WO2011056948A2 - Methods of texturing surfaces for controlled reflection - Google Patents
Methods of texturing surfaces for controlled reflection Download PDFInfo
- Publication number
- WO2011056948A2 WO2011056948A2 PCT/US2010/055418 US2010055418W WO2011056948A2 WO 2011056948 A2 WO2011056948 A2 WO 2011056948A2 US 2010055418 W US2010055418 W US 2010055418W WO 2011056948 A2 WO2011056948 A2 WO 2011056948A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- microstamp
- metal
- substrate surface
- etchant composition
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 125
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- 238000001020 plasma etching Methods 0.000 claims abstract description 17
- 239000002105 nanoparticle Substances 0.000 claims abstract description 16
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims description 77
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 42
- 239000004065 semiconductor Substances 0.000 claims description 39
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 38
- 238000005530 etching Methods 0.000 claims description 35
- 239000004094 surface-active agent Substances 0.000 claims description 33
- 150000003839 salts Chemical class 0.000 claims description 30
- -1 alkali hydroxide salt Chemical class 0.000 claims description 27
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 238000009835 boiling Methods 0.000 claims description 15
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 14
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 14
- 230000003746 surface roughness Effects 0.000 claims description 12
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Chemical compound [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 claims description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 8
- CPRMKOQKXYSDML-UHFFFAOYSA-M rubidium hydroxide Chemical compound [OH-].[Rb+] CPRMKOQKXYSDML-UHFFFAOYSA-M 0.000 claims description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- 229910017604 nitric acid Inorganic materials 0.000 claims description 7
- 239000007800 oxidant agent Substances 0.000 claims description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 7
- 239000002082 metal nanoparticle Substances 0.000 claims description 6
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- 125000000129 anionic group Chemical group 0.000 claims description 5
- 238000006555 catalytic reaction Methods 0.000 claims description 5
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 239000000047 product Substances 0.000 claims description 5
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 4
- 229910001854 alkali hydroxide Inorganic materials 0.000 claims description 4
- 125000002091 cationic group Chemical group 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000011065 in-situ storage Methods 0.000 claims description 4
- IGELFKKMDLGCJO-UHFFFAOYSA-N xenon difluoride Chemical compound F[Xe]F IGELFKKMDLGCJO-UHFFFAOYSA-N 0.000 claims description 4
- 239000002888 zwitterionic surfactant Substances 0.000 claims description 4
- 229910004613 CdTe Inorganic materials 0.000 claims description 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 3
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 claims description 3
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 3
- 239000000920 calcium hydroxide Substances 0.000 claims description 3
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 3
- 150000004770 chalcogenides Chemical class 0.000 claims description 3
- 238000011066 ex-situ storage Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 150000004677 hydrates Chemical class 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 2
- 229910052925 anhydrite Inorganic materials 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- MVYYDFCVPLFOKV-UHFFFAOYSA-M barium monohydroxide Chemical compound [Ba]O MVYYDFCVPLFOKV-UHFFFAOYSA-M 0.000 claims description 2
- IWOUKMZUPDVPGQ-UHFFFAOYSA-N barium nitrate Inorganic materials [Ba+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O IWOUKMZUPDVPGQ-UHFFFAOYSA-N 0.000 claims description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Inorganic materials [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 2
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 2
- KIZFHUJKFSNWKO-UHFFFAOYSA-M calcium monohydroxide Chemical compound [Ca]O KIZFHUJKFSNWKO-UHFFFAOYSA-M 0.000 claims description 2
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Inorganic materials [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 claims description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims description 2
- 229910052923 celestite Inorganic materials 0.000 claims description 2
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L copper(II) hydroxide Inorganic materials [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 2
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 claims description 2
- 238000005137 deposition process Methods 0.000 claims description 2
- 229910052909 inorganic silicate Inorganic materials 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- UUCCCPNEFXQJEL-UHFFFAOYSA-L strontium dihydroxide Chemical compound [OH-].[OH-].[Sr+2] UUCCCPNEFXQJEL-UHFFFAOYSA-L 0.000 claims description 2
- 229910001866 strontium hydroxide Inorganic materials 0.000 claims description 2
- DHEQXMRUPNDRPG-UHFFFAOYSA-N strontium nitrate Inorganic materials [Sr+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O DHEQXMRUPNDRPG-UHFFFAOYSA-N 0.000 claims description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Inorganic materials [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims 1
- UQTCSFPVHNDUOG-UHFFFAOYSA-N azanium 4-carboxy-2,6-dihydroxyphenolate Chemical compound [NH4+].OC(=O)C1=CC(O)=C([O-])C(O)=C1 UQTCSFPVHNDUOG-UHFFFAOYSA-N 0.000 claims 1
- BOFZOTMTKBQRAB-UHFFFAOYSA-N azanium;2-carboxyphenolate Chemical compound N.OC(=O)C1=CC=CC=C1O BOFZOTMTKBQRAB-UHFFFAOYSA-N 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 abstract description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 29
- 239000010703 silicon Substances 0.000 abstract description 29
- 239000002086 nanomaterial Substances 0.000 abstract 1
- 230000008569 process Effects 0.000 description 24
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 238000005215 recombination Methods 0.000 description 11
- 230000006798 recombination Effects 0.000 description 11
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 9
- 239000012071 phase Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 229920001983 poloxamer Polymers 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 229920001451 polypropylene glycol Polymers 0.000 description 5
- 238000007788 roughening Methods 0.000 description 5
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000013530 defoamer Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 235000019329 dioctyl sodium sulphosuccinate Nutrition 0.000 description 3
- SYELZBGXAIXKHU-UHFFFAOYSA-N dodecyldimethylamine N-oxide Chemical compound CCCCCCCCCCCC[N+](C)(C)[O-] SYELZBGXAIXKHU-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 239000005431 greenhouse gas Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 3
- HPYNZHMRTTWQTB-UHFFFAOYSA-N 2,3-dimethylpyridine Chemical compound CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 2
- KDSNLYIMUZNERS-UHFFFAOYSA-N 2-methylpropanamine Chemical compound CC(C)CN KDSNLYIMUZNERS-UHFFFAOYSA-N 0.000 description 2
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 2
- TVZRAEYQIKYCPH-UHFFFAOYSA-N 3-(trimethylsilyl)propane-1-sulfonic acid Chemical compound C[Si](C)(C)CCCS(O)(=O)=O TVZRAEYQIKYCPH-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- LFTLOKWAGJYHHR-UHFFFAOYSA-N N-methylmorpholine N-oxide Chemical compound CN1(=O)CCOCC1 LFTLOKWAGJYHHR-UHFFFAOYSA-N 0.000 description 2
- 241000237503 Pectinidae Species 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 229920002257 Plurafac® Polymers 0.000 description 2
- 229920001214 Polysorbate 60 Polymers 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- NWGKJDSIEKMTRX-AAZCQSIUSA-N Sorbitan monooleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O NWGKJDSIEKMTRX-AAZCQSIUSA-N 0.000 description 2
- 239000004147 Sorbitan trioleate Substances 0.000 description 2
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 229940074391 gallic acid Drugs 0.000 description 2
- 235000004515 gallic acid Nutrition 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 229910021426 porous silicon Inorganic materials 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 235000020637 scallop Nutrition 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 235000019337 sorbitan trioleate Nutrition 0.000 description 2
- 229960000391 sorbitan trioleate Drugs 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 125000005208 trialkylammonium group Chemical group 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical class OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- PSBDWGZCVUAZQS-UHFFFAOYSA-N (dimethylsulfonio)acetate Chemical compound C[S+](C)CC([O-])=O PSBDWGZCVUAZQS-UHFFFAOYSA-N 0.000 description 1
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- NVLADMORQQMDKF-UHFFFAOYSA-N 1-ethyl-1-oxidopyrrolidin-1-ium Chemical compound CC[N+]1([O-])CCCC1 NVLADMORQQMDKF-UHFFFAOYSA-N 0.000 description 1
- YIZTVEDOQDZLOH-UHFFFAOYSA-N 1-methyl-1-oxidopyrrolidin-1-ium Chemical compound C[N+]1([O-])CCCC1 YIZTVEDOQDZLOH-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- NRGGMCIBEHEAIL-UHFFFAOYSA-N 2-ethylpyridine Chemical compound CCC1=CC=CC=N1 NRGGMCIBEHEAIL-UHFFFAOYSA-N 0.000 description 1
- IWTFOFMTUOBLHG-UHFFFAOYSA-N 2-methoxypyridine Chemical compound COC1=CC=CC=N1 IWTFOFMTUOBLHG-UHFFFAOYSA-N 0.000 description 1
- NJBCRXCAPCODGX-UHFFFAOYSA-N 2-methyl-n-(2-methylpropyl)propan-1-amine Chemical compound CC(C)CNCC(C)C NJBCRXCAPCODGX-UHFFFAOYSA-N 0.000 description 1
- GDDNTTHUKVNJRA-UHFFFAOYSA-N 3-bromo-3,3-difluoroprop-1-ene Chemical compound FC(F)(Br)C=C GDDNTTHUKVNJRA-UHFFFAOYSA-N 0.000 description 1
- CDOUZKKFHVEKRI-UHFFFAOYSA-N 3-bromo-n-[(prop-2-enoylamino)methyl]propanamide Chemical compound BrCCC(=O)NCNC(=O)C=C CDOUZKKFHVEKRI-UHFFFAOYSA-N 0.000 description 1
- GVKAVGPGTZFANE-UHFFFAOYSA-N 4-ethyl-4-oxidomorpholin-4-ium Chemical compound CC[N+]1([O-])CCOCC1 GVKAVGPGTZFANE-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 1
- 101500000959 Bacillus anthracis Protective antigen PA-20 Proteins 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 229920000463 Poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol) Polymers 0.000 description 1
- 229920000464 Poly(propylene glycol)-block-poly(ethylene glycol)-block-poly(propylene glycol) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
- 229920001219 Polysorbate 40 Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020776 SixNy Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- IYFATESGLOUGBX-YVNJGZBMSA-N Sorbitan monopalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O IYFATESGLOUGBX-YVNJGZBMSA-N 0.000 description 1
- HVUMOYIDDBPOLL-XWVZOOPGSA-N Sorbitan monostearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O HVUMOYIDDBPOLL-XWVZOOPGSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- IJCWFDPJFXGQBN-RYNSOKOISA-N [(2R)-2-[(2R,3R,4S)-4-hydroxy-3-octadecanoyloxyoxolan-2-yl]-2-octadecanoyloxyethyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCCCCCCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCCCCCCCCCCCC IJCWFDPJFXGQBN-RYNSOKOISA-N 0.000 description 1
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- KHPLPBHMTCTCHA-UHFFFAOYSA-N ammonium chlorate Chemical compound N.OCl(=O)=O KHPLPBHMTCTCHA-UHFFFAOYSA-N 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical class N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- SMWDFEZZVXVKRB-UHFFFAOYSA-N anhydrous quinoline Natural products N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 229920006318 anionic polymer Polymers 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- KVBCYCWRDBDGBG-UHFFFAOYSA-N azane;dihydrofluoride Chemical compound [NH4+].F.[F-] KVBCYCWRDBDGBG-UHFFFAOYSA-N 0.000 description 1
- KBKZYWOOZPIUJT-UHFFFAOYSA-N azane;hypochlorous acid Chemical compound N.ClO KBKZYWOOZPIUJT-UHFFFAOYSA-N 0.000 description 1
- ZRDJERPXCFOFCP-UHFFFAOYSA-N azane;iodic acid Chemical compound [NH4+].[O-]I(=O)=O ZRDJERPXCFOFCP-UHFFFAOYSA-N 0.000 description 1
- YUUVAZCKXDQEIS-UHFFFAOYSA-N azanium;chlorite Chemical compound [NH4+].[O-]Cl=O YUUVAZCKXDQEIS-UHFFFAOYSA-N 0.000 description 1
- URGYLQKORWLZAQ-UHFFFAOYSA-N azanium;periodate Chemical compound [NH4+].[O-]I(=O)(=O)=O URGYLQKORWLZAQ-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- LPTWEDZIPSKWDG-UHFFFAOYSA-N benzenesulfonic acid;dodecane Chemical compound OS(=O)(=O)C1=CC=CC=C1.CCCCCCCCCCCC LPTWEDZIPSKWDG-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 229920003086 cellulose ether Polymers 0.000 description 1
- 229910052798 chalcogen Inorganic materials 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- HCAJEUSONLESMK-UHFFFAOYSA-N cyclohexylsulfamic acid Chemical compound OS(=O)(=O)NC1CCCCC1 HCAJEUSONLESMK-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 125000005131 dialkylammonium group Chemical group 0.000 description 1
