WO2011055786A1 - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
WO2011055786A1
WO2011055786A1 PCT/JP2010/069702 JP2010069702W WO2011055786A1 WO 2011055786 A1 WO2011055786 A1 WO 2011055786A1 JP 2010069702 W JP2010069702 W JP 2010069702W WO 2011055786 A1 WO2011055786 A1 WO 2011055786A1
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WO
WIPO (PCT)
Prior art keywords
frame
reflection
fixing member
reflective
emitting device
Prior art date
Application number
PCT/JP2010/069702
Other languages
French (fr)
Japanese (ja)
Inventor
充弘 尾前
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Publication of WO2011055786A1 publication Critical patent/WO2011055786A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the present invention relates to a light emitting device.
  • the LED 101 is mounted on a metal frame 102.
  • the frame 102 on which the LED 101 is mounted has two frame portions 102a and 102b that are electrically insulated from each other, and the LED 101 is fixed to one of the frame portions 102a.
  • a reflective frame 103 having a frame-shaped reflective surface is disposed on the frame 102, and the LED 101 is surrounded by the reflective surface of the reflective frame 102.
  • the fixing member 104 is disposed between the frame portion 102 a and the frame portion 102 b, and the frame portion 102 a and the frame portion 102 b are fixed by the fixing member 104.
  • a fixing member 105 is disposed between the frame 102 and the reflection frame 103, and the frame 102 and the reflection frame 103 are fixed by the fixing member 105.
  • a white epoxy resin, a transparent polyolefin resin, or the like is used as a constituent material of the fixing members 104 and 105.
  • the fixing members 104 and 105 when the light generated by the LED 101 is applied to the fixing members 104 and 105, the fixing members 104 and 105 are discolored, so that the luminous intensity changes with time (in many cases). May decrease) or the chromaticity may change. Further, when a transparent polyolefin resin is used, light generated by the LED 101 passes through the fixing members 104 and 105, thereby causing light leakage, and changes in luminous intensity and chromaticity as time passes. Arise.
  • the situation where the heat conduction between the frame 102 and the reflection frame 103 is hindered by the fixing member is a problem, and such a problem is a problem to be solved particularly in order to maintain the quality of the light emitting element.
  • the frame 102 and the reflection frame 103 are thermally expanded, the frame 102 is warped due to a difference in thermal expansion between the frame 102 and the reflection frame 103 or the frame 102 is reflected from the reflection frame 103.
  • the device may be damaged due to peeling.
  • the conventional configuration described above has a problem that it is particularly difficult to improve heat dissipation characteristics and reliability.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a light-emitting device capable of improving heat dissipation characteristics and reliability.
  • a light-emitting device includes a light-emitting element and a first frame portion and a second frame portion that are electrically insulated from each other.
  • the other of the concave portion and the convex portion is formed in the reflection frame, and the convex portion is inserted into the concave portion.
  • a convex part functions as a thermal via, it can thermally radiate more efficiently.
  • a through hole may be sufficient and a non-through hole may be sufficient.
  • the adhering strength between a 1st frame part and a reflective frame can be raised more.
  • the other of the concave portion and the convex portion formed in the reflection frame is inserted into one of the concave portion and the convex portion formed in the frame, one of the concave portion and the convex portion is formed in the first frame portion.
  • the other of the concave portion and the convex portion formed in the reflection frame may be press-fitted into one of the concave portion and the convex portion formed in the first frame portion. If comprised in this way, the adhering strength between a 1st frame part and a reflective frame can be raised easily.
  • the press-fitting described here is to make the opening diameter of the concave portion smaller than the diameter of the convex portion and push the convex portion into the concave portion with a strong pressure. Furthermore, when the other of the concave part and the convex part formed in the reflective frame is inserted into one of the concave part and the convex part formed in the frame, one of the concave part and the convex part is formed in the first frame part.
  • the fixing member may be embedded between one of the concave portion and the convex portion formed in the first frame portion and the other of the concave portion and the convex portion formed in the reflective frame.
  • the other of the concave and convex portions formed in the reflective frame When the other of the concave and convex portions formed in the reflective frame is inserted into one of the concave and convex portions formed in the frame, one of the concave and convex portions is formed in the second frame portion.
  • the fixing member may be embedded between one of the concave portion and the convex portion formed in the second frame portion and the other of the concave portion and the convex portion formed in the reflective frame. If comprised in this way, fixation of a 2nd frame part and a reflective frame can be strengthened, electrically insulating a 2nd frame part and a reflective frame.
  • a protrusion may be formed on one of the first frame part and the reflection frame, and the protrusion may be in direct contact with the other of the first frame part and the reflection frame. If comprised in this way, the heat conduction between a 1st flame
  • the frame includes a plurality of frame portions, and the frame portion having the largest plane area among the plurality of frame portions is the first frame portion.
  • a plane area is an area when seen in a plane.
  • the total area of the two or more second frame portions may be larger than the area of the first frame portion.
  • the reflection frame is made of metal. If comprised in this way, heat dissipation through a reflective frame can be performed favorably. Further, when the reflection frame is made of resin, there is a disadvantage that the light absorption increases due to the discoloration (black discoloration) of the reflection frame due to light and heat, thereby reducing the luminous intensity. However, with this configuration, a decrease in luminous intensity can be significantly reduced.
  • the metal material constituting the reflection frame is preferably the same as the metal material constituting the frame. If comprised in this way, since each coefficient of thermal expansion of a flame
  • the frame-side portion of the reflection surface of the reflection frame is an inclined surface that spreads radially, while the portion of the reflection frame opposite to the frame side is vertical. It may be a surface. If comprised in this way, when the sealing member is embedded in the part enclosed by the reflective surface of a reflective frame, the adhesion area between the sealing member and the reflective surface of a reflective frame will increase. Thereby, peeling of the sealing member from the reflective surface of a reflective frame can be suppressed more.
  • a light-emitting device includes a light-emitting element, and a first frame part and a second frame part that are electrically insulated from each other, and is provided on the first frame part.
  • a metal frame on which the light emitting element is mounted a reflective frame having a frame-like reflecting surface disposed on the frame and surrounding the light emitting element, and a first fixing member for fixing the first frame part and the second frame part to each other
  • a second fixing member for fixing the frame and the reflection frame to each other.
  • the first fixing member and the second fixing member are both made of a white silicone-based adhesive material.
  • a white silicone-based adhesive material is used, but a white molding resin (for example, Amodel etc.) may be used for resin molding.
  • the constituent material of the first fixing member for fixing the first frame portion and the second frame portion to each other is a white silicone-based adhesive material, and the frame and the reflection frame are mutually connected.
  • the following effects can be obtained by using a white silicone-based adhesive material as the constituent material of the second fixing member for fixing.
  • the white silicone adhesive material is a material that reflects light.
  • the light is reflected by the first fixing member and the second fixing member. Therefore, light leaking in a direction different from the desired direction (light leaking from between the first frame part and the second frame part and light leaking from between the frame and the reflection frame) is reduced, and accordingly.
  • the light emission in the desired direction can be increased.
  • the white silicone-based adhesive material since the white silicone-based adhesive material has little discoloration due to light irradiation, it is possible to suppress changes in luminous intensity, chromaticity, and the like.
  • the white silicone-based adhesive material is a material that can have relatively high thermal conductivity when configured as described above, the first frame portion and the second frame that are formed via the first fixing member. The heat conduction between the frames and the heat conduction between the frame and the reflection frame made through the second fixing member are improved.
  • the silicone-based adhesive material has high heat resistance. Therefore, it is possible to obtain a white silicone-based adhesive material that can ensure the required withstand voltage with a relatively thin film thickness, by including titanium oxide particles that are white and have improved thermal conductivity in the silicone-based adhesive material. is there. For this reason, it is possible to efficiently dissipate heat generated in the light emitting element, and at the same time, it is easy to ensure reliability.
  • the white silicone-based adhesive material is a material that can also be used as a cushioning material. Therefore, even if the frame and the reflective frame thermally expand, there is a difference in thermal expansion between the frame and the reflective frame. It is absorbed by the second fixing member. Thereby, it can suppress that a device generate
  • the light emitting device As a result, in the light emitting device according to the second aspect, it is possible to improve the light emission characteristics, the heat dissipation characteristics and the reliability.
  • the white silicone adhesive material constituting the first fixing member and the white silicone adhesive material constituting the second fixing member are the same material. With this configuration, it is not necessary to separately prepare the white silicone-based adhesive material serving as the first fixing member and the white silicone-based adhesive material serving as the second fixing member, so that the cost can be reduced. it can.
  • the frame has one of the recesses and the protrusions
  • the reflection frame has the other of the recesses and the protrusions
  • the protrusions are inserted into the recesses. Good. If comprised in this way, since a convex part functions as a thermal via, it can thermally radiate more efficiently.
  • a through hole may be sufficient and a non-through hole may be sufficient.
  • one of the concave and convex portions formed on the reflective frame When the other of the concave and convex portions formed on the reflective frame is inserted into one of the concave and convex portions formed on the frame, one of the concave and convex portions is formed on the first frame portion.
  • the other of the concave and convex portions formed on the reflective frame may be caulked to one of the concave and convex portions formed on the first frame portion. If comprised in this way, the adhering strength between a 1st frame part and a reflective frame can be raised more.
  • the other of the concave portion and the convex portion formed in the reflection frame when the other of the concave portion and the convex portion formed in the reflection frame is inserted into one of the concave portion and the convex portion formed in the frame, one of the concave portion and the convex portion is formed in the first frame portion.
  • the other of the concave portion and the convex portion formed in the reflection frame may be press-fitted into one of the concave portion and the convex portion formed in the first frame portion. If comprised in this way, the adhering strength between a 1st frame part and a reflective frame can be raised easily.
  • the press-fitting described here is to make the opening diameter of the concave portion smaller than the diameter of the convex portion and push the convex portion into the concave portion with a strong pressure.
  • one of the concave part and the convex part formed in the reflective frame is inserted into one of the concave part and the convex part formed in the frame, one of the concave part and the convex part is formed in the first frame part.
  • a part of the second fixing member may be embedded between one of the concave portion and the convex portion formed in the first frame portion and the other of the concave portion and the convex portion formed in the reflective frame.
  • one of the concave and convex portions formed in the reflective frame is inserted into one of the concave and convex portions formed in the frame, one of the concave and convex portions is formed in the second frame portion.
  • a part of the second fixing member may be embedded between one of the concave portion and the convex portion formed in the second frame portion and the other of the concave portion and the convex portion formed in the reflective frame. If comprised in this way, fixation of a 2nd frame part and a reflective frame can be strengthened, electrically insulating a 2nd frame part and a reflective frame.
  • a protrusion may be formed on one of the first frame and the reflection frame, and the protrusion may be in direct contact with the other of the first frame and the reflection frame. If comprised in this way, the heat conduction between a 1st flame
  • the frame includes a plurality of frame portions, and the frame portion having the largest plane area among the plurality of frame portions is the first frame portion. If comprised in this way, since a light emitting element is mounted in the 1st frame part which is a frame part with the largest plane area among several frame parts, the heat_generation
  • a plane area is an area when seen in a plane.
  • the total area of the two or more second frame portions may be larger than the area of the first frame portion. .
  • the frame side portion of the reflection surface of the reflection frame is an inclined surface that spreads radially, while the portion of the reflection frame opposite to the frame side is vertical. It may be a surface. If comprised in this way, when the sealing member is embedded in the part enclosed by the reflective surface of a reflective frame, the adhesion area between the sealing member and the reflective surface of a reflective frame will increase. Thereby, peeling of the sealing member from the reflective surface of a reflective frame can be suppressed more.
  • FIG. 2 is a cross-sectional view of the light emitting device according to the first embodiment (a cross-sectional view along the line AA ′ in FIG. 1). It is the top view which showed the arrangement
  • FIG. 1 is a plan view of a light emitting device module using a plurality of light emitting devices according to a first embodiment.
  • 1 is a plan view of a light emitting device module using a plurality of light emitting devices according to a first embodiment.
  • 1 is a plan view of a light emitting device module using a plurality of light emitting devices according to a first embodiment.
  • It is a top view for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment.
  • FIG. 13 is a cross-sectional view (a cross-sectional view along the line AA ′ in FIG. 12) for describing the method for manufacturing the light emitting device according to the first embodiment. It is a top view for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment.
  • FIG. 15 is a cross-sectional view (a cross-sectional view along the line AA ′ in FIG. 14) for describing the method for manufacturing the light emitting device according to the first embodiment. It is sectional drawing for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment.
  • FIG. 20 is a cross-sectional view (a cross-sectional view along the line AA ′ in FIG. 19) of the light emitting device according to the second embodiment. It is a top view (plan view at the time of seeing from the reflective frame side) of the flame
  • FIG. 22 is a cross-sectional view of the frame used in the second embodiment (a cross-sectional view along the line AA ′ in FIG. 21).
  • FIG. 22 is a cross-sectional view of the frame used in the second embodiment (a cross-sectional view taken along the line BB ′ in FIG. 21). It is a top view (plan view at the time of seeing from the frame side) of the reflective frame used for 2nd Embodiment. It is a side view (side view at the time of seeing from the arrow A direction of FIG. 24) of the reflective frame used for 2nd Embodiment. It is a side view (side view at the time of seeing from the arrow B direction of FIG. 24) of the reflective frame used for 2nd Embodiment. It is the top view which showed the arrangement
  • FIG. 36 is a cross-sectional view (a cross-sectional view taken along the line AA ′ of FIG. 35) of the light emitting device according to the third embodiment.
  • FIG. 36 is a cross-sectional view (a cross-sectional view taken along line BB ′ of FIG. 35) of the light emitting device according to the third embodiment.
  • It is a perspective view (perspective view at the time of seeing from the reflective frame side) of the flame
  • FIG. 43 is a cross-sectional view (a cross-sectional view along the line AA ′ in FIG. 42) for describing a method for manufacturing the light-emitting device according to the third embodiment.
  • FIG. 44 is a cross-sectional view (a cross-sectional view taken along the line BB ′ of FIG. 42) for describing the method for manufacturing the light-emitting device according to the third embodiment. It is a top view for demonstrating the manufacturing method of the light-emitting device by 3rd Embodiment.
  • FIG. 46 is a cross-sectional view (a cross-sectional view taken along the line AA ′ in FIG. 45) for describing the method for manufacturing the light-emitting device according to the third embodiment.
  • FIG. 46 is a cross-sectional view (a cross-sectional view taken along the line BB ′ of FIG. 45) for describing the method for manufacturing the light-emitting device according to the third embodiment.
  • FIG. 46 is a cross-sectional view (a cross-sectional view taken along the line BB ′ of FIG. 45) for describing the method for manufacturing the light-emitting device according to the third embodiment.
  • FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light-emitting device according to the third embodiment (a view corresponding to a cross-section taken along the line AA ′ in FIGS. 42 and 45).
  • FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light emitting device according to the third embodiment (a view corresponding to a cross section taken along line BB ′ in FIGS. 42 and 45).
  • FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light-emitting device according to the third embodiment (a view corresponding to a cross-section taken along the line AA ′ in FIGS. 42 and 45).
  • FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light-emitting device according to the third embodiment (a view corresponding to a cross-section taken along the line AA ′ in FIGS. 42 and 45).
  • FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light emitting device according to the third embodiment (a view corresponding to a cross section taken along line BB ′ in FIGS. 42 and 45). It is a top view (plan view at the time of omitting a sealing member) of a light emitting device by a 4th embodiment.
  • FIG. 52 is a cross-sectional view of the light-emitting device according to the fourth embodiment (a cross-sectional view along the line AA ′ in FIG. 52).
  • FIG. 53 is a cross-sectional view of the light emitting device according to the fourth embodiment (a cross-sectional view along the line BB ′ in FIG. 52).
  • an LED (light emitting diode element) 1 as a light emitting element is mounted on a frame 2.
  • a reflective frame 3 having a frame-shaped reflective surface 3 a is disposed on the frame 2, and the LED 1 is surrounded by the reflective surface 3 a of the reflective frame 3.
  • a sealing member 4 for sealing the LED 1 is embedded in the opening of the reflective frame 3 (in the portion surrounded by the reflective surface 3a).
  • the frame 2 on which the LED 1 is mounted is made of metal and is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy.
  • the frame 2 is divided into a frame portion 2a having a large plane area and a frame portion 2b having a plane area smaller than that of the frame portion 2a, and these are electrically insulated from each other. Yes.
  • the frame portion 2a having a larger plane area is processed into a substantially U shape (substantially U shape), and has an LED mounting portion 2c on which the LED 1 is mounted at the center thereof.
  • the frame portion 2b having a smaller plane area is processed into a substantially rectangular shape, and enters the inside of the U-shaped body.
  • the frame portions 2a and 2b are examples of the “first frame portion” and the “second frame portion” in the present invention, respectively.
  • the surface of the frame 2 on which the LED 1 is mounted has a surface treatment (silver plating, silver + palladium plating, etc.) with emphasis on light reflectivity and also on wire bonding and flip connection. Is given.
  • the surface of the frame 2 opposite to the side on which the LED 1 is mounted is surface-treated with emphasis on solderability so that solder connection to another circuit board is possible (silver plating or Gold plating etc. are given.
  • the surface treatment applied to both sides of the frame 2 is made the same specification, the convenience in manufacturing is improved. In such a case, if silver plating or silver + palladium plating is applied to both sides of the frame 2, Good.
  • the reflection frame 3 disposed on the frame 2 is made of a high heat conductive material such as aluminum, aluminum alloy, copper and copper alloy. Moreover, the reflective surface 3a of the reflective frame 3 is an inclined surface that spreads radially.
  • the reflective surface 3a of the reflective frame 3 is subjected to surface treatment with an emphasis on light reflectance. Examples of such surface treatment include silver plating, silver plating + insulating (ceramic) coating, and anodizing.
  • the reflection frame 3 in order to increase the light reflectance in the reflection frame 3 by a simple surface treatment, it is suitable to subject the aluminum reflection frame to alumite treatment or to form a thin oxide film by chemical polishing. If priority is given to heat conduction in the frame 2, it is suitable to use a copper frame. From this point of view, when selecting the constituent materials of the reflective frame 3 and the frame 2, an aluminum reflective frame and a copper frame may be selected. Further, in the case where priority is given to heat conduction in both cases, a copper reflective frame (with silver plating or the like) and a copper frame (with silver plating or the like) may be selected.
  • the frame portions 2a and 2b are fixed to each other by the fixing member 6 made of a silicone-based adhesive material, and further, the same silicone-based adhesive as the silicone-based adhesive material that is a constituent material of the fixing member 6 is used.
  • the frame 2 and the reflection frame 3 are fixed by a fixing member 7 made of a material.
  • the fixing members 6 and 7 are examples of the “first fixing member” and the “second fixing member” in the present invention, respectively.
  • the silicone-based adhesive material that is a constituent material of the fixing members 6 and 7 contains titanium oxide, ceramic powder, silica, or the like, and is thereby whitened. Therefore, when the light generated by the LED 1 reaches the fixing members 6 and 7, the light is reflected by the surface.
  • a white silicone-based adhesive material include “KER-3100-U2” and “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd. developed for chip bonding.
  • the fixing member 6 for fixing the frame portions 2a and 2b to each other is formed with a thickness substantially the same as the plate thickness of the frame 2, and is disposed over the entire region between the frame portion 2a and the frame portion 2b. Yes. That is, the space between the frame portion 2a and the frame portion 2b is completely embedded by the fixing member 6 so that no gap is generated between the frame portion 2a and the frame portion 2b.
  • region in planar view of this adhering member 6 is the area
  • the fixing member 7 for fixing the frame 2 and the reflection frame 3 is an area between the frame 2 and the frame portion of the reflection frame 3 and the region where the frame 2 and the frame portion of the reflection frame 3 overlap. Arranged throughout. In addition, the fixing member 7 is also disposed in a region where the fixing member 6 and the frame portion of the reflection frame 3 overlap. For this reason, the space
  • region in planar view of this adhering member 7 is an area
  • the LED 1 is fixed to the frame portion 2a (LED mounting portion 2c).
  • the fixing member 8 is an example of the “third fixing member” in the present invention, and when viewed in a plan view, the fixing member 8 is disposed in the area 10c with lattice-like hatching in FIG.
  • the silicone type sealing material is used as a constituent material of the sealing member 4 for sealing LED1. That is, the main component of the constituent material of the sealing member 4 is the same as the main component of the constituent material of the fixing members 6 to 8.
  • the constituent material of the fixing member 6 for fixing the frame portions 2a and 2b to each other is a white silicone-based adhesive material, and the frame 2 and the reflection frame 3 are fixed to each other.
  • the following effects can be obtained by using a white silicone-based adhesive material as the constituent material of the fixing member 7.
  • the white silicone adhesive material is a material that reflects light, so that the light generated by the LED 1 is fixed to the fixing members 6 and 7. , The light is reflected by the fixing members 6 and 7. Therefore, light leaking in a direction different from the desired direction (light leaking from between the frame portion 2a and the frame portion 2b and light leaking from between the frame 2 and the reflection frame 3) is reduced, and accordingly.
  • the light emission in the desired direction can be increased.
  • the white silicone-based adhesive material has little discoloration due to light irradiation, changes in emission luminous intensity and chromaticity can also be suppressed.
  • the white silicone-based adhesive material has excellent heat resistance and can have relatively high thermal conductivity, and at the same time, it can be formed thin while maintaining insulation.
  • the heat conduction between the frame portion 2a and the frame portion 2b and the heat conduction between the frame 2 and the reflection frame 3 performed via the fixing member 7 are improved. For this reason, the heat generated in the LED 1 can be efficiently radiated.
  • the white silicone-based adhesive material is a material that can also be used as a cushioning material, even if the frame 2 and the reflection frame 3 are thermally expanded, the difference in thermal expansion between the frame 2 and the reflection frame 3 is caused by the fixing member 7. Will be absorbed. As a result, it is possible to prevent the apparatus from being damaged by warping of the frame 2 or peeling of the reflection frame 3 from the frame 2.
  • the first embodiment it is possible to improve the light emission characteristics, heat dissipation characteristics, and reliability.
  • the white silicone adhesive material forming the fixing member 6 and the white silicone adhesive material forming the fixing member 7 are made of the same material, thereby fixing the fixing member 6. Therefore, it is not necessary to separately prepare the white silicone-based adhesive material to be used and the white silicone-based adhesive material to be the fixing member 7, so that the cost can be reduced.
  • the constituent material of the fixing member 8 is the same white silicone-based adhesive material as the fixing members 6 and 7, it is necessary to separately prepare a white silicone-based adhesive material to be the fixing member 8. Also disappear. For this reason, cost is further reduced.
