WO2011097970A1 - Pcb板的加工方法及设备 - Google Patents

Pcb板的加工方法及设备 Download PDF

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Publication number
WO2011097970A1
WO2011097970A1 PCT/CN2011/070261 CN2011070261W WO2011097970A1 WO 2011097970 A1 WO2011097970 A1 WO 2011097970A1 CN 2011070261 W CN2011070261 W CN 2011070261W WO 2011097970 A1 WO2011097970 A1 WO 2011097970A1
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Prior art keywords
liquid
pcb
cooling
solid
pcb board
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PCT/CN2011/070261
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English (en)
French (fr)
Inventor
缪桦
龚小林
王成勇
彭勤卫
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深南电路有限公司
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Application filed by 深南电路有限公司 filed Critical 深南电路有限公司
Publication of WO2011097970A1 publication Critical patent/WO2011097970A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Definitions

  • the invention belongs to the technical field of printed circuit board (PCB) processing, and in particular relates to a processing method and device for a PCB board.
  • PCB printed circuit board
  • the board In the PCB manufacturing process, the board needs to be machined, such as drilling, trimming, hollowing, etc., but some materials have a low glass transition temperature, and the high temperature generated during machining easily exceeds the glass of the material.
  • the transformation temperature when the material to be processed is at or above the glass transition temperature of the material, the material becomes soft, it is not easy to cut, and the processed debris is wrapped around the surface of the processing tool, resulting in poor chip removal, PCB board It is easy to produce a lot of burrs and dirt.
  • the processing material is a polytetrafluoroethylene PTFE (polytetrafluoroethylene ptfe)
  • the glass transition temperature of the PTFE material is 19 ⁇ 25 ° C
  • the temperature of the general processing workshop is controlled at 21 ° C.
  • the heat generated makes the PCB temperature easily exceed the glass transition temperature of the PTFE material, and the material becomes very soft and not easy to machine.
  • the processing method adopted in the prior art is to place the PCB board in a refrigerator for cooling before machining, and then take it out of the refrigerator for machining, at the temperature of the PCB board. When it is returned to room temperature, put it in the refrigerator again for cooling. Repeat the above steps until the PCB is processed.
  • the temperature of the machining workshop is generally 21 +/- 2 °C. After the PCB board taken out from the refrigerator is processed, it will recover to the greenhouse quickly, requiring multiple cooling, and the processing efficiency is low;
  • a thin plate drilling bit as described in Chinese Utility Model Patent No. 200420074251.6, published on Jun. 29, 2005.
  • the drill bit includes a drill pipe, a cutting head, and a cooling water hole in the drill pipe and the cutting head; the cooling water hole is composed of two sections of a water guiding hole and a water spraying hole, and the water guiding hole is located at the drill pipe part, and the drill pipe Concentrically, the water spray hole is located in the cutting head, the upper end is connected to the water guide hole, and the lower end outlet is eccentrically disposed on the lower end surface of the cutting head and connected to the drain groove.
  • a natural gas hydrate hole bottom cryosampler and a sampling method thereof as described in Chinese Patent Application No. 200810050476.0, published on Sep. 16, 2009. .
  • the natural gas hydrate bottom bottom refrigerating sampler is composed of a refrigeration part, a low temperature control part and a cryopreservation sample.
  • the liquid nitrogen is used as a refrigerant, and the ethylene glycol is used as a brine to freeze the hydrate sample at the bottom of the hole.
  • the liquid nitrogen is pre-stored in the sampler, and the low temperature control module controls the time during which the liquid nitrogen is injected into the brine to keep the temperature of the brine constant. Keep below -30 °C to inhibit hydrate sample decomposition. Summary of the invention
  • the technical problem to be solved by the present invention is to provide a method for rapidly cooling a portion of a PCB to be processed to a glass transition temperature of the material, facilitating machining, reducing burrs and drilling, and greatly improving processing efficiency and processing precision.
