WO2011058834A1 - 電子部品および素子用パッケージ並びにこれらの製造方法 - Google Patents
電子部品および素子用パッケージ並びにこれらの製造方法 Download PDFInfo
- Publication number
- WO2011058834A1 WO2011058834A1 PCT/JP2010/067366 JP2010067366W WO2011058834A1 WO 2011058834 A1 WO2011058834 A1 WO 2011058834A1 JP 2010067366 W JP2010067366 W JP 2010067366W WO 2011058834 A1 WO2011058834 A1 WO 2011058834A1
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- Prior art keywords
- lid
- metal
- electronic component
- aluminum
- package
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 89
- 239000002184 metal Substances 0.000 claims abstract description 89
- 239000000919 ceramic Substances 0.000 claims abstract description 71
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 30
- 238000003466 welding Methods 0.000 claims description 24
- 238000005304 joining Methods 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 claims description 6
- 239000002075 main ingredient Substances 0.000 abstract 1
- 239000008151 electrolyte solution Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005219 brazing Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- -1 lithium tetrafluoroborate Chemical compound 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 229910012851 LiCoO 2 Inorganic materials 0.000 description 1
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910001496 lithium tetrafluoroborate Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
- H01G11/80—Gaskets; Sealings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/84—Processes for the manufacture of hybrid or EDL capacitors, or components thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
- H01M50/103—Primary casings; Jackets or wrappings characterised by their shape or physical structure prismatic or rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/117—Inorganic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/117—Inorganic material
- H01M50/119—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0431—Cells with wound or folded electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Definitions
- the present invention relates to an electronic component and device package having high airtightness, and a method for manufacturing the same.
- Patent Document 1 discloses a battery structure as shown in FIG.
- the ceramic base 110 made of aluminum oxide has a recess at the center of the upper surface, and a step 110a is formed between the inner surface and the bottom surface of the recess.
- An internal electrode 122a is formed on the bottom surface of the recess, and an internal electrode 122b is formed on the top surface of the step 110a.
- external electrodes 124 a and 124 b are provided on the external bottom surface of the ceramic substrate 110.
- a connection electrode 123a is formed from the internal electrode 122a to the external electrode 124a, and a connection electrode 123b is formed from the internal electrode 122b to the external electrode 124b.
- These electrodes are made of tungsten.
- a metal base layer 128a made of tungsten is joined to the upper surface of the ceramic substrate 110 so as to surround the concave portion.
- the metal underlayer 128a is covered with nickel plating 128b to form the underlayer 128.
- a frame-like member 126 in which an aluminum layer is formed on the surface of an iron-nickel-cobalt alloy is brazed to the base layer 128 with an aluminum braze 127 so as to surround the concave portion of the ceramic base 110.
- the aluminum solder 127 is formed so as to cover the surface of the foundation layer 128.
- the foundation layer 128 improves the wettability with the aluminum brazing 127 on the upper surface of the ceramic base 110, and the bonding strength between the ceramic base 110 and the frame-like member 126 becomes stronger.
- a lid 150 made of aluminum is brazed with an aluminum solder 125 on the frame member 126.
- the element 140 is accommodated in the element package.
- the element 140 is formed by laminating a plate-like positive electrode 141 containing LiCoO 2 and acetylene black and a plate-like negative electrode 142 containing coke via a separator 143 made of a polyolefin fiber nonwoven fabric. Yes.
- the element 140 is fixed in the recess of the ceramic base 110 by connecting the positive electrode 141 to the internal electrode 122a and the negative electrode 142 to the internal electrode 122b.
- an electrolytic solution 170 in which lithium tetrafluoroborate is dissolved in dimethoxyethane as an organic solvent is injected into the device package.
- the battery 180 hermetically sealed is configured.
- the above-described conventional technique has a problem that the electrolytic solution 170 comes into contact with the base layer 128 when a micro crack is generated in the aluminum layer made of the aluminum solder 127 during use of the battery 180 or in the manufacturing process. It was.