- LFINSDKRYHNMRB-UHFFFAOYSA-N diazanium;oxido sulfate Chemical compound [NH4+].[NH4+].[O-]OS([O-])(=O)=O LFINSDKRYHNMRB-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UCRJJNVFJGKYQT-UHFFFAOYSA-M hexadecyl(trimethyl)azanium;hydron;sulfate Chemical compound OS([O-])(=O)=O.CCCCCCCCCCCCCCCC[N+](C)(C)C UCRJJNVFJGKYQT-UHFFFAOYSA-M 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- IGMBKNUVZFAHJM-UHFFFAOYSA-I hydrogen sulfate;oxido hydrogen sulfate;tetrabutylazanium;sulfate Chemical compound OS([O-])(=O)=O.[O-]S([O-])(=O)=O.OS(=O)(=O)O[O-].OS(=O)(=O)O[O-].CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC IGMBKNUVZFAHJM-UHFFFAOYSA-I 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 1
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 1
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 1
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- CTAPFRYPJLPFDF-UHFFFAOYSA-N isoxazole Chemical compound C=1C=NOC=1 CTAPFRYPJLPFDF-UHFFFAOYSA-N 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 229940042472 mineral oil Drugs 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- LFMTUFVYMCDPGY-UHFFFAOYSA-N n,n-diethylethanamine oxide Chemical compound CC[N+]([O-])(CC)CC LFMTUFVYMCDPGY-UHFFFAOYSA-N 0.000 description 1
- DVEKCXOJTLDBFE-UHFFFAOYSA-N n-dodecyl-n,n-dimethylglycinate Chemical compound CCCCCCCCCCCC[N+](C)(C)CC([O-])=O DVEKCXOJTLDBFE-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- WLGDAKIJYPIYLR-UHFFFAOYSA-N octane-1-sulfonic acid Chemical compound CCCCCCCCS(O)(=O)=O WLGDAKIJYPIYLR-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002557 polyglycidol polymer Polymers 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 description 1
- 235000010988 polyoxyethylene sorbitan tristearate Nutrition 0.000 description 1
- 239000001816 polyoxyethylene sorbitan tristearate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 229950008882 polysorbate Drugs 0.000 description 1
- 229920000053 polysorbate 80 Polymers 0.000 description 1
- 229920006316 polyvinylpyrrolidine Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000343 potassium bisulfate Inorganic materials 0.000 description 1
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- SATVIFGJTRRDQU-UHFFFAOYSA-N potassium hypochlorite Chemical compound [K+].Cl[O-] SATVIFGJTRRDQU-UHFFFAOYSA-N 0.000 description 1
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 description 1
- 239000001230 potassium iodate Substances 0.000 description 1
- 229940093930 potassium iodate Drugs 0.000 description 1
- 235000006666 potassium iodate Nutrition 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- GNGHGFVFONSDEL-UHFFFAOYSA-N pyrazine;pyridazine Chemical compound C1=CC=NN=C1.C1=CN=CC=N1 GNGHGFVFONSDEL-UHFFFAOYSA-N 0.000 description 1
- GRJJQCWNZGRKAU-UHFFFAOYSA-N pyridin-1-ium;fluoride Chemical compound F.C1=CC=NC=C1 GRJJQCWNZGRKAU-UHFFFAOYSA-N 0.000 description 1
- ILVXOBCQQYKLDS-UHFFFAOYSA-N pyridine N-oxide Chemical compound [O-][N+]1=CC=CC=C1 ILVXOBCQQYKLDS-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 1
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- DGSDBJMBHCQYGN-UHFFFAOYSA-M sodium;2-ethylhexyl sulfate Chemical compound [Na+].CCCCC(CC)COS([O-])(=O)=O DGSDBJMBHCQYGN-UHFFFAOYSA-M 0.000 description 1
- WQQPDTLGLVLNOH-UHFFFAOYSA-M sodium;4-hydroxy-4-oxo-3-sulfobutanoate Chemical class [Na+].OC(=O)CC(C([O-])=O)S(O)(=O)=O WQQPDTLGLVLNOH-UHFFFAOYSA-M 0.000 description 1
- 239000002594 sorbent Substances 0.000 description 1
- 229940035044 sorbitan monolaurate Drugs 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 1
- 239000001570 sorbitan monopalmitate Substances 0.000 description 1
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 1
- 235000011076 sorbitan monostearate Nutrition 0.000 description 1
- 239000001587 sorbitan monostearate Substances 0.000 description 1
- 229940035048 sorbitan monostearate Drugs 0.000 description 1
- 235000011078 sorbitan tristearate Nutrition 0.000 description 1
- 239000001589 sorbitan tristearate Substances 0.000 description 1
- 229960004129 sorbitan tristearate Drugs 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229940117986 sulfobetaine Drugs 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- LUVHDTDFZLTVFM-UHFFFAOYSA-M tetramethylazanium;chlorate Chemical compound [O-]Cl(=O)=O.C[N+](C)(C)C LUVHDTDFZLTVFM-UHFFFAOYSA-M 0.000 description 1
- FDXKBUSUNHRUIZ-UHFFFAOYSA-M tetramethylazanium;chlorite Chemical compound [O-]Cl=O.C[N+](C)(C)C FDXKBUSUNHRUIZ-UHFFFAOYSA-M 0.000 description 1
- ZRVXFJFFJZFRLQ-UHFFFAOYSA-M tetramethylazanium;iodate Chemical compound [O-]I(=O)=O.C[N+](C)(C)C ZRVXFJFFJZFRLQ-UHFFFAOYSA-M 0.000 description 1
- ZCWKIFAQRXNZCH-UHFFFAOYSA-M tetramethylazanium;perchlorate Chemical compound C[N+](C)(C)C.[O-]Cl(=O)(=O)=O ZCWKIFAQRXNZCH-UHFFFAOYSA-M 0.000 description 1
- HLQAWDQQEJSALG-UHFFFAOYSA-M tetramethylazanium;periodate Chemical compound C[N+](C)(C)C.[O-]I(=O)(=O)=O HLQAWDQQEJSALG-UHFFFAOYSA-M 0.000 description 1
- DAFQZPUISLXFBF-UHFFFAOYSA-N tetraoxathiolane 5,5-dioxide Chemical compound O=S1(=O)OOOO1 DAFQZPUISLXFBF-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- NTJBWZHVSJNKAD-UHFFFAOYSA-N triethylazanium;fluoride Chemical compound [F-].CC[NH+](CC)CC NTJBWZHVSJNKAD-UHFFFAOYSA-N 0.000 description 1
- UYPYRKYUKCHHIB-UHFFFAOYSA-N trimethylamine N-oxide Chemical compound C[N+](C)(C)[O-] UYPYRKYUKCHHIB-UHFFFAOYSA-N 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates generally to methods of texturing surfaces, more particularly to texturing surfaces to decrease the reflectance and hence increase the efficiency of photovoltaic cells.
- Optoelectronic devices rely on the optical and electronic properties of materials to either produce or detect electromagnetic radiation or to generate electricity from ambient electromagnetic radiation.
- Photosensitive optoelectronic devices convert electromagnetic radiation into electricity.
- Solar cells also known as photovoltaic (PV) devices, are used to generate electrical power from ambient light.
- PV devices are used to drive power consuming loads to provide, for example, lighting, heating, or to operate electronic equipment such as computers or remote monitoring or communications equipment. These power generation applications often involve the charging of batteries or other energy storage devices so that equipment operation may continue when direct illumination from the sun or other ambient light sources is not available.
- s-Si single crystal silicon
- the surface is typically anisotropically textured using a mixture of a base (e.g., NaOH or KOH) and an alcohol (e.g., isopropanol) at greater than 60°C for approximately 30 minutes.
- the resulting surface has a square pyramidal structure due to the etching rate difference between different crystal planes of silicon ((111) « (110) ⁇ (100)). Light reflection over a broad spectral range is reduced to below 10%> and thus the conversion efficiency increases typically 3 percentage points (absolute).
- Polycrystalline (p-Si) or multicrystalline (mc-Si) silicon is much more difficult to texture effectively since many crystal planes are exposed in a single cell and the texturing appears random.
- the substrate is etched in a mixture of HF and HN0 3 at temperature less than 50°C. While the surface can be made "black” (i.e., reflectivity less than a few percent) again via surface etching, the resulting surface is so rough that the surface recombination velocity (SRV) of electrons and holes becomes so high that the resulting cells have low conversion efficiency.
- SSV surface recombination velocity
- RIE reactive ion etching
- CF 4 , C 2 F 6 and SF 6 have a global warming potential many thousands of times worse than CO 2 (Inventory of U.S. Greenhouse Gas Emissions and Sinks: 2002).
- plasma processes allow for the texturing of multi-crystalline materials without saw damage, unlike wet chemical texture methods which require surface defects to create active texturing sites.
- plasma texturing yields photovoltaic cells with similar to slightly higher conversion efficiencies than that obtained using wet acidic isotropic texturing.
- Plasma processing is also particularly appropriate for wafers produced without surface damage such as Si ribbons and epitaxial layers on low-cost Si substrates, for which no easy wet chemical texturing processes are available.
- RIE relies on ion bombardment, which creates subsurface damage.
- the damaged region must be subsequently removed by employing a damage removal etch (DRE).
- DRE damage removal etch
- the DRE increases the reflectivity of the surface, but is a necessary trade-off in voltaic device processing to minimize the surface recombination velocity.
- a method for the controlled texturing of substrates comprising immersing a microstamp and a substrate to be etched together in a bath and pressing the microstamp to the substrate.
- a method of introducing a nanometer scale surface roughness to a substrate surface comprising (i) depositing nanoparticles on the substrate surface; (ii) introducing metal induced pitting to a substrate surface; (iii) using remote plasma source (RPS) or reactive ion etching (RIE); or (iv) immersing a microstamp and a substrate to be etched together in a bath and pressing the microstamp to the substrate to etch nanometer scale features into the substrate surface.
- RPS remote plasma source
- RIE reactive ion etching
- a method for the controlled texturing of substrates comprises masking a substrate to be etched with a microstamp and using gas phase etching to etch the substrate to introduce texture thereon.
- an etchant composition comprising, consisting of, or consisting essentially of at least one alkaline component, at least one surfactant, at least one metal salt, and water is described, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
- an etchant composition comprising, consisting of, or consisting essentially of at least one amine carboxylate, at least one surfactant, at least one metal salt, and water is described, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
- a method of introducing micron-scale surface roughness to semiconductor material comprising contacting the semiconductor material with an etchant composition under conditions sufficient to rough the surface of the semiconductor material, wherein the etchant composition comprises at least one alkaline component, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
- Another aspect relates to a method of introducing a micrometer scale surface roughness to a substrate surface, said method comprising (i) using an etchant composition; or (ii) immersing a microstamp and a substrate to be etched together in a bath and pressing the microstamp to the substrate to etch micrometer scale features into the substrate surface.
- Figure 1 illustrates a schematic of the microstamping method described herein.
- Figure 2 illustrates semi-spherical scallops.
- Figure 3 illustrates a novel method of introducing secondary texturing to the surface of the photovoltaic cell substrate.
- Figure 4 is a schematic illustration of the process of metal induced pitting.
- the present invention relates generally to methods of texturing surfaces, more particularly to texturing surfaces to decrease the reflectance without substantially increasing the surface recombination velocity and hence increase the efficiency of photovoltaic cells.
- substantially devoid is defined herein as less than 2 wt. %, preferably less than 1 wt. %, more preferably less than 0.5 wt. %, and most preferably less than 0.1 wt. %. "Devoid” corresponds to 0 wt. %.
- a photovoltaic device comprises a photovoltaic cell including at least one semiconductor material.
- semiconductor denotes materials which can conduct electricity when charge carriers are induced by thermal or electromagnetic excitation.
- photosensitive optoelectronic devices have been constructed of a number of inorganic semiconductors, e.g., crystalline, polycrystalline and amorphous silicon, gallium arsenide, cadmium telluride, copper indium gallium selenide (CIGS), and others.
- the semiconductor material can be doped or undoped.
- single crystalline Si or “single crystal Si” is synonymous with the term “monocrystalline Si.”
- chalcogenide corresponds to a molecule consisting of a chalcogen ion (e.g., sulfide, selenide, telluride) and an electropositive metal.
- a "noble metal” includes ruthenium, rhodium, palladium, silver, osmium, iridium, platinum and gold. All other metals for the purpose of this description are considered non- noble metals.
- gas phase deposition includes physical vapor deposition such as evaporation, sputter deposition, electron beam deposition, etc. and chemical vapor deposition, atomic layer deposition, and variations thereof.
- an etchant composition and a method of using same to introduce micron- scale surface roughness to semiconductor material is described.
