WO2011108869A2 - 정전 용량 방식 터치 패널 및 그 제조방법 - Google Patents
정전 용량 방식 터치 패널 및 그 제조방법 Download PDFInfo
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- WO2011108869A2 WO2011108869A2 PCT/KR2011/001478 KR2011001478W WO2011108869A2 WO 2011108869 A2 WO2011108869 A2 WO 2011108869A2 KR 2011001478 W KR2011001478 W KR 2011001478W WO 2011108869 A2 WO2011108869 A2 WO 2011108869A2
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- sensor
- layer
- touch panel
- intaglio
- sensor layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Definitions
- the present invention relates to a touch panel, and more particularly, to a capacitive touch panel and a manufacturing method thereof.
- the touch screen device refers to an input device for performing overall control of an electronic device including display screen control by detecting a touch position of a user on a display screen and inputting information on the detected touch position.
- Touch screen devices include resistive, capacitive, ultrasonic, optical (infrared) sensor, and electromagnetic inductive touch screens.
- the difficulty of design and processing technology is different, and the method is selected by taking advantage of the advantages.
- ITO Indume Tin Oxide
- FIG. 1A is a cross-sectional view of a touch panel including an ITO material according to the prior art
- each of FIGS. 1B and 1C is a manufacturing process of a touch panel including the ITO material according to the prior art, and includes a photo etching process and a screen printing process.
- the touch screen using the capacitive type according to the related art forms a sensing and motion sensor by patterning an ITO transparent electrode, so that the touch sensitivity is not good and not suitable for large area. Due to the pattern of the sensor electrode, not only the light transmittance is poor but also the visibility is not good.
- a touch panel according to the related art is made by a photo etching process or a screen printing process for forming a silver electrode pattern to form a pattern and wiring of an ITO transparent electrode.
- An object of the present invention is to provide a capacitive touch panel having various fill factors and a method of manufacturing the same, in which an intaglio fine pattern is formed by an imprinting process and a conductive layer having a lower resistance than that of ITO is formed in the intaglio. .
- Another object of the present invention is to provide a capacitive touch panel and a method of manufacturing the same, which are manufactured by processing a pattern of intaglio on a resin layer laminated on a transparent substrate and simultaneously forming a sensor electrode and a wiring electrode on the intaglio. There is.
- a capacitive touch panel including: a first sensor layer having a plurality of patterned first direction sensor electrodes and a plurality of first wiring electrodes; And a second sensor layer having a plurality of patterned second direction electrode electrodes and a plurality of second wiring electrodes, wherein the first sensor layer and the second sensor layer are bonded to each other in a vertical direction.
- At least one of the first direction sensor electrode and the second direction sensor electrode may be formed of a plurality of first regions sensing a touch and a plurality of second regions connecting the first region.
- At least one of the plurality of first regions and the plurality of second regions may be shaped like an edge surrounded by an electrode.
- At least one of the plurality of first regions and the plurality of second regions may have an open edge.
- the plurality of first regions may be formed as a plurality of grid-shaped electrodes inside the region.
- the first region of the first sensor layer and the first region of the second sensor layer do not overlap each other in the vertical direction of the first and second sensor layers.
- the second region of the first sensor layer and the second region of the second sensor layer overlap in the vertical direction.
- Each pattern of the second region of the first sensor layer and the second region of the second sensor layer is different from each pattern of the first region of the first sensor layer and the first region of the second sensor layer. It is possible to be formed in different patterns.
- the pattern formed by the vertical overlap of the second region of the first sensor layer and the second region of the second sensor layer is a pattern of the first region of the first sensor layer or a first region of the second sensor layer. It is possible to be identical or similar to the pattern of.
- the touch panel may further include a bonding layer, which is an optical clear adhesive, between the first sensor layer and the second sensor layer.
- Each of the first sensor layer and the second sensor layer includes a resin layer having a transparent base material and an intaglio pattern layer stacked on the transparent base material and formed thereon. It is possible to simultaneously form the wiring electrode.
- the cross section of the pattern layer may have a shape of any one of a rectangle, a triangle, and a trapezoid.
- the intaglio has a width of 1 ⁇ m to 10 ⁇ m, a depth of 1 ⁇ m to 10 ⁇ m, and a pitch between the intaglio and the intaglio to be 200 ⁇ m to 600 ⁇ m.