- the electrolytic solution 170 comes into contact with the base layer 128, the base layer 128 is corroded, and the airtightness of the battery 180 is lowered.
- Such contact is caused when the surface of the underlayer 128 is not sufficiently covered with the aluminum brazing 127 or when the brazing is performed, the metal of the aluminum brazing 127 and the underlayer 128 is alloyed and the metal of the underlayer 128 is used. Also occurs when the surface is exposed.
- an object of the present invention is to provide an electronic component and a device package having high airtightness, and to simplify processes and improve productivity in these manufacturing methods.
- an electronic component of the present invention is an electronic component having an element and a package containing the element.
- the package includes a ceramic base, a lid, the ceramic base, and the lid.
- a connecting member to be connected, the joint portion of the lid with the connecting member is made of metal, the connecting member is made of a metal mainly composed of aluminum, and is directly joined to the ceramic substrate.
- the element is fixed to the ceramic base or the lid.
- the connecting member is made of a metal containing 86 wt% or more of aluminum.
- a joint portion of the lid body with the connection member is made of a metal whose main component is aluminum.
- the lid body has a recess capable of accommodating the element.
- an electrolyte is injected into the package.
- the element package of the present invention is a package for housing an element, and the package includes a ceramic base, a lid, and a connecting member that connects the ceramic base and the lid,
- the connecting portion of the lid body with the connecting member is made of metal
- the connecting member is made of a metal whose main component is aluminum and is directly bonded to the ceramic base.
- a method of manufacturing an electronic component having an element and a package made of a ceramic base and a lid for housing the element is provided.
- the step of forming the connecting member includes a step of preparing a molten metal made of a metal mainly composed of aluminum, and after attaching the molten metal to the ceramic substrate. It is preferable to have a step of forming a metal layer on the surface of the ceramic substrate by solidifying the molten metal and a step of forming a connection member by patterning the metal layer.
- the method for manufacturing an electronic component of the present invention further includes a step of forming an internal electrode for fixing the element by patterning the metal layer after the step of forming the metal layer.
- the connecting member is made of a metal containing 86 wt% or more of aluminum.
- the joint portion of the lid is made of a metal mainly composed of aluminum.
- the lid body has a recess capable of accommodating the element.
- the step of joining the lid to the connection member is performed by laser welding.
- the electronic component manufacturing method of the present invention preferably further includes a step of injecting an electrolyte into the package.
- a method for manufacturing an element package for housing an element comprising the step of joining a joint portion of the lid to the connection member.
- the electronic component and the device package according to the present invention have high strength because the connecting member for connecting the ceramic base body and the lid body is made of a metal mainly composed of aluminum. High corrosion resistance. For this reason, it has high airtightness.
- FIG. 1 is a diagram for explaining a process of forming a metal layer on the surface of a ceramic substrate according to an embodiment of the present invention.
- a ceramic substrate 10 made of alumina having through holes 11a and 11b as shown in FIG. 1A is prepared as a substrate.
- a molten metal is prepared by setting a metal having a desired composition as a main component of aluminum in a crucible and then heating the crucible with a heater in a nitrogen gas atmosphere to dissolve the metal. To do.
- a metal containing 99 wt% of aluminum is used as the metal containing aluminum as a main component.
- the ceramic substrate 10 is immersed in the molten metal. Thereby, the molten metal adheres to the surface of the ceramic substrate 10. At this time, the molten metal also flows into and fills the through holes 11a and 11b. Thereafter, the ceramic substrate 10 is taken out from the molten metal into a nitrogen atmosphere, and the molten metal adhering to the surface is gradually cooled and solidified, and joined to the surface of the ceramic substrate 10. As a result, as shown in FIGS. 1B and 1C, a composite member 30 is obtained in which an aluminum metal layer 20 is formed in the surface of the ceramic substrate 10 and in the through holes 11a and 11b. In the joining of the ceramic and the metal using such a molten metal, a process of gradually cooling the metal from the molten state is performed, so that high lattice matching between the metal and the ceramic is obtained, and the joining strength becomes strong.