- the etchant composition can comprise, consist of, or consist essentially of at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
- the etchant composition can comprise, consist of, or consist essentially of at least one alkaline component, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
- the etchant composition can comprise, consist of, or consist essentially of at least one amine carboxylate, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
- low boiling point alcohol components correspond to straight-chained or branched Ci-Ce alcohols having boiling points less than about 90°C including, but not limited to, methanol, ethanol, isopropanol, and t-butyl alcohol.
- the etchant composition is substantially devoid of straight-chained or branched Ci-C 6 alcohol (e.g., meth-, eth-, prop-, but-, pent-, hex-) components.
- Alkaline components contemplated include alkali hydroxides, carbonates, hydrogen carbonates and quaternary ammonium hydroxides such as NaOH, KOH, RbOH, CsOH, Na 2 C0 3 , NaHC0 3 , K 2 C0 3 , KHCO 3 , CsOH, and NR 4 OH, wherein R can be the same as or different from one another and is selected from the group consisting of Ci-C 6 alkyls (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl), C 6 -Ci 0 aryl (e.g., benzyl), and combinations thereof.
- the at least one alkaline component comprises NaOH, KOH, RbOH, CsOH, or combinations thereof, even more preferably NaOH, KOH, or a combination of NaOH/KOH.
- Amine carboxylates contemplated include amine gallates and amine salicylates, wherein the amine carboxylate is generated in situ or ex situ.
- Amine gallates comprise, consist or consist essentially of at least one alkanolamines, gallic acid, water, pyrazine, optionally at least one oxidant and optionally at least one surfactant.
- Amine salicylates comprise, consist or consist essentially of at least one alkanolamines, salicylic acid, water, pyrazine, optionally at least one oxidant and optionally at least one surfactant.
- Metal salts contemplated include Group II (e.g., magnesium, calcium, strontium, barium), Group IV metals (e.g., silicon, germanium, tin, lead), copper, lanthanum, or any combination thereof, wherein the metal may be the cation or a atom of a polyatomic anion.
- Group II e.g., magnesium, calcium, strontium, barium
- Group IV metals e.g., silicon, germanium, tin, lead
- copper lanthanum, or any combination thereof, wherein the metal may be the cation or a atom of a polyatomic anion.
- metal salts contemplated include, but are not limited to, Ca(OH) 2 , Sr(OH) 2 , Ba(OH) 2 , CaO, SrO, BaO, Ca(N0 3 ) 2 , Sr(N0 3 ) 2 , Ba(N0 3 ) 2 , CuS0 4 -5H 2 0, CaS0 4 , SrS0 4 , BaS0 4 , Cu(OH) 2 , Na 2 (Ge0 3 ), Na 2 (Sn0 3 ), Na 4 (Si0 4 ), K 2 (Ge0 3 ), K ⁇ SiO ⁇ , K 2 (Sn0 3 ), LaCl 3 -7H 2 0, La 2 (S0 4 ) 3 and its hydrates, SnCl 4 -5H 2 0, and combinations thereof.
- the metal salt comprises CaOH or BaOH.
- the metal salt comprises CaO or BaO, and will undergo an in situ conversion to Ca(OH) 2 or Ba(OH) 2 , respectively.
- Surfactants contemplated include, but are not limited to, nonionic, anionic, cationic, and/or zwitterionic surfactants.
- suitable non-ionic surfactants may include fluoroalkyl surfactants, ethoxylated fluorosurfactants, polyethylene glycols, polypropylene glycols, polyethylene or polypropylene glycol ethers, dodecylbenzenesulfonic acid thereof, polyacrylate polymers, dinonylphenyl polyoxyethylene, silicone or modified silicone polymers, acetylenic diols or modified acetylenic diols, and alkylphenol polyglycidol ether, sorbitan esters (e.g., sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan tristearate, sorbitan monooleate (i.e., Span 80), sorbitan trioleate), polysorbitan acid,
- Anionic surfactants contemplated in the compositions described herein include, but are not limited to, fluorosurfactants such as ZONYL® UR and ZONYL® FS-62 (DuPont Canada Inc., Mississauga, Ontario, Canada), sodium alkyl sulfates such as sodium ethylhexyl sulfate (NIAPROOF® 08), ammonium alkyl sulfates, alkyl (Ci 0 -Ci 8 ) carboxylic acid ammonium salts, sodium sulfosuccinates and esters thereof, e.g., dioctyl sodium sulfosuccinate (DSS), alkyl (Cio-Cis) sulfonic acid sodium salts, and the di-anionic sulfonate surfactants DowFaxTM (The Dow Chemical Company, Midland, Mich., USA) such as the alkyldiphenyloxide disulfonate DowFaxTM
- Cationic surfactants contemplated include alkylammonium salts such as cetyltrimethylammonium bromide (CTAB) and cetyltrimethylammonium hydrogen sulfate.
- Suitable zwitterionic surfactants include ammonium carboxylates, ammonium sulfates, amine oxides (e.g., Dimethyldodecylamine oxide (DMAO)), N-dodecyl-N,N-dimethylbetaine, betaine, sulfobetaine, alkylammoniopropyl sulfate, and the like.
- DMAO Dimethyldodecylamine oxide
- the surfactants may include water soluble polymers including, but not limited to, polyethylene glycol (PEG), polyethylene oxide (PEO), polypropylene glycol (PPG), polyvinyl pyrrolidone (PVP), cationic polymers, nonionic polymers, anionic polymers, hydroxyethylcellulose (HEC), acrylamide polymers, poly(acrylic acid), carboxymethylcellulose (CMC), sodium carboxymethylcellulose (Na CMC), hydroxypropylmethylcellulose, polyvinylpyrrolidone K30, BIOCARETM polymers, DOWTM latex powders (DLP), ETHOCELTM ethylcellulose polymers, KYTAMERTM PC polymers, METHOCELTM cellulose ethers, POLYOXTM water soluble resins, SoftCATTM polymers, UCARETM polymers, UCONTM fluids, PPG-PEG-PPG block copolymers, PEG-PPG-PEG block copolymers, and combinations thereof.
- PEG polyethylene glyco
- the water soluble polymers may be short-chained or long-chained polymers and may be combined with the nonionic, anionic, cationic, and/or zwitterionic surfactants described herein.
- the at least one surfactant includes DSS, TRITONTM BG-10, Span 80, DMAO, or combinations thereof.
- the surfactant may include materials that are generically referred to as defoamers including, but are not limited to, silicone-oil based, mineral-oil based, natural-oil based, acetylenic- based, and phosphoric acid ester-based agents.
- the defoaming agents include, but are not limited to, ethylene oxide/propylene oxide block copolymers such as Pluronic® (BASF®) products (e.g., Pluronic® 17R2, Pluronic® 17R4, Pluronic®31Rl and Pluronic®25R2), alcohol alkoxylates such as Plurafac® products (BASF®) (e.g., Plurafac®PA20), fatty alcohol alkoxylates such as Surfonic® (Huntsmen) (e.g., Surfonic®Pl), phosphoric acid ester blends with non-ionic emulsifiers such as Defoamer M (Ortho Chemicals Australia Pty. Ltd.), and Super Defoamer 225 (Varn Products), and combinations thereof.
- Pluronic® BASF® products
- Pluronic® 17R2, Pluronic® 17R4, Pluronic®31Rl and Pluronic®25R2 Pluronic®
- each component in the etchant composition of the first aspect comprising, consisting of, or consisting essentially of at least one alkaline component, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components, based on the total weight of the composition, is: [0036]
- the amounts of each component in the etchant composition of the first aspect comprising, consisting of, or consisting essentially of at least one amine carboxylate, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components, based on the total weight of the composition, is:
- compositions of the first aspect described herein have pH greater than about 12, more preferably greater than about 13. It is to be appreciated that the pH of the composition of the first aspect described herein may be greater than 14, depending on the components used and the amount thereof.
- compositions of the first aspect further include semiconductor material, wherein the semiconductor material may comprise silicon, gallium arsenide, cadmium telluride, or copper indium gallium selenide (CIGS).
- the composition of the first aspect may include at least one alkaline component, at least one surfactant, at least one metal salt, semiconductor material, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components, wherein the semiconductor material comprises silicon, gallium arsenide, cadmium telluride, or copper indium gallium selenide (CIGS).
- the composition of the first aspect may include at least one amine carboxylate, at least one surfactant, at least one metal salt, semiconductor material, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components, wherein the semiconductor material comprises silicon, gallium arsenide, cadmium telluride, or copper indium gallium selenide (CIGS).
- the semiconductor material may be dissolved and/or suspended in the etchant composition.
- the method of using the etchant composition to introduce micron-scale surface roughness to semiconductor material comprises contacting the semiconductor material with the etchant composition under conditions sufficient to etch the surface of the semiconductor material.
- the roughness introduced is micron-scale surface roughness, wherein the pyramids etched into the surface have a lateral measurement of about 2 to about 10 microns, with good coverage of the pyramids across the surface.
- good coverage corresponds to roughening of at least 90% of the surface of the semiconductor material, preferably at least 95%, and most preferably at least 99% of the surface of the semiconductor material is roughened.
- the pyramids etched in the surface of the substrate can be the same size or a different size relative to other pyramids on the surface.
- the etchant compositions of the first aspect can be applied in any suitable manner to the semiconductor substrate to be roughened, e.g., by spraying the etchant composition on the surface, by dipping (in a volume of the etchant composition) of the substrate, by contacting the substrate with another material, e.g., a pad, or fibrous sorbent applicator element, that is saturated with the etchant composition, by contacting the substrate with a circulating etchant composition, or by any other suitable means, manner or technique, by which the etchant composition is brought into contact with the semiconductor substrate to be roughened.
- the back surface of the substrate can be masked to avoid exposure to the etchant composition.
- the compositions of the first aspect for roughening semiconductor material typically are contacted with the substrate for a time of from about 10 sec to about 120 minutes, at temperature in a range of from about 20 C to about 200 C, preferably about 70 C to about 100 C, even more preferably about 80 C to about 90 C.
- Such contacting times and temperatures are illustrative, and any other suitable time and temperature conditions may be employed that are efficacious to roughen the semiconductor material.
- the etchant composition may be removed from the device to which it has previously been applied by rinsing.
- the rinse solution for the composition of the first aspect includes deionized water.
- the roughened semiconductor material may be dried using nitrogen or a spin-dry cycle.
- a novel method for the controlled texturing of semiconductor materials wherein a microstamp with the optimum surface structure is manufactured.
- the microstamp may be a mirror inverse of the optimum surface structure, an anode with features to enhance etching in specific places, and/or a mask with features to ensure that certain parts of the surface are etched while others are not.
- the microstamp may be made out of a variety of materials including, but not limited to, metals, ceramics, glasses and plastics/polymers and may be made using any process such as micromachining, photolithography, embossing, etc.
- the semiconductor material substrate to be etched and the microstamp are immersed in a bath and pressed together.
- the microstamp may be of any size, covering only a fraction of the substrate at any one time or large enough to cover multiple substrates.
- the stamp and the substrate may be alternately pressed and removed a number of times to ensure adequate fluid transfer.
- the microstamp may be slightly flexible to minimize substrate breakage.
- a potential may be placed on the upper and lower surfaces to enhance the etching rate.
- trenches for metal lines may be etched simultaneously with the texturing of the surface, eliminating the need, cost and time for laser scribing, although laser scribing the trenches is still contemplated herein. It should be appreciated by one skilled in the art that any combination of the embodiments is contemplated herein.
- the microstamp includes a regular or irregular array of shapes thereon including, but not limited to: polyhedra such as cubes, tetrahedrons, octahedrons, dodecahedron, icosahedron; prisms such as triangular prisms, cuboids, rectangular prisms, pentagonal prisms, hexagonal prisms, octagonal prisms; pyramids such as triangularly shaped pyramids, square shaped pyramids and pentagonal shaped pyramids; hemispherical; other spherical-based shapes; and ellipsoidal-based shapes.
- the regular or irregular array can include any number of different shapes of various sizes having various levels of symmetry.
- the microstamp when the microstamp includes etchant holes, the microstamp comprises a hydrophilic surface to minimize surface tension issues at the etchant holes.
- the etchant holes may be any size so long as the integrity of the microstamp is not compromised. If necessary, the bath may be forced through smaller etchant holes using backside pressure.
- the etching rate of the substrate should be highest where the pressure is highest; the microstamp may break through any residual surface oxide and thus increase the etching rate; the pressure may induce amorphism in the substrate which can then act as an etch stop; and/or the microstamp may act as a removable "mask” limiting where the etching chemistry may attack the substrate.
- the mechanism will depend on the choice of specific chemistry used (e.g., acidic, basic, additives/surfactants, etc.), the time, the temperature and/or the pressure, etc.