  • PCB processing methods and equipment are provided.
  • a technical solution adopted by the present invention is: Providing a processing method for a PCB board, in the process of machining a PCB board, using a coolant or a cooling solid to control the temperature of a portion to be processed of the PCB board at all times Below the glass transition temperature.
  • the coolant or the cooled solid is sent to the surface of the PCB to be processed for cooling by continuous or intermittent spraying.
  • the temperature of the portion to be processed is continuously measured, and depending on the measured temperature, the intensity of the sprayed coolant or the cooled solid is controlled, or whether the coolant or the solid is sprayed.
  • the boiling point or sublimation point of the cooling liquid or the cooling solid is lower than the glass transition temperature of the PCB material.
  • the cooling liquid is liquid hydrogen, liquid oxygen, liquid argon, liquid helium, liquid helium, liquid helium, liquid helium, liquid nitrogen, liquid carbon dioxide, liquid propane, liquid butane or liquid dioxide;
  • the solid is solid carbon dioxide, solid propane, solid butane, solid sulfur dioxide, solid ethanol or solid acetone.
  • the material of the PCB board is PTFE material, and the temperature of the portion to be processed of the PCB board is always controlled below 25 °C.
  • Providing a processing device for a PCB board comprising an operation device for mechanically processing the PCB board, and spraying for spraying a coolant or cooling solids
  • the spraying direction of the spraying device is opposite to the portion to be processed of the PCB board.
  • the operating device is a drilling machine having a main shaft.
  • the spraying device is a sprayer.
  • the processing device further includes a temperature detector for measuring a temperature of a portion to be processed of the PCB board, and a controller for connecting the temperature detector, the drilling machine, and the liquid nitrogen atomizer, the controller receiving the temperature of the temperature detector Signaling, and controlling the spraying device and the operating device to operate according to the temperature signal.
  • the invention has the beneficial effects that the processing method of the PCB board of the invention is to directly cool the portion to be processed of the PCB board by using the cooling liquid or the cooling solid at the processing site, and the temperature of the portion to be processed of the PCB board is always controlled by the glass transition. Below the temperature, the material is hard and brittle at this time, which is convenient for mechanical processing, which can reduce burrs and dirt on the PCB board. Because of the in-situ processing, it can save the cooling requirements and eliminate the repeated disassembly and assembly of the PCB board. The operation of freezing the refrigerator greatly improves the processing efficiency. Since the PCB board is not repeatedly removed, the accuracy of the processing area is not affected by multiple positioning.
  • the coolant or the cooling solid of the present invention preferably uses a material whose boiling point or sublimation point is lower than the glass transition temperature of the PCB material, and when such material is sent to the surface to be processed of the PCB board, the coolant or the cooled solid will be at normal pressure. It quickly turns into a gas, and needs to absorb a large amount of heat during gasification or sublimation, so that the PCB can be quickly cooled to further improve the processing efficiency; and some coolant or cooling solids such as liquid argon, liquid helium, liquid helium, Gases, liquid helium, liquid nitrogen, liquid carbon dioxide, solid carbon dioxide and other materials will not produce hazardous gases after gasification And waste residue, no impact on the environment, no impact on the quality of the PCB.
  • the spraying device is adjacent to the operating device, and the sprayed cooling liquid or cooling solid can also cool the operating device well, which helps the operating device to cool down and greatly increases the operating life of the operating device.
  • FIG. 1 is a schematic structural view of a first embodiment of a PCB processing apparatus according to the present invention
  • FIG. 2 is a schematic structural view of a second embodiment of a PCB board processing apparatus according to the present invention.
  • Figure 3 is a control schematic diagram of an embodiment of a PCB board processing apparatus of the present invention.
  • the temperature of the portion to be processed of the PCB is always controlled below the glass transition temperature by using a cooling liquid or a cooling solid.
  • the temperature of the portion to be processed of the PCB is always controlled below 25 °C.