- the seed layer may be one of Cu, Ni, Cr, Fe, W, P, Co, Ag, Ag-C, Ni-P, CuO, SiO 2 or an alloy thereof.
- the sensor electrode and the wiring electrode may be formed on the seed layer as a material having a lower resistance than indium tin oxide (ITO).
- ITO indium tin oxide
- the sensor electrode and the wiring electrode may be any one of Cu, Ag, Ag-C, Al, Ni, Cr, Ni-P, or an alloy thereof.
- the touch panel may have a light transmittance of 80% or more and a haze of 4% or less.
- Each of the first and second wiring electrodes may be wider than a width of each of the first and second directional sensor electrodes, and each of the first and second directional sensor electrodes may be formed at a portion of each edge of the first and second sensor layers. It is possible to be formed at the same time.
- a second sensor layer patterned in a second direction and a second wiring electrode are formed. step; And forming a first sensor layer in which a first sensor electrode and a first wiring electrode patterned in a first direction are bonded to the top or bottom surface of the second sensor layer.
- the forming of the second sensor layer and the forming of the first sensor layer are performed at the same time, it is possible to further include bonding the second sensor layer and the first sensor layer.
- the touch panel manufacturing method may further include forming a bonding layer, which is an optical clear adhesive, on the top surface of the second sensor layer after the second sensor layer is formed.
- Each of the first and second sensor layer forming steps may include stacking a resin layer on which a pattern of a sensor electrode is formed on a transparent substrate; Forming an intaglio in the resin layer according to a pattern in which the sensor electrode and the wiring electrode are to be formed; And simultaneously forming the sensor electrode and the wiring electrode in the recess.
- intaglio forming step it is possible to form an intaglio by imprinting a resin layer.
- the surface of the resin layer and the inner surface of the intaglio may be surface treated.
- the seed layer formed on the surface of the resin layer is preferably removed by etching after the resin is filled in the intaglio, and the filled resin is also removed.
- a metal layer having a lower resistance than indium tin oxide (ITO) is formed on the seed layer formed on the intaglio surface.
- each of the first and second wiring electrodes is wider than a width of each of the first and second direction sensor electrodes. It is possible to be formed simultaneously with each of the first and second directional sensor electrodes at a portion of the edge.
- Each of the first and second directional sensor electrodes may include a plurality of first regions sensing a touch and a plurality of second regions connecting the plurality of first regions.
- the first region of the first and second sensor layers may be formed in a lattice pattern by a plurality of electrodes.
- the pattern of the second region of the first and second sensor layers may be formed in a pattern different from the pattern of the first region of the first and second sensor layers.
- the pattern formed by the vertical overlap of the second region of the first and second sensor layers may be the same as or similar to the pattern of the first region of the first sensor layer or the pattern of the first region of the second sensor layer. Do.
- a capacitive touch panel and a method for manufacturing the capacitive touch panel according to the embodiments of the present invention may have a touch sensor having various fill factors in which an intaglio fine pattern is applied to which an imprinting process is applied and a conductive layer having a lower resistance than ITO is formed in the intaglio It can be configured to improve the touch sensitivity and performance, and to increase the large area.
- the capacitive touch panel and the method of manufacturing the same according to the embodiments of the present invention may improve light transmittance limited by the sensor electrode and improve visibility by arranging the sensor electrode in a lattice shape.
- a capacitive touch panel and a method of manufacturing the same according to embodiments of the present invention may provide excellent durability by forming an electrode part at an intaglio to prevent the electrode part from being exposed.
- the capacitive touch panel and the method of manufacturing the same according to the embodiments of the present invention can reduce the manufacturing process and time by simultaneously forming the sensor electrode and the wiring electrode in the intaglio of the fine pattern formed on the resin layer, It can increase productivity and reduce manufacturing costs.
- FIG. 1A is a cross-sectional view of a touch panel including an ITO material according to the prior art
- each of FIGS. 1B and 1C is a manufacturing process of a touch panel including the ITO material according to the prior art, and includes a photo etching process and a screen printing process. Is a flowchart
- FIGS. 2A and 2B are plan views of a first sensor layer including an upper x-axis sensor electrode in a touch panel and a second sensor layer including a lower y-axis sensor electrode in a transparent electrode film according to an embodiment of the present invention. It is a top view,
- FIG. 3 is a cross-sectional view taken along the line A-A 'of FIG. 2A;
- FIG. 4 is a cross-sectional view taken along the line BB ′ of FIG. 2A;
- FIG. 6 illustrates molds having various shapes to form intaglios in a pattern layer and shapes of intaglios formed by the molds
- FIG. 7 is a plan view of a pattern layer having an intaglio formed by a rectangular mold
- FIG. 8A to 8F illustrate a process in which a sensor electrode is formed when a cross section of an intaglio is rectangular in an arbitrary sensor layer of a touch panel according to an embodiment of the present invention.
