WO2011062408A3 - 유리기판의 레이저 실링장치 - Google Patents

유리기판의 레이저 실링장치 Download PDF

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Publication number
WO2011062408A3
WO2011062408A3 PCT/KR2010/008103 KR2010008103W WO2011062408A3 WO 2011062408 A3 WO2011062408 A3 WO 2011062408A3 KR 2010008103 W KR2010008103 W KR 2010008103W WO 2011062408 A3 WO2011062408 A3 WO 2011062408A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
glass substrates
laser head
sealing device
present
Prior art date
Application number
PCT/KR2010/008103
Other languages
English (en)
French (fr)
Other versions
WO2011062408A2 (ko
Inventor
노동훈
조현영
Original Assignee
㈜엘지하우시스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ㈜엘지하우시스 filed Critical ㈜엘지하우시스
Priority to DE112010004460.0T priority Critical patent/DE112010004460B4/de
Priority to JP2012508412A priority patent/JP5323984B2/ja
Priority to US13/389,346 priority patent/US20120131959A1/en
Priority to CN201080035332.3A priority patent/CN102471152B/zh
Publication of WO2011062408A2 publication Critical patent/WO2011062408A2/ko
Publication of WO2011062408A3 publication Critical patent/WO2011062408A3/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

본 발명은 유리기판의 레이저 실링장치에 관한 것이다. 본 발명은 유리기판 사이에 도포되는 실링재를 레이저로 조사하여 용융시키는 제 1레이저헤드와; 상기 제 1레이저헤드와 일정한 간격으로 설치되어 상기 제 1레이저헤드가 조사한 부분을 레이저로 조사하고, 상기 제 1레이저헤드보다 상대적으로 낮은 파워로 설정되는 제 2레이저헤드를 포함한다. 그리고, 상기 제 1,2레이저헤드에 대해 대이동가능하게 설치되고, 일정한 온도로 가열된 상태에서 상기 유리기판이 놓여지는 히팅플레이트가 더 포함된다. 이와 같은 본 발명에 의하면, 레이저헤드에 의해 용융되는 실링재가 급격하게 온도가 하강하지 않고 완만하게 하강되기 때문에 유리기판에 열충격으로 인한 크랙이 발생하는 것이 최소화되는 효과가 있다.
PCT/KR2010/008103 2009-11-17 2010-11-16 유리기판의 레이저 실링장치 WO2011062408A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE112010004460.0T DE112010004460B4 (de) 2009-11-17 2010-11-16 Laserdichtvorrichtung für Glassubstrate
JP2012508412A JP5323984B2 (ja) 2009-11-17 2010-11-16 ガラス基板のレーザーシーリング装置
US13/389,346 US20120131959A1 (en) 2009-11-17 2010-11-16 Laser sealing device for glass substrates
CN201080035332.3A CN102471152B (zh) 2009-11-17 2010-11-16 玻璃基板的激光密封装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090111161A KR101206608B1 (ko) 2009-11-17 2009-11-17 유리기판의 레이저 실링장치
KR10-2009-0111161 2009-11-17

Publications (2)

Publication Number Publication Date
WO2011062408A2 WO2011062408A2 (ko) 2011-05-26
WO2011062408A3 true WO2011062408A3 (ko) 2011-11-03

Family

ID=44060181

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/008103 WO2011062408A2 (ko) 2009-11-17 2010-11-16 유리기판의 레이저 실링장치

Country Status (6)