  • the processing method of the PCB board of the invention is to directly cool the portion to be processed of the PCB board by using the cooling liquid or the cooling solid at the processing site, and the temperature of the portion to be processed of the PCB board is always controlled below the glass transition temperature, and the material is relatively Hard and brittle, easy to machine, can reduce burrs and dirt on the PCB board; due to the in-situ processing, while ensuring the cooling requirements, eliminating the need to repeatedly disassemble and position the PCB board, take the refrigerator to freeze the operation, greatly improve The processing efficiency, because there is no need to repeatedly disassemble the PCB board, will not affect the accuracy of the processing area due to multiple positioning.
  • the coolant or cooled solids are sent to the surface of the PCB to be processed for cooling by continuous or intermittent spraying.
  • the continuous spraying scheme is used when the spraying has no effect on the processing, and the cooling and processing are both correct and the efficiency is higher.
  • the cooling liquid or the cooling solid can be sprayed at predetermined intervals to make the cooling and processing mutual Do not disturb, each spraying time is 5 seconds, 10 seconds, 30 seconds or 60 seconds, etc., the spraying interval is 5, 8, 10 or 15 minutes and so on.
  • the temperature of the portion to be processed is continuously measured, and depending on the measured temperature, the strength of the sprayed coolant or cooled solid, or whether the coolant is sprayed or the solid is cooled, is controlled.
  • the feedback loop operation the low-temperature machining operation can be realized automatically and accurately, so that it can be adjusted in real time according to the actual situation, so it is more energy-saving.
  • the boiling point or sublimation point of the cooling liquid or cooling solid is lower than the glass transition temperature of the PCB material.
  • the cooling liquid is liquid hydrogen, liquid oxygen, liquid argon, liquid helium, liquid helium, liquid helium, liquid helium, liquid nitrogen, liquid carbon dioxide, liquid propane, liquid butane or liquid sulfur dioxide;
  • the cooled solid is solid carbon dioxide, Solid propane, solid butane, solid calcium dioxide, solid ethanol or solid acetone.
  • the cooling liquid or the cooling solid of the present invention preferably uses a material whose boiling point or sublimation point is lower than the glass transition temperature of the PCB material.
  • the coolant or the cooled solid will be under normal pressure. Rapidly changing into gas, it needs to absorb a large amount of heat during gasification or sublimation, so that the PCB can be cooled quickly to further improve the processing efficiency; and some coolant or cooling solids such as liquid argon, liquid helium, liquid helium, liquid
  • gas, liquid helium, liquid nitrogen, liquid carbon dioxide, solid carbon dioxide and other materials are vaporized, no harmful gases and wastes are generated, which has no impact on the environment and has no effect on the quality of the PCB.
  • the spray device is adjacent to the operating device, and the sprayed coolant or cooled solids can also cool the operating device well, which helps to cool the operating device and greatly increases the life of the operating device.
  • liquid cooling method In the processing of PCB boards, it is generally considered that the liquid cooling method cannot be used, because liquid cooling, especially water cooling, has no substantial effect on the performance of the general board, but for PCB boards, due to the existence of circuits on the board, etc., it is generally considered It cannot be cooled by water cooling.
  • the invention breaks through this inertial thinking, adopts liquid cooling or solid cooling, and achieves particularly remarkable technical effects.
  • the cooling liquid or the cooling solid which is vaporized and sublimated at normal temperature is directly sprayed on the portion to be processed, and the portion is directly cooled, and no other barrier elements affect the cooling process, and the cooling effect is particularly good.
  • the present invention is to locally cool the portion to be processed in the PCB board, requires very little energy, does not waste energy consumption, and has low cost.
  • FIG. 1 including the PCB.
  • the plate 21 is subjected to a machined operating device 22, which further comprises a spraying device 23 for spraying a cooling liquid or cooling solids, the spraying device 23 being sprayed in a direction opposite to the portion of the PCB board 21 to be processed.