  • the constituent material of the sealing member 4 is a silicone-based sealing material, so that components of the constituent materials of the fixing members 6 and 7 are applied to the reflecting surface 3 a of the reflecting frame 3. Even if the sealing member 4 is attached and embedded in the opening of the reflective frame 3 in that state, since the constituent materials thereof are both silicone, the sealing member 4 with respect to the reflective surface 3a of the reflective frame 3 It can suppress that adhesive strength becomes weak. Further, it is possible to suppress the occurrence of abnormality in the cured product due to the inhibition of curing in the sealing member 4.
  • the fixing member 6 is embedded between the frame portion 2a and the frame portion 2b so that no gap is generated between the frame portion 2a and the frame portion 2b.
  • the space between the frame portion 2a and the frame portion 2b is completely closed by the fixing member 6, and light can be reliably suppressed from leaking between the frame portion 2a and the frame portion 2b.
  • the fixing member 7 is embedded between the frame 2 and the reflection frame 3 so as not to generate a gap between the frame 2 and the reflection frame 3. Between the frame 2 and the reflection frame 3 is completely blocked by the fixing member 7, and light can be reliably prevented from leaking between the frame 2 and the reflection frame 3.
  • the plane area of the frame portion 2a is made larger than the plane area of the frame portion 2b, and the LED 1 is mounted on the frame portion 2a having the larger plane area. Heat generation is easily dissipated.
  • the reflection frame 3 by making the reflection frame 3 made of metal, heat can be radiated through the reflection frame 3 satisfactorily. Moreover, since the reflective surface 3a of the reflective frame 3 becomes difficult to discolor when the reflective frame 3 is metal, the light absorption by the reflective surface 3a of the reflective frame 3 is suppressed, and the fall of emitted light intensity may be reduced. it can. If the frame 2 and the reflective frame 3 are made of the same metal material, the thermal expansion coefficients of the frame 2 and the reflective frame 3 are the same, so that the reflection from the frame 2 due to the difference in the thermal expansion coefficient. The peeling of the frame 3 can be further suppressed.
  • a fixing member for fixing the frame portion 2a and the frame portion 2b (fixing member disposed between the frame portion 2a and the frame portion 2b). 6 may be extended to the frame portion 2a (LED mounting portion 2c), and the LED 1 and the frame portion 2a may be fixed to each other at a portion of the fixing member 6 extending to the frame portion 2a. That is, the member that fixes the frame portion 2a and the frame portion 2b and the member that fixes the LED 1 and the frame portion 2a may be integrated.
  • the fixing member 7 (fixing member disposed between the frame 2 and the reflecting frame 3) that fixes the frame 2 and the reflecting frame 3 is fixed.
  • a part may be intentionally protruded from between the frame 2 and the reflective frame 3 to the outside (the side opposite to the LED 1 side).
  • the adhesion area is increased by that amount, so that the fixing between the frame 2 and the reflection frame 3 can be further strengthened.
  • the reflecting surface 3a of the reflecting frame 3 may be a combination of an inclined surface and a vertical surface. If it does in this way, the adhesion area between the reflective surface 3a of the reflective frame 3 and the sealing member 4 embedded in the part enclosed by the reflective surface 3a will increase. Thereby, peeling of the sealing member 4 can be suppressed more.
  • the frame portion 2b may be divided into a plurality as shown in FIG. 7, or the LED mounting portion 2c of the frame portion 2a is replaced with a frame portion as shown in FIG. It may be sandwiched between 2b.
  • a white silicone-based adhesive material is used, but a white molding resin (for example, Amodel etc.) may be used for resin formation.
  • the resin may be formed by injection molding.
  • the present invention can be applied to a light emitting device module including one or a plurality of light emitting device rows 101 including a predetermined number of light emitting devices 10 connected in series. is there. In this case, the shape of the light emission port of the light emitting device module may not be unified. For example, as shown in FIG. 10, a long hole-shaped light exit opening and a circular light exit opening may be mixed.
  • a metal structure in which a plurality of frames 2 having frame portions 2a and 2b that are electrically insulated from each other are connected in a matrix is used. Make it. Further, as shown in FIGS. 14 and 15, a metal structure in which a plurality of reflection frames 3 each having a frame-like reflection surface 3a are connected in a matrix is also produced.
  • the frame 2 is placed on a predetermined base 11. Thereafter, by using a screen printing method, a dispensing method, or the like, a region 10a between the frame portion 2a and the frame portion 2b, a region 10b in which the frame 2 and the frame portion of the reflection frame 3 overlap, and a frame portion 2a ( A white silicone-based adhesive material is applied to each of the predetermined regions 10c of the LED mounting portion 2c). That is, the fixing member 6 is arranged in the region 10a, the fixing member 7 is arranged in the region 10b, and the fixing member 8 is arranged in the region 10c. At this time, the constituent materials of the fixing members 6 to 8 are the same white silicone-based adhesive material, and the fixing members 6 to 8 are applied simultaneously.
  • the reflection frame 3 is arranged on the frame 2 via the fixing member 7, and the LED 1 is arranged on the frame portion 2 a (LED mounting portion 2 c) via the fixing member 8.
  • the distance between the frame 2 and the reflection frame 3 (the distance between the base 11 and the jig 12) is held at a predetermined size by holding the reflection frame 3 with a predetermined jig 12. deep.
  • the fixing members 6 to 8 are simultaneously cured.
  • the frame 2a and the frame 2b are fixed, the frame 2 and the reflection frame 3 are fixed, and the LED 1 and the frame 2a (LED mounting portion 2c) are fixed simultaneously.
  • the LED 1 is electrically connected to the frame portions 2 a and 2 b through the wire 5 by performing wire bonding. Further, the sealing member 4 is embedded in the opening of the reflection frame 3, and the LED 1 is sealed with the sealing member 4. Thereby, a structure in which a plurality of light emitting devices 10 are connected in a matrix is obtained. Finally, the light emitting devices 10 according to the first embodiment shown in FIGS. 1 and 2 are manufactured by individually separating the plurality of light emitting devices 10 connected in a matrix.
  • the frame 2a and the frame 2b are fixed by the fixing member 6, the frame 2 and the reflection frame 3 are fixed by the fixing member 7, and the fixing member.
  • the LED 1 and the frame portion 2a (LED mounting portion 2c) can be fixed together at the same time. This makes it possible to simplify the manufacturing process.
  • the method of fixing the frame 2 and the reflective frame 3 with the white silicone-based adhesive material is not limited to the above-described method, and for example, another method as described below. It is also possible to use it.
  • a white silicone-based adhesive material is applied to the gap between the frame portion 2a and the frame portion 2b by using a screen printing method, a dispensing method, or the like. Further, a white silicone-based adhesive material is also applied to the portion of the rear surface of the frame portion of the reflective frame 3 that overlaps the frame 2 and the portion that overlaps the gap between the frame portion 2a and the frame portion 2b. Thereafter, the frame 2 and the reflective frame 3 to which the white silicone adhesive material is respectively applied are overlapped with each other, and the white silicone adhesive material is cured in this state, thereby fixing the frame 2 and the reflective frame 3 together.
  • the frame 2 and the reflection frame 3 are overlapped and fixed to each other.
  • a white silicone adhesive material is applied and filled into predetermined portions of the frame 2 and the reflective frame 3 that are overlapped with each other.
  • the depressurization method is performed in this state. If vacuum degassing is performed in this manner, the white silicone-based adhesive material can be efficiently infiltrated into the gap between the frame 2 and the reflection frame 3 that are overlapped with each other. Thereafter, the frame 2 and the reflection frame 3 are fixed by curing the silicone adhesive material.
  • the LED 21 as a light emitting element is mounted on a frame 22 as in the first embodiment, and a frame-shaped reflecting surface 23 a is mounted on the frame 22.
  • a reflection frame 23 having the above is disposed.
  • the LED 21 is sealed by a sealing member (silicone sealing material) 24 embedded in the opening of the reflection frame 23.
  • the frame 22 is made of a high heat conductive material such as aluminum, aluminum alloy, copper and copper alloy, and is subjected to the same plating process as the plating process applied to the frame 2 of the first embodiment. Further, the frame 22 is divided into two parts, a frame part 22a having a large flat area and a frame part 22b having a smaller flat area than the frame part 22a.
  • the LED 21 is disposed on the LED mounting portion (center portion of the frame 22) 22c of the frame portion 22a, and is electrically connected to the frame portions 22a and 22b via wires 25.
  • the frame portions 22a and 22b included in the frame 22 are examples of the “first frame portion” and the “second frame portion” of the present invention, respectively. The detailed shapes are shown in FIGS. 21 to 23. It is supposed to be.
  • the reflection frame 23 is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy, and is similar to the plating treatment applied to the reflection frame 3 of the first embodiment (anodizing treatment and chemical treatment). (Including polishing etc.). And the reflective surface 23a of this reflective frame 23 has the inclined surface which spreads radially, and the perpendicular surface connected with the inclined surface.
  • the detailed shape of the reflection frame 23 is as shown in FIGS.
  • the frame 22 and the reflection frame 23 are in direct contact with each other at a predetermined portion.
  • a protruding portion that protrudes toward a reflective frame 23 side from other portions at a predetermined portion of the frame 22 (a portion that directly contacts the reflective frame 23). 22d is formed.
  • the protruding portion 22d of the frame 22 is provided in a portion of the frame portion 22a excluding the LED mounting portion 22c and the other three portions 22e, and is not provided in the frame portion 22b.
  • the frame part of the reflective frame 23 is directly mounted on the protrusion part 22d of the frame part 22a, and, thereby, the frame part 22a and the reflective frame 23 are directly contacting. Further, the frame portion of the reflection frame 23 is directly placed on the protruding portion 22d of the frame portion 22a, whereby the portion 22e of the frame portion 22a and the frame portion of the reflection frame 23 are separated from each other, and the frame portion 22b. And the frame portion of the reflection frame 23 are separated from each other.
  • the frame portions 22a and 22b are fixed to each other by the fixing member 26 made of a white silicone adhesive material, and the frame 22 is reflected from the frame 22 by the fixing member 27 made of a white silicone adhesive material.
  • the frame 23 is fixed, and the LED 21 and the frame portion 22a (LED mounting portion 22c) are fixed by a fixing member 28 made of a white silicone-based adhesive material.
  • the white silicone adhesive materials constituting the fixing members 26 to 28 are the same material, such as “KER-3100-U2” and “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd. is there.
  • the fixing members 26 to 28 are examples of the “first fixing member”, the “second fixing member”, and the “third fixing member” in the present invention, respectively.
  • the fixing member 26 for fixing the frame portions 22a and 22b to each other is formed to have substantially the same thickness as the plate thickness of the frame 22, and is disposed over the entire region between the frame portion 22a and the frame portion 22b. Yes. Therefore, there is no gap between the frame portion 22a and the frame portion 22b.
  • region in the planar view of this adhering member 26 is the area
  • the fixing member 27 for fixing the frame 22 and the reflection frame 23 is an area between the frame 22 and the frame portion of the reflection frame 23 and an area where the frame 22 and the frame portion of the reflection frame 23 overlap.
  • the protrusion 22d of the frame portion 22a is disposed in a region that does not exist.
  • the fixing member 27 is also arranged in a region where the fixing member 26 and the frame portion of the reflection frame 23 overlap. For this reason, no gap is generated between the frame 22 and the frame portion of the reflection frame 23.
  • region in planar view of this adhering member 27 is an area
  • the fixing member 27 is not disposed in the region where the frame portion 22a and the frame portion of the reflection frame 23 are in direct contact with each other. However, by doing so, the frame portion 22a and the reflection frame 23 are not disposed. Heat conduction is enhanced. However, although not shown, an extremely thin fixing member may be disposed in a region where the frame portion 22a and the frame portion of the reflection frame 23 are in direct contact, or the fixing member may naturally permeate. . In this case, since a minute gap does not remain, the fixing strength can be increased and the light leakage suppression effect can be further improved. In addition, the heat conduction between the frame portion 22a and the reflection frame 23 can be further enhanced by infiltrating the extremely thin fixing member so that no minute gap remains.
  • the fixing member 28 for fixing the LED 21 and the frame portion 22a (the LED mounting portion 22c) is arranged in the lattice-shaped hatched region 20c in FIG. Become.
  • the reflection frame 23 is fixed to the frame portion 22a by mechanically attaching the reflection frame 23 to the frame portion 22a.
  • four through-holes (concave portions) 22f penetrating in the plate thickness direction are formed in the projecting portion 22d of the frame portion 22a, as shown in FIGS.
  • four protrusions (convex portions) 23b that can be inserted into the through holes 22f of the frame portion 22a are formed on the back surface side (the frame 22 side) of the frame portion of the reflective frame 23.
  • the projection 23b of the reflection frame 23 is inserted into the through hole 22f of the frame portion 22a, and in this state, the projection 23b of the reflection frame 23 is caulked into the through hole 22f of the frame portion 22a.
  • the light emitting characteristics, the heat radiation characteristics, and the reliability are improved by using a white silicone-based adhesive material as the constituent material of the fixing members 26 to 28, as in the first embodiment.
  • the effect of can be obtained.
  • the projecting portion 22d is formed on the frame portion 22a, and the projecting portion 22d of the frame portion 22a is brought into direct contact with the reflecting frame 23, whereby the frame portion 22a and the reflecting frame are formed. Therefore, the heat conduction to and from the heater 23 becomes better, and more efficient heat dissipation can be performed.
  • the reflection frame 23 does not directly contact the frame portion 22b, the frame portion 22a and the frame portion 22b are not electrically connected via the reflection frame 23.
  • the through hole 22f is formed in the frame portion 22a
  • the projection 23b is formed in the reflection frame 23
  • the projection 23b of the reflection frame 23 is formed in the through hole 22f of the frame portion 22a.
  • the fixing member 27 (fixing member disposed between the frame 22 and the reflecting frame 23) 27 that fixes the frame 22 and the reflecting frame 23 is fixed. Migration may be suppressed by intentionally protruding a part to the outside. Further, in this case, since the adhesion area is increased by the extent that the fixing member 27 protrudes to the outside, the fixing between the frame 22 and the reflection frame 23 can be further strengthened.
  • the cross-sectional shape of the gap between the frame portion 22a and the frame portion 22b is a step (two-stage) shape, the upper gap width is narrow, and the lower gap width is Is getting wider.
  • the reason why the upper gap width is narrowed is to reduce light leakage as much as possible, and the lower gap width is widened to suppress the occurrence of short-circuit defects during soldering.
  • frame 22 and the adhering member 26 increases, and generation
  • the projection 23b of the reflection frame 23 may be press-fitted into the through hole 22f of the frame portion 22a. In this case, it is possible to easily attach the reflection frame 23 to the frame portion 22a.
  • a gap is provided between the through hole 22f of the frame portion 22a and the projection 23b of the reflection frame 23, and a part of the fixing member 27 is provided in the gap. May be embedded.
  • heat between the frame portion 22a and the reflection frame 23 is caused by a part of the fixing member 27 (portion embedded between the through hole 22f of the frame portion 22a and the projection 23b of the reflection frame 23). The effect that the difference in expansion can be absorbed is obtained.
  • the outer shape of the portion of the frame portions 22a and 22b that overlaps the frame portion of the reflection frame 23 is changed to form the frame portion 22a.
  • two new through holes (concave portions) 22g may be formed in the frame portion 22b.
  • FIG. 34 if a part of the fixing member 27 is embedded between the through hole 22g of the frame portion 22b and the protrusion 23b of the reflection frame 23, the frame portion 22b and the reflection frame 23 are electrically connected.
  • the insulation between the frame portion 22b and the reflection frame 23 can be strengthened while insulating.
  • the LED 31 as the light emitting element is mounted on the frame 32 as in the first embodiment, and the frame-shaped reflecting surface 33a is mounted on the frame 32.
  • a reflection frame 33 having the above is disposed.
  • the LED 31 is sealed by a sealing member (silicone sealing material) 34 embedded in the opening of the reflection frame 33.
  • the frame 32 is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy, and is subjected to the same plating process as the plating process applied to the frame 2 of the first embodiment.
  • the frame 32 is divided into a frame portion 32a having a large plane area and a frame portion 32b having a plane area smaller than that of the frame portion 32a.
  • the LED 31 is disposed on the LED mounting portion (center portion of the frame 32) 32c of the frame portion 32a, and is electrically connected to the frame portions 32a and 32b via wires 35.
  • the frame portions 32a and 32b included in the frame 32 are examples of the “first frame portion” and the “second frame portion” of the present invention, respectively. 38. As shown in FIG.
  • the reflective frame 33 is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy, and is similar to the plating process applied to the reflective frame 3 of the first embodiment (alumite treatment and chemical treatment). (Including polishing etc.). And the reflective surface 33a of this reflective frame 33 has the inclined surface which spreads radially, and the perpendicular surface connected with the inclined surface. Note that FIG. 39 shows the reflection frame 33 as seen from the frame 32 side.
  • a predetermined portion of the frame 32 is formed with a protruding portion 32 d that protrudes toward the reflecting frame 33 rather than other portions.
  • the protruding portion 32d of the frame 32 is provided in a portion of the frame portion 32a excluding the LED mounting portion 32c and the outer peripheral portion 32e, and is not provided in the frame portion 32b.
  • four protrusions (convex portions) 32f are formed in the protruding portion 32d of the frame portion 32a so as to protrude further toward the reflecting frame 33 from the protruding portion 32d.
  • non-through holes (concave portions) 33b are formed on the back surface side (frame 32 side) of the frame portion of the reflective frame 33.
  • the non-through hole 33b of the reflection frame 33 has a shape in which the protrusion 32f of the frame portion 32a can be inserted.
  • the frame portion of the reflection frame 33 is placed directly on the protruding portion 32d of the frame portion 32a, whereby the frame portion 32a and the reflection frame 33 are in direct contact with each other. Yes. Further, since the frame portion of the reflection frame 33 is placed directly on the protruding portion 32d of the frame portion 32a, the outer peripheral portion 32e of the frame portion 32a and the frame portion of the reflection frame 33 are separated from each other, and the frame portion 32b and the frame part of the reflective frame 33 are spaced apart.
  • the protrusion 32f of the frame portion 32a is inserted into the non-through hole 33b of the reflection frame 33 in a state where the frame portion of the reflection frame 33 is directly placed on the protruding portion 32d of the frame portion 32a. Note that the tip of the protrusion 32f of the frame portion 32a and the bottom of the non-through hole 33b of the reflection frame 33 are separated from each other.
  • the frame portions 32a and 32b are fixed to each other by the fixing member 36 made of white silicone adhesive material, and the frame 32 is reflected from the frame 32 by the fixing member 37 made of white silicone adhesive material.
  • the frame 33 is fixed, and the LED 31 and the frame portion 32a (LED mounting portion 32c) are fixed by a white silicone-based adhesive material.
  • the white silicone-based adhesive materials constituting the fixing members 36 to 38 are the same material, for example, “KER-3100-U2” and “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd. It is.
  • the fixing members 36 to 38 are examples of the “first fixing member”, the “second fixing member”, and the “third fixing member” in the present invention, respectively.
  • the fixing member 36 for fixing the frame portions 32a and 32b to each other is formed to have substantially the same thickness as the plate thickness of the frame 32, and is disposed over the entire region between the frame portion 32a and the frame portion 32b. Yes. Therefore, no gap is generated between the frame portion 32a and the frame portion 32b.
  • region in planar view of this adhering member 36 is the area
  • the fixing member 37 for fixing the frame 32 and the reflection frame 33 is an area between the frame 32 and the frame portion of the reflection frame 33 and the region where the frame 32 and the frame portion of the reflection frame 33 overlap.
  • the protrusion 32d of the frame portion 32a is disposed in a region that does not exist.
  • the fixing member 37 is disposed between the tip end portion of the protrusion 32 f of the frame portion 32 a and the bottom portion of the non-through hole 33 b of the reflection frame 33.
  • the fixing member 37 is also arranged in a region where the fixing member 36 and the frame portion of the reflection frame 33 overlap. For this reason, no gap is generated between the frame 32 and the frame portion of the reflection frame 33.
  • region in planar view of this adhering member 37 is an area
  • the fixing member 38 for fixing the LED 31 and the frame portion 32a (the LED mounting portion 32c) is arranged in the lattice-shaped hatched region 30c in FIG. Become.
  • the fixing member 39 is also provided on the back side of the frame 32 (the side opposite to the reflection frame 33 side), but the fixing member 39 on the back side of the frame 32 may be provided, It does not have to be provided.
  • the light emitting characteristics, the heat radiation characteristics, and the reliability are improved by using a white silicone-based adhesive material as the constituent material of the fixing members 36 to 38, as in the first embodiment.
  • the effect of can be obtained.
  • the protrusion 32d is formed on the frame 32a, and the protrusion 32d of the frame 32a is brought into direct contact with the reflection frame 33, whereby the frame 32a and the reflection frame are formed.
  • the heat conduction to and from 33 becomes better, and the heat dissipation characteristics are further improved.
  • the reflection frame 33 does not directly contact the frame portion 32b, the frame portion 32a and the frame portion 32b are not electrically connected via the reflection frame 33.
  • the protrusion 32f is formed in the frame portion 32a
  • the non-through hole 33b is formed in the reflection frame 33
  • the protrusion 32f of the frame portion 32a is formed in the non-through hole of the reflection frame 33.
  • the projection 32f of the frame portion 32a can function as a thermal via, so that heat dissipation becomes more efficient.
  • the fixing strength between the frame portion 32a and the reflection frame 33 is also increased by fixing the tip of the projection 32f of the frame portion 32a and the bottom of the non-through hole 33b of the reflection frame 33 with the fixing member 37. Can do. Further, it is possible to prevent the reflective frame 33 from being displaced laterally with respect to the frame 32.
  • the fixing member 37 (fixing member disposed between the frame 32 and the reflecting frame 33) 37 that fixes the frame 32 and the reflecting frame 33 is fixed. Migration may be suppressed by intentionally protruding a part to the outside. Further, in this case, since the adhesion area is increased by the extent that the fixing member 37 protrudes to the outside, the fixing between the frame 32 and the reflection frame 33 can be further strengthened.
  • a metal structure in which a plurality of frames 32 having frame portions 32a and 32b that are electrically insulated from each other are connected in a matrix is used. Make it. At this time, a projecting portion 32d is formed by projecting a predetermined portion of the frame portion 32a from other portions, and a projection 32f is further formed in the projecting portion 32d.
  • a metal structure in which a plurality of reflection frames 33 each having a frame-like reflection surface 33a are connected in a matrix is also produced.
  • a non-through hole 33 b into which the protrusion 32 f of the frame portion 32 a can be inserted is formed on the back side of the frame portion of the reflective frame 33.
