WO2011120770A1 - Led module and manufacturing method thereof - Google Patents

Led module and manufacturing method thereof Download PDF

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Publication number
WO2011120770A1
WO2011120770A1 PCT/EP2011/053506 EP2011053506W WO2011120770A1 WO 2011120770 A1 WO2011120770 A1 WO 2011120770A1 EP 2011053506 W EP2011053506 W EP 2011053506W WO 2011120770 A1 WO2011120770 A1 WO 2011120770A1
Authority
WO
WIPO (PCT)
Prior art keywords
casing
led module
heat sinks
led
potting material
Prior art date
Application number
PCT/EP2011/053506
Other languages
French (fr)
Inventor
Canbang Yang
Yubao He
Zesheng Ye
Huajian Fan
Original Assignee
Osram Gesellschaft mit beschränkter Haftung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gesellschaft mit beschränkter Haftung filed Critical Osram Gesellschaft mit beschränkter Haftung
Publication of WO2011120770A1 publication Critical patent/WO2011120770A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations

Definitions

  • the present invention relates to an LED module and a manufacturing method of the LED module.
  • LED is a widely used light source, and also a light source with a long lifetime.
  • LED module is required to have waterproofing and dustproofing functions, for instance, it should meet relevant requirement of IP protection level.
  • IP protection level for example, IP dustproof and waterproof levels
  • the shortcoming is that it is hard to transfer heat to the surrounding environment when the heat sinks for thermal conductivity are covered by such potting materials with poor thermal conductivity, thus, the LED efficacy and lifetime are decreased.
  • Silicone rubber structure and low pressure molding are also common manners used in the prior art to meet the IP protection level.
  • the object of the present invention aims at providing an LED module capable of realizing favorable IP protection level as well as good thermal conductivity.
  • the LED module comprises a casing, LED light emitting assemblies and heat sinks.
  • the LED light emitting assemblies and the heat sinks are provided in the casing by means of potting materials, wherein, the casing has an opening opened to one side, and the heat sinks are exposed through the opening.
  • the heat sinks since the heat sinks are directly exposed to the environment, they can transfer the heat of the LED light emitting assemblies to the environment very well, so as to obtain thermal conductivity with high efficiency.
  • favorable IP protection level can be obtained by using the potting materials.
  • the casing 1 has a frontside from which the light is emitted and a backside opposite to the frontside, and the one side is the backside.
  • the frontside is transparent.
  • the space between the heat sinks and a casing edge defining a boundary of the opening is filled with a potting material which is preferably suited to be bonded with the heat sinks and the casing.
  • a potting material which is preferably suited to be bonded with the heat sinks and the casing.
  • the potting material is PU glue or silicone resin, and other materials possessing good bonding property also can be used.
  • a surface of the casing edge of the casing facing the heat sinks is coated with a sealant coating layer.
  • the sealant coating layer can be the quickly cured sealant coating layer that can be purchased in the market.
  • the sealant coating layer advantageously prevents the potting material of backside of LED modules from invading the frontside of LED modules and the production yield of the LED module is further improved.
  • the casing is made of plastic, a pipe for vacuumization which is guided into the inside of the casing and is integral with the casing is provided; and the pipe for vacuumization can be partly melted airproof after vacuumization.
  • the device for vacuumization simply can be connected to the pipe for vacuumization through which the air in the casing after potting is extracted, and the pipe is made airproof by simply partly melting the same, such that the inside of the casing is separated from the outside.
  • the pipe for vacuumization is integrally formed with the casing, the manufacturing process is therefore simplified and the production efficiency of the LED module is improved.
  • the LED light emitting assemblies comprise an LED lamp, a circuit board and a connection cable connected to the circuit board.
  • the LED lamp is mounted on the circuit board.
  • the object of the present invention further aims at providing a method for manufacturing the LED module described above.
  • the method comprises the following steps: a) providing a casing having an opening opened to one side; b) mounting LED light emitting assemblies and heat sinks in the casing to make the heat sinks exposed through the opening, thus, the heat sinks can be in direct contact with the air, and favorable thermal conductivity is obtained; and c) filling the potting material into the space between the heat sinks and the edge of the casing defining the boundary of the opening, and curing the potting material. Therefore, good IP protection level of the LED module as well as favorable thermal conductivity can be obtained.
  • the method according the present invention further comprises step d) before step b) or step c): coating a sealant coating layer on a surface of casing edge facing the heat sinks.
  • the sealant coating layer further profitably prevents the potting material from invading the elements in the frontside such as the circuits of the LED light emitting assemblies.