Country Link
US (1) US20120131959A1 (ko)
JP (1) JP5323984B2 (ko)
KR (1) KR101206608B1 (ko)
CN (1) CN102471152B (ko)
DE (1) DE112010004460B4 (ko)
WO (1) WO2011062408A2 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110308610A1 (en) * 2010-06-18 2011-12-22 Primestar Solar System and method for modifying an article and a modified article
CN102403466B (zh) * 2011-11-18 2014-12-31 上海大学 一种用于光电器件封装的激光键合方法
CN102881844A (zh) * 2012-10-18 2013-01-16 四川虹视显示技术有限公司 玻璃料密封有机发光二极管的方法
CN103008886B (zh) * 2012-12-28 2015-04-08 江苏大学 一种自适性激光冲击焊接的方法和装置
JP5997666B2 (ja) * 2013-07-26 2016-09-28 エンシュウ株式会社 レーザ熱処理装置
KR20150033195A (ko) 2013-09-23 2015-04-01 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
WO2015164241A1 (en) 2014-04-21 2015-10-29 Corning Incorporated Laser welding of high thermal expansion glasses and glass-ceramics
US10195825B2 (en) 2014-10-30 2019-02-05 Corning Incorporated Methods for strengthening the edge of laminated glass articles and laminated glass articles formed therefrom
WO2016069828A1 (en) * 2014-10-30 2016-05-06 Corning Incorporated Method and apparatus for sealing the edge of a glass article
CN104466033B (zh) 2014-12-15 2017-05-31 京东方科技集团股份有限公司 一种激光烧结设备及烧结方法
CN105070794B (zh) * 2015-07-14 2017-06-16 武汉大学 基于激光诱导的led荧光粉涂覆装置及方法
CN106997929A (zh) * 2016-01-22 2017-08-01 上海微电子装备有限公司 一种双面激光准同步封装***及封装方法
JP2017204599A (ja) * 2016-05-13 2017-11-16 日本電気硝子株式会社 気密パッケージの製造方法及び気密パッケージ
CN106808087B (zh) * 2017-02-13 2018-12-21 江苏华博数控设备有限公司 一种减小激光熔覆后工件形变量的方法
CN108188576B (zh) * 2018-01-16 2019-08-27 京东方科技集团股份有限公司 一种激光烧结方法及激光烧结设备
CN112981397B (zh) * 2021-05-20 2021-10-19 武汉锐科光纤激光技术股份有限公司 轧辊的激光熔覆方法和装置、存储介质及电子设备
CN116675435A (zh) * 2023-05-17 2023-09-01 武汉理工大学 一种玻璃粉、激光封接玻璃浆料、真空玻璃及其封接工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060005369A (ko) * 2003-04-16 2006-01-17 코닝 인코포레이티드 프릿으로 기밀 밀봉된 유리 패키지 및 이의 제조방법
EP1925601A1 (en) * 2006-11-07 2008-05-28 Corning Incorporated Hermetic seal for light emitting display device, method, and apparatus
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
KR100838077B1 (ko) * 2007-01-12 2008-06-16 삼성에스디아이 주식회사 평판 표시장치의 제조방법
US20090064717A1 (en) * 2007-09-10 2009-03-12 Dongjin Semichem Co., Ltd. Glass Frit And Sealing Method For Element Using The Same
US20090136766A1 (en) * 2007-11-26 2009-05-28 Dongjin Semichem Co., Ltd. Low melting point frit paste composition and sealing method for electric element using the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147251A (en) * 1981-03-09 1982-09-11 Toshiba Corp Dividing method for wafer using laser light
JPS5836409A (ja) * 1981-08-26 1983-03-03 Mitsubishi Chem Ind Ltd 熱可塑性合成樹脂成形品の溶着方法及び装置
JPS592352A (ja) * 1982-06-28 1984-01-07 Toshiba Corp 半導体装置の製造方法
US4589830A (en) * 1983-08-01 1986-05-20 Clawson Burrell E Press control system
US5489321A (en) * 1994-07-14 1996-02-06 Midwest Research Institute Welding/sealing glass-enclosed space in a vacuum
US6109994A (en) * 1996-12-12 2000-08-29 Candescent Technologies Corporation Gap jumping to seal structure, typically using combination of vacuum and non-vacuum environments
KR20010030852A (ko) * 1997-10-01 2001-04-16 브룩스 나이즐 비쥬얼 디스플레이
JP3515003B2 (ja) * 1999-02-03 2004-04-05 新明和工業株式会社 レーザ融着方法
JP3805273B2 (ja) * 2002-03-29 2006-08-02 Ｕｈｔ株式会社 積層型電子部品の製造装置
JP4825448B2 (ja) * 2005-05-12 2011-11-30 傳 篠田 表示装置を製造する製造装置
US20070001579A1 (en) * 2005-06-30 2007-01-04 Eun-Suk Jeon Glass-to-glass joining method using laser, vacuum envelope manufactured by the method, electron emission display having the vacuum envelope
ES2300912T3 (es) * 2005-08-20 2008-06-16 Hinterkopf Gmbh Maquina para imprimir cuerpos huecos.
JP2007220648A (ja) * 2006-02-14 2007-08-30 Samsung Sdi Co Ltd 平板表示装置とその製造装置及び製造方法
KR100786542B1 (ko) 2006-08-14 2007-12-21 (주)에스티아이 액정표시장치의 실런트 도포장치 및 이를 이용한 실런트도포방법
DE102006043774A1 (de) * 2006-09-14 2008-03-27 Fachhochschule Jena Verfahren zur Herstellung eines Formeinsatzes für Werkzeuge zur Produktion von Formteilen aus Kunststoff
JP2008070679A (ja) 2006-09-15 2008-03-27 Fujifilm Corp フラットパネルディスプレイの製造方法及びその装置
JP2009104841A (ja) * 2007-10-22 2009-05-14 Toshiba Corp 封止装置、封止方法、電子デバイス、および電子デバイスの製造方法
KR100912037B1 (ko) * 2007-12-03 2009-08-12 (주)엘지하우시스 태양전지 모듈의 제조 방법 및 제조 장치
JP4942207B2 (ja) * 2008-02-07 2012-05-30 キヤノン株式会社 気密容器の製造方法
US8448468B2 (en) * 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060005369A (ko) * 2003-04-16 2006-01-17 코닝 인코포레이티드 프릿으로 기밀 밀봉된 유리 패키지 및 이의 제조방법
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
EP1925601A1 (en) * 2006-11-07 2008-05-28 Corning Incorporated Hermetic seal for light emitting display device, method, and apparatus
KR100838077B1 (ko) * 2007-01-12 2008-06-16 삼성에스디아이 주식회사 평판 표시장치의 제조방법
US20090064717A1 (en) * 2007-09-10 2009-03-12 Dongjin Semichem Co., Ltd. Glass Frit And Sealing Method For Element Using The Same
US20090136766A1 (en) * 2007-11-26 2009-05-28 Dongjin Semichem Co., Ltd. Low melting point frit paste composition and sealing method for electric element using the same

Also Published As

Publication number Publication date
KR20110054504A (ko) 2011-05-25
JP2012525314A (ja) 2012-10-22
CN102471152B (zh) 2014-07-02
DE112010004460T8 (de) 2013-01-31
JP5323984B2 (ja) 2013-10-23
DE112010004460T5 (de) 2012-09-20
KR101206608B1 (ko) 2012-11-29
CN102471152A (zh) 2012-05-23
US20120131959A1 (en) 2012-05-31
DE112010004460B4 (de) 2017-11-09
WO2011062408A2 (ko) 2011-05-26

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