- FIG. 9 is a cross-sectional view taken along the line C-C 'of FIG. 2A, which shows the wiring electrode and the sensor electrode formed at the edge of the sensor layer together;
- FIG. 10 illustrates a process of removing a blade of a pattern layer surface other than a sensor electrode after coating a metallic material or a conductive polymer without a seed layer at an intaglio
- FIG. 11 illustrates a plan view of an arbitrary sensor layer having a sensor electrode formed on a touch panel according to another exemplary embodiment of the present invention.
- FIG. 12 is a plan view of a sensor electrode formed on a touch panel according to another exemplary embodiment of the present invention.
- FIG. 13 is a flowchart illustrating a touch panel manufacturing method according to an embodiment of the present invention.
- FIG. 14 is a flowchart illustrating a process of forming a sensor layer in FIG. 13.
- FIG. 2A and 2B are plan views of a first sensor layer including an upper x-axis sensor electrode in a touch panel and a second sensor layer including a lower y-axis sensor electrode in a transparent electrode film according to an embodiment of the present invention.
- FIG. 3 is a cross sectional view taken along the line A-A 'of FIG. 2A
- FIG. 4 is a cross sectional view taken along the line B-B' of FIG. 2A. 5 shows a part of the intaglio formed on the resin layer to be filled with the sensor electrode.
- the touch panel 10 may include a plurality of patterned first direction sensor electrodes 115 and a plurality of first wiring electrodes 140.
- the second sensor layer 200 includes a first sensor layer 100, a plurality of patterned second direction electrode electrodes 215, and a plurality of second wiring electrodes 240.
- the plurality of first wiring electrodes 140 and the plurality of second wiring electrodes 240 are shown in detail in FIG. 9.
- the plurality of first sensor layers 100 and the second sensor layers 200 are formed by bonding a wide surface in a vertical direction to each other.
- a plurality of first direction sensor electrode lines D1L1, 2, 3... Are connected to one end of the first direction sensor electrode 115, and a plurality of first direction sensor electrodes 215 are connected to one end of the second direction sensor electrode 215.
- the two-way sensor electrode lines D2L1, 2, 3 ... are connected.
- the number of the plurality of first and second direction sensor electrodes and the plurality of first and second direction sensor electrode lines may be determined in a wide variety of numbers depending on the use of the touch panel.
- the first sensor layer 100 is an upper layer
- the second sensor layer 200 is a lower layer. That is, the second sensor layer is formed first, and the first sensor layer is formed thereon.
- the lower part of the first sensor layer 100 is bonded to the upper part of the second sensor layer 200 including a material such as an adhesive having an adhesive such as OCA (Optical Clear Adhesive) without a separate bonding layer.
- OCA Optical Clear Adhesive
- the bonding layer 300 is preferably an adhesive in the form of a film (Optical Clear Adhesive).
- Optical Clear Adhesive Optical Clear Adhesive
- the touch panel may be formed by bonding any one sensor layer to the upper or lower part of another sensor layer after the first and second sensor layers are formed at the same time.
- Each of the first direction sensor electrode 115 and the second direction sensor electrode 215 is disposed in the first sensor layer 100 and the second sensor layer 200 to cross each other in space.
- the first direction sensor electrode may be formed in the horizontal direction in the first sensor layer
- the second direction sensor electrode may be formed in the vertical direction in the second sensor layer.
- the first direction sensor electrode is formed of a plurality of first regions R1 for detecting contact of an object on the surface of the touch panel 10 and a plurality of second regions R2 connecting the first regions.
- the second direction sensor electrode has the exception that a plurality of first regions R1 and a plurality of second regions R2 are formed in the vertical direction in the horizontal direction of the transparent electrode film in the first direction sensor electrode.
- the lower surface includes a plurality of first regions R3 and a plurality of second regions R4 having the same shape.