  • the fixing members 36 to 38 are simultaneously applied to the regions 30a to 30c by using a screen printing method, a dispensing method, or the like. Further, the fixing member 37 is also applied to the non-through holes 33b formed on the back side of the frame portion of the reflective frame 33 and other concave portions.
  • the reflection frame 33 is disposed on the frame 32 via the fixing member 37, and the LED 31 is mounted on the frame portion 32 a (LED mounting portion 32 c) via the fixing member 38.
  • the distance between the frame 32 and the reflection frame 33 is maintained by placing the frame portion of the reflection frame 33 directly on the protruding portion 32d of the frame portion 32a.
  • the fixing members 36 to 38 are cured simultaneously, thereby fixing the frame portion 32a and the frame portion 32b, fixing the frame 32 and the reflection frame 33, and LED 31 and the frame portion 32a (LED mounting).
  • the fixing with the part 32c) is performed at the same time.
  • the light emitting device 30 according to the third embodiment shown in FIGS. 35 to 37 is manufactured through a wire bonding process, a sealing process, and a separation process.
  • the LED 41 as a light emitting element is mounted on the frame 42 as in the first embodiment, and the frame-shaped reflecting surface 43a is mounted on the frame 42.
  • a reflection frame 43 having the following is arranged.
  • the LED 41 is sealed by a sealing member (silicone sealing material) 44 embedded in the opening of the reflection frame 43.
  • the frame 42 is made of a high heat conductive material such as aluminum, aluminum alloy, copper and copper alloy, and is subjected to the same plating process as the plating process applied to the frame 2 of the first embodiment.
  • the frame 42 is divided into one frame part 42a having a large plane area and six frame parts 42b having a plane area smaller than that of the frame part 42a.
  • the LED 41 is disposed on the LED mounting portion (a central portion of the frame 42) 42c of the frame portion 42a and is electrically connected to the frame portion 42b via a wire 45.
  • the frame portions 42a and 42b included in the frame 42 are examples of the “first frame portion” and the “second frame portion” of the present invention, respectively, and the detailed shapes are as shown in FIG. It has become.
  • the reflection frame 43 is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy, and is similar to the plating treatment applied to the reflection frame 3 of the first embodiment (alumite treatment and chemical treatment). (Including polishing etc.). And the reflective surface 43a of the reflective frame 43 is formed so that it may become the inclined surface which spreads radially.
  • the shape of the reflection surface 43a of the reflection frame 43 may be a combination of an inclined surface and a vertical surface, as in the other embodiments.
  • the detailed shape of the reflection frame 43 is as shown in FIGS.
  • the frame 42 and the reflection frame 43 are in direct contact with each other at a predetermined portion.
  • a predetermined portion on the back side (frame 42 side) of the frame portion of the reflective frame 43 is protruded from the other portion (directly with respect to the frame 42).
  • (Contact portion) 43b is formed.
  • the protrusion part 43b of this reflective frame 43 is provided in the part which overlaps with the frame part 42a, and is not provided in the part which overlaps with the frame part 42b.
  • the protrusion 43b of the reflection frame 43 is placed directly on the frame portion 42a, whereby the frame portion 42a and the reflection frame 43 are in direct contact with each other. Further, the protruding portion 43b of the reflection frame 43 is directly placed on the frame portion 42a, so that the frame portion 42b and the frame portion of the reflection frame 43 are separated from each other.
  • the frame portions 42a and 42b are fixed to each other by the fixing member 46 made of a white silicone adhesive material, and the frame 42 is reflected from the frame 42 by the fixing member 47 made of a white silicone adhesive material.
  • the frame 43 is fixed, and the LED 41 and the frame portion 42a (LED mounting portion 42c) are fixed by a fixing member 48 made of a white silicone-based adhesive material.
  • the white silicone adhesive materials constituting the fixing members 46 to 48 are the same material, such as “KER-3100-U2” and “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd. is there.
  • the fixing members 46 to 48 are examples of the “first fixing member”, the “second fixing member”, and the “third fixing member” in the present invention, respectively.
  • the fixing member 46 for fixing the frame portions 42a and 42b to each other is formed to have substantially the same thickness as the plate thickness of the frame 42, and is disposed in the entire region between the frame portion 42a and the frame portion 42b. Yes. Therefore, there is no gap between the frame part 42a and the frame part 42b.
  • region in planar view of this adhering member 46 is the area
  • the fixing member 47 for fixing the frame 42 and the reflection frame 43 is an area between the frame 42 and the frame portion of the reflection frame 43 and an area where the frame 42 and the frame portion of the reflection frame 43 overlap.
  • the reflection frame 43 is disposed in a region where the protruding portion 43b does not exist.
  • the fixing member 47 is also disposed in a region where the fixing member 46 and the frame portion of the reflection frame 43 overlap. For this reason, there is no gap between the frame 42 and the frame portion of the reflection frame 43.
  • region in planar view of this adhering member 47 is an area
  • the fixing member 48 for fixing the LED 41 and the frame part 42a (LED mounting part 42c) is arranged in a lattice-shaped hatched region 40c in FIG. Become.
  • two through holes (concave portions) 42d penetrating in the plate thickness direction are formed in the portion of the frame portion 42a that overlaps the frame portion of the reflective frame 43.
  • two projections (convex portions) 43c that can be inserted into the through holes 42d of the frame portion 42a are formed on the back surface side (the frame 42 side) of the frame portion of the reflective frame 43. ing.
  • the projection 43c of the reflection frame 43 is press-fitted into the through hole 42d of the frame portion 42a, and thereby the reflection frame 43 is fixed to the frame portion 42a.
  • an extremely thin fixing member may be disposed in a region where the projection 43c of the reflection frame 43 exists.
  • the fixing member is not disposed in advance in the region where the protrusion 43c of the reflection frame 43 exists, but the fixing member may penetrate from other regions.
  • the fixing of the reflection frame 43 to the frame portion 42a may be performed by press-fitting the projection 43c of the reflection frame 43 into the through hole 42d of the frame portion 42a.
  • the protrusion 43c of the reflection frame 43 may be caulked in the through hole 42d of 42a.
  • a gap may be provided between the through hole 42d of the frame portion 42a and the projection 43c of the reflection frame 43, and a part of the fixing member 47 may be embedded in the gap.
  • the light emitting characteristics, the heat dissipation characteristics, and the reliability are improved by using a white silicone-based adhesive material as the constituent material of the fixing members 46 to 48, as in the first embodiment.
  • the effect of can be obtained.
  • the projection 43b is formed in the reflection frame 43, and the projection 43b of the reflection frame 43 is brought into direct contact with the frame 42a, whereby the frame 42a and the reflection frame 43 are formed. Therefore, more efficient heat dissipation can be performed. In this case, since the reflection frame 43 is not in direct contact with the frame portion 42b, the frame portion 42a and the frame portion 42b are not electrically connected via the reflection frame 43.
  • the through hole 42d is formed in the frame portion 42a
  • the projection 43c is formed in the reflective frame 43
  • the projection 43c of the reflective frame 43 is formed in the through hole 42d of the frame portion 42a.
  • the fixing member 47 fixing member disposed between the frame 42 and the reflecting frame 43 47 that fixes the frame 42 and the reflecting frame 43 is fixed. Migration may be suppressed by intentionally protruding a portion outward. Further, in this case, since the adhesion area is increased by the extent that the fixing member 47 protrudes to the outside, the fixing between the frame 42 and the reflection frame 43 can be further strengthened.
  • a reflection frame 53 (reflection surface 53a) having a shape as shown in FIG. 61 is used.
  • the reflection frame 53 is obtained by deep drawing a metal plate and has a height (for example, about 5 cm) larger than the reflection frame of other embodiments.
  • the reflective frame 53 is attached to the frame 32 similar to that of the third embodiment, the state shown in FIG. 61 is obtained.
  • the reflection frame 53 having a large height it is possible to radiate heat more efficiently and to improve the light collecting property.
  • the electrode lead 32g for facilitating connection with the outside may be extended.

Abstract

A light-emitting device having improved heat dissipation characteristics and reliability. A light-emitting device is provided with: a light-emitting element; a metallic frame provided with a first frame section and a second frame section, which are electrically insulated from each other, and having the light-emitting element mounted on the first frame section; and a reflecting frame disposed on the frame and provided with a frame-like reflecting surface for surrounding the light-emitting element. Either a recess or a protrusion is formed on the frame, the other is formed on the reflecting frame, and the protrusion is inserted in the recess.

Description

発光装置Light emitting device
　本発明は、発光装置に関する。 The present invention relates to a light emitting device.
　従来、発光ダイオード素子（ＬＥＤ）などの発光素子を光源とする発光装置が知られている（たとえば、特許文献１参照）。以下に、図６３を参照して、従来の発光装置の構成の一例を簡単に説明する。 Conventionally, a light-emitting device using a light-emitting element such as a light-emitting diode element (LED) as a light source is known (for example, see Patent Document 1). Hereinafter, an example of the configuration of a conventional light emitting device will be briefly described with reference to FIG.
　従来の発光装置では、ＬＥＤ１０１が金属製のフレーム１０２上に搭載されている。ＬＥＤ１０１が搭載されるフレーム１０２は、互いに電気的に絶縁された２つのフレーム部１０２ａおよび１０２ｂを有しており、それらのうちの一方のフレーム部１０２ａにＬＥＤ１０１が固着されている。そして、従来では、ＬＥＤ１０１からの光に指向性を持たせるために、枠状の反射面を有する反射枠１０３をフレーム１０２上に配置し、その反射枠１０２の反射面でＬＥＤ１０１を取り囲んでいる。 In the conventional light emitting device, the LED 101 is mounted on a metal frame 102. The frame 102 on which the LED 101 is mounted has two frame portions 102a and 102b that are electrically insulated from each other, and the LED 101 is fixed to one of the frame portions 102a. Conventionally, in order to give directivity to the light from the LED 101, a reflective frame 103 having a frame-shaped reflective surface is disposed on the frame 102, and the LED 101 is surrounded by the reflective surface of the reflective frame 102.
　また、従来では、フレーム部１０２ａとフレーム部１０２ｂとの間に固着部材１０４を配置し、その固着部材１０４によってフレーム部１０２ａとフレーム部１０２ｂとを固着している。さらに、フレーム１０２と反射枠１０３との間には固着部材１０５を配置し、その固着部材１０５によってフレーム１０２と反射枠１０３とを固着している。なお、固着部材１０４および１０５の構成材料としては、白色エポキシ樹脂や透明ポリオレフィン樹脂などである。 Further, conventionally, the fixing member 104 is disposed between the frame portion 102 a and the frame portion 102 b, and the frame portion 102 a and the frame portion 102 b are fixed by the fixing member 104. Further, a fixing member 105 is disposed between the frame 102 and the reflection frame 103, and the frame 102 and the reflection frame 103 are fixed by the fixing member 105. In addition, as a constituent material of the fixing members 104 and 105, a white epoxy resin, a transparent polyolefin resin, or the like is used.
特開２００８－２８２９１７号公報Japanese Patent Laid-Open No. 2008-28217
　上記した従来の構成では、ＬＥＤ１０１で生成された光が固着部材１０４および１０５に照射されると、固着部材１０４および１０５が変色してしまうので、時間が経過するにつれて発光光度が変化（多くの場合は低下）したり、色度が変化したりする場合がある。また、透明ポリオレフィン樹脂を使用した場合には、ＬＥＤ１０１で生成された光が固着部材１０４および１０５を透過し、それによって光漏れが発生するとともに、時間が経過するにつれて発光光度および色度に変化が生じる。 In the above-described conventional configuration, when the light generated by the LED 101 is applied to the fixing members 104 and 105, the fixing members 104 and 105 are discolored, so that the luminous intensity changes with time (in many cases). May decrease) or the chromaticity may change. Further, when a transparent polyolefin resin is used, light generated by the LED 101 passes through the fixing members 104 and 105, thereby causing light leakage, and changes in luminous intensity and chromaticity as time passes. Arise.
　また、フレーム部１０２ａとフレーム部１０２ｂとの間の熱伝導が固着部材１０４によって阻害され、かつ、フレーム１０２と反射枠１０３との間の熱伝導が固着部材１０５によって阻害されるので、ＬＥＤ１０１の発熱が放熱され難くなるという不都合もある。 Further, the heat conduction between the frame portion 102a and the frame portion 102b is hindered by the fixing member 104, and the heat conduction between the frame 102 and the reflection frame 103 is hindered by the fixing member 105. There is also a disadvantage that it is difficult to dissipate heat.
　特に、フレーム１０２と反射枠１０３との間の熱伝導が固着部材により阻害されるという事態は問題であり、発光素子の品質を維持する為にはこのような問題は特に解決すべき課題である。
さらに、フレーム１０２および反射枠１０３が熱膨張した場合には、フレーム１０２と反射枠１０３との間の熱膨張の差に起因して、フレーム１０２に反りが発生したり、フレーム１０２から反射枠１０３が剥離したりすることで装置が破損してしまうこともある。 In particular, the situation where the heat conduction between the frame 102 and the reflection frame 103 is hindered by the fixing member is a problem, and such a problem is a problem to be solved particularly in order to maintain the quality of the light emitting element. .
Further, when the frame 102 and the reflection frame 103 are thermally expanded, the frame 102 is warped due to a difference in thermal expansion between the frame 102 and the reflection frame 103 or the frame 102 is reflected from the reflection frame 103. The device may be damaged due to peeling.
　これらの結果、上記した従来の構成では、特に放熱特性および信頼性を向上させることが困難であるという問題がある。 As a result, the conventional configuration described above has a problem that it is particularly difficult to improve heat dissipation characteristics and reliability.
　本発明は、上記課題を解決するためになされたものであり、特に放熱特性および信頼性を向上させることが可能な発光装置を提供することを目的とする。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a light-emitting device capable of improving heat dissipation characteristics and reliability.
　上記目的を達成するために、本発明の第１の局面による発光装置は、発光素子と、互いに電気的に絶縁された第１フレーム部および第２フレーム部を有し、第１フレーム部上に発光素子が搭載される金属製のフレームと、フレーム上に配置され、発光素子を取り囲む枠状の反射面を有する反射枠と、を有し、更に、フレームに凹部および凸部の一方が形成されているとともに、反射枠に凹部および凸部の他方が形成されており、凹部に凸部が挿入されている。このように構成すれば、凸部がサーマルビアとして機能するため、より効率的に放熱することができる。また、フレームに対して反射枠が横方向に位置ずれしてしまうのも抑制することができる。なお、凹部としては、貫通穴であってもよいし、非貫通穴であってもよい。
フレームに形成された凹部および凸部の一方に対して反射枠に形成された凹部および凸部の他方が挿入されている場合において、第１フレーム部に凹部および凸部の一方が形成されており、その第１フレーム部に形成された凹部および凸部の一方に、反射枠に形成された凹部および凸部の他方がかしめられていてもよい。このように構成すれば、第１フレーム部と反射枠との間の固着強度をより高めることができる。
また、フレームに形成された凹部および凸部の一方に対して反射枠に形成された凹部および凸部の他方が挿入されている場合において、第１フレーム部に凹部および凸部の一方が形成されており、その第１フレーム部に形成された凹部および凸部の一方に、反射枠に形成された凹部および凸部の他方が圧入されていてもよい。このように構成すれば、第１フレーム部と反射枠との間の固着強度を容易に高めることができる。なお、ここで述べた圧入とは、凹部の開口径を凸部の径よりも小さくし、強い圧力で凹部に凸部を押し込むことである。
さらに、フレームに形成された凹部および凸部の一方に対して反射枠に形成された凹部および凸部の他方が挿入されている場合において、第１フレーム部に凹部および凸部の一方が形成されており、その第１フレーム部に形成された凹部および凸部の一方と、反射枠に形成された凹部および凸部の他方との間に固着部材が埋め込まれていてもよい。このように構成すれば、第１フレーム部と反射枠との間の固着強度についてはかしめ構造や圧入構造よりも劣るが、固着部材が緩衝材として機能するので、フレームと反射枠との間の熱膨張の差に起因する不都合の発生を抑制するのには有効である。 In order to achieve the above object, a light-emitting device according to a first aspect of the present invention includes a light-emitting element and a first frame portion and a second frame portion that are electrically insulated from each other. A metal frame on which the light-emitting element is mounted; and a reflective frame having a frame-like reflecting surface that is disposed on the frame and surrounds the light-emitting element, and further, one of the concave portion and the convex portion is formed on the frame. In addition, the other of the concave portion and the convex portion is formed in the reflection frame, and the convex portion is inserted into the concave portion. If comprised in this way, since a convex part functions as a thermal via, it can thermally radiate more efficiently. In addition, it is possible to prevent the reflective frame from being displaced in the lateral direction with respect to the frame. In addition, as a recessed part, a through hole may be sufficient and a non-through hole may be sufficient.
When the other of the concave and convex portions formed on the reflective frame is inserted into one of the concave and convex portions formed on the frame, one of the concave and convex portions is formed on the first frame portion. The other of the concave and convex portions formed on the reflective frame may be caulked to one of the concave and convex portions formed on the first frame portion. If comprised in this way, the adhering strength between a 1st frame part and a reflective frame can be raised more.
In addition, when the other of the concave portion and the convex portion formed in the reflection frame is inserted into one of the concave portion and the convex portion formed in the frame, one of the concave portion and the convex portion is formed in the first frame portion. In addition, the other of the concave portion and the convex portion formed in the reflection frame may be press-fitted into one of the concave portion and the convex portion formed in the first frame portion. If comprised in this way, the adhering strength between a 1st frame part and a reflective frame can be raised easily. The press-fitting described here is to make the opening diameter of the concave portion smaller than the diameter of the convex portion and push the convex portion into the concave portion with a strong pressure.
Furthermore, when the other of the concave part and the convex part formed in the reflective frame is inserted into one of the concave part and the convex part formed in the frame, one of the concave part and the convex part is formed in the first frame part. The fixing member may be embedded between one of the concave portion and the convex portion formed in the first frame portion and the other of the concave portion and the convex portion formed in the reflective frame. If comprised in this way, although the adhering strength between the 1st frame part and a reflective frame is inferior to a caulking structure or a press fit structure, since an adhering member functions as a buffering material, it is between a frame and a reflective frame. This is effective in suppressing the occurrence of inconvenience due to the difference in thermal expansion.
　フレームに形成された凹部および凸部の一方に対して反射枠に形成された凹部および凸部の他方が挿入されている場合において、第２フレーム部に凹部および凸部の一方が形成されており、その第２フレーム部に形成された凹部および凸部の一方と、反射枠に形成された凹部および凸部の他方との間に固着部材が埋め込まれていてもよい。このように構成すれば、第２フレーム部と反射枠とを電気的に絶縁しながら、第２フレーム部と反射枠との固着を強固にすることができる。 When the other of the concave and convex portions formed in the reflective frame is inserted into one of the concave and convex portions formed in the frame, one of the concave and convex portions is formed in the second frame portion. The fixing member may be embedded between one of the concave portion and the convex portion formed in the second frame portion and the other of the concave portion and the convex portion formed in the reflective frame. If comprised in this way, fixation of a 2nd frame part and a reflective frame can be strengthened, electrically insulating a 2nd frame part and a reflective frame.
　上記第１の局面による発光装置において、第１フレーム部および反射枠の一方に突出部が形成されており、第１フレーム部および反射枠の他方に突出部が直接接触していてもよい。このように構成すれば、第１フレーム部と反射枠との間の熱伝導がより良好になり、さらに効率的な放熱を行うことができる。なお、この場合には、第２フレーム部には反射枠が直接接触しないので、反射枠を介して第１フレーム部と第２フレーム部とが電気的に接続されることはない。
上記第１の局面による発光装置において、フレームが複数のフレーム部を含んでおり、その複数のフレーム部のうちの平面積が最も大きいフレーム部が第１フレーム部となっていることが好ましい。このように構成すれば、複数のフレーム部のうちの平面積が最も大きいフレーム部である第１フレーム部に発光素子が搭載されるので、発光素子の発熱が放熱され易くなる。なお、平面積とは、平面的に見た場合の面積のことである。また、第１フレーム部が１つで第２フレーム部が２つ以上の場合、２つ以上の第２フレーム部の平面積の合計が第１フレーム部の平面積よりも大きくなっていてもよい。 In the light emitting device according to the first aspect, a protrusion may be formed on one of the first frame part and the reflection frame, and the protrusion may be in direct contact with the other of the first frame part and the reflection frame. If comprised in this way, the heat conduction between a 1st flame | frame part and a reflective frame will become better, and more efficient heat dissipation can be performed. In this case, since the reflection frame does not directly contact the second frame portion, the first frame portion and the second frame portion are not electrically connected via the reflection frame.
In the light emitting device according to the first aspect, it is preferable that the frame includes a plurality of frame portions, and the frame portion having the largest plane area among the plurality of frame portions is the first frame portion. If comprised in this way, since a light emitting element is mounted in the 1st frame part which is a frame part with the largest plane area among several frame parts, the heat_generation | fever of a light emitting element will become easy to thermally radiate. In addition, a plane area is an area when seen in a plane. In addition, when there is one first frame portion and two or more second frame portions, the total area of the two or more second frame portions may be larger than the area of the first frame portion. .
　上記第１の局面による発光装置において、反射枠が金属からなっていることがより好ましい。このように構成すれば、反射枠を介しての放熱を良好に行うことができる。また、反射枠が樹脂製である場合には、光と熱によって反射枠が変色（黒変）することで光吸収が増大（反射率が低下）して発光光度が低下するという不都合があったが、この構成では、発光光度の低下を大幅に低減することができる。
反射枠が金属からなっている場合において、反射枠を構成する金属材料がフレームを構成する金属材料と同じものであることが好ましい。このように構成すれば、フレームおよび反射枠のそれぞれの熱膨張率が互いに同じになるので、熱膨張率の違いに起因するフレームからの反射枠の剥離をより抑制することができる。 In the light emitting device according to the first aspect, it is more preferable that the reflection frame is made of metal. If comprised in this way, heat dissipation through a reflective frame can be performed favorably. Further, when the reflection frame is made of resin, there is a disadvantage that the light absorption increases due to the discoloration (black discoloration) of the reflection frame due to light and heat, thereby reducing the luminous intensity. However, with this configuration, a decrease in luminous intensity can be significantly reduced.
In the case where the reflection frame is made of metal, the metal material constituting the reflection frame is preferably the same as the metal material constituting the frame. If comprised in this way, since each coefficient of thermal expansion of a flame | frame and a reflective frame becomes mutually the same, peeling of the reflective frame from the flame | frame resulting from the difference in a thermal expansion coefficient can be suppressed more.