- the surface of the composite member 30 is polished by a polishing machine, and the surface of the metal layer 20 is homogenized.
- a photosensitive resist film was formed on the surface of the metal layer 20, exposed by applying a light-shielding pattern mask, further developed, and the light-shielded portion of the resist film was removed.
- patterning was performed by dissolving the other portion with a ferric chloride-hydrochloric acid mixed etching solution while leaving the masking portion to which the resist film of the metal layer 20 was deposited.
- a substrate 31 was obtained in which the internal electrodes 22a and 22b, the external electrodes 24a and 24b, and the connection member 21 were formed on the surface of the ceramic base 10.
- the connecting member 21 is formed in a frame shape so as to surround the internal electrodes 22a and 22b.
- the internal electrode 22a and the external electrode 24a are electrically connected by a connection electrode 23a made of the metal layer 20 formed in the through hole 11a.
- the internal electrode 22b and the external electrode 24b are electrically connected by a connection electrode 23b made of the metal layer 20 formed in the through hole 11b.
- the surfaces of the external electrodes 24a and 24b are plated in order to improve wettability with solder.
- metal layers are sequentially deposited on the surfaces of the external electrodes 24a and 24b by nickel plating and gold plating.
- the internal electrode, the external electrode, and the connection electrode are formed simultaneously with the connection member by patterning the metal layer formed of the molten metal, the process is simplified compared to the case where each is formed in a separate process. To improve productivity.
- the element 40 is formed by winding a positive electrode 41 and a negative electrode 42 with an insulating separator 43 interposed therebetween.
- a sheet-shaped current collector made of aluminum having a polarizable electrode layer containing activated carbon supported thereon was used as the positive electrode 41 and the negative electrode 42.
- One end of the positive electrode 41 is connected and fixed to the internal electrode 22a formed on the surface of the ceramic substrate 10 by ultrasonic welding.
- One end of the negative electrode 42 is connected and fixed to the internal electrode 22b formed on the surface of the ceramic substrate 10 by ultrasonic welding.
- These connections are not limited to ultrasonic welding, and laser welding, TIG welding, or the like may be used.
- a lid 50a made of a metal containing 99 wt% aluminum and having a recess 51a capable of accommodating the element 40 and a through hole 52a is prepared.
- the end 50a 'located at the edge of the lid 50a is bent on the side opposite to the recess 51a, that is, on the outside.
- the end package 50 a ′ of the lid 50 a is laser welded to the connection member 21 formed on the surface of the ceramic base 10, whereby an element package for housing the element 40 is obtained.
- ⁇ ⁇ Welding may use a joining method such as resistance welding or ultrasonic welding, but laser welding is preferred.
- Laser welding is performed by irradiating the laser beam 60 onto the surface 53 ′ opposite to the contact surface of the end 50 a ′ with the connection member 21.
- laser welding it is possible to perform partial welding of a minute region as compared with other joining methods, so that there is no unevenness in welding and sealing failure is reduced. There is a low risk of damaging the surrounding area due to heat.
- damage and deformation of the ceramic base body, the lid, and the connection member can be suppressed.
- the present invention can be applied to various sizes of electronic components, and can cope with downsizing of electronic components.
- the joint strength can be easily designed by changing the joint width.
- spatter scattering during welding can be reduced as compared with ultrasonic welding or the like, occurrence of a short circuit due to this can be suppressed.
- the thickness T2 of the connection member 21 is thicker than the thickness T1 of the end portion 50a '.
- the connecting member 21 preferably contains 86 wt% or more of aluminum, more preferably 99 wt% or more.
- the connecting member 21 preferably contains 86 wt% or more of aluminum, more preferably 99 wt% or more.
- the electrolytic solution 70 is injected into the element package from the hole 52a.
- the electrolytic solution 70 used TEMA-BF 4 (triethylmethylammonium tetrafluoroborate) as an electrolyte and PC (propylene carbonate) as an organic solvent.
- an aluminum metal ball 54 is installed so as to close the hole 52a, and is welded to the lid 50a by laser welding, whereby the element package is hermetically sealed.