- the first region R3 of the second sensor layer detects position information on the vertical axis. Therefore, the touched position on the touch panel 10 can be accurately found.
- the plurality of first regions R1 and R3 may be formed to be wider than the plurality of second regions R2 and R4 to facilitate detection of an object touching the surface of the transparent electrode film.
- the plurality of first regions R1 and R3 and the plurality of second regions R2 and R4 may be formed to be surrounded by edges by the edge electrode 115c.
- the plurality of first regions R1 may have various shapes such as a rhombus or a hexagon, and the inside of the region may be formed of a grid-shaped sensor electrode. That is, as illustrated in FIGS. 2A and 2B, the first regions R1 and R3 are formed such that the plurality of horizontal sensor electrodes 115a and the plurality of longitudinal sensor electrodes 115b cross each other, thereby forming a lattice. It may be formed into a shape.
- the intersection region 211c of the intaglio region 211a to which the horizontal electrode line is filled and the intaglio region 211b to which the longitudinal electrode line is filled among the electrode lines constituting the sensor electrode are non-crossing regions 211a. , 211b).
- the plurality of first regions R1 and R3 do not overlap each other in the vertical direction of the first and second sensor layers, and the plurality of second regions R2 and R4 are formed with the second region of the first sensor layer.
- the second region of the second sensor layer overlaps in the vertical direction.
- each of the patterns of the second region R2 of the first sensor layer and the second region R4 of the second sensor layer may include a first region of the first sensor layer and the second sensor. It is possible to be formed in a pattern different from each pattern of the first region of the layer.
- the pattern formed by vertically overlapping the second region R2 of the first sensor layer and the second region R4 of the second sensor layer is a pattern of the first region of the first sensor layer or It is preferably formed to be the same as or similar to the pattern of the first region of the second sensor layer.
- the sensor electrodes are formed in a lattice shape in the horizontal direction and the vertical direction in the first sensor layer and the second sensor layer, the light transmittance of the sensor layer can be improved.
- the ends of the horizontal sensor electrodes 115a and 215b and the plurality of vertical sensor electrodes 115b and 215a are connected to the edge electrodes 115c and 215c so that the resistance of the first regions R1 and R3 may be reduced.
- a sufficient amount of current may flow into the first and second sensor electrodes of the first and second layers, thereby improving the touch sensitivity of the touch panel.
- the first region R1 of the first sensor layer 100 and the first region R3 of the second sensor layer 200 are disposed not to overlap each other in the vertical direction of the first and second sensor layers.
- the first region R1 of the second sensor layer 200 has a pattern of a sensor electrode in the first sensor layer 100. Projected onto the unformed area 110.
- the first sensor layer 100 and the second thin film layer 200 are illustrated.
- the resin layers 110 and 210 including the pattern layer are stacked on the transparent substrate 120, and an intaglio is formed therein.
- the intaglio includes metal layers for forming seed layers 113 and 213, sensor electrodes 115 and 215, and wiring electrodes 140 and 240 therein. In the present embodiment, the intaglio does not penetrate the transparent substrate because the resin layers 110 and 210 remain at the bottom.
- the first sensor layer 100 and the second sensor layer 200 are bonded by the bonding layer 300.
- the pattern layer means a region in which an intaglio is formed on the resin layer according to the pattern of the sensor electrode.
- FIG. 6 is a cross-sectional view of a mold having various shapes to form an intaglio in a pattern layer and an intaglio formed by the mold
- FIG. 7 is a plan view of a pattern layer having an intaglio formed by a rectangular mold.
- the intaglio cross section may have a rectangular, triangular, or rhombus shape.
- the pitch which is the interval between the intaglio width and the intaglio to form a lattice pattern, has a range of values shown in Table 1 to obtain a fill factor.
- the depth of the intaglio may be formed to be the same as the height of the resin layer to be formed, but it is preferable that some resin layers remain on the bottom surface of the intaglio so that the surface of the transparent substrate and the metal layer do not contact.
- the Fill Factor is a ratio obtained by dividing the area occupied by the conductive layer in the area of any lattice-shaped touch sensor which is formed by laminating a plurality of lattices formed in one sensor layer or multiple sensor layers. It is defined and represented by the equation (1).
- the fill factor preferably has a value between 1.4 and 7.0%, and the line width and pitch may be appropriately adjusted according to the value of the fill factor.