  • the operating device 22 is a drilling machine having a main shaft, and the spraying device 23 is fixed adjacent to the main shaft, and may of course be other machining equipment such as a milling machine, a cutting machine or the like.
  • the processing device of the PCB board further includes a temperature detector 24 fixed to the drilling machine, and the temperature detector 24 may be an infrared thermometer, and the processing tool is fixed by the pressure foot 25 in the drilling machine.
  • the spraying device 23 is a sprayer.
  • the processing device of the PCB board further includes a protective cover 26 disposed at a periphery of the processing tool, and the spraying device 23 is connected to the storage tank 27 through the transfer tube 28.
  • the storage tank 27 stores a cooling liquid or a cooling solid.
  • the processing device of the PCB board further includes a temperature detector for measuring a temperature of a portion to be processed of the PCB board, and a method for connecting the temperature detector, the drilling machine, and the liquid nitrogen atomizer. a controller, the controller receiving a temperature signal of the thermometer, and controlling the spraying device and the operating device to operate according to the temperature signal.
  • a timed spray device is installed beside the main shaft of the rig, and a layer of coolant or cooling solid is sprayed on the PCB before drilling, and then every few minutes, before the PCB returns to room temperature or vitrified Spray the coolant or cool the solids before changing the temperature until the PCB is processed.
  • the processing device of the PCB board of the present invention directly cools the portion to be processed of the PCB board by using the cooling liquid or the cooling solid at the processing site, and the temperature of the portion to be processed of the PCB board is always controlled below the glass transition temperature, and the material is relatively