  • step e performing a vacuumizing process by a pipe which is guided into the inside of the casing and partly melting the pipe airproof after the vacuumizing process. Then, vacuumization is simply accomplished, while the vacuum state in the casing is maintained.
  • the LED module according to the present invention Through application of the LED module according to the present invention, it is much easier to dissipate the heat emitted by the LED light emitting assemblies themselves, to obtain reliable IP protection level, and to further advantageously avoid condensation in the LED module. And furthermore, the LED module according to the present invention also can be used in various different fields such as high power down light.
  • Figure 1 is an exploded view of the LED module according to the present invention.
  • Figure 2 is a top view of the LED module according to the present invention observed from the side of the opening of the casing;
  • Figure 3 is a side view of the LED module 10 according to the present invention observed from one side having the pipe for vacuumization.
  • FIG. 1 is an exploded view of the LED module according to the present invention. From the figure it can be seen that the LED module 10 comprises a casing 1 , light emitting assemblies formed by an LED lamp 2, a PCB circuit board 3 and a connection cable 6, and heat sinks 4.
  • the casing 1 has an opening opened to one side.
  • the LED lamp 2, the PCB circuit board 3 and the connection cable 6, and the heat sinks 4 are provided in the casing 1 through the opening, and these components can be preassembled before being provided in the casing 1 , for example, mounting the LED lamp 2 on the PCB circuit board 3 and contacting the conduction surface of the heat sinks 4 with the LED lamp 2.
  • the heat emitted by the LED lamp 2 and the PCB circuit board 3 are dissipated. Since the heat sinks 4 are exposed in the environment and in direct contact with the air, the heat sinks can advantageously transfer the heat emitted by the LED lamp 2 and the PCB circuit board 3 to the air, therefore, the thermal conductivity with high efficiency can be obtained, and good IP protection level also can be achieved by using the potting materials.
  • Figure 2 is a top view of the LED module 10 according to the present invention observed from the side of the opening of the casing 1 . From the figure it can be clearly seen that the inner surface of the casing edge 9 facing the heat sinks is coated with a sealant coating layer 8, which is aimed at preventing the invasion of potting material from backside of LED module into the element in the frontside of the LED module in the potting step. A potting material such as PU glue or silicone resin is potted between the sealant coating layer 8 and the heat sinks 4, makes the gap between the sealant coating layer 8 and the heat sinks 4 waterproof, and thus has the function of preventing water invasion. From figure 2 it can be further seen that the heat dissipation surface of the heat sinks are exposed in and in direct contact with the air, thereby, favorable heat dissipation effect is achieved.
  • a sealant coating layer 8 such as PU glue or silicone resin
  • FIG 3 is a side view of the LED module 10 according to the present invention observed from one side having the pipe for vacuumization.
  • the pipe for vacuumization can be clearly seen herefrom.
  • the pipe is integral with the casing 1 and guided into the inside of the casing 1 .
  • the casing 1 and the pipe 5 are made of plastic material.
  • the vacuumizing device which is not shown is connected with the pipe 5, so as to extract the air within the casing 1 .
  • the pipe 5 is melted. Since the pipe 5 is made of plastic material, when melting the pipe 5, the plastic material is melted, thus, the pipe guided into the inside of the casing 1 is automatically closed, and further the inside of the casing 1 is kept vacuumized.
  • the method for manufacturing the LED module according to the present invention is explained in detail in reference to figures 1 , 2 and 3. Firstly, a) providing a casing having an opening opened to one side; then, b) mounting LED light emitting assemblies and heat sinks 4 in the casing 1 to make the heat sinks 4 exposed through the opening, accordingly, the heat sinks can be in direct contact with the air, and favorable thermal conductivity can be obtained. Wherei n , the LED light emitti ng assemblies and the heat si nks can be preassembled together.
  • a sealant coating layer can be coated on the inner surface of casing edge 9. The sealant coating layer advantageously prevents a potting material 8 from invading the elements in the frontside of LED modules.
  • step c) filling a potting material into the space between the heat sinks 4 and the casing edge 9, then, after curing the potting material, further comprising step e) performing a vacuumizing process by means of a pipe 5 provided on periphery of the casing and guided into the inside of the casing with the help of a vacuumizing device (not shown) and closing the pipe 5 by partly melting the pipe, so as to achieve favorable IP protection level of the LED module as well as good thermal conductivity.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present relates to an LED module (10), comprising a casing (1), LED light emitting assemblies and heat sinks (4) with the LED light emitting assemblies and the heat sinks (4) being provided in the casing (1) using a potting material, characterized in that the casing (1) has an opening opened to one side, and the heat sinks (4) are exposed through the opening. Through application of the LED module according to the present invention, it is much easier to dissipate the heat emitted by the LED light emitting assemblies themselves, and to obtain reliable IP protection level.