- Table 1 Line width ( ⁇ m) Pitch ( ⁇ m) Fill Factor (%) 1 to 5 100 1.9 to 10 200 2.5 to 5.0 300 1.9 to 3.5 400 1.4 to 2.5 500 0.4 to 1.9 600 0.3 to 1.7 6 to 10 100 11 to 19 200 5.9 to 10 300 3.9 to 7.0 400 2.9 to 5.0 500 2.3 to 3.9 600 1.9 to 3.3
- FIG. 8A to 8F illustrate a process in which a sensor electrode is formed when a cross section of an intaglio is arbitrary in an arbitrary sensor layer of a touch panel according to an embodiment of the present invention, and FIG. 9 is formed at an edge of the sensor layer.
- the wiring electrode and the sensor electrode are shown together, and FIG. 10 illustrates a process of removing the surface of the pattern layer other than the sensor electrode with the blade after coating the metallic material or the conductive polymer without the seed layer at the intaglio.
- FIG. 13 is a flowchart illustrating a touch panel manufacturing method according to an embodiment of the present invention
- FIG. 14 is a flowchart illustrating a process of forming a sensor layer in FIG. 13.
- a second sensor layer in which a second sensor electrode patterned in a second direction is generated S100
- the first sensor electrode patterned in the first direction on the bonding layer is generated
- S300 By forming one sensor layer (S300), a touch panel made of a transparent electrode film is manufactured.
- the pressure-sensitive adhesive in the form of a film is preferably laminated between the first sensor layer and the second sensor layer to bond the first and second sensor layers.
- the first sensor layer and the second sensor layer may be bonded to each other by the lower layer of the upper layer including the adhesive material. That is, the thickness of the touch panel may be reduced by performing a role of the bonding layer by including one of the first and second sensor layers having a tacky material at the bottom without a separate bonding layer.
- the first sensor layer and the second sensor layer are formed through the same process, and the process of forming the sensor layer based on the second sensor layer will be described in detail with reference to FIGS. 8A to 8F.
- the resin layer 210 is stacked on the transparent substrate 220.
- S110, S310 A resin film or glass may be used for the transparent substrate 220.
- thermoplastic resins such as polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), triacetate cellulose (TAC), and polyether sulfone (PES) can be used.
- PET polyethylene terephthalate
- PC polycarbonate
- PMMA polymethyl methacrylate
- TAC triacetate cellulose
- PES polyether sulfone
- the thickness is preferably in the range of 25 to 250 ⁇ m
- the light transmittance is 80% or more, more preferably 90% or more.
- PSA Pressure Sensitive Adhesitve
- a UV curable resin or a thermosetting resin may be used as the resin layer 210.
- the intaglio 211 is formed by imprinting the mold 400 on the resin layer 210.
- the intaglio 211 is formed according to a pattern in which the plurality of first and second direction sensor electrodes and the plurality of first and second wiring electrodes are to be formed (S120 and S320).
- the intaglio 211 is formed by pressing or pressing the mold 400 against the resin material before the resin material is cured. It can be formed by adding a to cure the resin layer 210 and removing the mold 400 after the resin material is cured.
- the embossed mold 300 is used to form an intaglio in the resin layer 210, it is preferable that the surface roughness is sufficiently low material. It is preferable that the haze is 4% or less after the negative patterning by the mold.
- the intaglio pattern shape formed on the resin formed in the resin layer 210 is square, but the intaglio cross-sectional shape of the various patterns is formed using a mold of various shapes shown in FIG. 6. You can get it.
- the pattern size of the intaglio formed in the resin layer 210 may vary depending on the embodiment, but it is preferable that the line width is 1 ⁇ m to 10 ⁇ m, the depth is 1 ⁇ m to 10 ⁇ m, and the pitch is 200 ⁇ m to 600 ⁇ m. .
- the inner surface of the intaglio 211 and the surface of the resin layer 210 may improve adhesion between the seed layer 213 and the resin layer 210 to be formed in a later process.
- the surface-treated portion may be represented by the surface treatment layer 212 (S130, S330).
- the surface treatment method may be applied by chemical etching or catalytic treatment using an alkaline aqueous solution, plasma or ion beam treatment.
- a metal seed layer 213 is formed on the surface treatment layer 212 (S140, S340).