Hard and brittle, easy to machine, can reduce burrs and dirt on the PCB board; due to the in-situ processing, while ensuring the cooling requirements, eliminating the need to repeatedly disassemble and position the PCB board, take the refrigerator to freeze the operation, greatly improve The processing efficiency, because there is no need to repeatedly disassemble the PCB board, will not affect the accuracy of the processing area due to multiple positioning.
  • the coolant or the cooling solid of the present invention preferably uses a material whose boiling point or sublimation point is lower than the glass transition temperature of the PCB material, and when such material is sent to the surface to be processed of the PCB board, Since the coolant or the cooled solid will quickly become a gas under normal pressure, a large amount of heat needs to be absorbed during the gasification or sublimation process, so that the PCB board can be quickly cooled to further improve the processing efficiency; and some coolant or cooling solids
  • liquid argon, liquid helium, liquid helium, liquid helium, liquid helium, liquid nitrogen, liquid carbon dioxide, solid carbon dioxide and other materials will not produce hazardous gases and waste residue after gasification, and have no impact on the environment, and have no effect on the quality of the PCB.
  • the spraying device is adjacent to the operating device, and the sprayed cooling liquid or cooling solid can also cool the operating device well, which helps the operating device to cool down and greatly increases the operating life of the operating device.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)

Description

PCB板的加工方法及设备 技术领域
本发明属于印刷电路板（ PCB板）加工技术领域，尤其涉及一种 PCB 板的加工方法及设备。
说
背景技术
在 PCB的制作工艺中，需要对板材进行机械加工，比如钻孔、切边、 镂空等， 但有些材料的玻璃化转变温度很低， 机械加工时产生的高温很 容易就超过该种材料的玻璃化转变温度， 当书被加工的材料处于或高于材 料的玻璃化转变温度时， 材料就会***， 不容易切割， 加工的碎屑缠在 加工工具表面， 导致排屑不良， PCB板上容易产生大量的毛刺和钻污。