- the substrate surface is preferably rinsed to remove the etchant as well as any reaction products.
- the stamp may be reused multiple times. In one embodiment, it may be advantageous to use multiple stamps to impart an increasingly rough texture to the substrate surface.
- the etching chemistry may be altered during each of these process steps to optimize photovoltaic cell performance. Additional process step(s), chemical additives, and/or process chemistries may be added to minimize the surface recombination velocity.
- the method of the second aspect allows for a reproducible surface structure with optimized texture.
- the texture may be a variety of sizes from the micron-scale to the nanoscale to a mixture of sizes between the micron-scale and nanoscale.
- the semiconductor material is microscale roughened using the composition and method of the first aspect, as described herein, and thereafter, nanoscale surface roughening is achieved using the method of the second aspect (i.e., the microstamp).
- the semiconductor material is microscale roughened method of the second aspect (i.e., using a microscale microstamp), and thereafter nanoscale surface roughening is achieved using the method of the second aspect (i.e., using a nanoscale microstamp).
- a microscale microstamp i.e., using a microscale microstamp
- nanoscale surface roughening is achieved using the method of the second aspect (i.e., using a nanoscale microstamp).
- an anisotropic etch or an isotropic etch may be used with the microstamp.
- polycrystalline silicon it is expected that an isotropic etch will be most advantageous since multiple crystal planes are exposed.
- anisotropic etches include (i) a mixture of a base (e.g., NaOH and KOH) and optionally an alcohol (e.g., isopropanol); (ii) ethylenediamine and pyrocatechol with or without water; (iii) aqueous hydrazine; (iv) amine gallates (e.g., an alkanolamines with gallic acid, water, pyrazine, optionally oxidants and optionally surfactants); and (v) the etchant composition of the first aspect.
- the most commonly used wet isotropic etchant is a solution of nitric acid, hydrofluoric acid, and optionally acetic acid.
- etching occurs preferentially at defects, therefore, when saw damage is present, etching (and therefore texturing) occurs independent of the crystal orientation.
- the microstamp may either enhance or inhibit the etching rate, thus imparting a specific surface texture.
- etching steps to minimize saw damage may not be required, thus simplifying the overall cell fabrication process.
- Acidic isotropic etches result in lower reflection than traditional anisotropic etches on p-Si or mc-Si, and thus better cell conversion efficiency.
- wafers After acidic texturing, wafers must be immersed in a dilute NaOH or KOH solution to remove a thin porous silicon layer that is formed during the texturing step. This is followed by a neutralization step to remove all Na + or K + ions from the surface before emitter diffusion.
- this wet texture process is effective at yielding higher conversion efficiencies, it is multi-step, chemically intensive, and tends to generate significant waste.
- This process may be simplified by using an oxidant along with an acid fluoride, instead of the immersion in the dilute NaOH or KOH solution, to oxidize the freshly etched silicon surface and avoid generating a porous silicon layer. Avoiding the caustic etchants (i.e., NaOH and KOH) eliminates the need for a neutralization step.
- a viscous alkaline silicon etch paste may be squeezed between the microstamp and the silicon surface, e.g., as described in U.S. Patent Application Publication No. 2005/0247674 in the name of Kukelbeck et al. and entitled “Etching Pastes for Silicon Surfaces and Layers,” which is incorporated by reference herein in its entirety.
- Oxidants contemplated herein include, but are not limited to, methanesulfonic acid (MSA), ozone, bubbled air, ethanesulfonic acid, benzenesulfonic acid, 2-hydroxyethanesulfonic acid, cyclohexylaminosulfonic acid, n-propanesulfonic acid, n-butanesulfonic acid, or n-octanesulfonic acid, hydrogen peroxide (H 2 0 2 ), FeCl 3 (both hydrated and unhydrated), oxone (2KHSO 5 KHSO 4 K 2 SO 4 ), ammonium polyatomic salts (e.g., ammonium peroxomonosulfate, ammonium chlorite (NH 4 CIO 2 ), ammonium chlorate (NH 4 CIO 3 ), ammonium iodate (NH 4 IO 3 ), ammonium perborate (NH 4 BO 3 ), ammonium perchlorate (NH
- Acid fluorides contemplated herein include, but are not limited to, hydrogen fluoride (HF); ammonium fluoride (NH F); tetraalkylammonium fluoride (NR F); alkyl hydrogen fluoride (NRH 3 F); ammonium hydrogen bifluoride (NH 5 F 2 ); dialkylammonium hydrogen fluoride (NR 2 H 2 F); trialkylammonium hydrogen fluoride (NR 3 HF); trialkylammonium trihydrogen fluoride (NR 3 :3HF); anhydrous hydrogen fluoride pyridine complex; anhydrous hydrogen fluoride triethylamine complex; amine hydrogen fluoride complexes; and combinations thereof, where R may be the same as or different from one another and is selected from the group consisting of straight-chained or branched Ci-C 6 alkyl groups (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl) and where the amine includes
- Anionic, cationic, non-ionic and zwitterionic surface active agents may also be employed to minimize surface reflectance by controlling surface tension.
- a textured surface may be represented by semi-spherical scallops where D and h denote the width and depth of the texture, respectively, and r is the radius of a sphere (see, e.g., Figure 2).
- the width of the surface texture is determined primarily by the surface tension of the liquid while the texture depth is determined by the etching chemistry/rate/time.
- the relationship between D, h and r is:
- the nonionic surfactant may be an ethoxylated fluorosurfactant such as ZONYL® FSO-100 fluorosurfactant (DuPont Canada Inc., Mississauga, Ontario, Canada).
- surfactants/de foaming agents may be added to the bath, wherein the surfactants/defoaming agents have different "bubble generation” (i.e., "foaming") characteristics to tune the reflectance of the textured surface.
- the bubbles play a role similar to the microstamp in that they control where etching takes place.
- Pluronic 25R2 a non-ionic, non-fluorinated -PEG/PPG/PEG polymer
- DDBSA anionic- dodecylbenzene sulfonic acid, sodium salt
- Intermediate-sized bubbles should be formed from Dowfax 3B2 (anionic - alkyldiphenyloxide disulfonate sodium salt). These materials may be employed either individually or in combination with each other and the microstamping technique to yield multi-scale or fractal surfaces.
- the microstamp may be made out of a conductive material (e.g., metal) or coated with a conductive material and an electrochemical process initiated between the stamp and the substrate.
- the stamp need not touch the substrate.
- the bath may be either alkaline or acidic; additives such as surfactants and foaming agents may also be used.
- the stamp may be used as a contact etch mask thus limiting areas in which etching may take place.
- the etch rate may be enhanced using photons either through the stamp (using an optically transparent yet conductive material or a coating with these properties (e.g., indium tin oxide)) and/or through the silicon substrate.
- a similar microstamp may be used in gas phase etching.
- XeF 2 can be used as a plasma-less, isotropic, vapor-phase texturing etchant. XeF 2 etches silicon rapidly ( ⁇ 2 ⁇ / ⁇ ) with a high selectivity over S1O 2 , SiN, Al and photoresist (>1000:1), thus any of these materials may be used as a mask to protect the back-side of the wafer during the texturing process (if necessary).
- XeF 2 has not been listed as a greenhouse gas and thus could potentially eliminate the use of well known greenhouse gases from plasma/vapor phase texturing processes, as well as the surface damage caused by RIE plasma processes. This potentially eliminates any subsequent wet-chemical etching steps.
- Alternative gases for use in gas phase etching include, but are not limited to, F 2 , HF and C1F 3 .
- a photoablative process can be used, wherein the substrate surface is covered with a discrete array of masking material, such as metal and/or particles, and thereafter an excimer laser is used to ablate the exposed silicon.
- the method of the second aspect is not limited to texturing of silicon photovoltaic cells and may be applied to not only other photovoltaic materials (e.g., GaAs, CdTe, CIGS, etc.), but to a wide variety of substrates in many fields including optics, controlled surface hydrophobicity/hydrophilicity, etc.
- photovoltaic materials e.g., GaAs, CdTe, CIGS, etc.
- a method of introducing a micron scale and a nanometer scale surface roughness to the surface of a photovoltaic cell substrate is described. More specifically, the method of the third aspect relates to the deposition of nanoparticles or the introduction of metal induced pitting to a micron scale roughened substrate surface.
- wet-based formulations proposed here can be applied to other wet- processes in the solar cell production, such as Saw Damage Removal (SDR), Phosphorous Silicate Glass (PSG) removal, Edge Isolation and Si x N y removal.
- SDR Saw Damage Removal
- PSG Phosphorous Silicate Glass
- Edge Isolation Si x N y removal.
- a silicon- containing substrate e.g., monocrystalline or polycrystalline/multicrystalline
- the method of etching depends on the nature of the silicon-containing substrate, wherein KOH/NaOH and optionally isopropanol is conventionally used to anisotropically etch a monocrystalline Si substrate while a mixture of nitric acid and HF and optionally acetic acid is conventionally used to isotropically etch a multicrystalline Si substrate.
- Other etchants include carbonate, bicarbonate, or hydrazine and optionally at least one alcohol or at least one surfactant.
- the micron-scale roughness is introduced using the composition and method of the first aspect, as described herein.
- the substrate having the micron-scale texture then undergoes nanoscale texturing, wherein (i) nanoparticles are deposited thereon; or (ii) metal induced pitting (MIP) is initiated.
- MIP metal induced pitting
- the metals or nanoparticles may be optionally removed.
- the textured substrate can be subsequently used to build a solar cell.
- the micron- scale textured substrate of the second aspect is subjected to nanoscale texturing wherein (i) nanoparticles are deposited thereon; or (ii) metal induced pitting (MIP) is initiated.
- the metals or nanoparticles may be optionally removed.
- the textured substrate of the alternative embodiment can be subsequently used to build a solar cell.
- the nanoparticles can be deposited in situ or ex situ using solution-based or gas phase deposition methods, as readily understood by one skilled in the art.
- a ceramic or metal doped ceramic nanoparticle such as Ti0 2 can be deposited for a photoassist process, wherein UV light can activate etching in the vicinity of the particle.
- Metal induced pitting involves the immersion of the micron-scale textured substrate in a solution including a metal salt and a silicon oxide based etchant such as an acid fluoride or KOH.
- the metal salt can include copper (II), gold (I), silver (I), Pt(II), Pd (II), and combinations thereof.
- MIP results in the formation of craters on the surface of the micron-scale textured surface, hence introducing a secondary structure.
- the inventors speculate that p-type doped silicon is more prone to MIP than n-type doped silicon.
- FIG. 4 An example of metal induced pitting is shown in Figure 4 wherein nucleation at the silicon surface leads to the formation of a metal particle (based on the metal salt used) and the formation of silicon oxide in the silicon proximate to the metal particle. Thereafter, a fluoride salt may be introduced wherein the silicon oxide dissolves and the metal particle is released/oxidized, leaving behind a pit.
- a fluoride salt may be introduced wherein the silicon oxide dissolves and the metal particle is released/oxidized, leaving behind a pit.
- the method of the third aspect is a simple two-step process that requires only inexpensive, commodity chemicals.
- remote plasma source or reactive ion etching (RIE), i.e., dry etching processes
- RIE reactive ion etching
- the RPS or RIE etching can be a one-step texturing process and the resulting textured substrate can be subsequently used to build the solar cell.
- the RPS or RIE etching may be a two step process wherein the first etch introduces a primary roughness while the second etch introduces a secondary roughness.
- the first etch can be a wet or dry etch while the second etch is a dry etch.
- the primary roughness may be a micron-scale texture introduced using the composition and method of the first aspect while the secondary roughness may correspond to nanoscale roughness.
- the technique used in the first step can be the same as or different from the technique used in the second step.
- the textured substrate of the second aspect is subjected to a RPS or RIE etch to introduce nanoscale features according to the fourth aspect and the resulting textured substrate can be subsequently used to build the solar cell.
- the method of the fourth aspect is a one-sided process and does not require the presence of a defect for isotropic etching.
- a fifth aspect another method of introducing a micron scale and a nanometer scale surface roughness to the surface of a photovoltaic cell substrate is described. More specifically, the method of the fifth aspect relates to the deposition of nanoparticles on a micron scale roughened substrate surface.
- the method of introducing texture to the substrate according to the fifth aspect includes the etching of a silicon-containing substrate (e.g., monocrystalline or polycrystalline/multicrystalline) to form a micron-scale roughened substrate surface.
- a silicon-containing substrate e.g., monocrystalline or polycrystalline/multicrystalline
- the method of etching depends on the nature of the silicon-containing substrate, wherein KOH and optionally isopropanol is conventionally used to anisotropically etch a monocrystalline Si substrate while a mixture of nitric acid and HF and optionally acetic acid is conventionally used to isotropically etch a multicrystalline Si substrate.