- the seed layer 213 may be formed by electroless plating, CVD deposition, sputtering, or printing using a metal material.
- the material of the seed layer is copper (Cu), nickel (Ni), chromium (Cr), iron (Fe), tungsten (W), phosphorus (P), cobalt (Co), silver (Ag), silver-carbon ( Ag-C), nickel-phosphorus (Ni-P), copper oxide II (CuO), an inorganic substance (SiO2), or an alloy thereof may be used, and the thickness thereof is preferably 0.01 ⁇ m to 5 ⁇ m.
- the procedure of removing the seed layer 213 from the surface of the resin layer other than the intaglio pattern region may be performed by filling a resin having resistance to etching into the inside of the intaglio, which is the pattern region (S150 and S350). It is deposited to remove the seed layer and the resin filled in the intaglio selectively formed on the surface of the resin layer (S160, S360).
- the chemicals used for the etching include any one of nitric acid series, sulfuric acid series, hydrochloric acid series, copper sulfate series, ferric chloride, and copper chloride.
- the sensor electrode 215 and the wiring electrode 240 may be formed on the seed layer 213 by electroless plating, electrolytic plating, CVD deposition, sputtering, coating, or printing (S170, S370). ).
- the sensor electrode and the wiring electrode may be simultaneously stacked and formed of a material having a lower resistance than indium tin oxide (ITO).
- the material of the sensor electrode 215 and the wiring electrode 240 is copper (Cu), silver (Ag), silver-carbon (Ag-C), aluminum (Al), nickel (Ni), chromium (Cr), Nickel-phosphorus (Ni-P) or an alloy thereof can be used.
- each of the first and second wiring electrodes 140 and 240 may have a width wider than that of each of the first and second direction sensor electrodes, and may be formed at a portion of each edge of the first and second sensor layers. It is possible to be formed simultaneously with each of the 1,2-way sensor electrodes.
- the sensor layer may be coated by coating the metal material or the conductive polymer without the metal seed layer on the pattern layer and wiping off the remaining surface on the other surface, or by scraping off the blade 230.
- the conductive polymer coated on the surface of the pattern layer has a thickness of 1 ⁇ m ⁇ 10 ⁇ m.
- the height of the metal layer filled in the intaglio pattern of the resin layer 210 is preferably equal to or lower than the depth of the intaglio pattern formed in the resin layer 210.
- the pattern of the sensor electrode of the touch panel is only one embodiment, and it is possible to apply a plurality of sensor electrodes patterned in various structures to perform touch sensing and operation functions.
- the pattern of the sensor electrode is related to the fill factor calculated as a ratio of the area in which the line serving as the conductive layer to the total area of the sensor electrode is formed, and the fill factor of the touch panel according to the present embodiment is described in Table 1. .
- FIG. 11 is a plan view of an arbitrary sensor layer having a sensor electrode formed on a touch panel according to another embodiment of the present invention
- FIG. 12 is a plan view of a sensor electrode formed on a touch panel according to another embodiment of the present invention. It is shown.
- FIG. 11 illustrates an embodiment in which the edge electrodes formed outside the sensing and operating regions of the sensor electrodes are removed in FIGS. 2A and 2B to minimize visibility.
- the horizontal sensor electrode and the vertical sensor electrode are formed to cross each other. Fill Factor in the region is shown in Table 1.
- FIG. 12 illustrates a plurality of fine sensor electrode lines in a vertical or horizontal direction in each sensor layer, and the sensor electrode lines in different sensor layers are displayed in a lattice shape on the X and Y axes in a plan view of the touch panel.
- the fill factor of the intersection of the sensor electrode lines with the X and Y axes is shown in Table 1, and the visibility of the sensor electrode lines is compared with the shape of the sensor electrode having the edge electrode shown in FIGS. 2A and 2B. It is an advantageous structure.
- the sensor electrode can have various fill factors for each line width and pitch, and the sensor can be configured in various shapes such as square, pentagon, hexagon, and oval in the fill factor range.