- connection member is not corroded by contact with the electrolytic solution, and high airtightness of the element package is ensured. Further, the strength is not deteriorated by alloying with a metal or the like used for the underlayer.
- tungsten, nickel, or the like is used as the base layer, but since the base layer is not required in the present embodiment, in addition to reducing raw material costs, the process is simplified, Productivity is improved.
- the internal electrode is also formed of the same material as the connecting member, high corrosion resistance against the electrolytic solution can be obtained.
- the joint part with a cover body and the connection member of this cover body also uses the metal which has aluminum as a main component, the high corrosion resistance with respect to electrolyte solution is acquired.
- the electric double layer capacitor has been described as an electronic component.
- the present invention is not limited to this, and the present invention can be applied to an electronic component having an element in an element package such as a battery or a piezoelectric device. Is possible.
- alumina is used as the ceramic substrate 10.
- the present invention is not limited to this, and for example, aluminum nitride may be used.
- Aluminum nitride has a high cost as a material compared to alumina, but has high thermal conductivity and excellent heat dissipation.
- the outer surface 53 of the lid 50a has a lid 50a such as SUS, Kovar, 42% Ni—Fe alloy for improving the appearance, strengthening the strength, suppressing thermal expansion, and the like.
- the clad layer may be formed by clad with a metal made of a material different from the above.
- the thickness T1 of the layer mainly composed of aluminum at the end 50a ′ is preferably 10 ⁇ m or more.
- an aluminum-silicon alloy containing silicon in the range of 4.5 to 14 wt% may be used as the connecting member 21.
- the alloy has a thermal expansion coefficient close to that of a ceramic substrate. For this reason, when the alloy is used as a connection member, the thermal stress due to the difference in thermal expansion coefficient between the ceramic base and the connection member is reduced, the occurrence of cracks and the like is suppressed, and the airtightness of the device package is improved.
- A4043 silicon content 4.5 to 6.0 wt%) or A4032 (silicon content 11.0 to 13.5 wt%) defined in JIS standard is used.
- the lid 50a made of a metal containing 99 wt% of aluminum is used.
- the joint portion with the connecting member is used. Good. More preferably, the joint contains 86 wt% or more of aluminum.
- the joint portion may be made of a metal mainly composed of aluminum, and the other portion may be formed of ceramic.
- the ceramic substrate may have a recess.
- the side wall of the element package formed by the ceramic base and the lid is preferably made of metal. In this case, the side wall can easily absorb and relax the thermal stress caused by the difference in thermal expansion coefficient between the ceramic base and the lid. For this reason, there is little risk that a crack or the like is generated on the side wall and the airtightness of the device package is deteriorated.
- the lid is welded by irradiating the surface of the lid with a laser beam.
- the lid 50 b and the connection member 21 are connected. Welding may be performed by irradiating the interface with the laser beam 61.
- the lid 50b has a recess 51b capable of accommodating the element 40, and the end 50b 'located at the edge is not bent.
- the end portion 50b ′ may be bent on the side opposite to the concave portion 51b, that is, on the outer side, but the inner volume of the element package is increased when the end portion 50b ′ is not bent. be able to.
- the metal sphere is used to close the hole of the lid, but as in another modification shown in FIG. 6, the lid has a protruding portion 50c ′ protruding outward from the periphery of the hole 52c.
- the body 50c may be used.
- the laser beam 62 is irradiated to the protrusion 50c '.