比如加工材料为聚四氟乙烯（ Polytetrafluoroethylene ptfe, 筒写为 PTFE ) 的 PCB板时， 由于 PTFE材料的玻璃化转变温度为 19 ~ 25°C , 一般加工车间的温度控制在 21 °C左右， 加工产生的热量使 PCB板温度 很容易就超过了 PTFE材料的玻璃化转变温度， 材料变得很软， 不容易 机械加工操作。
为提高此类低玻璃化转变温度材料的 PCB板产品质量，现有技术中 采用的加工方法是在机械加工前将 PCB板放到冰箱中冷却，然后从冰箱 取出进行机械加工， 在 PCB 板温度恢复到室温时再次放入冰箱进行冷 却， 重复上述步骤， 直至 PCB板加工完成。
但是， 采用冰箱冷却的方法存在以下问题：
1 )机械加工车间的温度一般为 21+/-2°C , 从冰箱取出的 PCB板加 工后会 4艮快恢复到温室， 需要多次冷却， 加工效率低；
2 ) 需要多次拆装， 定位精度差， 使机械加工精度变差， 比如钻孔 的孔位精度变差；
3 )频繁的冷却操作使板件上面容易产生水蒸气， 吸附粉尘使加工 碎屑更加不容易排除。 术，如 2005年 6月 29日公开的中国实用新型专利第 200420074251.6号 所描述的一种薄板拓孔钻头。 所述钻头包括钻杆、 切削头， 钻杆及切削 头内带有冷却水孔； 所述冷却水孔由导水孔和喷水孔两段构成， 导水孔 位于钻杆部分， 与钻杆同心， 喷水孔位于切削头内， 其上端与导水孔相 接， 其下端出口偏心设置在切削头下端面上， 并与排水槽相连。
在另一相差更远的技术领域也出现液氮冷却的技术， 如 2009年 9 月 16 日公开的中国发明专利申请第 200810050476.0号所描述的一种天 然气水合物孔底冷冻取样器及其取样方法。 所述天然气水合物孔底冷冻 取样器是由制冷部分、 低温控制部分和冷冻保温样品三部分构成。 采用 液氮为冷冻剂， 乙二醇为载冷剂在孔底冷冻水合物样品， 液氮预先储存 在取样器中， 低温控制模块控制液氮注入载冷剂的时间， 使载冷剂温度 始终保持低于 -30 °C以下以抑制水合物样品分解。 发明内容
本发明主要解决的技术问题是提供一种可以快速将 PCB 板待加工 部位冷却到其材料的玻璃化转变温度以下、 方便机械加工、 减少毛刺和 钻污、 同时大幅提高加工效率、提高加工精度的 PCB板的加工方法及设 备。
为解决上述技术问题， 本发明采用的一个技术方案是： 提供一种 PCB板的加工方法， 在对 PCB板进行机械加工过程中， 利用冷却液或 冷却固体把 PCB板待加工部位的温度始终控制在玻璃化转变温度以下。
其中，采用连续或间歇喷洒的方式把冷却液或冷却固体送至 PCB板 待加工表面进行冷却。
其中， 持续测量待加工部位的温度， 并根据测量到的温度， 控制所 述喷洒冷却液或冷却固体的强度、 或是否喷洒冷却液或冷却固体。
其中，所述冷却液或冷却固体的沸点或升华点低于 PCB板材料的玻 璃化转变温度。 其中， 所述冷却液为液氢、 液氧、 液氩、 液氦、 液氖、 液氙、 液氡、 液氮、 液态二氧化碳、 液态丙烷、 液态丁烷或液态二氧化^ £; 所述冷却 固体为固态二氧化碳、 固态丙烷、 固态丁烷、 固态二氧化硫、 固态乙醇 或固态丙酮。
其中， 所述 PCB板材料为 PTFE材料， 把 PCB板待加工部位的温 度始终控制在 25 °C以下。
为解决上述技术问题， 本发明采用的另一个技术方案是： 提供一种 PCB板的加工设备， 包括对所述 PCB板实施机械加工的操作装置， 还 包括用于喷洒冷却液或冷却固体的喷洒装置， 所述喷洒装置的喷洒方向 正对 PCB板的待加工部位。
其中， 所述操作装置是具有主轴的钻机。
其中， 所述喷洒装置为喷雾器。
其中，所述加工设备还包括用于测量 PCB板待加工部位温度的测温 器和用于连接所述测温器、 钻机、 液氮喷雾器的控制器， 所述控制器接 收测温器的温度信号， 并根据所述温度信号控制所述喷洒装置和操作装 置工作。
本发明的有益效果是：本发明所述 PCB板的加工方法是在加工现场 利用冷却液或冷却固体直接对 PCB板待加工部位进行冷却， 把 PCB板 待加工部位的温度始终控制在玻璃化转变温度以下， 此时材料较为硬 脆， 方便机械加工， 可以减少 PCB板上的毛刺和钻污； 由于采用原地加 工， 在保证冷却要求的同时， 省去反复拆装定位 PCB板件， 拿去冰箱冷 冻的操作， 大幅提高了加工效率， 由于不用反复拆卸 PCB板件， 不会因 为多次定位影响加工区域的精度。