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Abstract
Description
선폭(㎛) | 피치(㎛) | Fill Factor(%) |
1 ~ 5 | 100 | 1.9 ~ 10 |
200 | 2.5 ~ 5.0 | |
300 | 1.9 ~ 3.5 | |
400 | 1.4 ~ 2.5 | |
500 | 0.4 ~ 1.9 | |
600 | 0.3 ~ 1.7 | |
6 ~ 10 | 100 | 11 ~ 19 |
200 | 5.9 ~ 10 | |
300 | 3.9 ~ 7.0 | |
400 | 2.9 ~ 5.0 | |
500 | 2.3 ~ 3.9 | |
600 | 1.9 ~ 3.3 |
Claims (35)
- 패턴화된 복수의 제1방향 센서전극과 복수의 제1 배선전극이 형성된 제1센서층; 및패턴화된 복수의 제2방향 센서전극과 복수의 제2 배선전극이 형성된 제2센서층을 포함하고,상기 제1센서층과 상기 제2센서층은 상호 접합되는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제1항에 있어서,상기 제1방향 센서전극과 상기 제2방향 센서전극 중 적어도 하나는 터치를 감지하는 복수의 제1영역과 상기 제1영역을 연결하는 복수의 제2영역으로 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제2항에 있어서,상기 복수의 제1영역 및 상기 복수의 제2영역 중 적어도 어느 하나의 영역은 전극에 의하여 가장 자리가 둘러싸인 형상인 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제2항에 있어서,상기 복수의 제1영역 및 상기 복수의 제2영역 중 적어도 어느 하나의 영역은 가장자리가 개방되는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제2항에 있어서,상기 복수의 제1영역은 영역 내부가 격자모양의 복수의 전극으로 형성되는 특징으로 하는 정전용량 방식의 터치 패널.
- 제2항에 있어서,상기 제1센서층의 제1영역과 상기 제2센서층의 제1영역은 상기 제1,2센서층의 수직 방향에서 상호 겹쳐지지 않는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제1항에 있어서,상기 제1센서층의 제2영역과 상기 제2센서층의 제2영역은 수직방향에서 겹쳐지는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제7항에 있어서,상기 제1센서층의 제2영역과 상기 제2센서층의 제2영역의 각각의 패턴은, 상기 제1센서층의 제1영역과 상기 제2센서층의 제1영역의 각각의 패턴과는 상이한 패턴으로 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제7항에 있어서,상기 제1센서층의 제2영역과 상기 제2센서층의 제2영역의 수직방향 겹침에 의해 형성되는 패턴은 상기 제1센서층의 제1영역의 패턴 또는 상기 제2센서층의 제1영역의 패턴과 동일하거나 유사한 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제1항에 있어서,상기 터치 패널은 상기 제1센서층과 상기 제2센서층 사이에 필름 형태의 점착제(Optical Clear Adhesive)인 접합층을 추가적으로 구비하는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제1항에 있어서,상기 제1센서층 및 상기 제2센서층의 각각은, 투명기재와, 상기 투명기재에 적층되어 상부에 형성된 음각의 패턴층을 구비한 수지층을 포함하는 것을 특징으로하는 정전용량 방식의 터치 패널.
- 제11항에 있어서,상기 음각의 내부에는 상기 센서전극과 상기 배선전극이 동시에 형성되는 것을 특징으로하는 정전용량 방식의 터치 패널.
- 제11항에 있어서,상기 패턴층의 단면은 사각형, 삼각형 및 사다리꼴 중 어느 하나의 형상인 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제11항에 있어서,상기 패턴층의 음각은 폭이 1㎛~10㎛이고, 깊이가 1㎛~10㎛이며, 상기 음각과 음각 사이의 피치가 200㎛~600㎛가 되도록 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제11항에 있어서,상기 음각의 표면에는 금속의 시드층이 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제15항에 있어서,상기 시드층은 Cu, Ni, Cr, Fe, W, P, Co, Ag, Ag-C, Ni-P, CuO, SiO2 중 하나 또는 그 합금인 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제15항에 있어서,상기 센서전극 및 상기 배선전극은 상기 시드층에서 ITO(Indume Tin Oxide)보다 낮은 저항성을 갖는 물질로 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제17항에 있어서,상기 센서전극 및 상기 배선전극은 Cu, Ag, Ag-C, Al, Ni, Cr, Ni-P 중 어느 하나 또는 그 합금인 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제11항에 있어서,상기 터치 패널은 광투과율이 80% 이상이고, 헤이즈가 4% 이하인 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제1항에 있어서,상기 제1,2배선전극의 각각은 상기 제1,2방향 센서전극의 각각의 폭보다 넓은 폭으로 상기 제1,2센서층의 각각의 가장자리 일부에서 상기 제1,2방향 센서전극의 각각과 동시에 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널.