- the protrusion 50c ′ is melted and then cooled to form a plug 50c ′′ that closes the hole 52c as shown in FIG. 6B, and the element package is hermetically sealed. In this way, the electric double layer capacitor 81 is obtained.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Secondary Cells (AREA)
Abstract
Description
11a,11b スルーホール
20 金属層
21 接続部材
22a,22b,122a,122b 内部電極
23a,23b,123a,123b 接続電極
24a,24b,124a,124b 外部電極
30 複合部材
31 基板
40,140 素子
41,141 正極
42,142 負極
43,143 セパレータ
50a,50b,50c,150 蓋体
50a’,50b’ 端部
50c’ 突出部
50c” 栓
51a,51b 凹部
52a,52c 孔
53,53’ 表面
54 金属球
60,61,62 レーザビーム
70,170 電解液
80,81 電気二重層コンデンサ
110a 段差
125,127 アルミニウムロウ
126 枠状部材
128 下地層
128a 金属下地層
128b めっき
180 電池
T1,T2 厚さ
Claims (15)
- 素子と該素子を収納したパッケージとを有する電子部品において、
該パッケージは、セラミック基体と、蓋体と、該セラミック基体と該蓋体を接続する接続部材とを具備し、
前記蓋体の前記接続部材との接合部は金属からなり、
前記接続部材はアルミニウムを主成分とする金属からなり、かつ、前記セラミック基体と直接接合しており、
前記素子は前記セラミック基体または前記蓋体に固定されていること、
を特徴とする電子部品。 - 前記接続部材は、アルミニウムを86wt%以上含有する金属からなること、
を特徴とする請求項1に記載の電子部品。 - 前記蓋体の前記接続部材との接合部はアルミニウムを主成分とする金属からなること、
を特徴とする請求項1または2に記載の電子部品。 - 前記蓋体が前記素子を収納可能な凹部を有していること、
を特徴とする請求項1乃至3の内いずれか1項に記載の電子部品 - 前記パッケージ内に電解液が注入されていること、
を特徴とする請求項1乃至4の内いずれか1項に記載の電子部品 - 素子を収納するためのパッケージにおいて、
該パッケージは、セラミック基体と、蓋体と、該セラミック基体と該蓋体を接続する接続部材とを具備し、
前記蓋体の前記接続部材との接合部は金属からなり、
前記接続部材はアルミニウムを主成分とする金属からなり、かつ、前記セラミック基体と直接接合していること、
を特徴とする素子用パッケージ。 - 素子と、該素子を収納するための、セラミック基体と蓋体からなるパッケージとを有する電子部品の製造方法において、
素子と、セラミック基体と、金属からなる接合部を有する蓋体と、を準備する工程と、
前記セラミック基体の表面にアルミニウムを主成分とする金属からなる接続部材を形成する工程と、
前記セラミック基体または前記蓋体に前記素子を固定する工程と、
前記接続部材に前記蓋体の接合部を接合することでパッケージを形成する工程と、
を有することを特徴とする電子部品の製造方法。 - 前記接続部材を形成する工程は、
アルミニウムを主成分とする金属からなる溶湯を準備する工程と、
前記セラミック基体に前記溶湯を付着させた後、該溶湯を凝固させることで、前記セラミック基体の表面に金属層を形成する工程と、
前記金属層をパターニングすることで接続部材を形成する工程とを有すること、
を特徴とする請求項7に記載の電子部品の製造方法。 - 前記金属層を形成する工程の後に、
該金属層をパターニングすることで前記素子を固定するための内部電極を形成する工程を更に備えること、
を特徴とする請求項8に記載の電子部品の製造方法。 - 前記接続部材は、アルミニウムを86wt%以上含有する金属からなること、
を特徴とする請求項7乃至9の内いずれか1項に記載の電子部品の製造方法。 - 前記蓋体の接合部はアルミニウムを主成分とする金属からなること、
を特徴とする請求項7乃至11の内いずれか1項に記載の電子部品の製造方法。 - 前記蓋体が前記素子を収納可能な凹部を有していること、
を特徴とする請求項7乃至11の内いずれか1項に記載の電子部品の製造方法。 - 前記接続部材に前記蓋体を接合する工程は、
レーザ溶接にて行われることを特徴とする請求項7乃至12の内いずれか1項に記載の電子部品の製造方法。 - 前記パッケージ内に電解液を注入する工程を更に備えること、
を特徴とする請求項7乃至13の内いずれか1項に記載の電子部品の製造方法。 - 素子を収納するためのパッケージの製造方法であって、
セラミック基体と金属からなる接合部を有する蓋体とを準備する工程と、
前記セラミック基体の表面にアルミニウムを主成分とする金属からなる接続部材を形成する工程と、
前記接続部材に前記蓋体の接合部を接合する工程と、
を有することを特徴とする素子用パッケージの製造方法。
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JP2011540447A JPWO2011058834A1 (ja) | 2009-11-11 | 2010-10-04 | 電子部品および素子用パッケージ並びにこれらの製造方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013030750A (ja) * | 2011-06-24 | 2013-02-07 | Seiko Instruments Inc | 電気化学セル及びその製造方法 |