　上記第１の局面による発光装置において、反射枠の反射面のフレーム側の部分が放射状に広がるような傾斜面となっている一方、反射枠の反射面のフレーム側とは反対側の部分が垂直面となっていてもよい。このように構成すれば、反射枠の反射面で囲まれた部分内に封止部材が埋め込まれている場合、その封止部材と反射枠の反射面との間の接着面積が増大する。これにより、反射枠の反射面からの封止部材の剥離をより抑制することができる。 In the light emitting device according to the first aspect, the frame-side portion of the reflection surface of the reflection frame is an inclined surface that spreads radially, while the portion of the reflection frame opposite to the frame side is vertical. It may be a surface. If comprised in this way, when the sealing member is embedded in the part enclosed by the reflective surface of a reflective frame, the adhesion area between the sealing member and the reflective surface of a reflective frame will increase. Thereby, peeling of the sealing member from the reflective surface of a reflective frame can be suppressed more.
　上記目的を達成するために、本発明の第２の局面による発光装置は、発光素子と、互いに電気的に絶縁された第１フレーム部および第２フレーム部を有し、第１フレーム部上に発光素子が搭載される金属製のフレームと、フレーム上に配置され、発光素子を取り囲む枠状の反射面を有する反射枠と、第１フレーム部および第２フレーム部を互いに固着する第１固着部材と、フレームおよび反射枠を互いに固着する第２固着部材とを備えている。そして、第１固着部材および第２固着部材が共に白色のシリコーン系接着材料からなっている。
尚、本実施例では白色系のシリコーン系接着材料を用いているが、白色成形樹脂（例えば、アモデル等）を使用して樹脂成形しても良い。 In order to achieve the above object, a light-emitting device according to a second aspect of the present invention includes a light-emitting element, and a first frame part and a second frame part that are electrically insulated from each other, and is provided on the first frame part. A metal frame on which the light emitting element is mounted, a reflective frame having a frame-like reflecting surface disposed on the frame and surrounding the light emitting element, and a first fixing member for fixing the first frame part and the second frame part to each other And a second fixing member for fixing the frame and the reflection frame to each other. The first fixing member and the second fixing member are both made of a white silicone-based adhesive material.
In this embodiment, a white silicone-based adhesive material is used, but a white molding resin (for example, Amodel etc.) may be used for resin molding.
　第２の局面では、上記のように、第１フレーム部および第２フレーム部を互いに固着するための第１固着部材の構成材料を白色のシリコーン系接着材料とするとともに、フレームおよび反射枠を互いに固着するための第２固着部材の構成材料も白色のシリコーン系接着材料とすることによって、以下のような効果が得られる。 In the second aspect, as described above, the constituent material of the first fixing member for fixing the first frame portion and the second frame portion to each other is a white silicone-based adhesive material, and the frame and the reflection frame are mutually connected. The following effects can be obtained by using a white silicone-based adhesive material as the constituent material of the second fixing member for fixing.
　すなわち、第１固着部材および第２固着部材の構成材料を白色のシリコーン系接着材料とすることによって、白色のシリコーン系接着材料は光を反射する材料であるので、発光素子で生成された光が第１固着部材および第２固着部材に達すると、その光が第１固着部材および第２固着部材で反射されることになる。したがって、所望方向とは異なる方向に漏れ出る光（第１フレーム部と第２フレーム部との間から漏れ出る光、および、フレームと反射枠との間から漏れ出る光）が減少し、その分、所望方向への発光を増大させることができる。また、白色のシリコーン系接着材料は光の照射による変色が少ないので、発光光度および色度などの変化を抑制することもできる。 That is, by using white silicone adhesive material as the constituent material of the first fixing member and the second fixing member, the white silicone adhesive material is a material that reflects light. When reaching the first fixing member and the second fixing member, the light is reflected by the first fixing member and the second fixing member. Therefore, light leaking in a direction different from the desired direction (light leaking from between the first frame part and the second frame part and light leaking from between the frame and the reflection frame) is reduced, and accordingly. The light emission in the desired direction can be increased. In addition, since the white silicone-based adhesive material has little discoloration due to light irradiation, it is possible to suppress changes in luminous intensity, chromaticity, and the like.
　また、上記のように構成すると、白色のシリコーン系接着材料は熱伝導性を比較的高くすることが可能な材料であるため、第１固着部材を介してなされる第１フレーム部と第２フレーム部との間の熱伝導、および、第２固着部材を介してなされるフレームと反射枠との間の熱伝導が良好になる。それに加えて、シリコーン系接着材料は耐熱性も高い。したがって、白色で熱伝導率を高められる酸化チタン粒子などをシリコーン系接着材料に含有することで、比較的薄い膜厚で必要な絶縁耐圧を確保できる白色のシリコーン系接着材料を得ることが可能である。このため、発光素子で発生した熱を効率良く放熱することができると同時に、信頼性も確保し易い。 In addition, since the white silicone-based adhesive material is a material that can have relatively high thermal conductivity when configured as described above, the first frame portion and the second frame that are formed via the first fixing member. The heat conduction between the frames and the heat conduction between the frame and the reflection frame made through the second fixing member are improved. In addition, the silicone-based adhesive material has high heat resistance. Therefore, it is possible to obtain a white silicone-based adhesive material that can ensure the required withstand voltage with a relatively thin film thickness, by including titanium oxide particles that are white and have improved thermal conductivity in the silicone-based adhesive material. is there. For this reason, it is possible to efficiently dissipate heat generated in the light emitting element, and at the same time, it is easy to ensure reliability.
　さらに、上記のように構成すると、白色のシリコーン系接着材料は緩衝材としても使える材料であるので、フレームおよび反射枠が熱膨張したとしても、フレームと反射枠との間の熱膨張の差が第２固着部材で吸収されることになる。これにより、フレームに反りが発生したり、フレームから反射枠が剥離したりすることで装置が破損してしまうのを抑制することができる。 Furthermore, when configured as described above, the white silicone-based adhesive material is a material that can also be used as a cushioning material. Therefore, even if the frame and the reflective frame thermally expand, there is a difference in thermal expansion between the frame and the reflective frame. It is absorbed by the second fixing member. Thereby, it can suppress that a device generate | occur | produces that a curvature | warp generate | occur | produces or a reflection frame peels from a flame | frame.
　これらの結果、第２の局面による発光装置では、発光特性、放熱特性および信頼性を向上させることが可能となる。 As a result, in the light emitting device according to the second aspect, it is possible to improve the light emission characteristics, the heat dissipation characteristics and the reliability.
　上記第２の局面による発光装置において、第１固着部材を構成する白色のシリコーン系接着材料および第２固着部材を構成する白色のシリコーン系接着材料が互いに同じ材料であることが好ましい。このように構成すれば、第１固着部材となる白色のシリコーン系接着材料と第２固着部材となる白色のシリコーン系接着材料とを別々に準備する必要がなくなるので、コストの削減を図ることができる。
上記第２の局面による発光装置において、フレームに凹部および凸部の一方が形成されているとともに、反射枠に凹部および凸部の他方が形成されており、凹部に凸部が挿入されていてもよい。このように構成すれば、凸部がサーマルビアとして機能するため、より効率的に放熱することができる。また、フレームに対して反射枠が横方向に位置ずれしてしまうのも抑制することができる。なお、凹部としては、貫通穴であってもよいし、非貫通穴であってもよい。 In the light emitting device according to the second aspect, it is preferable that the white silicone adhesive material constituting the first fixing member and the white silicone adhesive material constituting the second fixing member are the same material. With this configuration, it is not necessary to separately prepare the white silicone-based adhesive material serving as the first fixing member and the white silicone-based adhesive material serving as the second fixing member, so that the cost can be reduced. it can.
In the light emitting device according to the second aspect, the frame has one of the recesses and the protrusions, the reflection frame has the other of the recesses and the protrusions, and the protrusions are inserted into the recesses. Good. If comprised in this way, since a convex part functions as a thermal via, it can thermally radiate more efficiently. In addition, it is possible to prevent the reflective frame from being displaced in the lateral direction with respect to the frame. In addition, as a recessed part, a through hole may be sufficient and a non-through hole may be sufficient.
　フレームに形成された凹部および凸部の一方に対して反射枠に形成された凹部および凸部の他方が挿入されている場合において、第１フレーム部に凹部および凸部の一方が形成されており、その第１フレーム部に形成された凹部および凸部の一方に、反射枠に形成された凹部および凸部の他方がかしめられていてもよい。このように構成すれば、第１フレーム部と反射枠との間の固着強度をより高めることができる。 When the other of the concave and convex portions formed on the reflective frame is inserted into one of the concave and convex portions formed on the frame, one of the concave and convex portions is formed on the first frame portion. The other of the concave and convex portions formed on the reflective frame may be caulked to one of the concave and convex portions formed on the first frame portion. If comprised in this way, the adhering strength between a 1st frame part and a reflective frame can be raised more.
　また、フレームに形成された凹部および凸部の一方に対して反射枠に形成された凹部および凸部の他方が挿入されている場合において、第１フレーム部に凹部および凸部の一方が形成されており、その第１フレーム部に形成された凹部および凸部の一方に、反射枠に形成された凹部および凸部の他方が圧入されていてもよい。このように構成すれば、第１フレーム部と反射枠との間の固着強度を容易に高めることができる。なお、ここで述べた圧入とは、凹部の開口径を凸部の径よりも小さくし、強い圧力で凹部に凸部を押し込むことである。 In addition, when the other of the concave portion and the convex portion formed in the reflection frame is inserted into one of the concave portion and the convex portion formed in the frame, one of the concave portion and the convex portion is formed in the first frame portion. In addition, the other of the concave portion and the convex portion formed in the reflection frame may be press-fitted into one of the concave portion and the convex portion formed in the first frame portion. If comprised in this way, the adhering strength between a 1st frame part and a reflective frame can be raised easily. The press-fitting described here is to make the opening diameter of the concave portion smaller than the diameter of the convex portion and push the convex portion into the concave portion with a strong pressure.
　さらに、フレームに形成された凹部および凸部の一方に対して反射枠に形成された凹部および凸部の他方が挿入されている場合において、第１フレーム部に凹部および凸部の一方が形成されており、その第１フレーム部に形成された凹部および凸部の一方と、反射枠に形成された凹部および凸部の他方との間に第２固着部材の一部が埋め込まれていてもよい。このように構成すれば、第１フレーム部と反射枠との間の固着強度についてはかしめ構造や圧入構造よりも劣るが、第２固着部材が緩衝材として機能するので、フレームと反射枠との間の熱膨張の差に起因する不都合の発生を抑制するのには有効である。 Furthermore, when the other of the concave part and the convex part formed in the reflective frame is inserted into one of the concave part and the convex part formed in the frame, one of the concave part and the convex part is formed in the first frame part. And a part of the second fixing member may be embedded between one of the concave portion and the convex portion formed in the first frame portion and the other of the concave portion and the convex portion formed in the reflective frame. . If comprised in this way, about the adhering strength between the 1st frame part and a reflective frame, it is inferior to a caulking structure or a press fit structure, but since the 2nd adhering member functions as a buffering material, between a frame and a reflective frame It is effective to suppress the occurrence of inconvenience due to the difference in thermal expansion between the two.
　フレームに形成された凹部および凸部の一方に対して反射枠に形成された凹部および凸部の他方が挿入されている場合において、第２フレーム部に凹部および凸部の一方が形成されており、その第２フレーム部に形成された凹部および凸部の一方と、反射枠に形成された凹部および凸部の他方との間に第２固着部材の一部が埋め込まれていてもよい。このように構成すれば、第２フレーム部と反射枠とを電気的に絶縁しながら、第２フレーム部と反射枠との固着を強固にすることができる。 When the other of the concave and convex portions formed in the reflective frame is inserted into one of the concave and convex portions formed in the frame, one of the concave and convex portions is formed in the second frame portion. A part of the second fixing member may be embedded between one of the concave portion and the convex portion formed in the second frame portion and the other of the concave portion and the convex portion formed in the reflective frame. If comprised in this way, fixation of a 2nd frame part and a reflective frame can be strengthened, electrically insulating a 2nd frame part and a reflective frame.
　上記第２の局面による発光装置において、第１フレーム部および反射枠の一方に突出部が形成されており、第１フレーム部および反射枠の他方に突出部が直接接触していてもよい。このように構成すれば、第１フレーム部と反射枠との間の熱伝導がより良好になり、さらに効率的な放熱を行うことができる。なお、この場合には、第２フレーム部には反射枠が直接接触しないので、反射枠を介して第１フレーム部と第２フレーム部とが電気的に接続されることはない。 In the light emitting device according to the second aspect, a protrusion may be formed on one of the first frame and the reflection frame, and the protrusion may be in direct contact with the other of the first frame and the reflection frame. If comprised in this way, the heat conduction between a 1st flame | frame part and a reflective frame will become better, and more efficient heat dissipation can be performed. In this case, since the reflection frame does not directly contact the second frame portion, the first frame portion and the second frame portion are not electrically connected via the reflection frame.
　上記第２の局面による発光装置において、フレームが複数のフレーム部を含んでおり、その複数のフレーム部のうちの平面積が最も大きいフレーム部が第１フレーム部となっていることが好ましい。このように構成すれば、複数のフレーム部のうちの平面積が最も大きいフレーム部である第１フレーム部に発光素子が搭載されるので、発光素子の発熱が放熱され易くなる。なお、平面積とは、平面的に見た場合の面積のことである。また、第１フレーム部が１つで第２フレーム部が２つ以上の場合、２つ以上の第２フレーム部の平面積の合計が第１フレーム部の平面積よりも大きくなっていてもよい。 In the light emitting device according to the second aspect, it is preferable that the frame includes a plurality of frame portions, and the frame portion having the largest plane area among the plurality of frame portions is the first frame portion. If comprised in this way, since a light emitting element is mounted in the 1st frame part which is a frame part with the largest plane area among several frame parts, the heat_generation | fever of a light emitting element will become easy to thermally radiate. In addition, a plane area is an area when seen in a plane. In addition, when there is one first frame portion and two or more second frame portions, the total area of the two or more second frame portions may be larger than the area of the first frame portion. .
　上記第２の局面による発光装置において、反射枠の反射面のフレーム側の部分が放射状に広がるような傾斜面となっている一方、反射枠の反射面のフレーム側とは反対側の部分が垂直面となっていてもよい。このように構成すれば、反射枠の反射面で囲まれた部分内に封止部材が埋め込まれている場合、その封止部材と反射枠の反射面との間の接着面積が増大する。これにより、反射枠の反射面からの封止部材の剥離をより抑制することができる。 In the light emitting device according to the second aspect described above, the frame side portion of the reflection surface of the reflection frame is an inclined surface that spreads radially, while the portion of the reflection frame opposite to the frame side is vertical. It may be a surface. If comprised in this way, when the sealing member is embedded in the part enclosed by the reflective surface of a reflective frame, the adhesion area between the sealing member and the reflective surface of a reflective frame will increase. Thereby, peeling of the sealing member from the reflective surface of a reflective frame can be suppressed more.
　以上のように、本発明によれば、容易に、発光特性、放熱特性および信頼性を向上させることができる。 As described above, according to the present invention, light emission characteristics, heat dissipation characteristics, and reliability can be easily improved.
第１実施形態による発光装置の平面図（封止部材を省略した場合の平面図）である。It is a top view (plan view at the time of omitting a sealing member) of a light emitting device by a 1st embodiment. 第１実施形態による発光装置の断面図（図１のＡ－Ａ´線に沿った断面図）である。FIG. 2 is a cross-sectional view of the light emitting device according to the first embodiment (a cross-sectional view along the line AA ′ in FIG. 1). 第１実施形態に使用される固着部材の配置領域を示した平面図である。It is the top view which showed the arrangement | positioning area | region of the fixing member used for 1st Embodiment. 第１実施形態の変形例による発光装置の断面図である。It is sectional drawing of the light-emitting device by the modification of 1st Embodiment. 第１実施形態の変形例による発光装置の断面図である。It is sectional drawing of the light-emitting device by the modification of 1st Embodiment. 第１実施形態の変形例による発光装置の断面図である。It is sectional drawing of the light-emitting device by the modification of 1st Embodiment. 第１実施形態に使用されるフレームの変形例を示した平面図である。It is the top view which showed the modification of the flame | frame used for 1st Embodiment. 第１実施形態に使用されるフレームの変形例を示した平面図である。It is the top view which showed the modification of the flame | frame used for 1st Embodiment. 第１実施形態による発光装置を複数使用した発光装置モジュールの平面図である。1 is a plan view of a light emitting device module using a plurality of light emitting devices according to a first embodiment. 第１実施形態による発光装置を複数使用した発光装置モジュールの平面図である。1 is a plan view of a light emitting device module using a plurality of light emitting devices according to a first embodiment. 第１実施形態による発光装置を複数使用した発光装置モジュールの平面図である。1 is a plan view of a light emitting device module using a plurality of light emitting devices according to a first embodiment. 第１実施形態による発光装置の製造方法を説明するための平面図である。It is a top view for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment. 第１実施形態による発光装置の製造方法を説明するための断面図（図１２のＡ－Ａ´線に沿った断面図）である。FIG. 13 is a cross-sectional view (a cross-sectional view along the line AA ′ in FIG. 12) for describing the method for manufacturing the light emitting device according to the first embodiment. 第１実施形態による発光装置の製造方法を説明するための平面図である。It is a top view for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment. 第１実施形態による発光装置の製造方法を説明するための断面図（図１４のＡ－Ａ´線に沿った断面図）である。FIG. 15 is a cross-sectional view (a cross-sectional view along the line AA ′ in FIG. 14) for describing the method for manufacturing the light emitting device according to the first embodiment. 第１実施形態による発光装置の製造方法を説明するための断面図である。It is sectional drawing for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment. 第１実施形態による発光装置の製造方法を説明するための断面図である。It is sectional drawing for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment. 第１実施形態による発光装置の製造方法を説明するための断面図である。It is sectional drawing for demonstrating the manufacturing method of the light-emitting device by 1st Embodiment. 第２実施形態による発光装置の平面図（封止部材を省略した場合の平面図）である。It is a top view (plan view at the time of omitting a sealing member) of a light emitting device by a 2nd embodiment. 第２実施形態による発光装置の断面図（図１９のＡ－Ａ´線に沿った断面図）である。FIG. 20 is a cross-sectional view (a cross-sectional view along the line AA ′ in FIG. 19) of the light emitting device according to the second embodiment. 第２実施形態に使用されるフレームの平面図（反射枠側から見た場合の平面図）である。It is a top view (plan view at the time of seeing from the reflective frame side) of the flame | frame used for 2nd Embodiment. 第２実施形態に使用されるフレームの断面図（図２１のＡ－Ａ´線に沿った断面図）である。FIG. 22 is a cross-sectional view of the frame used in the second embodiment (a cross-sectional view along the line AA ′ in FIG. 21). 第２実施形態に使用されるフレームの断面図（図２１のＢ－Ｂ´線に沿った断面図）である。FIG. 22 is a cross-sectional view of the frame used in the second embodiment (a cross-sectional view taken along the line BB ′ in FIG. 21). 第２実施形態に使用される反射枠の平面図（フレーム側から見た場合の平面図）である。It is a top view (plan view at the time of seeing from the frame side) of the reflective frame used for 2nd Embodiment. 第２実施形態に使用される反射枠の側面図（図２４の矢印Ａ方向から見た場合の側面図）である。It is a side view (side view at the time of seeing from the arrow A direction of FIG. 24) of the reflective frame used for 2nd Embodiment. 第２実施形態に使用される反射枠の側面図（図２４の矢印Ｂ方向から見た場合の側面図）である。It is a side view (side view at the time of seeing from the arrow B direction of FIG. 24) of the reflective frame used for 2nd Embodiment. 第２実施形態に使用される固着部材の配置領域を示した平面図である。It is the top view which showed the arrangement | positioning area | region of the fixing member used for 2nd Embodiment. 第２実施形態でなされるフレームと反射枠との固定方法を説明するための断面図である。It is sectional drawing for demonstrating the fixing method of the flame | frame and reflection frame made in 2nd Embodiment. 第２実施形態の変形例による発光装置の断面図である。It is sectional drawing of the light-emitting device by the modification of 2nd Embodiment. 第２実施形態でなされるフレームと反射枠との固定方法の変形例を説明するための断面図である。It is sectional drawing for demonstrating the modification of the fixing method of the flame | frame and reflection frame made in 2nd Embodiment. 第２実施形態でなされるフレームと反射枠との固定方法の変形例を説明するための断面図である。It is sectional drawing for demonstrating the modification of the fixing method of the flame | frame and reflection frame made in 2nd Embodiment. 第２実施形態の変形例による発光装置の平面図（封止部材を省略した場合の平面図）である。It is a top view (plan view when a sealing member is omitted) of a light emitting device according to a modification of the second embodiment. 第２実施形態の変形例に使用されるフレームの平面図である。It is a top view of the flame | frame used for the modification of 2nd Embodiment. 第２実施形態の変形例でなされるフレームと反射枠との固定方法を説明するための断面図である。It is sectional drawing for demonstrating the fixing method of the flame | frame and reflection frame made in the modification of 2nd Embodiment. 第３実施形態による発光装置の平面図（封止部材を省略した場合の平面図）である。It is a top view (plan view at the time of omitting a sealing member) of a light emitting device by a 3rd embodiment. 第３実施形態による発光装置の断面図（図３５のＡ－Ａ´線に沿った断面図）である。FIG. 36 is a cross-sectional view (a cross-sectional view taken along the line AA ′ of FIG. 35) of the light emitting device according to the third embodiment. 第３実施形態による発光装置の断面図（図３５のＢ－Ｂ´線に沿った断面図）である。FIG. 36 is a cross-sectional view (a cross-sectional view taken along line BB ′ of FIG. 35) of the light emitting device according to the third embodiment. 第３実施形態に使用されるフレームの斜視図（反射枠側から見た場合の斜視図）である。It is a perspective view (perspective view at the time of seeing from the reflective frame side) of the flame | frame used for 3rd Embodiment. 第３実施形態に使用される反射枠の斜視図（フレーム側から見た場合の斜視図）である。It is a perspective view (perspective view at the time of seeing from the frame side) of the reflective frame used for 3rd Embodiment. 第３実施形態に使用される固着部材の配置領域を示した平面図である。It is the top view which showed the arrangement | positioning area | region of the fixing member used for 3rd Embodiment. 第３実施形態の変形例による発光装置の断面図である。It is sectional drawing of the light-emitting device by the modification of 3rd Embodiment. 第３実施形態による発光装置の製造方法を説明するための平面図である。It is a top view for demonstrating the manufacturing method of the light-emitting device by 3rd Embodiment. 第３実施形態による発光装置の製造方法を説明するための断面図（図４２のＡ－Ａ´線に沿った断面図）である。FIG. 43 is a cross-sectional view (a cross-sectional view along the line AA ′ in FIG. 42) for describing a method for manufacturing the light-emitting device according to the third embodiment. 第３実施形態による発光装置の製造方法を説明するための断面図（図４２のＢ－Ｂ´線に沿った断面図）である。FIG. 44 is a cross-sectional view (a cross-sectional view taken along the line BB ′ of FIG. 42) for describing the method for manufacturing the light-emitting device according to the third embodiment. 第３実施形態による発光装置の製造方法を説明するための平面図である。It is a top view for demonstrating the manufacturing method of the light-emitting device by 3rd Embodiment. 第３実施形態による発光装置の製造方法を説明するための断面図（図４５のＡ－Ａ´線に沿った断面図）である。FIG. 46 is a cross-sectional view (a cross-sectional view taken along the line AA ′ in FIG. 45) for describing the method for manufacturing the light-emitting device according to the third embodiment. 第３実施形態による発光装置の製造方法を説明するための断面図（図４５のＢ－Ｂ´線に沿った断面図）である。FIG. 46 is a cross-sectional view (a cross-sectional view taken along the line BB ′ of FIG. 45) for describing the method for manufacturing the light-emitting device according to the third embodiment. 第３実施形態による発光装置の製造方法を説明するための断面図（図４２および図４５のＡ－Ａ´線に沿った断面に対応する図）である。FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light-emitting device according to the third embodiment (a view corresponding to a cross-section taken along the line AA ′ in FIGS. 42 and 45). 第３実施形態による発光装置の製造方法を説明するための断面図（図４２および図４５のＢ－Ｂ´線に沿った断面に対応する図）である。FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light emitting device according to the third embodiment (a view corresponding to a cross section taken along line BB ′ in FIGS. 42 and 45). 第３実施形態による発光装置の製造方法を説明するための断面図（図４２および図４５のＡ－Ａ´線に沿った断面に対応する図）である。FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light-emitting device according to the third embodiment (a view corresponding to a cross-section taken along the line AA ′ in FIGS. 42 and 45). 第３実施形態による発光装置の製造方法を説明するための断面図（図４２および図４５のＢ－Ｂ´線に沿った断面に対応する図）である。FIG. 46 is a cross-sectional view for explaining the method for manufacturing the light emitting device according to the third embodiment (a view corresponding to a cross section taken along line BB ′ in FIGS. 42 and 45). 第４実施形態による発光装置の平面図（封止部材を省略した場合の平面図）である。It is a top view (plan view at the time of omitting a sealing member) of a light emitting device by a 4th embodiment. 第４実施形態による発光装置の断面図（図５２のＡ－Ａ´線に沿った断面図）である。FIG. 52 is a cross-sectional view of the light-emitting device according to the fourth embodiment (a cross-sectional view along the line AA ′ in FIG. 52). 第４実施形態による発光装置の断面図（図５２のＢ－Ｂ´線に沿った断面図）である。FIG. 53 is a cross-sectional view of the light emitting device according to the fourth embodiment (a cross-sectional view along the line BB ′ in FIG. 52). 第４実施形態に使用されるフレームの平面図（反射枠側から見た場合の平面図）である。It is a top view (plan view at the time of seeing from the reflective frame side) of the flame | frame used for 4th Embodiment. 第４実施形態に使用される反射枠の平面図（フレーム側から見た場合の平面図）である。It is a top view (plan view at the time of seeing from the frame side) of the reflective frame used for 4th Embodiment. 第４実施形態に使用される反射枠の側面図（図５６の矢印Ａ方向から見た場合の側面図）である。It is a side view (side view at the time of seeing from the arrow A direction of FIG. 56) of the reflective frame used for 4th Embodiment. 第４実施形態に使用される反射枠の側面図（図５６の矢印Ｂ方向から見た場合の側面図）である。It is a side view (side view at the time of seeing from the arrow B direction of FIG. 56) of the reflective frame used for 4th Embodiment. 第４実施形態に使用される固着部材の配置領域を示した平面図である。It is the top view which showed the arrangement | positioning area | region of the fixing member used for 4th Embodiment. 第４実施形態の変形例による発光装置の断面図である。It is sectional drawing of the light-emitting device by the modification of 4th Embodiment. 第５実施形態による発光装置の断面図である。It is sectional drawing of the light-emitting device by 5th Embodiment. 第５実施形態の変形例による発光装置の断面図である。It is sectional drawing of the light-emitting device by the modification of 5th Embodiment. 従来の発光装置の断面図である。It is sectional drawing of the conventional light-emitting device.