- the micron-scale texture is obtained using the composition and method of the first aspect described herein, according to the second aspect described herein, or using the RPS or RIE etch of the fourth aspect described herein.
- Metal nanoparticles are then deposited on the substrate having the micron-scale texture, wherein (i) noble metal nanoparticles are deposited thereon using spin-on coating instead of gas phase deposition; or (ii) non-noble metal nanoparticles are deposited using solution-based deposition processes or gas phase deposition. Nanoscale roughness is achieved using metal-induced catalysis using a HF/H2O2 or an alternative composition in the presence of the deposited metal or some other metal catalyst present in the HF/H2O2 or alternative composition.
- the catalysis may be photoinduced, as readily understood by one skilled in the art.
- the metal nanoparticles can be removed to yield the textured substrate, which can be subsequently used to build a solar cell.
- the "alternative composition” may be any solution disclosed in International Patent Application No. PCT/US06/60696 filed November 9, 2006 entitled “Composition and Method for Recycling Semiconductor Wafers Having Low-k Dielectric Materials Thereon,” International Patent Application No. PCT/US08/58878 filed March 31, 2008 entitled “Methods for Stripping Material for Wafer Reclamation," International Patent Application No.
- PCT/US08/66906 filed June 13, 2008 entitled “Wafer Reclamation Compositions and Methods," and International Patent Application No. PCT/US09/59199 filed October 1, 2009 entitled “Use of Surfactant/Defoamer Mixtures for Enhances Metals Loading and Surface Passivation of Silicon Substrates,” which are all hereby incorporated by reference herein in their entireties.
- the surface structure and surface/interface chemistry must be such that the surface recombination velocity is not substantially increased.
- Losses in solar cell efficiency come primarily from four areas - reflectance losses which can be addressed by a texturing process, thermodynamic efficiency which is a result of the semiconductor band gap, resistive electrical losses which arise from the material and interface properties, and recombination losses.
- Recombination loss occurs when the photo-generated electron-hole pairs combine with other carriers before they can migrate and be collected at the cell's p-n junction.
- a portion of minority carriers tend to migrate towards the surface so by manipulating the surface potential, the minority carriers can be repulsed or attracted which directly affects the rate of recombination at the surface of the semiconductor.
Abstract
Novel methods for the texturing of photovoltaic cells is described, wherein texturing minimizes reflectance losses and hence increases solar cell efficiency. In one aspect, a microstamp with the mirror inverse of the optimum surface structure is described. The photovoltaic cell substrate to be etched and the microstamp are immersed in a bath and pressed together to yield the optimum surface structure. In another aspect, nanoscale structures are introduced to the surface of a photovoltaic cell by depositing nanoparticles or introducing metal induced pitting to a substrate surface. In still another aspect, remote plasma source (RPS) or reactive ion etching (RIE), is used to etch nanoscale features into a silicon-containing substrate.
Description
METHODS OF TEXTURING SURFACES FOR CONTROLLED REFLECTION
FIELD
[0001] The present invention relates generally to methods of texturing surfaces, more particularly to texturing surfaces to decrease the reflectance and hence increase the efficiency of photovoltaic cells.
DESCRIPTION OF THE RELATED ART
[0002] Optoelectronic devices rely on the optical and electronic properties of materials to either produce or detect electromagnetic radiation or to generate electricity from ambient electromagnetic radiation. Photosensitive optoelectronic devices convert electromagnetic radiation into electricity. Solar cells, also known as photovoltaic (PV) devices, are used to generate electrical power from ambient light. PV devices are used to drive power consuming loads to provide, for example, lighting, heating, or to operate electronic equipment such as computers or remote monitoring or communications equipment. These power generation applications often involve the charging of batteries or other energy storage devices so that equipment operation may continue when direct illumination from the sun or other ambient light sources is not available.
[0003] Solar cells are characterized by the efficiency with which they can convert incident solar power to useful electric power. Devices utilizing crystalline silicon dominate commercial applications, and some have achieved efficiencies of 23% or greater. However, efficient single crystal silicon-based devices, especially of large surface area, are difficult and expensive to produce due to the problems inherent in producing large crystals without significant efficiency-degrading defects.
[0004] Control of light scattering in photovoltaic cells can increase performance dramatically. For example, single crystal silicon (s-Si) reflects approximately 35% of incident visible light. The surface is typically anisotropically textured using a mixture of a base (e.g., NaOH or KOH) and an alcohol (e.g., isopropanol) at greater than 60°C for approximately 30 minutes. The resulting surface has a square pyramidal structure due to the etching rate difference between different crystal planes of silicon ((111) « (110) < (100)). Light reflection over a broad spectral range is reduced to below 10%> and thus the conversion efficiency increases typically 3 percentage points (absolute).
[0005] Polycrystalline (p-Si) or multicrystalline (mc-Si) silicon (either sliced from a boule, grown in a ribbon, or deposited on a substrate) is much more difficult to texture effectively since many crystal planes are exposed in a single cell and the texturing appears random. Typically, the substrate is etched in a mixture of HF and HN03 at temperature less than 50°C. While the surface can be made "black" (i.e., reflectivity less than a few percent) again via surface etching, the resulting surface is so rough that the surface recombination velocity (SRV) of electrons and holes becomes so high that the
resulting cells have low conversion efficiency. These "black" surfaces may be chemically etched to remove some roughness and therefore improve the electrical properties, but this leads to increased reflectivity. Moreover, since each p-Si substrate has a different mix of exposed silicon planes, it is difficult to achieve reproducible high volume manufacturing. Accordingly, some p-Si photovoltaic cells are manufactured without any surface texturing.
[0006] An alternative to wet chemical processing is plasma processing based on reactive ion etching (RIE) which has the advantage of safer handling, less waste disposal, reduced use of deionized water and single sided etching. That said, plasma processes do entail additional cost and complexity due to the need for vacuum systems. Furthermore, common plasma etching gases such as CF4, C2F6 and SF6 have a global warming potential many thousands of times worse than CO2 (Inventory of U.S. Greenhouse Gas Emissions and Sinks: 2002). Nevertheless, plasma processes allow for the texturing of multi-crystalline materials without saw damage, unlike wet chemical texture methods which require surface defects to create active texturing sites. In fact, plasma texturing yields photovoltaic cells with similar to slightly higher conversion efficiencies than that obtained using wet acidic isotropic texturing. Plasma processing is also particularly appropriate for wafers produced without surface damage such as Si ribbons and epitaxial layers on low-cost Si substrates, for which no easy wet chemical texturing processes are available. Disadvantageously, RIE relies on ion bombardment, which creates subsurface damage. The damaged region must be subsequently removed by employing a damage removal etch (DRE). As expected, the DRE increases the reflectivity of the surface, but is a necessary trade-off in voltaic device processing to minimize the surface recombination velocity.
SUMMARY
[0007] In one aspect, a method for the controlled texturing of substrates is described, said method comprising immersing a microstamp and a substrate to be etched together in a bath and pressing the microstamp to the substrate.
[0008] In another aspect, a method of introducing a nanometer scale surface roughness to a substrate surface, said method comprising (i) depositing nanoparticles on the substrate surface; (ii) introducing metal induced pitting to a substrate surface; (iii) using remote plasma source (RPS) or reactive ion etching (RIE); or (iv) immersing a microstamp and a substrate to be etched together in a bath and pressing the microstamp to the substrate to etch nanometer scale features into the substrate surface.
[0009] In still another aspect, a method for the controlled texturing of substrates is described, wherein said method comprises masking a substrate to be etched with a microstamp and using gas phase etching to etch the substrate to introduce texture thereon.
[0010] In yet another aspect, an etchant composition comprising, consisting of, or consisting essentially of at least one alkaline component, at least one surfactant, at least one metal salt, and water
is described, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
[0011] In another aspect, an etchant composition comprising, consisting of, or consisting essentially of at least one amine carboxylate, at least one surfactant, at least one metal salt, and water is described, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
[0012] In still another aspect, a method of introducing micron-scale surface roughness to semiconductor material, said method comprising contacting the semiconductor material with an etchant composition under conditions sufficient to rough the surface of the semiconductor material, wherein the etchant composition comprises at least one alkaline component, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
[0013] Another aspect relates to a method of introducing a micrometer scale surface roughness to a substrate surface, said method comprising (i) using an etchant composition; or (ii) immersing a microstamp and a substrate to be etched together in a bath and pressing the microstamp to the substrate to etch micrometer scale features into the substrate surface.
[0014] Other aspects, features and advantages will be more fully apparent from the ensuing disclosure and appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 illustrates a schematic of the microstamping method described herein.
[0016] Figure 2 illustrates semi-spherical scallops.
[0017] Figure 3 illustrates a novel method of introducing secondary texturing to the surface of the photovoltaic cell substrate.
[0018] Figure 4 is a schematic illustration of the process of metal induced pitting.
DETAILED DESCRIPTION AND PREFERRED EMBODIMENTS THEREOF
[0019] The present invention relates generally to methods of texturing surfaces, more particularly to texturing surfaces to decrease the reflectance without substantially increasing the surface recombination velocity and hence increase the efficiency of photovoltaic cells.
[0020] "Substantially devoid" is defined herein as less than 2 wt. %, preferably less than 1 wt. %, more preferably less than 0.5 wt. %, and most preferably less than 0.1 wt. %. "Devoid" corresponds to 0 wt. %.
[0021] As used herein, "about" is intended to correspond to ± 5 % of the stated value.
[0022] As defined herein, a "photovoltaic device" comprises a photovoltaic cell including at least one semiconductor material.
[0023] Herein the term "semiconductor" denotes materials which can conduct electricity when charge carriers are induced by thermal or electromagnetic excitation. Traditionally, photosensitive optoelectronic devices have been constructed of a number of inorganic semiconductors, e.g., crystalline, polycrystalline and amorphous silicon, gallium arsenide, cadmium telluride, copper indium gallium selenide (CIGS), and others. The semiconductor material can be doped or undoped.
[0024] It should be appreciated that the term "single crystalline Si" or "single crystal Si" is synonymous with the term "monocrystalline Si."
[0025] It should be appreciated that the term "polycrystalline Si" is synonymous with the term "multicrystalline Si."
[0026] As defined herein, a "chalcogenide" corresponds to a molecule consisting of a chalcogen ion (e.g., sulfide, selenide, telluride) and an electropositive metal.
[0027] As used herein, a "noble metal" includes ruthenium, rhodium, palladium, silver, osmium, iridium, platinum and gold. All other metals for the purpose of this description are considered non- noble metals.
[0028] As used herein, "gas phase deposition" includes physical vapor deposition such as evaporation, sputter deposition, electron beam deposition, etc. and chemical vapor deposition, atomic layer deposition, and variations thereof.
[0029] In a first aspect, an etchant composition and a method of using same to introduce micron- scale surface roughness to semiconductor material is described. The etchant composition can comprise, consist of, or consist essentially of at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components. In one embodiment, the etchant composition can comprise, consist of, or consist essentially of at least one alkaline component, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components. In another embodiment, the etchant composition can comprise, consist of, or consist essentially of at least one amine carboxylate, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components. As defined herein, "low boiling point alcohol components" correspond to straight-chained or branched Ci-Ce alcohols having boiling points less than about 90°C including, but not limited to, methanol, ethanol, isopropanol, and t-butyl alcohol. In another embodiment, the etchant composition is substantially devoid of straight-chained or branched Ci-C6 alcohol (e.g., meth-, eth-, prop-, but-, pent-, hex-) components.
[0030] Alkaline components contemplated include alkali hydroxides, carbonates, hydrogen carbonates and quaternary ammonium hydroxides such as NaOH, KOH, RbOH, CsOH, Na2C03,
NaHC03, K2C03, KHCO3, CsOH, and NR4OH, wherein R can be the same as or different from one another and is selected from the group consisting of Ci-C6 alkyls (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl), C6-Ci0 aryl (e.g., benzyl), and combinations thereof. Preferably, the at least one alkaline component comprises NaOH, KOH, RbOH, CsOH, or combinations thereof, even more preferably NaOH, KOH, or a combination of NaOH/KOH.
[0031] Amine carboxylates contemplated include amine gallates and amine salicylates, wherein the amine carboxylate is generated in situ or ex situ. Amine gallates comprise, consist or consist essentially of at least one alkanolamines, gallic acid, water, pyrazine, optionally at least one oxidant and optionally at least one surfactant. Amine salicylates comprise, consist or consist essentially of at least one alkanolamines, salicylic acid, water, pyrazine, optionally at least one oxidant and optionally at least one surfactant.