JP2017037969A (ja) * | 2015-08-10 | 2017-02-16 | セイコーインスツル株式会社 | 電気化学セル |
JP2017037968A (ja) * | 2015-08-10 | 2017-02-16 | セイコーインスツル株式会社 | 電気化学セル |
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US11830672B2 (en) | 2016-11-23 | 2023-11-28 | KYOCERA AVX Components Corporation | Ultracapacitor for use in a solder reflow process |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10125824A (ja) * | 1996-10-15 | 1998-05-15 | Dowa Mining Co Ltd | バイアホールを有する回路基板及びその製造方法 |
JP2005123154A (ja) * | 2003-02-26 | 2005-05-12 | Kyocera Corp | 電池用ケースおよび電池 |
JP2006028018A (ja) * | 2005-08-01 | 2006-02-02 | Dowa Mining Co Ltd | Al−セラミックス複合基板 |
JP2008098462A (ja) * | 2006-10-13 | 2008-04-24 | Fujitsu Media Device Kk | 固体電解コンデンサ |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5446316A (en) * | 1994-01-06 | 1995-08-29 | Harris Corporation | Hermetic package for a high power semiconductor device |
JP4550519B2 (ja) * | 2004-08-10 | 2010-09-22 | セイコーインスツル株式会社 | 電気化学セルおよびその製造方法 |
-
2010
- 2010-10-04 CN CN2010800509350A patent/CN102687218A/zh active Pending
- 2010-10-04 JP JP2011540447A patent/JPWO2011058834A1/ja active Pending
- 2010-10-04 WO PCT/JP2010/067366 patent/WO2011058834A1/ja active Application Filing
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2012
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10125824A (ja) * | 1996-10-15 | 1998-05-15 | Dowa Mining Co Ltd | バイアホールを有する回路基板及びその製造方法 |
JP2005123154A (ja) * | 2003-02-26 | 2005-05-12 | Kyocera Corp | 電池用ケースおよび電池 |
JP2006028018A (ja) * | 2005-08-01 | 2006-02-02 | Dowa Mining Co Ltd | Al−セラミックス複合基板 |
JP2008098462A (ja) * | 2006-10-13 | 2008-04-24 | Fujitsu Media Device Kk | 固体電解コンデンサ |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013030750A (ja) * | 2011-06-24 | 2013-02-07 | Seiko Instruments Inc | 電気化学セル及びその製造方法 |
JP2017076810A (ja) * | 2011-06-24 | 2017-04-20 | セイコーインスツル株式会社 | 電気化学セル |
JP2017098554A (ja) * | 2011-06-24 | 2017-06-01 | セイコーインスツル株式会社 | 電気化学セル |
JP2018061050A (ja) * | 2011-06-24 | 2018-04-12 | セイコーインスツル株式会社 | 電気化学セル |
JP2018061051A (ja) * | 2011-06-24 | 2018-04-12 | セイコーインスツル株式会社 | 電気化学セル |
KR101943105B1 (ko) * | 2011-06-24 | 2019-01-28 | 세이코 인스트루 가부시키가이샤 | 전기 화학 셀 및 그 제조 방법 |
JP2017037969A (ja) * | 2015-08-10 | 2017-02-16 | セイコーインスツル株式会社 | 電気化学セル |
JP2017037968A (ja) * | 2015-08-10 | 2017-02-16 | セイコーインスツル株式会社 | 電気化学セル |
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JPWO2011058834A1 (ja) | 2013-03-28 |
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