　（第１実施形態）
　以下に、図１～図３を参照して、第１実施形態による発光装置１０の構成について詳細に説明する。 (First embodiment)
Hereinafter, the configuration of the light emitting device 10 according to the first embodiment will be described in detail with reference to FIGS. 1 to 3.
　第１実施形態では、図１および図２に示すように、発光素子としてのＬＥＤ（発光ダイオード素子）１がフレーム２上に搭載されている。また、フレーム２上には枠状の反射面３ａを有する反射枠３が配置されており、反射枠３の反射面３ａによってＬＥＤ１が取り囲まれている。そして、反射枠３の開口部内（反射面３ａで囲まれた部分内）には、ＬＥＤ１を封止するための封止部材４が埋め込まれている。 In the first embodiment, as shown in FIGS. 1 and 2, an LED (light emitting diode element) 1 as a light emitting element is mounted on a frame 2. A reflective frame 3 having a frame-shaped reflective surface 3 a is disposed on the frame 2, and the LED 1 is surrounded by the reflective surface 3 a of the reflective frame 3. A sealing member 4 for sealing the LED 1 is embedded in the opening of the reflective frame 3 (in the portion surrounded by the reflective surface 3a).
　ＬＥＤ１が搭載されるフレーム２は金属製であり、アルミニウム、アルミニウム合金、銅および銅合金などの高熱伝導材料からなっている。また、フレーム２は、平面積が大きいフレーム部２ａと、フレーム部２ａよりも平面積が小さいフレーム部２ｂとの２つに分割されており、それらが互いに電気的に絶縁された構造となっている。平面積が大きい方のフレーム部２ａは略コの字形状（略Ｕ字形状）に加工されており、その中央部にＬＥＤ１が搭載されるＬＥＤ搭載部２ｃを持っている。一方、平面積が小さい方のフレーム部２ｂは略長方形状に加工されており、コの字体の内側に入り込んでいる。そして、ＬＥＤ１は、フレーム部２ａのＬＥＤ搭載部２ｃ上に配置された状態で、フレーム部２ａおよび２ｂにワイヤ５を介して電気的に接続されている。なお、フレーム部２ａおよび２ｂは、それぞれ、本発明の「第１フレーム部」および「第２フレーム部」の一例である。 The frame 2 on which the LED 1 is mounted is made of metal and is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy. The frame 2 is divided into a frame portion 2a having a large plane area and a frame portion 2b having a plane area smaller than that of the frame portion 2a, and these are electrically insulated from each other. Yes. The frame portion 2a having a larger plane area is processed into a substantially U shape (substantially U shape), and has an LED mounting portion 2c on which the LED 1 is mounted at the center thereof. On the other hand, the frame portion 2b having a smaller plane area is processed into a substantially rectangular shape, and enters the inside of the U-shaped body. And LED1 is electrically connected to the frame parts 2a and 2b via the wire 5 in the state arrange | positioned on the LED mounting part 2c of the frame part 2a. The frame portions 2a and 2b are examples of the “first frame portion” and the “second frame portion” in the present invention, respectively.
　また、このフレーム２のＬＥＤ１が搭載される側の面には、光反射率に重点を置くとともに、ワイヤーボンドおよびフリップ接続などにも重点を置いた表面処理（銀メッキや銀＋パラジウムメッキなど）が施されている。さらに、フレーム２のＬＥＤ１が搭載される側とは反対側の面には、別の回路基板に対して半田接続が可能となるように、半田付け性に重点を置いた表面処理（銀メッキや金メッキなど）が施されている。なお、フレーム２の両面に施す表面処理を同一仕様とすれば製造上の簡便性が向上するが、そのようにする場合には、銀メッキまたは銀＋パラジウムメッキなどをフレーム２の両面に施せばよい。 In addition, the surface of the frame 2 on which the LED 1 is mounted has a surface treatment (silver plating, silver + palladium plating, etc.) with emphasis on light reflectivity and also on wire bonding and flip connection. Is given. Furthermore, the surface of the frame 2 opposite to the side on which the LED 1 is mounted is surface-treated with emphasis on solderability so that solder connection to another circuit board is possible (silver plating or Gold plating etc. are given. In addition, if the surface treatment applied to both sides of the frame 2 is made the same specification, the convenience in manufacturing is improved. In such a case, if silver plating or silver + palladium plating is applied to both sides of the frame 2, Good.
　フレーム２上に配置された反射枠３は、アルミニウム、アルミニウム合金、銅および銅合金などの高熱伝導材料からなっている。また、反射枠３の反射面３ａは、放射状に広がるような傾斜面となっている。そして、この反射枠３の反射面３ａには、光反射率に重点を置いた表面処理が施されている。このような表面処理としては、銀メッキ、銀メッキ＋絶縁（セラミック）コーティング、および、アルマイト処理などがある。 The reflection frame 3 disposed on the frame 2 is made of a high heat conductive material such as aluminum, aluminum alloy, copper and copper alloy. Moreover, the reflective surface 3a of the reflective frame 3 is an inclined surface that spreads radially. The reflective surface 3a of the reflective frame 3 is subjected to surface treatment with an emphasis on light reflectance. Examples of such surface treatment include silver plating, silver plating + insulating (ceramic) coating, and anodizing.
　ところで、反射枠３における光反射率を簡便な表面処理で高めるには、アルミニウム反射枠にアルマイト処理を施したり、化学研磨により薄い酸化膜を形成したりするのが適している。また、フレーム２における熱伝導を優先すると、銅フレームを用いるのが適している。このような観点で反射枠３およびフレーム２の構成材料を選定する場合には、アルミニウム反射枠および銅フレームを選定すればよい。また、両方共に熱伝導を優先する場合には、銅反射枠（銀メッキなどを施したもの）および銅フレーム（銀メッキなどを施したもの）を選定すればよい。 Incidentally, in order to increase the light reflectance in the reflection frame 3 by a simple surface treatment, it is suitable to subject the aluminum reflection frame to alumite treatment or to form a thin oxide film by chemical polishing. If priority is given to heat conduction in the frame 2, it is suitable to use a copper frame. From this point of view, when selecting the constituent materials of the reflective frame 3 and the frame 2, an aluminum reflective frame and a copper frame may be selected. Further, in the case where priority is given to heat conduction in both cases, a copper reflective frame (with silver plating or the like) and a copper frame (with silver plating or the like) may be selected.
　ここで、第１実施形態では、シリコーン系接着材料からなる固着部材６によってフレーム部２ａおよび２ｂが互いに固着されており、さらに、固着部材６の構成材料であるシリコーン系接着材料と同じシリコーン系接着材料からなる固着部材７によってフレーム２と反射枠３とが固着されている。なお、固着部材６および７は、それぞれ、本発明の「第１固着部材」および「第２固着部材」の一例である。 Here, in the first embodiment, the frame portions 2a and 2b are fixed to each other by the fixing member 6 made of a silicone-based adhesive material, and further, the same silicone-based adhesive as the silicone-based adhesive material that is a constituent material of the fixing member 6 is used. The frame 2 and the reflection frame 3 are fixed by a fixing member 7 made of a material. The fixing members 6 and 7 are examples of the “first fixing member” and the “second fixing member” in the present invention, respectively.
　固着部材６および７の構成材料であるシリコーン系接着材料は、酸化チタンやセラミックス粉末またはシリカなどが含有されたものであり、それによって白色化されている。したがって、ＬＥＤ１で生成された光が固着部材６および７に到達すると、その表面によって光の反射が行われることになる。このような白色のシリコーン系接着材料としては、たとえば、チップボンディング用に開発された信越化学工業株式会社製の「ＫＥＲ－３１００－Ｕ２」や「ＫＥＲ－３２００－Ｔ１」などがある。 The silicone-based adhesive material that is a constituent material of the fixing members 6 and 7 contains titanium oxide, ceramic powder, silica, or the like, and is thereby whitened. Therefore, when the light generated by the LED 1 reaches the fixing members 6 and 7, the light is reflected by the surface. Examples of such a white silicone-based adhesive material include “KER-3100-U2” and “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd. developed for chip bonding.
　なお、酸化チタンを加えることでシリコーン系接着材料を白色化する場合、酸化チタンの光触媒作用によって品質に悪影響を及ぼす可能性がある。したがって、酸化チタンにより白色化されたシリコーン系接着材料を固着部材６および７の構成材料として用いる場合には、酸化チタンに対して、光触媒作用の発生が抑制されるような表面処理を施しておくのがよいと考えられる。 In addition, when whitening a silicone adhesive material by adding titanium oxide, there is a possibility that the quality may be adversely affected by the photocatalytic action of titanium oxide. Therefore, when using a silicone-based adhesive material whitened with titanium oxide as a constituent material of the fixing members 6 and 7, the titanium oxide is subjected to a surface treatment that suppresses the occurrence of photocatalytic action. It is considered good.
　フレーム部２ａおよび２ｂを互いに固着するための固着部材６は、フレーム２の板厚と略同じ厚みで形成されているとともに、フレーム部２ａとフレーム部２ｂとの間の領域の全域に配置されている。すなわち、フレーム部２ａとフレーム部２ｂとの間に空隙が生じないように、フレーム部２ａとフレーム部２ｂとの間が固着部材６によって完全に埋め込まれている。なお、この固着部材６の平面視における配置領域は、図３中の破線のハッチングが施された領域（ハッチング間隔が狭い領域およびハッチング間隔が広い領域）１０ａである。 The fixing member 6 for fixing the frame portions 2a and 2b to each other is formed with a thickness substantially the same as the plate thickness of the frame 2, and is disposed over the entire region between the frame portion 2a and the frame portion 2b. Yes. That is, the space between the frame portion 2a and the frame portion 2b is completely embedded by the fixing member 6 so that no gap is generated between the frame portion 2a and the frame portion 2b. In addition, the arrangement | positioning area | region in planar view of this adhering member 6 is the area | region (area | region where a hatching space | interval is narrow, and a hatching space | interval is wide) 10a to which the broken line hatching in FIG.
　また、フレーム２と反射枠３とを固着するための固着部材７は、フレーム２と反射枠３の枠部との間で、かつ、フレーム２と反射枠３の枠部とが重畳する領域の全域に配置されている。加えて、固着部材６と反射枠３の枠部とが重畳する領域にも固着部材７が配置されている。このため、フレーム２（固着部材６）と反射枠３の枠部との間は、そこが固着部材７によって完全に埋め込まれることで空隙が生じていない。なお、この固着部材７の平面視における配置領域は、図３中の実線のハッチングが施された領域１０ｂ、および、破線のハッチングが施された領域１０ａのうちのハッチング間隔が狭い領域である。 Further, the fixing member 7 for fixing the frame 2 and the reflection frame 3 is an area between the frame 2 and the frame portion of the reflection frame 3 and the region where the frame 2 and the frame portion of the reflection frame 3 overlap. Arranged throughout. In addition, the fixing member 7 is also disposed in a region where the fixing member 6 and the frame portion of the reflection frame 3 overlap. For this reason, the space | gap is not produced between the frame 2 (adhering member 6) and the frame part of the reflective frame 3 because it is completely embedded with the adhering member 7. In addition, the arrangement | positioning area | region in planar view of this adhering member 7 is an area | region where the hatching space | interval is narrow among the area | region 10b to which the solid line hatching in FIG.
　また、第１実施形態では、固着部材６および７の構成材料と同じ材料、すなわち、白色のシリコーン系接着材料（信越化学工業株式会社製の「ＫＥＲ－３１００－Ｕ２」や「ＫＥＲ－３２００－Ｔ１」など）からなる固着部材８によって、ＬＥＤ１のフレーム部２ａ（ＬＥＤ搭載部２ｃ）への固着がなされている。なお、固着部材８は本発明の「第３固着部材」の一例であり、平面的に見ると、図３中の格子状のハッチングが施された領域１０ｃに配置されることになる。 In the first embodiment, the same material as that of the fixing members 6 and 7, that is, a white silicone-based adhesive material (“KER-3100-U2” or “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd.) The LED 1 is fixed to the frame portion 2a (LED mounting portion 2c). The fixing member 8 is an example of the “third fixing member” in the present invention, and when viewed in a plan view, the fixing member 8 is disposed in the area 10c with lattice-like hatching in FIG.
　さらに、第１実施形態では、ＬＥＤ１を封止するための封止部材４の構成材料として、シリコーン系封止材料を用いている。すなわち、封止部材４の構成材料の主成分が固着部材６～８の構成材料の主成分と同じになっている。 Furthermore, in 1st Embodiment, the silicone type sealing material is used as a constituent material of the sealing member 4 for sealing LED1. That is, the main component of the constituent material of the sealing member 4 is the same as the main component of the constituent material of the fixing members 6 to 8.
　第１実施形態では、上記のように、フレーム部２ａおよび２ｂを互いに固着するための固着部材６の構成材料を白色のシリコーン系接着材料とするとともに、フレーム２および反射枠３を互いに固着するための固着部材７の構成材料も白色のシリコーン系接着材料とすることによって、以下のような効果が得られる。 In the first embodiment, as described above, the constituent material of the fixing member 6 for fixing the frame portions 2a and 2b to each other is a white silicone-based adhesive material, and the frame 2 and the reflection frame 3 are fixed to each other. The following effects can be obtained by using a white silicone-based adhesive material as the constituent material of the fixing member 7.
　すなわち、固着部材６および７の構成材料を白色のシリコーン系接着材料とすることによって、白色のシリコーン系接着材料は光を反射する材料であるので、ＬＥＤ１で生成された光が固着部材６および７に達すると、その光が固着部材６および７で反射されることになる。したがって、所望方向とは異なる方向に漏れ出る光（フレーム部２ａとフレーム部２ｂとの間から漏れ出る光、および、フレーム２と反射枠３との間から漏れ出る光）が減少し、その分、所望方向への発光を増大させることができる。また、白色のシリコーン系接着材料は光の照射による変色が少ないので、発光光度および色度の変化を抑制することもできる。 That is, by using the white silicone adhesive material as the constituent material of the fixing members 6 and 7, the white silicone adhesive material is a material that reflects light, so that the light generated by the LED 1 is fixed to the fixing members 6 and 7. , The light is reflected by the fixing members 6 and 7. Therefore, light leaking in a direction different from the desired direction (light leaking from between the frame portion 2a and the frame portion 2b and light leaking from between the frame 2 and the reflection frame 3) is reduced, and accordingly. The light emission in the desired direction can be increased. In addition, since the white silicone-based adhesive material has little discoloration due to light irradiation, changes in emission luminous intensity and chromaticity can also be suppressed.
　また、白色のシリコーン系接着材料は耐熱性に優れていて熱伝導性を比較的高くできる材料であると同時に、絶縁性を保ちつつ薄く形成することが可能であるため、固着部材６を介してなされるフレーム部２ａとフレーム部２ｂとの間の熱伝導、および、固着部材７を介してなされるフレーム２と反射枠３との間の熱伝導が良好になる。このため、ＬＥＤ１で発生した熱を効率良く放熱することができる。 In addition, the white silicone-based adhesive material has excellent heat resistance and can have relatively high thermal conductivity, and at the same time, it can be formed thin while maintaining insulation. The heat conduction between the frame portion 2a and the frame portion 2b and the heat conduction between the frame 2 and the reflection frame 3 performed via the fixing member 7 are improved. For this reason, the heat generated in the LED 1 can be efficiently radiated.
　さらに、白色のシリコーン系接着材料は緩衝材としても使える材料であるので、フレーム２および反射枠３が熱膨張したとしても、フレーム２と反射枠３との間の熱膨張の差が固着部材７で吸収されることになる。これにより、フレーム２に反りが発生したり、フレーム２から反射枠３が剥離したりすることで装置が破損してしまうのを抑制することができる。 Further, since the white silicone-based adhesive material is a material that can also be used as a cushioning material, even if the frame 2 and the reflection frame 3 are thermally expanded, the difference in thermal expansion between the frame 2 and the reflection frame 3 is caused by the fixing member 7. Will be absorbed. As a result, it is possible to prevent the apparatus from being damaged by warping of the frame 2 or peeling of the reflection frame 3 from the frame 2.
　これらの結果、第１実施形態では、発光特性、放熱特性および信頼性を向上させることが可能となる。 As a result, in the first embodiment, it is possible to improve the light emission characteristics, heat dissipation characteristics, and reliability.
　また、第１実施形態では、上記のように、固着部材６を構成する白色のシリコーン系接着材料および固着部材７を構成する白色のシリコーン系接着材料を互いに同じ材料とすることによって、固着部材６となる白色のシリコーン系接着材料と固着部材７となる白色のシリコーン系接着材料とを別々に準備する必要がなくなるので、コストの削減を図ることができる。それに加えて、第１実施形態では、固着部材８の構成材料を固着部材６および７と同じ白色のシリコーン系接着材料としているので、固着部材８となる白色のシリコーン系接着材料を別途準備する必要もなくなる。このため、コストがさらに削減される。 In the first embodiment, as described above, the white silicone adhesive material forming the fixing member 6 and the white silicone adhesive material forming the fixing member 7 are made of the same material, thereby fixing the fixing member 6. Therefore, it is not necessary to separately prepare the white silicone-based adhesive material to be used and the white silicone-based adhesive material to be the fixing member 7, so that the cost can be reduced. In addition, in the first embodiment, since the constituent material of the fixing member 8 is the same white silicone-based adhesive material as the fixing members 6 and 7, it is necessary to separately prepare a white silicone-based adhesive material to be the fixing member 8. Also disappear. For this reason, cost is further reduced.
　また、第１実施形態では、上記のように、封止部材４の構成材料をシリコーン系封止材料とすることによって、固着部材６および７の構成材料の成分が反射枠３の反射面３ａに付着され、その状態のまま反射枠３の開口部内に封止部材４が埋め込まれたとしても、それらの構成材料は共にシリコーン系であるため、反射枠３の反射面３ａに対する封止部材４の接着強度が弱くなるのを抑制することができる。また、封止部材４に硬化阻害が生じて硬化物に異常が発生するのも抑制することができる。 In the first embodiment, as described above, the constituent material of the sealing member 4 is a silicone-based sealing material, so that components of the constituent materials of the fixing members 6 and 7 are applied to the reflecting surface 3 a of the reflecting frame 3. Even if the sealing member 4 is attached and embedded in the opening of the reflective frame 3 in that state, since the constituent materials thereof are both silicone, the sealing member 4 with respect to the reflective surface 3a of the reflective frame 3 It can suppress that adhesive strength becomes weak. Further, it is possible to suppress the occurrence of abnormality in the cured product due to the inhibition of curing in the sealing member 4.