另外本发明冷却液或冷却固体优先采用沸点或升华点低于 PCB 板 材料的玻璃化转变温度的材料， 此类材料被送到 PCB板待加工表面时， 由于冷却液或冷却固体会在常压下快速变为气体， 在气化或升华过程中 需要吸收大量的热量，从而可以迅速地将 PCB板冷却，进一步提高加工 效率； 而一些冷却液或冷却固体比如液氩、 液氦、 液氖、 液氙、 液氡、 液氮、 液态二氧化碳、 固态二氧化碳等材料气化后不会产生危害性气体 和废渣，对环境无影响，对 PCB板质量无影响。喷洒装置邻近操作装置， 喷出的冷却液或冷却固体还可以对操作装置进行很好的冷却， 有助于操 作装置的降温， 大幅增加操作装置的寿命。 附图说明
图 1是本发明 PCB板加工设备实施例一的结构示意图；
图 2是本发明 PCB板加工设备实施例二的结构示意图；
图 3是本发明 PCB板加工设备实施例的控制原理图。
21、 PCB板； 22、 操作装置； 23、 喷洒装置； 24、 测温器； 25、 压 力脚； 26、 保护罩； 27、 存储罐； 28、 传输管。
具体实施方式
为详细说明本发明的技术内容、 构造特征、 所实现目的及效果， 以 下结合实施方式并配合附图详予说明。
作为本发明 PCB板加工方法的实施例， 在对 PCB板进行机械加工 过程中，利用冷却液或冷却固体把 PCB板待加工部位的温度始终控制在 玻璃化转变温度以下。 以 PCB板材料为 PTFE材料为例， 把 PCB板待 加工部位的温度始终控制在 25 °C以下。
本发明所述 PCB 板的加工方法是在加工现场利用冷却液或冷却固 体直接对 PCB板待加工部位进行冷却， 把 PCB板待加工部位的温度始 终控制在玻璃化转变温度以下， 此时材料较为硬脆， 方便机械加工， 可 以减少 PCB板上的毛刺和钻污； 由于采用原地加工，在保证冷却要求的 同时， 省去反复拆装定位 PCB板件， 拿去冰箱冷冻的操作， 大幅提高了 加工效率， 由于不用反复拆卸 PCB板件， 不会因为多次定位影响加工区 域的精度。
在一实施例中， 采用连续或间歇喷洒的方式把冷却液或冷却固体送 至 PCB板待加工表面进行冷却。连续喷洒方案是喷洒对加工无影响的情 况下使用， 同时降温和加工两不误， 效率更高； 当并不需要持续降温时， 可以间隔预定时间喷洒冷却液或冷却固体， 使得降温和加工互不干扰， 每次喷洒的时间为 5秒、 10秒、 30秒或 6 0秒等等， 喷洒间歇的时间为 5、 8、 10或 15分钟等等。
在一实施例中，持续测量待加工部位的温度，并根据测量到的温度， 控制所述喷洒冷却液或冷却固体的强度、 或是否喷洒冷却液或冷却固 体。 采用反馈循环回路操作， 可以自动、 精确地实现低温加工操作， 由 于是根据实际情况进行实时调整， 所以更节能。
在一实施例中，所述冷却液或冷却固体的沸点或升华点低于 PCB板 材料的玻璃化转变温度。 所述冷却液为液氢、 液氧、 液氩、 液氦、 液氖、 液氙、 液氡、 液氮、 液态二氧化碳、 液态丙烷、 液态丁烷或液态二氧化 硫； 所述冷却固体为固态二氧化碳、 固态丙烷、 固态丁烷、 固态二氧化 石克、 固态乙醇或固态丙酮。
本发明冷却液或冷却固体优先采用沸点或升华点低于 PCB 板材料 的玻璃化转变温度的材料，此类材料被送到 PCB板待加工表面时， 由于 冷却液或冷却固体会在常压下快速变为气体， 在气化或升华过程中需要 吸收大量的热量，从而可以迅速地将 PCB板冷却，进一步提高加工效率； 而一些冷却液或冷却固体比如液氩、 液氦、 液氖、 液氙、 液氡、 液氮、 液态二氧化碳、 固态二氧化碳等材料气化后不会产生危害性气体和废 渣， 对环境无影响， 对 PCB板质量无影响。 喷洒装置邻近操作装置， 喷 出的冷却液或冷却固体还可以对操作装置进行很好的冷却， 有助于操作 装置的降温， 大幅增加操作装置的寿命。
在对 PCB板的加工中， 一般认为无法使用液冷方式， 因为液冷特别 是水冷方式对一般的板材性能无实质影响，但对 PCB板材而言，却由于 其上面存在电路等原因， 一般认为不能用水冷方式进行冷却。 本发明突 破了此惯性思维，采用了液冷或固冷方式，取得了特别显著的技术效果。
特别是， 采用在常温下气化和升华的冷却液或冷却固体， 直接喷洒 在待加工部位，直接对此部位进行冷却，无其他隔阻元件影响冷却过程， 冷却效果特别好。
而且， 本发明是对 PCB板件中的待加工部位进行局部冷却， 需要的 能量非常少， 不浪费能耗， 成本低。
作为本发明 PCB板的加工设备的实施例一，请参阅图 1 ,包括对 PCB 板 21实施机械加工的操作装置 22, 还包括用于喷洒冷却液或冷却固体 的喷洒装置 23 , 所述喷洒装置 23的喷洒方向正对 PCB板 21的待加工 部位。
本实施例中， 所述操作装置 22 是具有主轴的钻机， 所述喷洒装置 23邻近所述主轴固定， 当然也可以是其他机加工设备， 比如铣床、 切割 机等。本实施例中，所述 PCB板的加工设备还包括固定于钻机旁的测温 器 24, 所述测温器 24可以为红外测温仪， 所述钻机中采用压力脚 25固 定加工工具。
