WO2011124205A3 - Verpackung für metall-keramik-substrate sowie verfahren zum verpacken solcher substrate - Google Patents

Verpackung für metall-keramik-substrate sowie verfahren zum verpacken solcher substrate Download PDF

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Publication number
WO2011124205A3
WO2011124205A3 PCT/DE2011/000354 DE2011000354W WO2011124205A3 WO 2011124205 A3 WO2011124205 A3 WO 2011124205A3 DE 2011000354 W DE2011000354 W DE 2011000354W WO 2011124205 A3 WO2011124205 A3 WO 2011124205A3
Authority
WO
WIPO (PCT)
Prior art keywords
package
metal
substrates
packaging
ceramic substrate
Prior art date
Application number
PCT/DE2011/000354
Other languages
English (en)
French (fr)
Other versions
WO2011124205A2 (de
Inventor
Johann BRÄUTIGAM
Erich Ernstberger
Heiko Schweiger
Jürgen SCHULZ-HARDER
Original Assignee
Curamik Electronics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics Gmbh filed Critical Curamik Electronics Gmbh
Priority to US13/639,261 priority Critical patent/US9434509B2/en
Priority to HU1200739A priority patent/HU230528B1/hu
Priority to JP2013503000A priority patent/JP5794438B2/ja
Priority to KR1020127026454A priority patent/KR101905197B1/ko
Priority to CN201180017250.0A priority patent/CN102939646B/zh
Publication of WO2011124205A2 publication Critical patent/WO2011124205A2/de
Publication of WO2011124205A3 publication Critical patent/WO2011124205A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
    • A23C9/00—Milk preparations; Milk powder or milk powder preparations
    • A23C9/12—Fermented milk preparations; Treatment using microorganisms or enzymes
    • A23C9/13—Fermented milk preparations; Treatment using microorganisms or enzymes using additives
    • A23C9/1307—Milk products or derivatives; Fruit or vegetable juices; Sugars, sugar alcohols, sweeteners; Oligosaccharides; Organic acids or salts thereof or acidifying agents; Flavours, dyes or pigments; Inert or aerosol gases; Carbonation methods
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
    • A23C9/00—Milk preparations; Milk powder or milk powder preparations
    • A23C9/12—Fermented milk preparations; Treatment using microorganisms or enzymes
    • A23C9/13—Fermented milk preparations; Treatment using microorganisms or enzymes using additives
    • A23C9/137—Thickening substances
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
    • A23C9/00—Milk preparations; Milk powder or milk powder preparations
    • A23C9/152—Milk preparations; Milk powder or milk powder preparations containing additives
    • A23C9/1524—Inert gases, noble gases, oxygen, aerosol gases; Processes for foaming
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23F—COFFEE; TEA; THEIR SUBSTITUTES; MANUFACTURE, PREPARATION, OR INFUSION THEREOF
    • A23F5/00—Coffee; Coffee substitutes; Preparations thereof
    • A23F5/24—Extraction of coffee; Coffee extracts; Making instant coffee
    • A23F5/243—Liquid, semi-liquid or non-dried semi-solid coffee extract preparations; Coffee gels; Liquid coffee in solid capsules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B5/00—Packaging individual articles in containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, jars
    • B65B5/08—Packaging groups of articles, the articles being individually gripped or guided for transfer to the containers or receptacles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
    • B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
    • B65D81/2007—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas under vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
    • A23C2210/00—Physical treatment of dairy products
    • A23C2210/30—Whipping, foaming, frothing or aerating dairy products
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23C—DAIRY PRODUCTS, e.g. MILK, BUTTER OR CHEESE; MILK OR CHEESE SUBSTITUTES; MAKING THEREOF
    • A23C2270/00—Aspects relating to packaging
    • A23C2270/05—Gelled or liquid milk product, e.g. yoghurt, cottage cheese or pudding being one of the separate layers of a multilayered soft or liquid food product
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
    • A23V2002/00—Food compositions, function of food ingredients or processes for food or foodstuffs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/02—Articles partially enclosed in folded or wound strips or sheets, e.g. wrapped newspapers

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Food Science & Technology (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Microbiology (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Vacuum Packaging (AREA)