　また、第１実施形態では、上記のように、フレーム部２ａとフレーム部２ｂとの間に空隙が生じないように、フレーム部２ａとフレーム部２ｂとの間に固着部材６を埋め込むことによって、フレーム部２ａとフレーム部２ｂとの間が固着部材６で完全に塞がれた状態となり、フレーム部２ａとフレーム部２ｂとの間から光が漏れ出るのを確実に抑制することができる。 In the first embodiment, as described above, the fixing member 6 is embedded between the frame portion 2a and the frame portion 2b so that no gap is generated between the frame portion 2a and the frame portion 2b. The space between the frame portion 2a and the frame portion 2b is completely closed by the fixing member 6, and light can be reliably suppressed from leaking between the frame portion 2a and the frame portion 2b.
　また、第１実施形態では、上記のように、フレーム２と反射枠３との間に空隙が生じないように、フレーム２と反射枠３との間に固着部材７を埋め込むことによって、フレーム２と反射枠３との間が固着部材７で完全に塞がれた状態となり、フレーム２と反射枠３との間から光が漏れ出るのを確実に抑制することができる。 In the first embodiment, as described above, the fixing member 7 is embedded between the frame 2 and the reflection frame 3 so as not to generate a gap between the frame 2 and the reflection frame 3. Between the frame 2 and the reflection frame 3 is completely blocked by the fixing member 7, and light can be reliably prevented from leaking between the frame 2 and the reflection frame 3.
　また、第１実施形態では、上記のように、フレーム部２ａの平面積をフレーム部２ｂの平面積よりも大きくし、平面積が大きい方のフレーム部２ａにＬＥＤ１を搭載することによって、ＬＥＤ１の発熱が放熱され易くなる。 In the first embodiment, as described above, the plane area of the frame portion 2a is made larger than the plane area of the frame portion 2b, and the LED 1 is mounted on the frame portion 2a having the larger plane area. Heat generation is easily dissipated.
　また、第１実施形態では、上記のように、反射枠３を金属製とすることによって、反射枠３を介しての放熱を良好に行うことができる。また、反射枠３が金属製であると、反射枠３の反射面３ａが変色し難くなるので、反射枠３の反射面３ａでの光吸収が抑制され、発光光度の低下を低減することができる。なお、フレーム２と反射枠３とを同じ金属材料で作製すれば、フレーム２および反射枠３のそれぞれの熱膨張率が互いに同じになるので、熱膨張率の違いに起因するフレーム２からの反射枠３の剥離をより抑制することができる。 Further, in the first embodiment, as described above, by making the reflection frame 3 made of metal, heat can be radiated through the reflection frame 3 satisfactorily. Moreover, since the reflective surface 3a of the reflective frame 3 becomes difficult to discolor when the reflective frame 3 is metal, the light absorption by the reflective surface 3a of the reflective frame 3 is suppressed, and the fall of emitted light intensity may be reduced. it can. If the frame 2 and the reflective frame 3 are made of the same metal material, the thermal expansion coefficients of the frame 2 and the reflective frame 3 are the same, so that the reflection from the frame 2 due to the difference in the thermal expansion coefficient. The peeling of the frame 3 can be further suppressed.
　なお、上記した第１実施形態の構成において、図４に示すように、フレーム部２ａとフレーム部２ｂとを固着する固着部材（フレーム部２ａとフレーム部２ｂとの間に配置される固着部材）６をフレーム部２ａ（ＬＥＤ搭載部２ｃ）上にまで延ばし、その固着部材６のフレーム部２ａ上にまで延びた部分でＬＥＤ１とフレーム部２ａとを固着してもよい。すなわち、フレーム部２ａとフレーム部２ｂとを固着する部材と、ＬＥＤ１とフレーム部２ａとを固着する部材とを一体化してもよい。 In the configuration of the first embodiment described above, as shown in FIG. 4, a fixing member for fixing the frame portion 2a and the frame portion 2b (fixing member disposed between the frame portion 2a and the frame portion 2b). 6 may be extended to the frame portion 2a (LED mounting portion 2c), and the LED 1 and the frame portion 2a may be fixed to each other at a portion of the fixing member 6 extending to the frame portion 2a. That is, the member that fixes the frame portion 2a and the frame portion 2b and the member that fixes the LED 1 and the frame portion 2a may be integrated.
　また、上記した第１実施形態の構成において、図５に示すように、フレーム２と反射枠３とを固着する固着部材（フレーム２と反射枠３との間に配置される固着部材）７の一部を、フレーム２と反射枠３との間から外側（ＬＥＤ１側とは反対側）に意図的にはみ出させてもよい。 Further, in the configuration of the first embodiment described above, as shown in FIG. 5, the fixing member 7 (fixing member disposed between the frame 2 and the reflecting frame 3) that fixes the frame 2 and the reflecting frame 3 is fixed. A part may be intentionally protruded from between the frame 2 and the reflective frame 3 to the outside (the side opposite to the LED 1 side).
　このように、固着部材７の一部をフレーム２と反射枠３との間から外側にはみ出させれば、固着部材７の外側にはみ出した部分により、金属（フレーム２に施されるメッキの材料）の反射枠３へのマイグレーションが阻害される。これにより、マイグレーションによってフレーム２が反射枠３に電気的に接続されることに起因して、フレーム部２ａとフレーム部２ｂとが反射枠３を通じて短絡してしまうという不都合が発生するのを抑制することができる。さらに、半田を用いて別の回路基板にフレーム２を接続する場合には、固着部材７の外側にはみ出した部分により、半田のフレーム２側から反射枠３側に盛り上がった部分が反射枠３に接触し難くなる。このため、半田を介してフレーム２と反射枠３とが電気的に接続されることに起因して、フレーム部２ａとフレーム部２ｂとが反射枠３を通じて短絡するという不都合が発生するのも抑制することができる。 In this way, if a part of the fixing member 7 protrudes outside from between the frame 2 and the reflection frame 3, the metal (plating material applied to the frame 2) is caused by the part protruding outside the fixing member 7. ) To the reflection frame 3 is hindered. Accordingly, it is possible to prevent the inconvenience that the frame 2a and the frame 2b are short-circuited through the reflection frame 3 due to the frame 2 being electrically connected to the reflection frame 3 by migration. be able to. Further, when the frame 2 is connected to another circuit board using solder, a portion that protrudes from the frame 2 side of the solder to the side of the reflective frame 3 due to the portion protruding to the outside of the fixing member 7 becomes the reflective frame 3. It becomes difficult to touch. For this reason, it is suppressed that the frame part 2a and the frame part 2b are short-circuited through the reflection frame 3 due to the electrical connection between the frame 2 and the reflection frame 3 via the solder. can do.
　また、固着部材７を外側にはみ出させると、その分だけ接着面積が増大するので、フレーム２と反射枠３との固着をさらに強固にすることができる。 Further, when the fixing member 7 is protruded to the outside, the adhesion area is increased by that amount, so that the fixing between the frame 2 and the reflection frame 3 can be further strengthened.
　また、上記した第１実施形態の構成において、図６に示すように、反射枠３の反射面３ａを、傾斜面と垂直面とを組み合わせたものにしてもよい。このようにすれば、反射枠３の反射面３ａと、その反射面３ａで囲まれた部分内に埋め込まれた封止部材４との間の接着面積が増大する。これにより、封止部材４の剥離をより抑制することができる。 Further, in the configuration of the first embodiment described above, as shown in FIG. 6, the reflecting surface 3a of the reflecting frame 3 may be a combination of an inclined surface and a vertical surface. If it does in this way, the adhesion area between the reflective surface 3a of the reflective frame 3 and the sealing member 4 embedded in the part enclosed by the reflective surface 3a will increase. Thereby, peeling of the sealing member 4 can be suppressed more.
　また、上記した第１実施形態の構成において、図７に示すように、フレーム部２ｂを複数に分割してもよいし、図８に示すように、フレーム部２ａのＬＥＤ搭載部２ｃをフレーム部２ｂで挟み込んでもよい。
尚、本実施例では、白色系のシリコーン系接着材料を用いているが、白色成形樹脂（例えば、アモデル等）を使用して樹脂形成しても良い。例えば、射出成形により樹脂形成しても良い。
さらに、図９～図１１に示すように、直列に接続された所定数の発光装置１０を含む発光装置列１０ｌを１列または複数列備えた発光装置モジュールに本発明を適用することも可能である。この場合、発光装置モジュールの光出射口の形状は統一されていなくてもよい。たとえば、図１０に示すように、長穴形状の光出射口と円形状の光出射口とが混在していてもよい。 Further, in the configuration of the first embodiment described above, the frame portion 2b may be divided into a plurality as shown in FIG. 7, or the LED mounting portion 2c of the frame portion 2a is replaced with a frame portion as shown in FIG. It may be sandwiched between 2b.
In this embodiment, a white silicone-based adhesive material is used, but a white molding resin (for example, Amodel etc.) may be used for resin formation. For example, the resin may be formed by injection molding.
Furthermore, as shown in FIGS. 9 to 11, the present invention can be applied to a light emitting device module including one or a plurality of light emitting device rows 101 including a predetermined number of light emitting devices 10 connected in series. is there. In this case, the shape of the light emission port of the light emitting device module may not be unified. For example, as shown in FIG. 10, a long hole-shaped light exit opening and a circular light exit opening may be mixed.
　以下に、図１２～図１８を参照して、第１実施形態による発光装置１０の製造方法について説明する。 Hereinafter, a method for manufacturing the light emitting device 10 according to the first embodiment will be described with reference to FIGS.
　第１実施形態の製造方法としては、まず、図１２および図１３に示すように、互いに電気的に絶縁されるフレーム部２ａおよび２ｂを有するフレーム２がマトリクス状に複数繋がれた金属構造体を作製する。また、図１４および図１５に示すように、枠状の反射面３ａを有する反射枠３がマトリクス状に複数繋がれた金属構造体も作製する。 As a manufacturing method of the first embodiment, first, as shown in FIGS. 12 and 13, a metal structure in which a plurality of frames 2 having frame portions 2a and 2b that are electrically insulated from each other are connected in a matrix is used. Make it. Further, as shown in FIGS. 14 and 15, a metal structure in which a plurality of reflection frames 3 each having a frame-like reflection surface 3a are connected in a matrix is also produced.
　次に、図１６に示すように、フレーム２を所定の基台１１上に載置する。この後、スクリーン印刷法やディスペンス法などを用いて、フレーム部２ａとフレーム部２ｂとの間の領域１０ａ、フレーム２と反射枠３の枠部とが重畳する領域１０ｂ、および、フレーム部２ａ（ＬＥＤ搭載部２ｃ）の所定の領域１０ｃのそれぞれに、白色のシリコーン系接着材料を塗布する。すなわち、領域１０ａに固着部材６を配置するとともに、領域１０ｂに固着部材７を配置し、領域１０ｃに固着部材８を配置する。この際、固着部材６～８の構成材料を同一の白色のシリコーン系接着材料とし、固着部材６～８の塗布を同時に行う。 Next, as shown in FIG. 16, the frame 2 is placed on a predetermined base 11. Thereafter, by using a screen printing method, a dispensing method, or the like, a region 10a between the frame portion 2a and the frame portion 2b, a region 10b in which the frame 2 and the frame portion of the reflection frame 3 overlap, and a frame portion 2a ( A white silicone-based adhesive material is applied to each of the predetermined regions 10c of the LED mounting portion 2c). That is, the fixing member 6 is arranged in the region 10a, the fixing member 7 is arranged in the region 10b, and the fixing member 8 is arranged in the region 10c. At this time, the constituent materials of the fixing members 6 to 8 are the same white silicone-based adhesive material, and the fixing members 6 to 8 are applied simultaneously.
　次に、図１７に示すように、固着部材７を介してフレーム２上に反射枠３を配置するとともに、固着部材８を介してフレーム部２ａ（ＬＥＤ搭載部２ｃ）上にＬＥＤ１を配置する。この際、所定の治具１２で反射枠３を把持することによって、フレーム２と反射枠３との間隔（基台１１と治具１２との間隔）を予め設定された大きさに保持しておく。そして、その状態で、固着部材６～８の硬化を同時に行う。これによって、フレーム部２ａとフレーム部２ｂとの固着、フレーム２と反射枠３との固着、および、ＬＥＤ１とフレーム部２ａ（ＬＥＤ搭載部２ｃ）との固着が同時になされる。 Next, as shown in FIG. 17, the reflection frame 3 is arranged on the frame 2 via the fixing member 7, and the LED 1 is arranged on the frame portion 2 a (LED mounting portion 2 c) via the fixing member 8. At this time, the distance between the frame 2 and the reflection frame 3 (the distance between the base 11 and the jig 12) is held at a predetermined size by holding the reflection frame 3 with a predetermined jig 12. deep. In this state, the fixing members 6 to 8 are simultaneously cured. As a result, the frame 2a and the frame 2b are fixed, the frame 2 and the reflection frame 3 are fixed, and the LED 1 and the frame 2a (LED mounting portion 2c) are fixed simultaneously.
　次に、図１８に示すように、ワイヤボンディングを行うことによって、ワイヤ５を介して、ＬＥＤ１をフレーム部２ａおよび２ｂに電気的に接続する。また、反射枠３の開口部内に封止部材４を埋め込み、その封止部材４でＬＥＤ１を封止する。これにより、複数の発光装置１０がマトリクス状に繋がれた構造体が得られる。最後に、マトリクス状に繋がれた複数の発光装置１０を個々に分離することによって、図１および図２に示した第１実施形態による発光装置１０が製造される。 Next, as shown in FIG. 18, the LED 1 is electrically connected to the frame portions 2 a and 2 b through the wire 5 by performing wire bonding. Further, the sealing member 4 is embedded in the opening of the reflection frame 3, and the LED 1 is sealed with the sealing member 4. Thereby, a structure in which a plurality of light emitting devices 10 are connected in a matrix is obtained. Finally, the light emitting devices 10 according to the first embodiment shown in FIGS. 1 and 2 are manufactured by individually separating the plurality of light emitting devices 10 connected in a matrix.
　第１実施形態では、上記のような製造方法を用いることによって、固着部材６によるフレーム部２ａとフレーム部２ｂとの固着、固着部材７によるフレーム２と反射枠３との固着、および、固着部材８によるＬＥＤ１とフレーム部２ａ（ＬＥＤ搭載部２ｃ）との固着を一括して行うことができる。これにより、製造工程の簡略化を図ることが可能となる。 In the first embodiment, by using the manufacturing method as described above, the frame 2a and the frame 2b are fixed by the fixing member 6, the frame 2 and the reflection frame 3 are fixed by the fixing member 7, and the fixing member. The LED 1 and the frame portion 2a (LED mounting portion 2c) can be fixed together at the same time. This makes it possible to simplify the manufacturing process.
　なお、白色のシリコーン系接着材料によるフレーム２と反射枠３との固着方法（図１６および図１７に示した工程）としては、上記した方法に限らず、たとえば、以下のような別の方法を用いることも可能である。 Note that the method of fixing the frame 2 and the reflective frame 3 with the white silicone-based adhesive material (the process shown in FIGS. 16 and 17) is not limited to the above-described method, and for example, another method as described below. It is also possible to use it.
　すなわち、別の方法の１つ目としては、まず、スクリーン印刷法やディスペンス法などを用いて、フレーム部２ａとフレーム部２ｂとの間の間隙に白色のシリコーン系接着材料を塗布する。また、反射枠３の枠部の裏面のうち、フレーム２に重なる部分、および、フレーム部２ａとフレーム部２ｂとの間の間隙に重なる部分にも白色のシリコーン系接着材料を塗布する。その後、白色のシリコーン系接着材料がそれぞれ塗布されたフレーム２および反射枠３を互いに重ね合わせ、その状態で白色のシリコーン系接着材料を硬化させることによって、フレーム２と反射枠３とを固着する。 That is, as another method, first, a white silicone-based adhesive material is applied to the gap between the frame portion 2a and the frame portion 2b by using a screen printing method, a dispensing method, or the like. Further, a white silicone-based adhesive material is also applied to the portion of the rear surface of the frame portion of the reflective frame 3 that overlaps the frame 2 and the portion that overlaps the gap between the frame portion 2a and the frame portion 2b. Thereafter, the frame 2 and the reflective frame 3 to which the white silicone adhesive material is respectively applied are overlapped with each other, and the white silicone adhesive material is cured in this state, thereby fixing the frame 2 and the reflective frame 3 together.
　また、別の方法の２つ目としては、まず、フレーム２および反射枠３を互いに重ね合わせて固定する。続いて、スクリーン印刷法やディスペンス法などを用いて、互いに重ね合わされたフレーム２および反射枠３の所定部分に白色のシリコーン系接着材料を塗布・充填する。そして、その状態で減圧脱法を行う。なお、このように減圧脱泡を行えば、互いに重ね合わされたフレーム２および反射枠３の隙間に、白色のシリコーン系接着材料を効率良く浸透させることができる。その後、シリコーン系接着材料を硬化させることによって、フレーム２と反射枠３とを固着する。 Also, as another method, first, the frame 2 and the reflection frame 3 are overlapped and fixed to each other. Subsequently, using a screen printing method, a dispensing method, or the like, a white silicone adhesive material is applied and filled into predetermined portions of the frame 2 and the reflective frame 3 that are overlapped with each other. Then, the depressurization method is performed in this state. If vacuum degassing is performed in this manner, the white silicone-based adhesive material can be efficiently infiltrated into the gap between the frame 2 and the reflection frame 3 that are overlapped with each other. Thereafter, the frame 2 and the reflection frame 3 are fixed by curing the silicone adhesive material.
　（第２実施形態）
　以下に、図１９～図２８を参照して、第２実施形態による発光装置２０の構成について詳細に説明する。 (Second Embodiment)
Hereinafter, the configuration of the light emitting device 20 according to the second embodiment will be described in detail with reference to FIGS.
　第２実施形態では、図１９および図２０に示すように、上記第１実施形態と同様、発光素子としてのＬＥＤ２１がフレーム２２上に搭載されており、そのフレーム２２上に枠状の反射面２３ａを有する反射枠２３が配置されている。また、ＬＥＤ２１は、反射枠２３の開口部内に埋め込まれた封止部材（シリコーン系封止材料）２４によって封止されている。 In the second embodiment, as shown in FIGS. 19 and 20, the LED 21 as a light emitting element is mounted on a frame 22 as in the first embodiment, and a frame-shaped reflecting surface 23 a is mounted on the frame 22. A reflection frame 23 having the above is disposed. The LED 21 is sealed by a sealing member (silicone sealing material) 24 embedded in the opening of the reflection frame 23.
　フレーム２２は、アルミニウム、アルミニウム合金、銅および銅合金などの高熱伝導材料からなり、かつ、上記第１実施形態のフレーム２に施されたメッキ処理と同様のメッキ処理が施されたものである。さらに、フレーム２２は、平面積が大きいフレーム部２２ａと、そのフレーム部２２ａよりも平面積が小さいフレーム部２２ｂとの２つに分割されている。そして、ＬＥＤ２１は、フレーム部２２ａのＬＥＤ搭載部（フレーム２２の中央部分）２２ｃ上に配置されているとともに、フレーム部２２ａおよび２２ｂにワイヤ２５を介して電気的に接続されている。なお、フレーム２２に含まれるフレーム部２２ａおよび２２ｂは、それぞれ、本発明の「第１フレーム部」および「第２フレーム部」の一例であり、詳細な形状としては、図２１～図２３に示されるようになっている。 The frame 22 is made of a high heat conductive material such as aluminum, aluminum alloy, copper and copper alloy, and is subjected to the same plating process as the plating process applied to the frame 2 of the first embodiment. Further, the frame 22 is divided into two parts, a frame part 22a having a large flat area and a frame part 22b having a smaller flat area than the frame part 22a. The LED 21 is disposed on the LED mounting portion (center portion of the frame 22) 22c of the frame portion 22a, and is electrically connected to the frame portions 22a and 22b via wires 25. The frame portions 22a and 22b included in the frame 22 are examples of the “first frame portion” and the “second frame portion” of the present invention, respectively. The detailed shapes are shown in FIGS. 21 to 23. It is supposed to be.
　反射枠２３は、アルミニウム、アルミニウム合金、銅および銅合金などの高熱伝導材料からなり、かつ、上記第１実施形態の反射枠３に施されたメッキ処理と同様のメッキ処理など（アルマイト処理および化学研磨などを含む）が施されたものである。そして、この反射枠２３の反射面２３ａは、放射状に広がる傾斜面と、その傾斜面に繋がる垂直面とを持っている。なお、反射枠２３の詳細な形状としては、図２４～図２６に示されるようになっている。 The reflection frame 23 is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy, and is similar to the plating treatment applied to the reflection frame 3 of the first embodiment (anodizing treatment and chemical treatment). (Including polishing etc.). And the reflective surface 23a of this reflective frame 23 has the inclined surface which spreads radially, and the perpendicular surface connected with the inclined surface. The detailed shape of the reflection frame 23 is as shown in FIGS.
　また、これらフレーム２２および反射枠２３は、所定部分において互いに直接接触している。具体的には、図２１～図２３に示すように、フレーム２２の所定部分に、他の部分よりも反射枠２３側に向かって突出した突出部（反射枠２３に対して直接接触する部分）２２ｄが形成されている。なお、このフレーム２２の突出部２２ｄは、フレーム部２２ａのうちのＬＥＤ搭載部２２ｃおよびそれ以外の３ヶ所の部分２２ｅを除く部分に設けられており、フレーム部２２ｂには設けられていない。 Further, the frame 22 and the reflection frame 23 are in direct contact with each other at a predetermined portion. Specifically, as shown in FIG. 21 to FIG. 23, a protruding portion that protrudes toward a reflective frame 23 side from other portions at a predetermined portion of the frame 22 (a portion that directly contacts the reflective frame 23). 22d is formed. The protruding portion 22d of the frame 22 is provided in a portion of the frame portion 22a excluding the LED mounting portion 22c and the other three portions 22e, and is not provided in the frame portion 22b.
　そして、図２０に示すように、フレーム部２２ａの突出部２２ｄ上に反射枠２３の枠部が直に載置され、それによって、フレーム部２２ａと反射枠２３とが直接接触している。また、フレーム部２２ａの突出部２２ｄ上に反射枠２３の枠部が直に載置されることで、フレーム部２２ａの部分２２ｅと反射枠２３の枠部とが離間され、かつ、フレーム部２２ｂと反射枠２３の枠部とが離間されている。 And as shown in FIG. 20, the frame part of the reflective frame 23 is directly mounted on the protrusion part 22d of the frame part 22a, and, thereby, the frame part 22a and the reflective frame 23 are directly contacting. Further, the frame portion of the reflection frame 23 is directly placed on the protruding portion 22d of the frame portion 22a, whereby the portion 22e of the frame portion 22a and the frame portion of the reflection frame 23 are separated from each other, and the frame portion 22b. And the frame portion of the reflection frame 23 are separated from each other.