[0032] Metal salts contemplated include Group II (e.g., magnesium, calcium, strontium, barium), Group IV metals (e.g., silicon, germanium, tin, lead), copper, lanthanum, or any combination thereof, wherein the metal may be the cation or a atom of a polyatomic anion. For example, metal salts contemplated include, but are not limited to, Ca(OH)2, Sr(OH)2, Ba(OH)2, CaO, SrO, BaO, Ca(N03)2, Sr(N03)2, Ba(N03)2, CuS04-5H20, CaS04, SrS04, BaS04, Cu(OH)2, Na2(Ge03), Na2(Sn03), Na4(Si04), K2(Ge03), K^SiO^, K2(Sn03), LaCl3-7H20, La2(S04)3 and its hydrates, SnCl4-5H20, and combinations thereof. Preferably, the metal salt comprises CaOH or BaOH. Alternatively, the metal salt comprises CaO or BaO, and will undergo an in situ conversion to Ca(OH)2 or Ba(OH)2, respectively.
[0033] Surfactants contemplated include, but are not limited to, nonionic, anionic, cationic, and/or zwitterionic surfactants. For example, suitable non-ionic surfactants may include fluoroalkyl surfactants, ethoxylated fluorosurfactants, polyethylene glycols, polypropylene glycols, polyethylene or polypropylene glycol ethers, dodecylbenzenesulfonic acid thereof, polyacrylate polymers, dinonylphenyl polyoxyethylene, silicone or modified silicone polymers, acetylenic diols or modified acetylenic diols, and alkylphenol polyglycidol ether, sorbitan esters (e.g., sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan tristearate, sorbitan monooleate (i.e., Span 80), sorbitan trioleate), polysorbate surfactants (e.g., polyoxyethylene (20) sorbitan monolaurate, polyoxyethylene (20) sorbitan monopalmitate, polyoxyethylene (20) sorbitan monostearate, polyoxyethylene (20) sorbitan monooleate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate), alkyl polyglucosides (e.g., TRITON™ BG-10) as well as combinations comprising at least one of the foregoing. Anionic surfactants contemplated in the compositions described herein include, but are not limited to, fluorosurfactants such as ZONYL® UR and ZONYL® FS-62 (DuPont Canada Inc., Mississauga, Ontario, Canada), sodium alkyl sulfates such as sodium ethylhexyl sulfate (NIAPROOF® 08), ammonium alkyl sulfates, alkyl (Ci0-Ci8) carboxylic acid ammonium salts, sodium sulfosuccinates and esters thereof, e.g., dioctyl sodium sulfosuccinate
(DSS), alkyl (Cio-Cis) sulfonic acid sodium salts, and the di-anionic sulfonate surfactants DowFax™ (The Dow Chemical Company, Midland, Mich., USA) such as the alkyldiphenyloxide disulfonate DowFax™3B2. Cationic surfactants contemplated include alkylammonium salts such as cetyltrimethylammonium bromide (CTAB) and cetyltrimethylammonium hydrogen sulfate. Suitable zwitterionic surfactants include ammonium carboxylates, ammonium sulfates, amine oxides (e.g., Dimethyldodecylamine oxide (DMAO)), N-dodecyl-N,N-dimethylbetaine, betaine, sulfobetaine, alkylammoniopropyl sulfate, and the like. Alternatively, the surfactants may include water soluble polymers including, but not limited to, polyethylene glycol (PEG), polyethylene oxide (PEO), polypropylene glycol (PPG), polyvinyl pyrrolidone (PVP), cationic polymers, nonionic polymers, anionic polymers, hydroxyethylcellulose (HEC), acrylamide polymers, poly(acrylic acid), carboxymethylcellulose (CMC), sodium carboxymethylcellulose (Na CMC), hydroxypropylmethylcellulose, polyvinylpyrrolidone K30, BIOCARE™ polymers, DOW™ latex powders (DLP), ETHOCEL™ ethylcellulose polymers, KYTAMER™ PC polymers, METHOCEL™ cellulose ethers, POLYOX™ water soluble resins, SoftCAT™ polymers, UCARE™ polymers, UCON™ fluids, PPG-PEG-PPG block copolymers, PEG-PPG-PEG block copolymers, and combinations thereof. The water soluble polymers may be short-chained or long-chained polymers and may be combined with the nonionic, anionic, cationic, and/or zwitterionic surfactants described herein. Preferably, the at least one surfactant includes DSS, TRITON™ BG-10, Span 80, DMAO, or combinations thereof.
[0034] Optionally, the surfactant may include materials that are generically referred to as defoamers including, but are not limited to, silicone-oil based, mineral-oil based, natural-oil based, acetylenic- based, and phosphoric acid ester-based agents. More preferably, the defoaming agents include, but are not limited to, ethylene oxide/propylene oxide block copolymers such as Pluronic® (BASF®) products (e.g., Pluronic® 17R2, Pluronic® 17R4, Pluronic®31Rl and Pluronic®25R2), alcohol alkoxylates such as Plurafac® products (BASF®) (e.g., Plurafac®PA20), fatty alcohol alkoxylates such as Surfonic® (Huntsmen) (e.g., Surfonic®Pl), phosphoric acid ester blends with non-ionic emulsifiers such as Defoamer M (Ortho Chemicals Australia Pty. Ltd.), and Super Defoamer 225 (Varn Products), and combinations thereof.
[0035] The amounts of each component in the etchant composition of the first aspect comprising, consisting of, or consisting essentially of at least one alkaline component, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components, based on the total weight of the composition, is:
[0036] The amounts of each component in the etchant composition of the first aspect comprising, consisting of, or consisting essentially of at least one amine carboxylate, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components, based on the total weight of the composition, is:
[0037] The compositions of the first aspect described herein have pH greater than about 12, more preferably greater than about 13. It is to be appreciated that the pH of the composition of the first aspect described herein may be greater than 14, depending on the components used and the amount thereof.
[0038] In another embodiment, the aforementioned compositions of the first aspect further include semiconductor material, wherein the semiconductor material may comprise silicon, gallium arsenide, cadmium telluride, or copper indium gallium selenide (CIGS). For example, the composition of the first aspect may include at least one alkaline component, at least one surfactant, at least one metal salt, semiconductor material, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components, wherein the semiconductor material comprises silicon, gallium arsenide, cadmium telluride, or copper indium gallium selenide (CIGS). Alternatively, the composition of the first aspect may include at least one amine carboxylate, at least one surfactant, at least one metal salt, semiconductor material, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components, wherein the semiconductor material comprises silicon, gallium arsenide, cadmium telluride, or copper indium gallium selenide (CIGS). The semiconductor material may be dissolved and/or suspended in the etchant composition.
[0039] The method of using the etchant composition to introduce micron-scale surface roughness to semiconductor material comprises contacting the semiconductor material with the etchant composition under conditions sufficient to etch the surface of the semiconductor material. Preferably, the roughness introduced is micron-scale surface roughness, wherein the pyramids etched into the surface have a lateral measurement of about 2 to about 10 microns, with good coverage of the pyramids across the surface. As defined herein, "good coverage" corresponds to roughening of at least 90% of the surface of the semiconductor material, preferably at least 95%, and most preferably at least 99% of the surface of the semiconductor material is roughened. It should be appreciated by the skilled artisan that the pyramids etched in the surface of the substrate can be the same size or a different size relative to other pyramids on the surface.
[0040] In removal application, the etchant compositions of the first aspect can be applied in any suitable manner to the semiconductor substrate to be roughened, e.g., by spraying the etchant
composition on the surface, by dipping (in a volume of the etchant composition) of the substrate, by contacting the substrate with another material, e.g., a pad, or fibrous sorbent applicator element, that is saturated with the etchant composition, by contacting the substrate with a circulating etchant composition, or by any other suitable means, manner or technique, by which the etchant composition is brought into contact with the semiconductor substrate to be roughened. Where necessary, the back surface of the substrate can be masked to avoid exposure to the etchant composition.
[0041] In use of the compositions of the first aspect for roughening semiconductor material, the compositions typically are contacted with the substrate for a time of from about 10 sec to about 120 minutes, at temperature in a range of from about 20 C to about 200 C, preferably about 70 C to about 100 C, even more preferably about 80 C to about 90 C. Such contacting times and temperatures are illustrative, and any other suitable time and temperature conditions may be employed that are efficacious to roughen the semiconductor material.
[0042] Following the achievement of the desired roughening, the etchant composition may be removed from the device to which it has previously been applied by rinsing. Preferably, the rinse solution for the composition of the first aspect includes deionized water. Thereafter, the roughened semiconductor material may be dried using nitrogen or a spin-dry cycle.
[0043] In a second aspect, a novel method for the controlled texturing of semiconductor materials is described, wherein a microstamp with the optimum surface structure is manufactured. The microstamp may be a mirror inverse of the optimum surface structure, an anode with features to enhance etching in specific places, and/or a mask with features to ensure that certain parts of the surface are etched while others are not. The microstamp may be made out of a variety of materials including, but not limited to, metals, ceramics, glasses and plastics/polymers and may be made using any process such as micromachining, photolithography, embossing, etc. The semiconductor material substrate to be etched and the microstamp are immersed in a bath and pressed together. Holes may be added to the microstamp to ensure that the etching chemistry reaches the substrate surface and etch products are easily removed. Vibration and/or pulsing may also be used. The microstamp may be of any size, covering only a fraction of the substrate at any one time or large enough to cover multiple substrates. Advantageously, only the front surface of the substrate is textured without having to mask the back surface. In one embodiment, the stamp and the substrate may be alternately pressed and removed a number of times to ensure adequate fluid transfer. In another embodiment, the microstamp may be slightly flexible to minimize substrate breakage. In still another embodiment, a potential may be placed on the upper and lower surfaces to enhance the etching rate. In yet another embodiment, trenches for metal lines, as readily understood by those skilled in the art, may be etched simultaneously with the texturing of the surface, eliminating the need, cost and time for laser scribing, although laser scribing the trenches is still contemplated herein. It should be appreciated by one skilled in the art that any combination of the embodiments is contemplated herein.
[0044] The microstamp includes a regular or irregular array of shapes thereon including, but not limited to: polyhedra such as cubes, tetrahedrons, octahedrons, dodecahedron, icosahedron; prisms such as triangular prisms, cuboids, rectangular prisms, pentagonal prisms, hexagonal prisms, octagonal prisms; pyramids such as triangularly shaped pyramids, square shaped pyramids and pentagonal shaped pyramids; hemispherical; other spherical-based shapes; and ellipsoidal-based shapes. The regular or irregular array can include any number of different shapes of various sizes having various levels of symmetry. Preferably, when the microstamp includes etchant holes, the microstamp comprises a hydrophilic surface to minimize surface tension issues at the etchant holes. It should be appreciated that the etchant holes may be any size so long as the integrity of the microstamp is not compromised. If necessary, the bath may be forced through smaller etchant holes using backside pressure.
[0045] Although not wishing to be bound by theory, there are several possible mechanisms of action when using a microstamp including, but not limited to: the etching rate of the substrate should be highest where the pressure is highest; the microstamp may break through any residual surface oxide and thus increase the etching rate; the pressure may induce amorphism in the substrate which can then act as an etch stop; and/or the microstamp may act as a removable "mask" limiting where the etching chemistry may attack the substrate. The mechanism will depend on the choice of specific chemistry used (e.g., acidic, basic, additives/surfactants, etc.), the time, the temperature and/or the pressure, etc.
[0046] Following the application of the microstamp to the substrate and the etching process, the substrate surface is preferably rinsed to remove the etchant as well as any reaction products. The stamp may be reused multiple times. In one embodiment, it may be advantageous to use multiple stamps to impart an increasingly rough texture to the substrate surface. The etching chemistry may be altered during each of these process steps to optimize photovoltaic cell performance. Additional process step(s), chemical additives, and/or process chemistries may be added to minimize the surface recombination velocity.
[0047] Advantageously, the method of the second aspect allows for a reproducible surface structure with optimized texture. The texture may be a variety of sizes from the micron-scale to the nanoscale to a mixture of sizes between the micron-scale and nanoscale.
[0048] In one embodiment of the method of the second aspect, the semiconductor material is microscale roughened using the composition and method of the first aspect, as described herein, and thereafter, nanoscale surface roughening is achieved using the method of the second aspect (i.e., the microstamp).
[0049] In another embodiment of the method of the second aspect, the semiconductor material is microscale roughened method of the second aspect (i.e., using a microscale microstamp), and thereafter nanoscale surface roughening is achieved using the method of the second aspect (i.e., using a nanoscale microstamp).