Abstract

Verpackung für Metall-Keramik-Substrate jeweils bestehend aus einer Keramikschicht, aus mehreren auf wenigstens einer Oberflächenseite der Keramikschicht gebildeten Einzelmetallisierungen und zwischen diesen verlaufenden Sollbruchlinien.
PCT/DE2011/000354 2010-04-07 2011-03-30 Verpackung für metall-keramik-substrate sowie verfahren zum verpacken solcher substrate WO2011124205A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US13/639,261 US9434509B2 (en) 2010-04-07 2011-03-30 Package for metal-ceramic substrate and method for packing such substrates
HU1200739A HU230528B1 (hu) 2010-04-07 2011-03-30 Fém-kerámia szubsztrátum csomagolás, valamint ilyen szubsztrátumok csomagolására szolgáló eljárás
JP2013503000A JP5794438B2 (ja) 2010-04-07 2011-03-30 金属−セラミック基板の包装並びにそのような基板の包装方法
KR1020127026454A KR101905197B1 (ko) 2010-04-07 2011-03-30 금속-세라믹 기판용 패키지 및 이러한 기판의 패키징 방법
CN201180017250.0A CN102939646B (zh) 2010-04-07 2011-03-30 金属陶瓷基底的封装以及用于封装这种基底的方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102010014138.0 2010-04-07
DE102010014138 2010-04-07
DE102010018668A DE102010018668B4 (de) 2010-04-07 2010-04-28 Verpackungseinheit für Metall-Keramik-Substrate
DE102010018668.6 2010-04-28

Publications (2)

Publication Number Publication Date
WO2011124205A2 WO2011124205A2 (de) 2011-10-13
WO2011124205A3 true WO2011124205A3 (de) 2012-02-23

Family

ID=44544004

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2011/000354 WO2011124205A2 (de) 2010-04-07 2011-03-30 Verpackung für metall-keramik-substrate sowie verfahren zum verpacken solcher substrate

Country Status (7)

Country Link
US (1) US9434509B2 (de)
JP (1) JP5794438B2 (de)
KR (1) KR101905197B1 (de)
CN (1) CN102939646B (de)
DE (1) DE102010018668B4 (de)
HU (1) HU230528B1 (de)
WO (1) WO2011124205A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011106104B4 (de) * 2011-06-09 2014-04-10 Otto Bock Healthcare Products Gmbh Verfahren zum Herstellen bestückter Leiterplatten
KR101695576B1 (ko) * 2015-12-22 2017-01-11 재단법인 다차원 스마트 아이티 융합시스템 연구단 입력 패턴 및 출력 패턴이 분리 가능한 파워 앰프 모듈 패키지 및 그 패키징 방법
US11262130B1 (en) * 2017-12-14 2022-03-01 Kolorfusion International Inc. System and method for heat and pressure treatment
EP3664128B1 (de) 2018-12-06 2021-03-31 Heraeus Deutschland GmbH & Co. KG Verpackungseinheit für substrate
EP3664129B1 (de) 2018-12-06 2022-02-02 Heraeus Deutschland GmbH & Co. KG Verpackungseinheit für ein substrat
EP3664130B1 (de) 2018-12-06 2022-02-02 Heraeus Deutschland GmbH & Co. KG Verpackungseinheit für ein substrat
US20200395234A1 (en) * 2019-06-12 2020-12-17 Intel Corporation Multi-component trays for transporting integrated circuit dice
WO2021066845A1 (en) * 2019-10-04 2021-04-08 Hewlett-Packard Development Company, L.P. Molded substrates
KR20210103800A (ko) * 2020-02-14 2021-08-24 주식회사 아모그린텍 기판 트레이
JP7361641B2 (ja) * 2020-03-10 2023-10-16 日本碍子株式会社 角柱状ハニカム構造体用トレイ
US20220199455A1 (en) * 2020-12-22 2022-06-23 Applied Materials, Inc. Minimal contact packaging for process chamber components
USD984895S1 (en) 2020-12-22 2023-05-02 Applied Materials, Inc. Packaging insert for a process chamber component

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US6112795A (en) * 1998-03-12 2000-09-05 International Business Machines Corporation Fixture for multi-layered ceramic package assembly
WO2009019190A1 (de) * 2007-08-03 2009-02-12 Siemens Aktiengesellschaft Federkontaktierung von elektrischen kontaktflächen eines elektronischen bauteils

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WO2009019190A1 (de) * 2007-08-03 2009-02-12 Siemens Aktiengesellschaft Federkontaktierung von elektrischen kontaktflächen eines elektronischen bauteils

Also Published As

Publication number Publication date
US20130213853A1 (en) 2013-08-22
KR101905197B1 (ko) 2018-11-30
CN102939646B (zh) 2015-06-17
WO2011124205A2 (de) 2011-10-13
JP2013523547A (ja) 2013-06-17
JP5794438B2 (ja) 2015-10-14
HU230528B1 (hu) 2016-11-28
HUP1200739A2 (en) 2013-10-28
DE102010018668A1 (de) 2012-01-19
CN102939646A (zh) 2013-02-20
US9434509B2 (en) 2016-09-06
DE102010018668B4 (de) 2012-11-15
KR20130040816A (ko) 2013-04-24

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