　ここで、第２実施形態では、白色のシリコーン系接着材料からなる固着部材２６によってフレーム部２２ａおよび２２ｂが互いに固着されているとともに、白色のシリコーン系接着材料からなる固着部材２７によってフレーム２２と反射枠２３とが固着され、かつ、白色のシリコーン系接着材料からなる固着部材２８によってＬＥＤ２１とフレーム部２２ａ（ＬＥＤ搭載部２２ｃ）とが固着されている。これら固着部材２６～２８の構成材料である白色のシリコーン系接着材料は互いに同じ材料であり、たとえば、信越化学工業株式会社製の「ＫＥＲ－３１００－Ｕ２」や「ＫＥＲ－３２００－Ｔ１」などである。なお、固着部材２６～２８は、それぞれ、本発明の「第１固着部材」、「第２固着部材」および「第３固着部材」の一例である。 Here, in the second embodiment, the frame portions 22a and 22b are fixed to each other by the fixing member 26 made of a white silicone adhesive material, and the frame 22 is reflected from the frame 22 by the fixing member 27 made of a white silicone adhesive material. The frame 23 is fixed, and the LED 21 and the frame portion 22a (LED mounting portion 22c) are fixed by a fixing member 28 made of a white silicone-based adhesive material. The white silicone adhesive materials constituting the fixing members 26 to 28 are the same material, such as “KER-3100-U2” and “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd. is there. The fixing members 26 to 28 are examples of the “first fixing member”, the “second fixing member”, and the “third fixing member” in the present invention, respectively.
　フレーム部２２ａおよび２２ｂを互いに固着するための固着部材２６は、フレーム２２の板厚と略同じ厚みで形成されているとともに、フレーム部２２ａとフレーム部２２ｂとの間の領域の全域に配置されている。したがって、フレーム部２２ａとフレーム部２２ｂとの間には、空隙が生じていない。なお、この固着部材２６の平面視における配置領域は、図２７中の破線のハッチングが施された領域（ハッチング間隔が狭い領域およびハッチング間隔が広い領域）２０ａである。 The fixing member 26 for fixing the frame portions 22a and 22b to each other is formed to have substantially the same thickness as the plate thickness of the frame 22, and is disposed over the entire region between the frame portion 22a and the frame portion 22b. Yes. Therefore, there is no gap between the frame portion 22a and the frame portion 22b. In addition, the arrangement | positioning area | region in the planar view of this adhering member 26 is the area | region (area | region where a hatching space | interval is narrow, and a hatching space | interval is wide) where the broken line hatching was given in FIG.
　また、フレーム２２と反射枠２３とを固着するための固着部材２７は、フレーム２２と反射枠２３の枠部との間で、かつ、フレーム２２と反射枠２３の枠部とが重畳する領域のうち、フレーム部２２ａの突出部２２ｄが存在しない領域に配置されている。加えて、固着部材２６と反射枠２３の枠部とが重畳する領域にも固着部材２７が配置されている。このため、フレーム２２と反射枠２３の枠部との間についても、空隙が生じていない。なお、この固着部材２７の平面視における配置領域は、図２７中の実線のハッチングが施された領域２０ｂ、および、破線のハッチングが施された領域２０ａのうちのハッチング間隔が狭い領域である。 Further, the fixing member 27 for fixing the frame 22 and the reflection frame 23 is an area between the frame 22 and the frame portion of the reflection frame 23 and an area where the frame 22 and the frame portion of the reflection frame 23 overlap. Of these, the protrusion 22d of the frame portion 22a is disposed in a region that does not exist. In addition, the fixing member 27 is also arranged in a region where the fixing member 26 and the frame portion of the reflection frame 23 overlap. For this reason, no gap is generated between the frame 22 and the frame portion of the reflection frame 23. In addition, the arrangement | positioning area | region in planar view of this adhering member 27 is an area | region where the hatching space | interval is narrow among the area | region 20b to which the solid line hatching in FIG. 27 was given, and the area | region 20a to which the broken line hatching was given.
　なお、フレーム部２２ａと反射枠２３の枠部とが直接接触する領域には固着部材２７を配置しないようにしているが、このようにすることで、フレーム部２２ａと反射枠２３との間の熱伝導が高められている。ただし、図示しないが、フレーム部２２ａと反射枠２３の枠部とが直接接触する領域に、極薄い固着部材を配置してもよいし、固着部材が自然に浸透していくようにしてもよい。この場合には、微小な隙間が残らないので、固着強度を高くすることができるとともに、光漏れの抑制効果をより向上させることができる。加えて、微小な隙間が残らないように極薄の固着部材を浸透させることにより、フレーム部２２ａと反射枠２３との間の熱伝導をさらに高めることもできる。 Note that the fixing member 27 is not disposed in the region where the frame portion 22a and the frame portion of the reflection frame 23 are in direct contact with each other. However, by doing so, the frame portion 22a and the reflection frame 23 are not disposed. Heat conduction is enhanced. However, although not shown, an extremely thin fixing member may be disposed in a region where the frame portion 22a and the frame portion of the reflection frame 23 are in direct contact, or the fixing member may naturally permeate. . In this case, since a minute gap does not remain, the fixing strength can be increased and the light leakage suppression effect can be further improved. In addition, the heat conduction between the frame portion 22a and the reflection frame 23 can be further enhanced by infiltrating the extremely thin fixing member so that no minute gap remains.
　また、ＬＥＤ２１とフレーム部２２ａ（ＬＥＤ搭載部２２ｃ）とを固着するための固着部材２８は、平面的に見ると、図２７中の格子状のハッチングが施された領域２０ｃに配置されることになる。 Further, the fixing member 28 for fixing the LED 21 and the frame portion 22a (the LED mounting portion 22c) is arranged in the lattice-shaped hatched region 20c in FIG. Become.
　さらに、第２実施形態では、フレーム部２２ａに対する反射枠２３の固着が、フレーム部２２ａに反射枠２３を機械的に取り付けることによってもなされている。具体的には、図２１に示すように、フレーム部２２ａの突出部２２ｄ内に、板厚方向に貫通する４つの貫通穴（凹部）２２ｆが形成されているとともに、図２４～図２６に示すように、反射枠２３の枠部の裏面側（フレーム２２側）に、フレーム部２２ａの貫通穴２２ｆに挿入可能な４つの突起（凸部）２３ｂが形成されている。そして、図２８に示すように、反射枠２３の突起２３ｂがフレーム部２２ａの貫通穴２２ｆに挿入され、その状態で、フレーム部２２ａの貫通穴２２ｆに反射枠２３の突起２３ｂがかしめられている。 Furthermore, in the second embodiment, the reflection frame 23 is fixed to the frame portion 22a by mechanically attaching the reflection frame 23 to the frame portion 22a. Specifically, as shown in FIG. 21, four through-holes (concave portions) 22f penetrating in the plate thickness direction are formed in the projecting portion 22d of the frame portion 22a, as shown in FIGS. Thus, four protrusions (convex portions) 23b that can be inserted into the through holes 22f of the frame portion 22a are formed on the back surface side (the frame 22 side) of the frame portion of the reflective frame 23. As shown in FIG. 28, the projection 23b of the reflection frame 23 is inserted into the through hole 22f of the frame portion 22a, and in this state, the projection 23b of the reflection frame 23 is caulked into the through hole 22f of the frame portion 22a. .
　第２実施形態では、上記のように、固着部材２６～２８の構成材料を白色のシリコーン系接着材料とすることによって、第１実施形態と同様、発光特性、放熱特性および信頼性が向上するなどの効果を得ることができる。 In the second embodiment, as described above, the light emitting characteristics, the heat radiation characteristics, and the reliability are improved by using a white silicone-based adhesive material as the constituent material of the fixing members 26 to 28, as in the first embodiment. The effect of can be obtained.
　また、第２実施形態では、上記のように、フレーム部２２ａに突出部２２ｄを形成するとともに、そのフレーム部２２ａの突出部２２ｄを反射枠２３に直接接触させることによって、フレーム部２２ａと反射枠２３との間の熱伝導がより良好になり、さらに効率的な放熱を行うことができる。なお、この場合には、フレーム部２２ｂには反射枠２３が直接接触しないので、反射枠２３を介してフレーム部２２ａとフレーム部２２ｂとが電気的に接続されることはない。 In the second embodiment, as described above, the projecting portion 22d is formed on the frame portion 22a, and the projecting portion 22d of the frame portion 22a is brought into direct contact with the reflecting frame 23, whereby the frame portion 22a and the reflecting frame are formed. Therefore, the heat conduction to and from the heater 23 becomes better, and more efficient heat dissipation can be performed. In this case, since the reflection frame 23 does not directly contact the frame portion 22b, the frame portion 22a and the frame portion 22b are not electrically connected via the reflection frame 23.
　また、第２実施形態では、上記のように、フレーム部２２ａに貫通穴２２ｆを形成するとともに、反射枠２３に突起２３ｂを形成し、フレーム部２２ａの貫通穴２２ｆに反射枠２３の突起２３ｂをかしめることによって、フレーム部２２ａと反射枠２３との間の固着強度をより高めることができる。さらに、フレーム２２に対して反射枠２３が横方向に位置ずれしてしまうのを抑制することもできる。また、反射枠２３の突起２３ｂをサーマルビアとして機能させることができるので、放熱がより効率的になる。 In the second embodiment, as described above, the through hole 22f is formed in the frame portion 22a, the projection 23b is formed in the reflection frame 23, and the projection 23b of the reflection frame 23 is formed in the through hole 22f of the frame portion 22a. By caulking, the fixing strength between the frame portion 22a and the reflection frame 23 can be further increased. Furthermore, it is also possible to suppress the displacement of the reflection frame 23 in the lateral direction with respect to the frame 22. In addition, since the protrusion 23b of the reflection frame 23 can function as a thermal via, heat dissipation becomes more efficient.
　なお、上記した第２実施形態の構成において、図２９に示すように、フレーム２２と反射枠２３とを固着する固着部材（フレーム２２と反射枠２３との間に配置される固着部材）２７の一部を意図的に外側にはみ出させることによって、マイグレーションの抑制を図るようにしてもよい。また、この場合には、固着部材２７が外側にはみ出している分だけ接着面積が増大するので、フレーム２２と反射枠２３との固着をさらに強固にすることができる。 In the configuration of the second embodiment described above, as shown in FIG. 29, the fixing member 27 (fixing member disposed between the frame 22 and the reflecting frame 23) 27 that fixes the frame 22 and the reflecting frame 23 is fixed. Migration may be suppressed by intentionally protruding a part to the outside. Further, in this case, since the adhesion area is increased by the extent that the fixing member 27 protrudes to the outside, the fixing between the frame 22 and the reflection frame 23 can be further strengthened.
　また、図２９に示した変形例では、フレーム部２２ａとフレーム部２２ｂとの間の間隙の断面形状が段差（二段）形状となっており、上側の間隙幅が狭く、下側の間隙幅が広くなっている。上側の間隙幅を狭くしているのは光漏れを少しでも減少させるためであり、下側の間隙幅を広くしているのは半田付け時にショート不良が発生するのを抑制するためである。また、このようにすることで、フレーム２２と固着部材２６との間の接着面積が増大し、剥離などの発生も抑制される。 In the modification shown in FIG. 29, the cross-sectional shape of the gap between the frame portion 22a and the frame portion 22b is a step (two-stage) shape, the upper gap width is narrow, and the lower gap width is Is getting wider. The reason why the upper gap width is narrowed is to reduce light leakage as much as possible, and the lower gap width is widened to suppress the occurrence of short-circuit defects during soldering. Moreover, by doing in this way, the adhesion area between the flame | frame 22 and the adhering member 26 increases, and generation | occurrence | production of peeling etc. is suppressed.
　また、上記した第２実施形態の構成において、図３０に示すように、フレーム部２２ａの貫通穴２２ｆに反射枠２３の突起２３ｂを圧入してもよい。この場合には、容易に、フレーム部２２ａへの反射枠２３の機械的な取り付けを行うことができる。 Further, in the configuration of the second embodiment described above, as shown in FIG. 30, the projection 23b of the reflection frame 23 may be press-fitted into the through hole 22f of the frame portion 22a. In this case, it is possible to easily attach the reflection frame 23 to the frame portion 22a.
　また、上記した第２実施形態の構成において、図３１に示すように、フレーム部２２ａの貫通穴２２ｆと反射枠２３の突起２３ｂとの間に隙間を設け、その隙間に固着部材２７の一部を埋め込んでもよい。このようにすれば、固着部材２７の一部（フレーム部２２ａの貫通穴２２ｆと反射枠２３の突起２３ｂとの間に埋め込まれた部分）によって、フレーム部２２ａと反射枠２３との間の熱膨張の差を吸収することができるという効果が得られる。 In the configuration of the second embodiment described above, as shown in FIG. 31, a gap is provided between the through hole 22f of the frame portion 22a and the projection 23b of the reflection frame 23, and a part of the fixing member 27 is provided in the gap. May be embedded. In this way, heat between the frame portion 22a and the reflection frame 23 is caused by a part of the fixing member 27 (portion embedded between the through hole 22f of the frame portion 22a and the projection 23b of the reflection frame 23). The effect that the difference in expansion can be absorbed is obtained.
　また、上記した第２実施形態の構成において、図３２および図３３に示すように、フレーム部２２ａおよび２２ｂの反射枠２３の枠部と重畳する部分の外形を変更し、フレーム部２２ａに形成する貫通穴２２ｆを２つに減らすとともに、フレーム部２２ｂに新たに２つの貫通穴（凹部）２２ｇを形成してもよい。この場合、図３４に示すように、フレーム部２２ｂの貫通穴２２ｇと反射枠２３の突起２３ｂとの間に固着部材２７の一部を埋め込めば、フレーム部２２ｂと反射枠２３とを電気的に絶縁しながら、フレーム部２２ｂと反射枠２３との固着を強固にすることができる。 Further, in the configuration of the second embodiment described above, as shown in FIGS. 32 and 33, the outer shape of the portion of the frame portions 22a and 22b that overlaps the frame portion of the reflection frame 23 is changed to form the frame portion 22a. While reducing the number of through holes 22f to two, two new through holes (concave portions) 22g may be formed in the frame portion 22b. In this case, as shown in FIG. 34, if a part of the fixing member 27 is embedded between the through hole 22g of the frame portion 22b and the protrusion 23b of the reflection frame 23, the frame portion 22b and the reflection frame 23 are electrically connected. The insulation between the frame portion 22b and the reflection frame 23 can be strengthened while insulating.
　（第３実施形態）
　以下に、図３５～図４０を参照して、第３実施形態による発光装置３０の構成について詳細に説明する。 (Third embodiment)
Hereinafter, the configuration of the light emitting device 30 according to the third embodiment will be described in detail with reference to FIGS.
　第３実施形態では、図３５～図３７に示すように、上記第１実施形態と同様、発光素子としてのＬＥＤ３１がフレーム３２上に搭載されており、そのフレーム３２上に枠状の反射面３３ａを有する反射枠３３が配置されている。また、ＬＥＤ３１は、反射枠３３の開口部内に埋め込まれた封止部材（シリコーン系封止材料）３４によって封止されている。 In the third embodiment, as shown in FIGS. 35 to 37, the LED 31 as the light emitting element is mounted on the frame 32 as in the first embodiment, and the frame-shaped reflecting surface 33a is mounted on the frame 32. A reflection frame 33 having the above is disposed. The LED 31 is sealed by a sealing member (silicone sealing material) 34 embedded in the opening of the reflection frame 33.
　フレーム３２は、アルミニウム、アルミニウム合金、銅および銅合金などの高熱伝導材料からなり、かつ、上記第１実施形態のフレーム２に施されたメッキ処理と同様のメッキ処理が施されたものである。また、このフレーム３２は、平面積が大きいフレーム部３２ａと、フレーム部３２ａよりも平面積が小さいフレーム部３２ｂとの２つに分割されている。そして、ＬＥＤ３１は、フレーム部３２ａのＬＥＤ搭載部（フレーム３２の中央部分）３２ｃ上に配置されているとともに、フレーム部３２ａおよび３２ｂにワイヤ３５を介して電気的に接続されている。なお、フレーム３２に含まれるフレーム部３２ａおよび３２ｂは、それぞれ、本発明の「第１フレーム部」および「第２フレーム部」の一例であって、反射枠３３側から斜視的に見ると、図３８に示されるようになっている。 The frame 32 is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy, and is subjected to the same plating process as the plating process applied to the frame 2 of the first embodiment. The frame 32 is divided into a frame portion 32a having a large plane area and a frame portion 32b having a plane area smaller than that of the frame portion 32a. The LED 31 is disposed on the LED mounting portion (center portion of the frame 32) 32c of the frame portion 32a, and is electrically connected to the frame portions 32a and 32b via wires 35. The frame portions 32a and 32b included in the frame 32 are examples of the “first frame portion” and the “second frame portion” of the present invention, respectively. 38. As shown in FIG.
　反射枠３３は、アルミニウム、アルミニウム合金、銅および銅合金などの高熱伝導材料からなり、かつ、上記第１実施形態の反射枠３に施されたメッキ処理と同様のメッキ処理など（アルマイト処理および化学研磨などを含む）が施されたものである。そして、この反射枠３３の反射面３３ａは、放射状に広がる傾斜面と、その傾斜面に繋がる垂直面とを持っている。なお、反射枠３３をフレーム３２側から斜視的に見ると、図３９に示されるようになっている。 The reflective frame 33 is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy, and is similar to the plating process applied to the reflective frame 3 of the first embodiment (alumite treatment and chemical treatment). (Including polishing etc.). And the reflective surface 33a of this reflective frame 33 has the inclined surface which spreads radially, and the perpendicular surface connected with the inclined surface. Note that FIG. 39 shows the reflection frame 33 as seen from the frame 32 side.
　ここで、第３実施形態では、図３８に示すように、フレーム３２の所定部分に、他の部分よりも反射枠３３側に向かって突出した突出部３２ｄが形成されている。なお、このフレーム３２の突出部３２ｄは、フレーム部３２ａのうちのＬＥＤ搭載部３２ｃおよび外周部３２ｅを除く部分に設けられており、フレーム部３２ｂには設けられていない。また、フレーム部３２ａの突出部３２ｄ内には、その突出部３２ｄからさらに反射枠３３側に向かって突出する４つの突起（凸部）３２ｆが形成されている。 Here, in the third embodiment, as shown in FIG. 38, a predetermined portion of the frame 32 is formed with a protruding portion 32 d that protrudes toward the reflecting frame 33 rather than other portions. The protruding portion 32d of the frame 32 is provided in a portion of the frame portion 32a excluding the LED mounting portion 32c and the outer peripheral portion 32e, and is not provided in the frame portion 32b. In addition, four protrusions (convex portions) 32f are formed in the protruding portion 32d of the frame portion 32a so as to protrude further toward the reflecting frame 33 from the protruding portion 32d.
　また、図３９に示すように、反射枠３３の枠部の裏面側（フレーム３２側）には、４つの非貫通穴（凹部）３３ｂが形成されている。この反射枠３３の非貫通穴３３ｂは、フレーム部３２ａの突起３２ｆを挿入することが可能な形状となっている。 Further, as shown in FIG. 39, four non-through holes (concave portions) 33b are formed on the back surface side (frame 32 side) of the frame portion of the reflective frame 33. The non-through hole 33b of the reflection frame 33 has a shape in which the protrusion 32f of the frame portion 32a can be inserted.
　そして、図３６および図３７に示すように、フレーム部３２ａの突出部３２ｄ上に反射枠３３の枠部が直に載置され、それによって、フレーム部３２ａと反射枠３３とが直接接触している。また、フレーム部３２ａの突出部３２ｄ上に反射枠３３の枠部が直に載置されることで、フレーム部３２ａの外周部３２ｅと反射枠３３の枠部とが離間され、かつ、フレーム部３２ｂと反射枠３３の枠部とが離間されている。 As shown in FIGS. 36 and 37, the frame portion of the reflection frame 33 is placed directly on the protruding portion 32d of the frame portion 32a, whereby the frame portion 32a and the reflection frame 33 are in direct contact with each other. Yes. Further, since the frame portion of the reflection frame 33 is placed directly on the protruding portion 32d of the frame portion 32a, the outer peripheral portion 32e of the frame portion 32a and the frame portion of the reflection frame 33 are separated from each other, and the frame portion 32b and the frame part of the reflective frame 33 are spaced apart.
　さらに、フレーム部３２ａの突出部３２ｄ上に反射枠３３の枠部が直に載置された状態で、フレーム部３２ａの突起３２ｆが反射枠３３の非貫通穴３３ｂに挿入されている。なお、フレーム部３２ａの突起３２ｆの先端部と反射枠３３の非貫通穴３３ｂの底部とは離間されている。 Furthermore, the protrusion 32f of the frame portion 32a is inserted into the non-through hole 33b of the reflection frame 33 in a state where the frame portion of the reflection frame 33 is directly placed on the protruding portion 32d of the frame portion 32a. Note that the tip of the protrusion 32f of the frame portion 32a and the bottom of the non-through hole 33b of the reflection frame 33 are separated from each other.
　ここで、第３実施形態では、白色のシリコーン系接着材料からなる固着部材３６によってフレーム部３２ａおよび３２ｂが互いに固着されているとともに、白色のシリコーン系接着材料からなる固着部材３７によってフレーム３２と反射枠３３とが固着され、かつ、白色のシリコーン系接着材料によってＬＥＤ３１とフレーム部３２ａ（ＬＥＤ搭載部３２ｃ）とが固着されている。これら固着部材３６～３８の構成材料である白色のシリコーン系接着材料は互いに同じ材料であって、たとえば、信越化学工業株式会社製の「ＫＥＲ－３１００－Ｕ２」や「ＫＥＲ－３２００－Ｔ１」などである。なお、固着部材３６～３８は、それぞれ、本発明の「第１固着部材」、「第２固着部材」および「第３固着部材」の一例である。 Here, in the third embodiment, the frame portions 32a and 32b are fixed to each other by the fixing member 36 made of white silicone adhesive material, and the frame 32 is reflected from the frame 32 by the fixing member 37 made of white silicone adhesive material. The frame 33 is fixed, and the LED 31 and the frame portion 32a (LED mounting portion 32c) are fixed by a white silicone-based adhesive material. The white silicone-based adhesive materials constituting the fixing members 36 to 38 are the same material, for example, “KER-3100-U2” and “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd. It is. The fixing members 36 to 38 are examples of the “first fixing member”, the “second fixing member”, and the “third fixing member” in the present invention, respectively.