[0050] For single crystal silicon surfaces, either an anisotropic etch or an isotropic etch may be used with the microstamp. For polycrystalline silicon, it is expected that an isotropic etch will be most advantageous since multiple crystal planes are exposed. Examples of anisotropic etches include (i) a mixture of a base (e.g., NaOH and KOH) and optionally an alcohol (e.g., isopropanol); (ii) ethylenediamine and pyrocatechol with or without water; (iii) aqueous hydrazine; (iv) amine gallates (e.g., an alkanolamines with gallic acid, water, pyrazine, optionally oxidants and optionally surfactants); and (v) the etchant composition of the first aspect. The most commonly used wet isotropic etchant is a solution of nitric acid, hydrofluoric acid, and optionally acetic acid. Other etchants are known to those skilled in the art. This etching process occurs preferentially at defects, therefore, when saw damage is present, etching (and therefore texturing) occurs independent of the crystal orientation. As noted above, the microstamp may either enhance or inhibit the etching rate, thus imparting a specific surface texture. Advantageously, etching steps to minimize saw damage may not be required, thus simplifying the overall cell fabrication process.
[0051] Acidic isotropic etches result in lower reflection than traditional anisotropic etches on p-Si or mc-Si, and thus better cell conversion efficiency. After acidic texturing, wafers must be immersed in a dilute NaOH or KOH solution to remove a thin porous silicon layer that is formed during the texturing step. This is followed by a neutralization step to remove all Na+ or K+ ions from the surface before emitter diffusion. Although this wet texture process is effective at yielding higher conversion efficiencies, it is multi-step, chemically intensive, and tends to generate significant waste. This process may be simplified by using an oxidant along with an acid fluoride, instead of the immersion in the dilute NaOH or KOH solution, to oxidize the freshly etched silicon surface and avoid generating a porous silicon layer. Avoiding the caustic etchants (i.e., NaOH and KOH) eliminates the need for a neutralization step.
[0052] Alternatively, a viscous alkaline silicon etch paste may be squeezed between the microstamp and the silicon surface, e.g., as described in U.S. Patent Application Publication No. 2005/0247674 in the name of Kukelbeck et al. and entitled "Etching Pastes for Silicon Surfaces and Layers," which is incorporated by reference herein in its entirety.
[0053] Oxidants contemplated herein include, but are not limited to, methanesulfonic acid (MSA), ozone, bubbled air, ethanesulfonic acid, benzenesulfonic acid, 2-hydroxyethanesulfonic acid, cyclohexylaminosulfonic acid, n-propanesulfonic acid, n-butanesulfonic acid, or n-octanesulfonic acid, hydrogen peroxide (H202), FeCl3 (both hydrated and unhydrated), oxone (2KHSO5 KHSO4 K2SO4), ammonium polyatomic salts (e.g., ammonium peroxomonosulfate, ammonium chlorite (NH4CIO2), ammonium chlorate (NH4CIO3), ammonium iodate (NH4IO3), ammonium perborate (NH4BO3), ammonium perchlorate (NH4CIO4), ammonium periodate (NH4IO3), ammonium persulfate ((NH4)2S208), ammonium hypochlorite (NH4CIO)), sodium polyatomic salts (e.g., sodium persulfate (Na2S20g), sodium hypochlorite (NaCIO)), potassium polyatomic salts (e.g.,
potassium iodate (KI03), potassium permanganate (KMn04), potassium persulfate, nitric acid (HNO3), potassium persulfate (K2S208), potassium hypochlorite (KCIO)), tetramethylammonium polyatomic salts (e.g., tetramethylammonium chlorite ((N(CH3)4)C102), tetramethylammonium chlorate ((N(CH3)4)C103), tetramethylammonium iodate ((N(CH3)4)I03), tetramethylammonium perborate ((N(CH3)4)B03), tetramethylammonium perchlorate ((N(CH3)4)C104), tetramethylammonium periodate ((N(CH3) )I04), tetramethylammonium persulfate ((N(CH3) )S20g)), tetrabutylammonium polyatomic salts (e.g., tetrabutylammonium peroxomonosulfate), peroxomonosulfuric acid, ferric nitrate (Fe(N03)3), cerium ammonium nitrate (CAN), urea hydrogen peroxide ((CO(NH2)2)H202), peracetic acid (CH3(CO)OOH), and combinations thereof.
[0054] Acid fluorides contemplated herein include, but are not limited to, hydrogen fluoride (HF); ammonium fluoride (NH F); tetraalkylammonium fluoride (NR F); alkyl hydrogen fluoride (NRH3F); ammonium hydrogen bifluoride (NH5F2); dialkylammonium hydrogen fluoride (NR2H2F); trialkylammonium hydrogen fluoride (NR3HF); trialkylammonium trihydrogen fluoride (NR3:3HF); anhydrous hydrogen fluoride pyridine complex; anhydrous hydrogen fluoride triethylamine complex; amine hydrogen fluoride complexes; and combinations thereof, where R may be the same as or different from one another and is selected from the group consisting of straight-chained or branched Ci-C6 alkyl groups (e.g., methyl, ethyl, propyl, butyl, pentyl, hexyl) and where the amine includes straight-chained or branched Ci-C20 alkylamines, substituted or unsubstituted C6-Ci0 arylamines, glycolamines, alkanolamines, and amine-N-oxides including, but not limited to: pyridine; 2- ethylpyridine; 2-methoxypyridine and derivatives thereof such as 3-methoxypyridine; 2-picoline; pyridine derivatives; dimethylpyridine; piperidine; piperazine; triethylamine; triethanolamine; ethylamine, methylamine, isobutylamine, tert-butylamine, tributylamine, dipropylamine, dimethylamine, diglycol amine; monoethanolamine; pyrrole; isoxazole; 1 ,2,4-triazole; bipyridine; pyrimidine; pyrazine; pyridazine; quinoline; isoquinoline; indole; imidazole; N-methylmorpholine-N- oxide (NMMO); trimethylamine-N-oxide; triethylamine-N-oxide; pyridine-N-oxide; N- ethylmorpholine-N-oxide; N-methylpyrrolidine-N-oxide; N-ethylpyrrolidine-N-oxide; 1- methylimidazole; diisopropylamine; diisobutylamine; aniline; aniline derivatives; and combinations thereof.
[0055] Anionic, cationic, non-ionic and zwitterionic surface active agents may also be employed to minimize surface reflectance by controlling surface tension. For example, a textured surface may be represented by semi-spherical scallops where D and h denote the width and depth of the texture, respectively, and r is the radius of a sphere (see, e.g., Figure 2). The width of the surface texture is determined primarily by the surface tension of the liquid while the texture depth is determined by the etching chemistry/rate/time. The relationship between D, h and r is:
D2 = 8rh - 4h2
In other words, the reflectance depends on both h and D and a large value of h/D is necessary to obtain a low reflectance (see, e.g., Nishimoto, Y., et al., J. Electrochem. Soc, 146, 457-461 (1999). Measured results were in good agreement with this simulation. The surfactants contemplated for use were introduced hereinabove. In a preferred embodiment, the nonionic surfactant may be an ethoxylated fluorosurfactant such as ZONYL® FSO-100 fluorosurfactant (DuPont Canada Inc., Mississauga, Ontario, Canada).
[0056] In the method described herein, surfactants/de foaming agents may be added to the bath, wherein the surfactants/defoaming agents have different "bubble generation" (i.e., "foaming") characteristics to tune the reflectance of the textured surface. The bubbles play a role similar to the microstamp in that they control where etching takes place. For example, Pluronic 25R2 (a non-ionic, non-fluorinated -PEG/PPG/PEG polymer) may be used for very small bubble generation while DDBSA (anionic- dodecylbenzene sulfonic acid, sodium salt) should lead to the formation of larger bubbles. Intermediate-sized bubbles should be formed from Dowfax 3B2 (anionic - alkyldiphenyloxide disulfonate sodium salt). These materials may be employed either individually or in combination with each other and the microstamping technique to yield multi-scale or fractal surfaces.
[0057] As introduced hereinabove, the microstamp may be made out of a conductive material (e.g., metal) or coated with a conductive material and an electrochemical process initiated between the stamp and the substrate. In one embodiment, the stamp need not touch the substrate. The bath may be either alkaline or acidic; additives such as surfactants and foaming agents may also be used. Alternatively, the stamp may be used as a contact etch mask thus limiting areas in which etching may take place. The etch rate may be enhanced using photons either through the stamp (using an optically transparent yet conductive material or a coating with these properties (e.g., indium tin oxide)) and/or through the silicon substrate. By controlling the potential and the solution chemistry, all crystallographic faces of silicon may be etched at comparable rates and similar shapes, thus leading to reproducible surface texturing even as the crystal structure varies (see, e.g., Gregory Zhang, Electrochemistry of Silicon and its Oxide, Kluwer Academic/Plenum Publishers, New York, 2001). Consistent with the teaching herein, trenches for metal contact lines may be etched simultaneously and/or laser scribing may be utilized. A deionized water rinse may be used to remove any residual acid or base. Advantageously, electrochemical etching is rapid thus increasing the throughput of cells through a solar fab.
[0058] In addition to wet chemical and electrochemical etching of silicon, a similar microstamp may be used in gas phase etching. For example, XeF2 can be used as a plasma-less, isotropic, vapor-phase texturing etchant. XeF2 etches silicon rapidly (~ 2 μΓπ/ηήη) with a high selectivity over S1O2, SiN, Al and photoresist (>1000:1), thus any of these materials may be used as a mask to protect the back-side of the wafer during the texturing process (if necessary). XeF2 has not been listed as a greenhouse gas
and thus could potentially eliminate the use of well known greenhouse gases from plasma/vapor phase texturing processes, as well as the surface damage caused by RIE plasma processes. This potentially eliminates any subsequent wet-chemical etching steps. Alternative gases for use in gas phase etching include, but are not limited to, F2, HF and C1F3. In another embodiment, a photoablative process can be used, wherein the substrate surface is covered with a discrete array of masking material, such as metal and/or particles, and thereafter an excimer laser is used to ablate the exposed silicon.
[0059] Note that the method of the second aspect is not limited to texturing of silicon photovoltaic cells and may be applied to not only other photovoltaic materials (e.g., GaAs, CdTe, CIGS, etc.), but to a wide variety of substrates in many fields including optics, controlled surface hydrophobicity/hydrophilicity, etc.
[0060] In a third aspect, a method of introducing a micron scale and a nanometer scale surface roughness to the surface of a photovoltaic cell substrate is described. More specifically, the method of the third aspect relates to the deposition of nanoparticles or the introduction of metal induced pitting to a micron scale roughened substrate surface.
[0061] Furthermore, all the wet-based formulations proposed here can be applied to other wet- processes in the solar cell production, such as Saw Damage Removal (SDR), Phosphorous Silicate Glass (PSG) removal, Edge Isolation and SixNy removal.
[0062] The method of introducing texture to the substrate is illustrated in Figure 3, wherein a silicon- containing substrate (e.g., monocrystalline or polycrystalline/multicrystalline) is etched to form a micron-scale roughened substrate surface. The method of etching depends on the nature of the silicon-containing substrate, wherein KOH/NaOH and optionally isopropanol is conventionally used to anisotropically etch a monocrystalline Si substrate while a mixture of nitric acid and HF and optionally acetic acid is conventionally used to isotropically etch a multicrystalline Si substrate. Other etchants include carbonate, bicarbonate, or hydrazine and optionally at least one alcohol or at least one surfactant. Alternatively, the micron-scale roughness is introduced using the composition and method of the first aspect, as described herein. The substrate having the micron-scale texture then undergoes nanoscale texturing, wherein (i) nanoparticles are deposited thereon; or (ii) metal induced pitting (MIP) is initiated. The metals or nanoparticles may be optionally removed. The textured substrate can be subsequently used to build a solar cell. In an alternative embodiment, the micron- scale textured substrate of the second aspect is subjected to nanoscale texturing wherein (i) nanoparticles are deposited thereon; or (ii) metal induced pitting (MIP) is initiated. The metals or nanoparticles may be optionally removed. The textured substrate of the alternative embodiment can be subsequently used to build a solar cell.
[0063] The nanoparticles, specifically silica, CdTe nanoparticles, CdSe nanoparticles or other chalcogenides, can be deposited in situ or ex situ using solution-based or gas phase deposition methods, as readily understood by one skilled in the art. In another embodiment, a ceramic or metal
doped ceramic nanoparticle such as Ti02 can be deposited for a photoassist process, wherein UV light can activate etching in the vicinity of the particle.
[0064] One potential advantage of introducing these nanoparticles, which could bear variously tunable charges and morphology, is to enable an effective field induced surface passivation which ultimately leads to the reduction of SRV.