- 제2방향으로 패턴화된 제2센서전극과 제2배선전극이 생성되는 제2센서층을 형성하는 단계; 및상기 제2센서층의 상면 또는 하면에 접합되는 제1방향으로 패턴화된 제1센서전극과 제1배선전극이 생성되는 제1센서층을 형성하는 단계를 포함하는 정전용량 방식의 터치 패널 제조 방법.
- 제21항에 있어서,상기 터치 패널 제조 방법은, 상기 제2센서층이 형성된 후에 상기 제2센서층의 상면에 필름 형태의 점착제(Optical Clear Adhesive)인 접합층을 형성하는 단계;를 추가적으로 포함하는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제21항에 있어서,상기 제1,2센서층 형성단계의 각각은,투명 기재에 수지층을 적층하는 단계;상기 수지층에 상기 센서전극 및 상기 배선전극이 형성될 패턴에 따라 음각을 형성하는 단계; 및상기 음각의 내부에 상기 센서전극 및 상기 배선전극을 동시에 형성하는 단계를 포함하는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제21항에 있어서,상기 음각 형성 단계는, 수지층을 임프린트하여 음각을 형성하는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제21항에 있어서,상기 음각 형성 단계 후에 상기 수지층의 표면 및 음각의 내면이 표면 처리되는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제25항에 있어서,상기 수지층의 표면과 상기 표면처리된 음각의 내면에 시드층을 형성하는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제26항에 있어서,상기 수지층의 표면에 형성된 시드층은 상기 음각에 수지가 충진된 후 에칭으로 제거되고, 상기 충진된 수지도 제거되는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제27항에 있어서,상기 음각 표면에 형성된 시드층 상에 ITO(Indume Tin Oxide)보다 낮은 저항성을 갖는 금속층이 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제25항에 있어서,상기 수지층 표면과 상기 음각 내부에 금속성 물질이나 전도성 고분자를 코팅한 후 상기 음각을 제외한 수지층 표면의 잔여물은 블레이드로 제거되는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제21항에 있어서,상기 제1,2센서층의 형성단계의 각각에서, 상기 제1,2 배선전극의 각각은 상기 제1,2방향 센서전극의 각각의 폭보다 넓은 폭으로 상기 제1,2센서층의 각각의 가장자리 일부에서 상기 제1,2방향 센서전극의 각각과 동시에 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제21항에 있어서,상기 제1,2방향 센서전극의 각각은 터치를 감지하는 복수의 제1영역과 상기 복수의 제1영역을 연결하는 복수의 제2영역을 포함하는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제31항에 있어서,상기 제1,2센서층의 제1영역은 복수의 전극선들에 의하여 격자 패턴으로 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제31항에 있어서,상기 제1,2센서층의 제2영역의 패턴은, 상기 제1,2센서층의 제1영역의 패턴과는 상이한 패턴으로 형성되는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제31항에 있어서,상기 제1,2센서층의 제2영역의 수직방향 겹침에 의해 형성되는 패턴은 상기 제1센서층의 제1영역의 패턴 또는 상기 제2센서층의 제1영역의 패턴과 동일하거나 유사한 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
- 제21항에 있어서,상기 제2센서층을 형성하는 단계와, 상기 제1센서층을 형성하는 단계가 동시에 수행되는 경우에는 상기 제1센서층과 상기 제2센서층을 접합시키는 단계를 추가적으로 포함하는 것을 특징으로 하는 정전용량 방식의 터치 패널 제조 방법.
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EP11750926.5A EP2544080B1 (en) | 2010-03-03 | 2011-03-03 | Capacitive touch panel and manufacturing method for same |
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CN102782624B (zh) | 2016-03-30 |
EP2544080A4 (en) | 2016-05-18 |
TW201203064A (en) | 2012-01-16 |
US20120327021A1 (en) | 2012-12-27 |
JP2013521563A (ja) | 2013-06-10 |
TWI461996B (zh) | 2014-11-21 |
WO2011108869A3 (ko) | 2012-01-12 |
EP2544080B1 (en) | 2019-08-28 |
US9244573B2 (en) | 2016-01-26 |
CN102782624A (zh) | 2012-11-14 |
EP2544080A2 (en) | 2013-01-09 |
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