Description

Description
LED Module and Manufacturing Method thereof Technical Field
The present invention relates to an LED module and a manufacturing method of the LED module.
Background Art
LED is a widely used light source, and also a light source with a long lifetime.
LED module is required to have waterproofing and dustproofing functions, for instance, it should meet relevant requirement of IP protection level. In order to meet such requirement, in the prior art, the following solution is usually used: providing each component such as LED assembly of the LED module and heat sinks in a closed plastic casing, and potting epoxy resin, silicone resin or other potting materials between these components and the plastic casing. By this manner, IP protection level, for example, IP dustproof and waterproof levels, is well met, but the shortcoming is that it is hard to transfer heat to the surrounding environment when the heat sinks for thermal conductivity are covered by such potting materials with poor thermal conductivity, thus, the LED efficacy and lifetime are decreased. Silicone rubber structure and low pressure molding are also common manners used in the prior art to meet the IP protection level.
The disadvantage of the above manners is damaging the thermal conductivity of the LED module when the IP protection level is satisfied. Therefore, it is an urgent need to solve the problem in the prior art.
Summary of the Invention
The object of the present invention aims at providing an LED module capable of realizing favorable IP protection level as well as good thermal conductivity.
The LED module comprises a casing, LED light emitting assemblies and heat sinks. The LED light emitting assemblies and the heat sinks are provided in the casing by means of potting materials, wherein, the casing has an opening opened to one side, and the heat sinks are exposed through the opening. In this solution, since the heat sinks are directly exposed to the environment, they can transfer the heat of the LED light emitting assemblies to the environment very well, so as to obtain thermal conductivity with high efficiency. In addition, favorable IP protection level can be obtained by using the potting materials.
Preferably, the casing 1 has a frontside from which the light is emitted and a backside opposite to the frontside, and the one side is the backside. The frontside is transparent.
According to the embodiment of the present invention, the space between the heat sinks and a casing edge defining a boundary of the opening is filled with a potting material which is preferably suited to be bonded with the heat sinks and the casing. Through the favorable bonding performance of the potting material, the heat sinks and the casing are completely bonded together, therefore, fluids such as water and oil cannot invade the elements such as circuit board or LED lamp of the LED module, through the gap between the heat sinks and casing, so as to avoid possible short circuit and other problems, and the IP protection level of the whole LED module is also improved.
Preferably, the potting material is PU glue or silicone resin, and other materials possessing good bonding property also can be used.
Advantageously, a surface of the casing edge of the casing facing the heat sinks is coated with a sealant coating layer. The sealant coating layer can be the quickly cured sealant coating layer that can be purchased in the market. When the potting material is potted between the heat sinks and the casing edge from backside of LED modules, the sealant coating layer advantageously prevents the potting material of backside of LED modules from invading the frontside of LED modules and the production yield of the LED module is further improved.
Furthermore, preferably, the casing is made of plastic, a pipe for vacuumization which is guided into the inside of the casing and is integral with the casing is provided; and the pipe for vacuumization can be partly melted airproof after vacuumization. The device for vacuumization simply can be connected to the pipe for vacuumization through which the air in the casing after potting is extracted, and the pipe is made airproof by simply partly melting the same, such that the inside of the casing is separated from the outside. Thus, it effectively keeps vacuum within the casing so as to avoid condensation in the module when using the LED module. Since the pipe for vacuumization is integrally formed with the casing, the manufacturing process is therefore simplified and the production efficiency of the LED module is improved.
In the LED module according to the present invention, the LED light emitting assemblies comprise an LED lamp, a circuit board and a connection cable connected to the circuit board. The LED lamp is mounted on the circuit board.
Moreover, the object of the present invention further aims at providing a method for manufacturing the LED module described above.
The method comprises the following steps: a) providing a casing having an opening opened to one side; b) mounting LED light emitting assemblies and heat sinks in the casing to make the heat sinks exposed through the opening, thus, the heat sinks can be in direct contact with the air, and favorable thermal conductivity is obtained; and c) filling the potting material into the space between the heat sinks and the edge of the casing defining the boundary of the opening, and curing the potting material. Therefore, good IP protection level of the LED module as well as favorable thermal conductivity can be obtained.
