P. | Molded substrates |
KR20210103800A (ko) * | 2020-02-14 | 2021-08-24 | 주식회사 아모그린텍 | 기판 트레이 |
JP7361641B2 (ja) * | 2020-03-10 | 2023-10-16 | 日本碍子株式会社 | 角柱状ハニカム構造体用トレイ |
US20220199455A1 (en) * | 2020-12-22 | 2022-06-23 | Applied Materials, Inc. | Minimal contact packaging for process chamber components |
USD984895S1 (en) | 2020-12-22 | 2023-05-02 | Applied Materials, Inc. | Packaging insert for a process chamber component |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6112795A (en) * | 1998-03-12 | 2000-09-05 | International Business Machines Corporation | Fixture for multi-layered ceramic package assembly |
WO2009019190A1 (de) * | 2007-08-03 | 2009-02-12 | Siemens Aktiengesellschaft | Federkontaktierung von elektrischen kontaktflächen eines elektronischen bauteils |
Family Cites Families (19)
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US3766634A (en) | 1972-04-20 | 1973-10-23 | Gen Electric | Method of direct bonding metals to non-metallic substrates |
US3744120A (en) | 1972-04-20 | 1973-07-10 | Gen Electric | Direct bonding of metals with a metal-gas eutectic |
US4548824A (en) * | 1983-05-02 | 1985-10-22 | Pakor, Inc. | Package for storing perishable products in a reduced air atmosphere |
US4707414A (en) * | 1984-04-09 | 1987-11-17 | General Dynamics, Pomona Division | Electrostatic-free package |
JPS61152576A (ja) * | 1984-12-18 | 1986-07-11 | 松下電器産業株式会社 | リ−ドフレ−ムの包装方法 |
US4933193A (en) * | 1987-12-11 | 1990-06-12 | E. I. Du Pont De Nemours And Company | Microwave cooking package |
US5546731A (en) * | 1993-07-02 | 1996-08-20 | Ihor Wyslotsky | Method of extending shelf life of a comestible product while providing a locally packaged appearance |
US5575394A (en) * | 1994-07-15 | 1996-11-19 | Fluoroware, Inc. | Wafer shipper and package |
EP0862209B1 (de) * | 1997-03-01 | 2009-12-16 | Electrovac AG | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
JP3967010B2 (ja) * | 1997-11-14 | 2007-08-29 | シャープ株式会社 | 包装トレイ |
JP4117691B2 (ja) * | 1998-04-27 | 2008-07-16 | ローム株式会社 | 物品包装体および物品包装方法 |
KR20020063246A (ko) * | 1999-12-28 | 2002-08-01 | 가부시키 가이샤 에바라 세이사꾸쇼 | 기판 표면의 산화방지방법 및 장치 |
US6474475B1 (en) * | 2000-02-22 | 2002-11-05 | Micron Technology, Inc. | Apparatus for handling stacked integrated circuit devices |
US6837374B2 (en) * | 2001-07-15 | 2005-01-04 | Entegris, Inc. | 300MM single stackable film frame carrier |
DE10309210B4 (de) * | 2003-02-28 | 2006-04-27 | Leica Mikrosysteme Gmbh | Verwendung eines Transportbehälters für Objektträger zur immunologischen Markierung für Gewebedünnschnitte |
JP4335921B2 (ja) | 2003-09-23 | 2009-09-30 | イリノイ トゥール ワークス インコーポレイティド | 低コストウェファボックスの改良 |
US7520389B2 (en) * | 2004-05-24 | 2009-04-21 | Seagate Technologies, Llc | Package structure for soft mounting direct connect storage device |
AU2005283083A1 (en) * | 2004-07-01 | 2006-03-16 | Daikyo Seiko, Ltd. | Vacuum package system and method |
JP2006131288A (ja) * | 2004-11-09 | 2006-05-25 | Fujinon Sano Kk | 光学素子収容ケース |
-
2010
- 2010-04-28 DE DE102010018668A patent/DE102010018668B4/de active Active
-
2011
- 2011-03-30 US US13/639,261 patent/US9434509B2/en active Active
- 2011-03-30 CN CN201180017250.0A patent/CN102939646B/zh active Active
- 2011-03-30 JP JP2013503000A patent/JP5794438B2/ja active Active
- 2011-03-30 WO PCT/DE2011/000354 patent/WO2011124205A2/de active Application Filing
- 2011-03-30 KR KR1020127026454A patent/KR101905197B1/ko active IP Right Grant
- 2011-03-30 HU HU1200739A patent/HU230528B1/hu unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6112795A (en) * | 1998-03-12 | 2000-09-05 | International Business Machines Corporation | Fixture for multi-layered ceramic package assembly |
WO2009019190A1 (de) * | 2007-08-03 | 2009-02-12 | Siemens Aktiengesellschaft | Federkontaktierung von elektrischen kontaktflächen eines elektronischen bauteils |
Also Published As
Publication number | Publication date |
---|---|
US20130213853A1 (en) | 2013-08-22 |
KR101905197B1 (ko) | 2018-11-30 |
CN102939646B (zh) | 2015-06-17 |
WO2011124205A2 (de) | 2011-10-13 |
JP2013523547A (ja) | 2013-06-17 |
JP5794438B2 (ja) | 2015-10-14 |
HU230528B1 (hu) | 2016-11-28 |
HUP1200739A2 (en) | 2013-10-28 |
DE102010018668A1 (de) | 2012-01-19 |
CN102939646A (zh) | 2013-02-20 |
US9434509B2 (en) | 2016-09-06 |
DE102010018668B4 (de) | 2012-11-15 |
KR20130040816A (ko) | 2013-04-24 |
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