[0065] Metal induced pitting involves the immersion of the micron-scale textured substrate in a solution including a metal salt and a silicon oxide based etchant such as an acid fluoride or KOH. The metal salt can include copper (II), gold (I), silver (I), Pt(II), Pd (II), and combinations thereof. MIP results in the formation of craters on the surface of the micron-scale textured surface, hence introducing a secondary structure. Although not wishing to be bound by theory, the inventors speculate that p-type doped silicon is more prone to MIP than n-type doped silicon. An example of metal induced pitting is shown in Figure 4 wherein nucleation at the silicon surface leads to the formation of a metal particle (based on the metal salt used) and the formation of silicon oxide in the silicon proximate to the metal particle. Thereafter, a fluoride salt may be introduced wherein the silicon oxide dissolves and the metal particle is released/oxidized, leaving behind a pit.
[0066] Advantageously, the method of the third aspect is a simple two-step process that requires only inexpensive, commodity chemicals.
[0067] In a fourth aspect, remote plasma source (RPS) or reactive ion etching (RIE), i.e., dry etching processes, is used to etch micron-scale and nanoscale features into the silicon-containing substrate, preferably without the necessity of introducing the silicon-containing substrate to an anisotropic etch bath (i.e., KOH/isopropanol) or the isotropic etch bath (i.e., HNO3/HF/CH3COOH). In other words, the RPS or RIE etching can be a one-step texturing process and the resulting textured substrate can be subsequently used to build the solar cell. In another embodiment, the RPS or RIE etching may be a two step process wherein the first etch introduces a primary roughness while the second etch introduces a secondary roughness. The first etch can be a wet or dry etch while the second etch is a dry etch. For example, the primary roughness may be a micron-scale texture introduced using the composition and method of the first aspect while the secondary roughness may correspond to nanoscale roughness. It should be appreciated that the technique used in the first step can be the same as or different from the technique used in the second step. In another embodiment, the textured substrate of the second aspect is subjected to a RPS or RIE etch to introduce nanoscale features according to the fourth aspect and the resulting textured substrate can be subsequently used to build the solar cell.
[0068] Advantageously, the method of the fourth aspect is a one-sided process and does not require the presence of a defect for isotropic etching.
[0069] In a fifth aspect, another method of introducing a micron scale and a nanometer scale surface roughness to the surface of a photovoltaic cell substrate is described. More specifically, the method
of the fifth aspect relates to the deposition of nanoparticles on a micron scale roughened substrate surface.
[0070] The method of introducing texture to the substrate according to the fifth aspect includes the etching of a silicon-containing substrate (e.g., monocrystalline or polycrystalline/multicrystalline) to form a micron-scale roughened substrate surface. The method of etching depends on the nature of the silicon-containing substrate, wherein KOH and optionally isopropanol is conventionally used to anisotropically etch a monocrystalline Si substrate while a mixture of nitric acid and HF and optionally acetic acid is conventionally used to isotropically etch a multicrystalline Si substrate. Alternatively, the micron-scale texture is obtained using the composition and method of the first aspect described herein, according to the second aspect described herein, or using the RPS or RIE etch of the fourth aspect described herein. Metal nanoparticles are then deposited on the substrate having the micron-scale texture, wherein (i) noble metal nanoparticles are deposited thereon using spin-on coating instead of gas phase deposition; or (ii) non-noble metal nanoparticles are deposited using solution-based deposition processes or gas phase deposition. Nanoscale roughness is achieved using metal-induced catalysis using a HF/H2O2 or an alternative composition in the presence of the deposited metal or some other metal catalyst present in the HF/H2O2 or alternative composition. In another embodiment, the catalysis may be photoinduced, as readily understood by one skilled in the art. After the nanoscale roughness is imparted in the substrate surface, the metal nanoparticles can be removed to yield the textured substrate, which can be subsequently used to build a solar cell. For the purposes of this disclosure, the "alternative composition" may be any solution disclosed in International Patent Application No. PCT/US06/60696 filed November 9, 2006 entitled "Composition and Method for Recycling Semiconductor Wafers Having Low-k Dielectric Materials Thereon," International Patent Application No. PCT/US08/58878 filed March 31, 2008 entitled "Methods for Stripping Material for Wafer Reclamation," International Patent Application No. PCT/US08/66906 filed June 13, 2008 entitled "Wafer Reclamation Compositions and Methods," and International Patent Application No. PCT/US09/59199 filed October 1, 2009 entitled "Use of Surfactant/Defoamer Mixtures for Enhances Metals Loading and Surface Passivation of Silicon Substrates," which are all hereby incorporated by reference herein in their entireties. In all cases, the surface structure and surface/interface chemistry must be such that the surface recombination velocity is not substantially increased.
[0071] Losses in solar cell efficiency come primarily from four areas - reflectance losses which can be addressed by a texturing process, thermodynamic efficiency which is a result of the semiconductor band gap, resistive electrical losses which arise from the material and interface properties, and recombination losses. Recombination loss occurs when the photo-generated electron-hole pairs combine with other carriers before they can migrate and be collected at the cell's p-n junction. A portion of minority carriers tend to migrate towards the surface so by manipulating the surface potential, the minority carriers can be repulsed or attracted which directly affects the rate of
recombination at the surface of the semiconductor. Approaches to modifying the surface potential include chemical modification of the surface, adsorption of a thin film, or coating with a thin film material compatible with the design of the cell. Thus two sources of loss, reflection and recombination, could potentially be addressed with a single chemical process. Although not wanting to be bound by theory, if the top layer is a p-type semiconductor then the majority carrier will be holes. If a dipole at the surface is achieved, carriers from the surface may be repelled or attracted. For example, changing Si-OH at the surface to Si-H results in a surface where the holes are not as attracted and the rate of surface recombination decreases. With regards to an n-type semiconductor, halogen termination or aminosilanes may slow down surface recombination.
[0072] Although the invention has been variously disclosed herein with reference to illustrative embodiments and features, it will be appreciated that the embodiments and features described hereinabove are not intended to limit the invention, and that other variations, modifications and other embodiments will suggest themselves to those of ordinary skill in the art, based on the disclosure herein. The invention therefore is to be broadly construed, as encompassing all such variations, modifications and alternative embodiments within the spirit and scope of the claims hereafter set forth.
Claims
1. A method of introducing a micrometer scale surface roughness to a substrate surface, said method comprising (i) using an etchant composition; or (ii) immersing a microstamp and a substrate to be etched together in a bath and pressing the microstamp to the substrate to etch micrometer scale features into the substrate surface.
2. The method of claim 1, wherein the microstamp is a mirror inverse of the optimum surface structure of the substrate.
3. The method of claims 1 or 2, wherein the microstamp comprises at least one hole to ensure that the etching chemistry reaches the substrate surface and etch products are easily removed.
4. The method of any of the preceding claims, wherein vibration and/or pulsing is used.
5. The method of any of the preceding claims, wherein a potential is placed on the microstamp and the substrate to enhance the etching rate.
6. The method of any of the preceding claims, wherein the microstamp includes a regular or irregular array of shapes.
7. The method of claim 6, wherein the shapes include at least one shape selected from the group consisting of cubes, tetrahedrons, octahedrons, dodecahedron, icosahedron, triangular prisms, cuboids, rectangular prisms, pentagonal prisms, hexagonal prisms, octagonal prisms, triangularly shaped pyramids, square shaped pyramids, pentagonal shaped pyramids, hemispherical shapes, other spherical-based shapes, and ellipsoidal-based shapes.
8. The method of any of the preceding claims, wherein the substrate is rinsed to remove the bath and any reaction products.
9. The method of any of the preceding claims, wherein the bath comprises at least one alkali hydroxide salt and optionally at least one alcohol.
10. The method of claim 9, wherein the bath etches the substrate anisotropically.
1 1. The method of claims 9 or 10, wherein the substrate is single crystal silicon.
12. The method of any of claims 1 -8, wherein the bath comprises nitric acid, hydrofluoric acid, and optionally acetic acid.
13. The method of claim 12, wherein the bath etches the substrate isotropically.
14. The method of claims 12 or 13, wherein the substrate is polycrystalline silicon.
15. The method of any of claims 12-14, wherein the substrate is introduced to a mixture comprising an oxidant and an acid fluoride.
16. The method of any of the preceding claims, wherein at least one surfactant is added to the bath.
17. The method of claim 1 , wherein the etchant composition comprises at least one alkaline component, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
18. The method of claim 1 , wherein the etchant composition comprises at least one amine carboxylate, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
19. The method of claim 17, wherein the alcohol components comprise any straight-chained or branced Ci-Ce alcohols.
20. The method of claims 17 or 19, wherein the at least one alkaline component comprises an alkali hydroxide, carbonates, hydrogen carbonates, quaternary ammonium hydroxides, or any combination thereof.
21. The method of claims 17 or 19, wherein the at least one alkaline component comprises NaOH, KOH, RbOH, CsOH, Na2C03, NaHC03, K2C03, KHC03, NR4OH, or any combination thereof, wherein R can be the same as or different from one another and is selected from the group consisting of Ci-C6 alkyls, C6-Ci0 aryl, and combinations thereof.
22. The method of claims 17 or 19, wherein the at least one alkaline component comprises NaOH, KOH, RbOH, CsOH, or combinations thereof.
23. The method of claims 17 or 19, wherein the at least one alkaline component comprises NaOH, KOH, or a combination of NaOH/KOH.
24. The method of claim 18, wherein the at least one amine carboxylate comprises amine gallate or amine salicylate.
25. The method of any of claims 17-24, wherein the at least one metal salt comprises a Group II metal, a Group IV metal, copper, lanthanum, or combinations thereof.
26. The method of any of claims 17-24, wherein the at least one metal salt comprises Ca(OH)2, Sr(OH)2, Ba(OH)2, CaO, SrO, BaO, Ca(N03)2, Sr(N03)2, Ba(N03)2, CuS04-5H20, CaS04, SrS04, BaS04, Cu(OH)2, Na2(Ge03), Na2(Sn03), Na4(Si04), K2(Ge03), K^SiC^), K2(Sn03), LaCl3-7H20, La2(S04)3 and its hydrates, , SnCl4-5H20, and combinations thereof.
27. The method of any of claims 17-24, wherein the at least one metal salt comprises CaOH, La2(S04)3 and its hydrates, or BaOH.
28. The method of any of claims 17-27, wherein the at least one surfactant comprises a nonionic, anionic, cationic, and/or zwitterionic surfactants.
29. The method of any of claims 17-28, wherein the pH is greater than 12.
30. The method of any of claims 17-29, further comprising semiconductor material.
31. A method of introducing a nanometer scale surface roughness to a substrate surface, said method comprising (i) depositing nanoparticles on the substrate surface; (ii) introducing metal induced pitting to a substrate surface; (iii) using remote plasma source (RPS) or reactive ion etching (RIE); or (iv) immersing a microstamp and a substrate to be etched together in a bath and pressing the microstamp to the substrate to etch nanometer scale features into the substrate surface.
32. The method of claim 31, wherein the nanoparticles are selected from but not limited to the group consisting of silica, CdTe, CdSe, other chalcogenides, and combinations thereof.
33. The method of claims 31 or 32, wherein the nanoparticles are deposited in-situ or ex-situ using solution-based or gas phase deposition methods.
34. The method of claim 31, wherein noble metal nanoparticles are deposited on the substrate surface using spin-on coating instead of gas phase deposition.
35. The method of claim 31, wherein non-noble metal nanoparticles are deposited on the substrate surface using solution-based deposition processes or gas phase deposition.
36. The methods of claims 34 or 35, wherein nanometer scale roughness is achieved by metal inducing catalysis at the substrate surface in the presence of a catalysis composition.
37. The method of claim 36, wherein the catalysis composition comprises an acid fluoride and an oxidant.
38. The method of claim 31, wherein the metal induced pitting (MIP) is achieved by introducing the substrate surface to a MIP mixture comprising a metal salt and a fluoride based etchant or an alkali hydroxide.
39. The method of claim 38, wherein the fluoride based etchant comprises an acid fluoride.
40. The method of claims 38 or 39, wherein the metal salt comprises at least one metal ion selected from the group consisting of copper (II), gold (I), silver (I), Pt(II), and Pd (II).
41. The method of any of claims 31-40, comprising introducing a micron-scale roughness to the substrate surface before introducing the nanometer scale surface roughness to the substrate surface.
42. A method for the controlled texturing of substrates, wherein said method comprises masking a substrate to be etched with a microstamp and using gas phase etching to etch the substrate to introduce texture thereon.
43. The method of claim 42, wherein the gas phase etching comprises the introduction of XeF2 to the substrate.
44. A method of introducing micron-scale surface roughness to semiconductor material, said method comprising contacting the semiconductor material with an etchant composition under conditions sufficient to rough the surface of the semiconductor material, wherein the etchant composition comprises at least one alkaline component, at least one surfactant, at least one metal salt, and water, wherein the etchant composition is substantially devoid of any low boiling point alcohol components.
45. The method of claim 44, further comprising rinsing the semiconductor material following contact with the etchant composition.
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