Besides, preferably, the method according the present invention further comprises step d) before step b) or step c): coating a sealant coating layer on a surface of casing edge facing the heat sinks. The sealant coating layer further profitably prevents the potting material from invading the elements in the frontside such as the circuits of the LED light emitting assemblies.
Lastly, in step e), performing a vacuumizing process by a pipe which is guided into the inside of the casing and partly melting the pipe airproof after the vacuumizing process. Then, vacuumization is simply accomplished, while the vacuum state in the casing is maintained.
Through application of the LED module according to the present invention, it is much easier to dissipate the heat emitted by the LED light emitting assemblies themselves, to obtain reliable IP protection level, and to further advantageously avoid condensation in the LED module. And furthermore, the LED module according to the present invention also can be used in various different fields such as high power down light.
Brief Description of the Drawings
The present is further explained by combining with the drawings and the embodiments:
Figure 1 is an exploded view of the LED module according to the present invention;
Figure 2 is a top view of the LED module according to the present invention observed from the side of the opening of the casing;
Figure 3 is a side view of the LED module 10 according to the present invention observed from one side having the pipe for vacuumization.
Detailed Description of the Embodiments
Figure 1 is an exploded view of the LED module according to the present invention. From the figure it can be seen that the LED module 10 comprises a casing 1 , light emitting assemblies formed by an LED lamp 2, a PCB circuit board 3 and a connection cable 6, and heat sinks 4. The casing 1 has an opening opened to one side. In the assembling state, the LED lamp 2, the PCB circuit board 3 and the connection cable 6, and the heat sinks 4 are provided in the casing 1 through the opening, and these components can be preassembled before being provided in the casing 1 , for example, mounting the LED lamp 2 on the PCB circuit board 3 and contacting the conduction surface of the heat sinks 4 with the LED lamp 2.
Consequently, the heat emitted by the LED lamp 2 and the PCB circuit board 3 are dissipated. Since the heat sinks 4 are exposed in the environment and in direct contact with the air, the heat sinks can advantageously transfer the heat emitted by the LED lamp 2 and the PCB circuit board 3 to the air, therefore, the thermal conductivity with high efficiency can be obtained, and good IP protection level also can be achieved by using the potting materials.
Figure 2 is a top view of the LED module 10 according to the present invention observed from the side of the opening of the casing 1 . From the figure it can be clearly seen that the inner surface of the casing edge 9 facing the heat sinks is coated with a sealant coating layer 8, which is aimed at preventing the invasion of potting material from backside of LED module into the element in the frontside of the LED module in the potting step. A potting material such as PU glue or silicone resin is potted between the sealant coating layer 8 and the heat sinks 4, makes the gap between the sealant coating layer 8 and the heat sinks 4 waterproof, and thus has the function of preventing water invasion. From figure 2 it can be further seen that the heat dissipation surface of the heat sinks are exposed in and in direct contact with the air, thereby, favorable heat dissipation effect is achieved.
Figure 3 is a side view of the LED module 10 according to the present invention observed from one side having the pipe for vacuumization. The pipe for vacuumization can be clearly seen herefrom. The pipe is integral with the casing 1 and guided into the inside of the casing 1 . In this solution, the casing 1 and the pipe 5 are made of plastic material. The vacuumizing device which is not shown is connected with the pipe 5, so as to extract the air within the casing 1 . When the casing is vacuumized, the pipe 5 is melted. Since the pipe 5 is made of plastic material, when melting the pipe 5, the plastic material is melted, thus, the pipe guided into the inside of the casing 1 is automatically closed, and further the inside of the casing 1 is kept vacuumized.
The method for manufacturing the LED module according to the present invention is explained in detail in reference to figures 1 , 2 and 3. Firstly, a) providing a casing having an opening opened to one side; then, b) mounting LED light emitting assemblies and heat sinks 4 in the casing 1 to make the heat sinks 4 exposed through the opening, accordingly, the heat sinks can be in direct contact with the air, and favorable thermal conductivity can be obtained. Wherei n , the LED light emitti ng assemblies and the heat si nks can be preassembled together. Optionally, before or after step b), a sealant coating layer can be coated on the inner surface of casing edge 9. The sealant coating layer advantageously prevents a potting material 8 from invading the elements in the frontside of LED modules.
Then, performing potting step: c) filling a potting material into the space between the heat sinks 4 and the casing edge 9, then, after curing the potting material, further comprising step e) performing a vacuumizing process by means of a pipe 5 provided on periphery of the casing and guided into the inside of the casing with the help of a vacuumizing device (not shown) and closing the pipe 5 by partly melting the pipe, so as to achieve favorable IP protection level of the LED module as well as good thermal conductivity.