本实施例中， 所述喷洒装置 23为喷雾器。
在一实施例中， 如图 2所示， 所述 PCB板的加工设备还包括保护罩 26, 所述保护罩 26设置在加工工具的***， 喷洒装置 23通过传输管 28 和存储罐 27相连接， 所述存储罐 27内存储冷却液或冷却固体。
在一实施例中， 如图 3所示， 所述 PCB板的加工设备还包括用于测 量 PCB板待加工部位温度的测温器和用于连接所述测温器、钻机、液氮 喷雾器的控制器， 所述控制器接收测温器的温度信号， 并根据所述温度 信号控制所述喷洒装置和操作装置工作。
在一实施例中， 在钻机的主轴旁边安装一个定时喷洒装置， 钻孔前 先在 PCB板上面喷洒一层冷却液或冷却固体，然后每隔几分钟，在 PCB 板恢复至室温前或玻璃化转变温度前再喷洒一次冷却液或冷却固体， 直 到 PCB板加工完成。
本发明所述 PCB 板的加工设备是在加工现场利用冷却液或冷却固 体直接对 PCB板待加工部位进行冷却， 把 PCB板待加工部位的温度始 终控制在玻璃化转变温度以下， 此时材料较为硬脆， 方便机械加工， 可 以减少 PCB板上的毛刺和钻污； 由于采用原地加工，在保证冷却要求的 同时， 省去反复拆装定位 PCB板件， 拿去冰箱冷冻的操作， 大幅提高了 加工效率， 由于不用反复拆卸 PCB板件， 不会因为多次定位影响加工区 域的精度。
另外本发明冷却液或冷却固体优先采用沸点或升华点低于 PCB 板 材料的玻璃化转变温度的材料， 此类材料被送到 PCB板待加工表面时， 由于冷却液或冷却固体会在常压下快速变为气体， 在气化或升华过程中 需要吸收大量的热量，从而可以迅速地将 PCB板冷却，进一步提高加工 效率； 而一些冷却液或冷却固体比如液氩、 液氦、 液氖、 液氙、 液氡、 液氮、 液态二氧化碳、 固态二氧化碳等材料气化后不会产生危害性气体 和废渣，对环境无影响，对 PCB板质量无影响。喷洒装置邻近操作装置， 喷出的冷却液或冷却固体还可以对操作装置进行很好的冷却， 有助于操 作装置的降温， 大幅增加操作装置的寿命。
以上所述仅为本发明的实施例， 并非因此限制本发明的专利范围， 凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换， 或 直接或间接运用在其他相关的技术领域， 均同理包括在本发明的专利保 护范围内。

Claims

权 利 要 求 书
1. 一种 PCB板的加工方法， 其特征在于： 在对 PCB板进行机械加 工过程中，利用冷却液或冷却固体把 PCB板待加工部位的温度始终控制 在玻璃化转变温度以下。
2.根据权利要求 1所述 PCB板的加工方法， 其特征在于： 采用连 续或间歇喷洒的方式把冷却液或冷却固体送至 PCB 板待加工表面进行 冷却。
3.根据权利要求 1所述 PCB板的加工方法， 其特征在于： 持续测 量待加工部位的温度， 并根据测量到的温度， 控制所述喷洒冷却液或冷 却固体的强度、 或是否喷洒冷却液或冷却固体。
4.根据权利要求 1至 3任一项所述 PCB板的加工方法， 其特征在 于：所述冷却液或冷却固体的沸点或升华点低于 PCB板材料的玻璃化转 变温度。
5.根据权利要求 1至 3任一项所述 PCB板的加工方法， 其特征在 于： 所述冷却液为液氩、 液氧、 液氩、 液氦、 液氖、 液氙、 液氡、 液氮、 液态二氧化碳、 液态丙烷、 液态丁烷或液态二氧化石克； 所述冷却固体为 固态二氧化碳、 固态丙烷、 固态丁烷、 固态二氧化硫、 固态乙醇或固态 丙酮。
6.根据权利要求 1所述 PCB板的加工方法，其特征在于：所述 PCB 板材料为 PTFE材料， 把 PCB板待加工部位的温度始终控制在 25 °C以 下。
7. 一种 PCB板的加工设备， 包括对所述 PCB板实施机械加工的操 作装置， 其特征在于： 还包括用于喷洒冷却液或冷却固体的喷洒装置， 所述喷洒装置的喷洒方向正对 PCB板的待加工部位。
8.根据权利要求 7所述 PCB板的加工设备， 其特征在于： 所述操 作装置是具有主轴的钻机。
9.根据权利要求 7所述 PCB板的加工设备， 其特征在于： 所述喷 洒装置为喷雾器。
10. 根据权利要求 7所述 PCB板的加工设备， 其特征在于： 还包括 用于测量 PCB 板待加工部位温度的测温器和用于连接所述测温器、 钻 机、 液氮喷雾器的控制器， 所述控制器接收测温器的温度信号， 并根据 所述温度信号控制所述喷洒装置和操作装置工作。
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