Claims

Claims
1 . An LED module (10), comprising a casing (1 ), LED light emitting assemblies and heat sinks (4) with the LED light emitting assemblies and the heat sinks (4) being provided in the casing (1 ) by means of potting material, characterized in that the casing (1 ) has an opening opened to one side, and the heat sinks (4) are exposed through the opening.
2. The LED module (10) according to Claim 1 , characterized in that the casing (1 ) has a frontside from which light is emitted and a backside opposite to the frontside, and the one side is the backside.
3. The LED module (10) according to Claim 1 or 2, characterized in that a space between the heat sinks (4) and a casing edge (9) defining a boundary of the opening is filled with a potting material (7).
4. The LED module (10) according to Claim 3, characterized in that the potting material (7) is suited to be bonded with the heat sinks (4) and the casing (1 ).
5. The LED module (10) according to Claim 4, characterized in that the potting material (7) is PU glue or silicon resin.
6. The LED module (10) according to Claim 3, characterized in that a surface of the casing edge (9) of the casing (1 ) facing the heat sinks (4) is coated with a sealant coating layer (8).
7. The LED module (10) according to Claim 1 or 2, characterized in that the casing (1 ) is made of plastic; a pipe (5) for vacuumization which is guided into the inside of the casing and is integral with the casing (1 ) is provided; and the pipe can be partly melted airproof after vacuumization.
8. The LED module (10) according to Claim 1 or 2, characterized in that the LED light emitting assemblies comprise an LED lamp (2), a circuit board (3) and a connection cable (6); and the LED lamp (2) is mounted on the circuit board (3).
9. A method for manufacturing an LED module (10), comprising the following steps: a ) providing a casing (1 ) having an opening opened to one side; b ) mounting LED light emitting assemblies and heat sinks (4) in the casing (1 ) to make the heat sinks (4) exposed through the opening; c ) filling a potting material into a space between the heat sinks (4) and a casing edge (9) defining an edge of the opening, and curing said potting material.
1 0. The method for manufacturing the LED module according to Claim 9, further comprising step d) before step b) or step c): coating a sealant coating layer (8) on a surface of casing edge (9) facing the heat sinks (4).
1 1 . The method for manufacturing the LED module according to Claim 9 or 10, further comprising step e) after step c): performing a vacuumizing process by a pipe (5) which is guided into the inside of the casing, and partly melting the pipe airproof after the vacuumizing process.
PCT/EP2011/053506 2010-03-30 2011-03-09 Led module and manufacturing method thereof WO2011120770A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010157478.7A CN102207251A (en) 2010-03-30 2010-03-30 LED (light emitting diode) module and manufacturing method thereof
CN201010157478.7 2010-03-30

Publications (1)

Publication Number Publication Date
WO2011120770A1 true WO2011120770A1 (en) 2011-10-06

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WO (1) WO2011120770A1 (en)

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GB2490421A (en) * 2011-04-29 2012-10-31 Joy Mm Delaware Inc Flat panel light
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GB2490421B (en) * 2011-04-29 2018-10-17 Joy Global Underground Mining Llc Flat panel light
WO2016204627A1 (en) * 2015-06-19 2016-12-22 Willy Kronborg Light weight oxygen free lamp assembly and method for fabrication of same
JP2020107310A (en) * 2018-12-26 2020-07-09 廣達電腦股▲ふん▼有限公司Ｑｕａｎｔａ Ｃｏｍｐｕｔｅｒ Ｉｎｃ． Common carrier for different types of cards

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