　フレーム部３２ａおよび３２ｂを互いに固着するための固着部材３６は、フレーム３２の板厚と略同じ厚みで形成されているとともに、フレーム部３２ａとフレーム部３２ｂとの間の領域の全域に配置されている。したがって、フレーム部３２ａとフレーム部３２ｂとの間には、空隙が生じていない。なお、この固着部材３６の平面視における配置領域は、図４０中の破線のハッチングが施された領域（ハッチング間隔が狭い領域およびハッチング間隔が広い領域）３０ａである。 The fixing member 36 for fixing the frame portions 32a and 32b to each other is formed to have substantially the same thickness as the plate thickness of the frame 32, and is disposed over the entire region between the frame portion 32a and the frame portion 32b. Yes. Therefore, no gap is generated between the frame portion 32a and the frame portion 32b. In addition, the arrangement | positioning area | region in planar view of this adhering member 36 is the area | region (area | region where a hatching space | interval is narrow, and a hatching space | interval is wide) 30a where the broken line hatching was given in FIG.
　また、フレーム３２と反射枠３３とを固着するための固着部材３７は、フレーム３２と反射枠３３の枠部との間で、かつ、フレーム３２と反射枠３３の枠部とが重畳する領域のうち、フレーム部３２ａの突出部３２ｄが存在しない領域に配置されている。ただし、固着部材３７は、フレーム部３２ａの突起３２ｆの先端部と反射枠３３の非貫通穴３３ｂの底部との間には配置されている。加えて、固着部材３６と反射枠３３の枠部とが重畳する領域にも固着部材３７が配置されている。このため、フレーム３２と反射枠３３の枠部との間についても、空隙が生じていない。なお、この固着部材３７の平面視における配置領域は、図４０中の実線のハッチングが施された領域３０ｂ、および、破線のハッチングが施された領域３０ａのうちのハッチング間隔が狭い領域である。 Further, the fixing member 37 for fixing the frame 32 and the reflection frame 33 is an area between the frame 32 and the frame portion of the reflection frame 33 and the region where the frame 32 and the frame portion of the reflection frame 33 overlap. Of these, the protrusion 32d of the frame portion 32a is disposed in a region that does not exist. However, the fixing member 37 is disposed between the tip end portion of the protrusion 32 f of the frame portion 32 a and the bottom portion of the non-through hole 33 b of the reflection frame 33. In addition, the fixing member 37 is also arranged in a region where the fixing member 36 and the frame portion of the reflection frame 33 overlap. For this reason, no gap is generated between the frame 32 and the frame portion of the reflection frame 33. In addition, the arrangement | positioning area | region in planar view of this adhering member 37 is an area | region where the hatching space | interval is narrow among the area | region 30b to which the solid line hatching in FIG. 40 was given, and the area | region 30a to which the broken line hatching was given.
　また、ＬＥＤ３１とフレーム部３２ａ（ＬＥＤ搭載部３２ｃ）とを固着するための固着部材３８は、平面的に見ると、図４０中の格子状のハッチングが施された領域３０ｃに配置されることになる。 Further, the fixing member 38 for fixing the LED 31 and the frame portion 32a (the LED mounting portion 32c) is arranged in the lattice-shaped hatched region 30c in FIG. Become.
　ところで、この実施形態では、フレーム３２の裏面側（反射枠３３側とは反対側）にも固着部材３９が設けられているが、フレーム３２の裏面側の固着部材３９は設けてもよいし、設けなくてもよい。 By the way, in this embodiment, the fixing member 39 is also provided on the back side of the frame 32 (the side opposite to the reflection frame 33 side), but the fixing member 39 on the back side of the frame 32 may be provided, It does not have to be provided.
　第３実施形態では、上記のように、固着部材３６～３８の構成材料を白色のシリコーン系接着材料とすることによって、第１実施形態と同様、発光特性、放熱特性および信頼性が向上するなどの効果を得ることができる。 In the third embodiment, as described above, the light emitting characteristics, the heat radiation characteristics, and the reliability are improved by using a white silicone-based adhesive material as the constituent material of the fixing members 36 to 38, as in the first embodiment. The effect of can be obtained.
　また、第３実施形態では、上記のように、フレーム部３２ａに突出部３２ｄを形成するとともに、そのフレーム部３２ａの突出部３２ｄを反射枠３３に直接接触させることによって、フレーム部３２ａと反射枠３３との間の熱伝導がより良好になり、放熱特性がさらに向上する。なお、この場合には、フレーム部３２ｂには反射枠３３が直接接触しないので、反射枠３３を介してフレーム部３２ａとフレーム部３２ｂとが電気的に接続されることはない。 In the third embodiment, as described above, the protrusion 32d is formed on the frame 32a, and the protrusion 32d of the frame 32a is brought into direct contact with the reflection frame 33, whereby the frame 32a and the reflection frame are formed. The heat conduction to and from 33 becomes better, and the heat dissipation characteristics are further improved. In this case, since the reflection frame 33 does not directly contact the frame portion 32b, the frame portion 32a and the frame portion 32b are not electrically connected via the reflection frame 33.
　また、第３実施形態では、上記のように、フレーム部３２ａに突起３２ｆを形成するとともに、反射枠３３に非貫通穴３３ｂを形成し、フレーム部３２ａの突起３２ｆを反射枠３３の非貫通穴３３ｂに挿入することによって、フレーム部３２ａの突起３２ｆをサーマルビアとして機能させることができるので、放熱がより効率的になる。この場合、フレーム部３２ａの突起３２ｆの先端部と反射枠３３の非貫通穴３３ｂの底部とを固着部材３７で固着することによって、フレーム部３２ａと反射枠３３との間の固着強度も高めることができる。さらに、フレーム３２に対して反射枠３３が横方向に位置ずれしてしまうのを抑制することもできる。 Further, in the third embodiment, as described above, the protrusion 32f is formed in the frame portion 32a, the non-through hole 33b is formed in the reflection frame 33, and the protrusion 32f of the frame portion 32a is formed in the non-through hole of the reflection frame 33. By inserting it into 33b, the projection 32f of the frame portion 32a can function as a thermal via, so that heat dissipation becomes more efficient. In this case, the fixing strength between the frame portion 32a and the reflection frame 33 is also increased by fixing the tip of the projection 32f of the frame portion 32a and the bottom of the non-through hole 33b of the reflection frame 33 with the fixing member 37. Can do. Further, it is possible to prevent the reflective frame 33 from being displaced laterally with respect to the frame 32.
　なお、上記した第３実施形態の構成において、図４１に示すように、フレーム３２と反射枠３３とを固着する固着部材（フレーム３２と反射枠３３との間に配置される固着部材）３７の一部を意図的に外側にはみ出させることによって、マイグレーションの抑制を図るようにしてもよい。また、この場合には、固着部材３７が外側にはみ出している分だけ接着面積が増大するので、フレーム３２と反射枠３３との固着をさらに強固にすることができる。 In the configuration of the third embodiment described above, as shown in FIG. 41, the fixing member 37 (fixing member disposed between the frame 32 and the reflecting frame 33) 37 that fixes the frame 32 and the reflecting frame 33 is fixed. Migration may be suppressed by intentionally protruding a part to the outside. Further, in this case, since the adhesion area is increased by the extent that the fixing member 37 protrudes to the outside, the fixing between the frame 32 and the reflection frame 33 can be further strengthened.
　以下に、図４２～図４９を参照して、第３実施形態による発光装置３０の製造方法について説明する。 Hereinafter, a method for manufacturing the light emitting device 30 according to the third embodiment will be described with reference to FIGS.
　第３実施形態の製造方法としては、まず、図４２～図４４に示すように、互いに電気的に絶縁されるフレーム部３２ａおよび３２ｂを有するフレーム３２がマトリクス状に複数繋がれた金属構造体を作製する。この際、フレーム部３２ａの所定部分を他の部分よりも突出させることで突出部３２ｄを形成し、その突出部３２ｄ内にさらに突起３２ｆを形成する。 As a manufacturing method of the third embodiment, first, as shown in FIGS. 42 to 44, a metal structure in which a plurality of frames 32 having frame portions 32a and 32b that are electrically insulated from each other are connected in a matrix is used. Make it. At this time, a projecting portion 32d is formed by projecting a predetermined portion of the frame portion 32a from other portions, and a projection 32f is further formed in the projecting portion 32d.
　また、図４５～図４７に示すように、枠状の反射面３３ａを有する反射枠３３がマトリクス状に複数繋がれた金属構造体も作製する。この際、反射枠３３の枠部の裏面側に、フレーム部３２ａの突起３２ｆを挿入することが可能な非貫通穴３３ｂを形成する。 Also, as shown in FIGS. 45 to 47, a metal structure in which a plurality of reflection frames 33 each having a frame-like reflection surface 33a are connected in a matrix is also produced. At this time, a non-through hole 33 b into which the protrusion 32 f of the frame portion 32 a can be inserted is formed on the back side of the frame portion of the reflective frame 33.
　次に、図４８および図４９に示すように、スクリーン印刷法やディスペンス法などを用いて、領域３０ａ～３０ｃのそれぞれに、固着部材３６～３８を同時に塗布する。また、反射枠３３の枠部の裏面側に形成された非貫通穴３３ｂやその他の凹部にも固着部材３７を塗布する。 Next, as shown in FIGS. 48 and 49, the fixing members 36 to 38 are simultaneously applied to the regions 30a to 30c by using a screen printing method, a dispensing method, or the like. Further, the fixing member 37 is also applied to the non-through holes 33b formed on the back side of the frame portion of the reflective frame 33 and other concave portions.
　次に、図５０および図５１に示すように、固着部材３７を介してフレーム３２上に反射枠３３を配置するとともに、固着部材３８を介してフレーム部３２ａ（ＬＥＤ搭載部３２ｃ）上にＬＥＤ３１を配置する。この際、フレーム部３２ａの突出部３２ｄ上に反射枠３３の枠部が直に載置されることによって、フレーム３２と反射枠３３との間の距離が保持される。そして、その状態で、固着部材３６～３８の硬化を同時に行うことによって、フレーム部３２ａとフレーム部３２ｂとの固着、フレーム３２と反射枠３３との固着、および、ＬＥＤ３１とフレーム部３２ａ（ＬＥＤ搭載部３２ｃ）との固着を同時に行う。 Next, as shown in FIGS. 50 and 51, the reflection frame 33 is disposed on the frame 32 via the fixing member 37, and the LED 31 is mounted on the frame portion 32 a (LED mounting portion 32 c) via the fixing member 38. Deploy. At this time, the distance between the frame 32 and the reflection frame 33 is maintained by placing the frame portion of the reflection frame 33 directly on the protruding portion 32d of the frame portion 32a. In this state, the fixing members 36 to 38 are cured simultaneously, thereby fixing the frame portion 32a and the frame portion 32b, fixing the frame 32 and the reflection frame 33, and LED 31 and the frame portion 32a (LED mounting). The fixing with the part 32c) is performed at the same time.
　最後に、ワイヤボンディング工程、封止工程、および、分離工程を経て、図３５～図３７に示した第３実施形態による発光装置３０が製造される。 Finally, the light emitting device 30 according to the third embodiment shown in FIGS. 35 to 37 is manufactured through a wire bonding process, a sealing process, and a separation process.
　（第４実施形態）
　以下に、図５２～図５９を参照して、第４実施形態による発光装置４０の構成について詳細に説明する。 (Fourth embodiment)
Hereinafter, the configuration of the light emitting device 40 according to the fourth embodiment will be described in detail with reference to FIGS. 52 to 59.
　第４実施形態では、図５２～図５４に示すように、上記第１実施形態と同様、発光素子としてのＬＥＤ４１がフレーム４２上に搭載されており、そのフレーム４２上に枠状の反射面４３ａを有する反射枠４３が配置されている。また、ＬＥＤ４１は、反射枠４３の開口部内に埋め込まれた封止部材（シリコーン系封止材料）４４によって封止されている。 In the fourth embodiment, as shown in FIGS. 52 to 54, the LED 41 as a light emitting element is mounted on the frame 42 as in the first embodiment, and the frame-shaped reflecting surface 43a is mounted on the frame 42. A reflection frame 43 having the following is arranged. The LED 41 is sealed by a sealing member (silicone sealing material) 44 embedded in the opening of the reflection frame 43.
　フレーム４２は、アルミニウム、アルミニウム合金、銅および銅合金などの高熱伝導材料からなり、かつ、上記第１実施形態のフレーム２に施されたメッキ処理と同様のメッキ処理が施されたものである。また、フレーム４２は、平面積が大きい１つのフレーム部４２ａと、フレーム部４２ａよりも平面積が小さい６つのフレーム部４２ｂとに分割されている。そして、ＬＥＤ４１は、フレーム部４２ａのＬＥＤ搭載部（フレーム４２の中央部分）４２ｃ上に配置されているとともに、フレーム部４２ｂにワイヤ４５を介して電気的に接続されている。なお、フレーム４２に含まれるフレーム部４２ａおよび４２ｂは、それぞれ、本発明の「第１フレーム部」および「第２フレーム部」の一例であって、詳細な形状としては、図５５に示されるようになっている。 The frame 42 is made of a high heat conductive material such as aluminum, aluminum alloy, copper and copper alloy, and is subjected to the same plating process as the plating process applied to the frame 2 of the first embodiment. The frame 42 is divided into one frame part 42a having a large plane area and six frame parts 42b having a plane area smaller than that of the frame part 42a. The LED 41 is disposed on the LED mounting portion (a central portion of the frame 42) 42c of the frame portion 42a and is electrically connected to the frame portion 42b via a wire 45. The frame portions 42a and 42b included in the frame 42 are examples of the “first frame portion” and the “second frame portion” of the present invention, respectively, and the detailed shapes are as shown in FIG. It has become.
　反射枠４３は、アルミニウム、アルミニウム合金、銅および銅合金などの高熱伝導材料からなり、かつ、上記第１実施形態の反射枠３に施されたメッキ処理と同様のメッキ処理など（アルマイト処理および化学研磨などを含む）が施されたものである。そして、反射枠４３の反射面４３ａは、放射状に広がる傾斜面となるように形成されている。この反射枠４３の反射面４３ａの形状は、他の実施形態と同様、傾斜面と垂直面とを組み合わせたものであってもよい。なお、反射枠４３の詳細な形状としては、図５６～図５８に示されるようになっている。 The reflection frame 43 is made of a high heat conductive material such as aluminum, aluminum alloy, copper, and copper alloy, and is similar to the plating treatment applied to the reflection frame 3 of the first embodiment (alumite treatment and chemical treatment). (Including polishing etc.). And the reflective surface 43a of the reflective frame 43 is formed so that it may become the inclined surface which spreads radially. The shape of the reflection surface 43a of the reflection frame 43 may be a combination of an inclined surface and a vertical surface, as in the other embodiments. The detailed shape of the reflection frame 43 is as shown in FIGS.
　また、これらフレーム４２および反射枠４３は、所定部分において互いに直接接触している。具体的には、図５６～図５８に示すように、反射枠４３の枠部の裏面側（フレーム４２側）の所定部分に、他の部分よりも突出した突出部（フレーム４２に対して直接接触する部分）４３ｂが形成されている。なお、この反射枠４３の突出部４３ｂは、フレーム部４２ａと重畳する部分に設けられており、フレーム部４２ｂと重畳する部分には設けられていない。 Further, the frame 42 and the reflection frame 43 are in direct contact with each other at a predetermined portion. Specifically, as shown in FIG. 56 to FIG. 58, a predetermined portion on the back side (frame 42 side) of the frame portion of the reflective frame 43 is protruded from the other portion (directly with respect to the frame 42). (Contact portion) 43b is formed. In addition, the protrusion part 43b of this reflective frame 43 is provided in the part which overlaps with the frame part 42a, and is not provided in the part which overlaps with the frame part 42b.
　そして、図５３および図５４に示すように、フレーム部４２ａ上に反射枠４３の突出部４３ｂが直に載置され、それによって、フレーム部４２ａと反射枠４３とが直接接触している。また、フレーム部４２ａ上に反射枠４３の突出部４３ｂが直に載置されることで、フレーム部４２ｂと反射枠４３の枠部とが離間されている。 53 and 54, the protrusion 43b of the reflection frame 43 is placed directly on the frame portion 42a, whereby the frame portion 42a and the reflection frame 43 are in direct contact with each other. Further, the protruding portion 43b of the reflection frame 43 is directly placed on the frame portion 42a, so that the frame portion 42b and the frame portion of the reflection frame 43 are separated from each other.
　ここで、第４実施形態では、白色のシリコーン系接着材料からなる固着部材４６によってフレーム部４２ａおよび４２ｂが互いに固着されているとともに、白色のシリコーン系接着材料からなる固着部材４７によってフレーム４２と反射枠４３とが固着され、かつ、白色のシリコーン系接着材料からなる固着部材４８によってＬＥＤ４１とフレーム部４２ａ（ＬＥＤ搭載部４２ｃ）とが固着されている。これら固着部材４６～４８の構成材料である白色のシリコーン系接着材料は互いに同じ材料であり、たとえば、信越化学工業株式会社製の「ＫＥＲ－３１００－Ｕ２」や「ＫＥＲ－３２００－Ｔ１」などである。なお、固着部材４６～４８は、それぞれ、本発明の「第１固着部材」、「第２固着部材」および「第３固着部材」の一例である。 Here, in the fourth embodiment, the frame portions 42a and 42b are fixed to each other by the fixing member 46 made of a white silicone adhesive material, and the frame 42 is reflected from the frame 42 by the fixing member 47 made of a white silicone adhesive material. The frame 43 is fixed, and the LED 41 and the frame portion 42a (LED mounting portion 42c) are fixed by a fixing member 48 made of a white silicone-based adhesive material. The white silicone adhesive materials constituting the fixing members 46 to 48 are the same material, such as “KER-3100-U2” and “KER-3200-T1” manufactured by Shin-Etsu Chemical Co., Ltd. is there. The fixing members 46 to 48 are examples of the “first fixing member”, the “second fixing member”, and the “third fixing member” in the present invention, respectively.
　フレーム部４２ａおよび４２ｂを互いに固着するための固着部材４６は、フレーム４２の板厚と略同じ厚みで形成されているとともに、フレーム部４２ａとフレーム部４２ｂとの間の領域の全域に配置されている。したがって、フレーム部４２ａとフレーム部４２ｂとの間には、空隙が生じていない。なお、この固着部材４６の平面視における配置領域は、図５９中の破線のハッチングが施された領域（ハッチング間隔が狭い領域およびハッチング間隔が広い領域）４０ａである。 The fixing member 46 for fixing the frame portions 42a and 42b to each other is formed to have substantially the same thickness as the plate thickness of the frame 42, and is disposed in the entire region between the frame portion 42a and the frame portion 42b. Yes. Therefore, there is no gap between the frame part 42a and the frame part 42b. In addition, the arrangement | positioning area | region in planar view of this adhering member 46 is the area | region (area | region where a hatching space | interval is narrow, and a hatching space | interval is wide) where the broken line hatching was given in FIG.
　また、フレーム４２と反射枠４３とを固着するための固着部材４７は、フレーム４２と反射枠４３の枠部との間で、かつ、フレーム４２と反射枠４３の枠部とが重畳する領域のうち、反射枠４３の突出部４３ｂが存在しない領域に配置されている。加えて、固着部材４６と反射枠４３の枠部とが重畳する領域にも固着部材４７が配置されている。このため、フレーム４２と反射枠４３の枠部との間についても、空隙が生じていない。なお、この固着部材４７の平面視における配置領域は、図５９中の実線のハッチングが施された領域４０ｂ、および、破線のハッチングが施された領域４０ａのうちのハッチング間隔が狭い領域である。 Further, the fixing member 47 for fixing the frame 42 and the reflection frame 43 is an area between the frame 42 and the frame portion of the reflection frame 43 and an area where the frame 42 and the frame portion of the reflection frame 43 overlap. Among them, the reflection frame 43 is disposed in a region where the protruding portion 43b does not exist. In addition, the fixing member 47 is also disposed in a region where the fixing member 46 and the frame portion of the reflection frame 43 overlap. For this reason, there is no gap between the frame 42 and the frame portion of the reflection frame 43. In addition, the arrangement | positioning area | region in planar view of this adhering member 47 is an area | region where the hatching space | interval is narrow among the area | region 40b where the solid line hatching was given in FIG. 59, and the area | region 40a where the broken line hatching was given.
　また、ＬＥＤ４１とフレーム部４２ａ（ＬＥＤ搭載部４２ｃ）とを固着するための固着部材４８は、平面的に見ると、図５９中の格子状のハッチングが施された領域４０ｃに配置されることになる。 Further, the fixing member 48 for fixing the LED 41 and the frame part 42a (LED mounting part 42c) is arranged in a lattice-shaped hatched region 40c in FIG. Become.
　さらに、第４実施形態では、図５５に示すように、フレーム部４２ａのうちの反射枠４３の枠部と重畳する部分内に、板厚方向に貫通する２つの貫通穴（凹部）４２ｄが形成されている。また、図５６～図５８に示すように、反射枠４３の枠部の裏面側（フレーム４２側）に、フレーム部４２ａの貫通穴４２ｄに挿入可能な２つの突起（凸部）４３ｃが形成されている。そして、図５４に示すように、反射枠４３の突起４３ｃがフレーム部４２ａの貫通穴４２ｄに圧入され、これによって、フレーム部４２ａに対して反射枠４３が固着されている。なお、図示しないが、反射枠４３の突起４３ｃが存在する領域に、極薄の固着部材を配置してもよい。また、反射枠４３の突起４３ｃが存在する領域には固着部材を予め配置しないが、他の領域から固着部材が浸透してくるようにしてもよい。 Furthermore, in the fourth embodiment, as shown in FIG. 55, two through holes (concave portions) 42d penetrating in the plate thickness direction are formed in the portion of the frame portion 42a that overlaps the frame portion of the reflective frame 43. Has been. As shown in FIGS. 56 to 58, two projections (convex portions) 43c that can be inserted into the through holes 42d of the frame portion 42a are formed on the back surface side (the frame 42 side) of the frame portion of the reflective frame 43. ing. As shown in FIG. 54, the projection 43c of the reflection frame 43 is press-fitted into the through hole 42d of the frame portion 42a, and thereby the reflection frame 43 is fixed to the frame portion 42a. Although not shown, an extremely thin fixing member may be disposed in a region where the projection 43c of the reflection frame 43 exists. In addition, the fixing member is not disposed in advance in the region where the protrusion 43c of the reflection frame 43 exists, but the fixing member may penetrate from other regions.
　ところで、フレーム部４２ａに対する反射枠４３の固着については、反射枠４３の突起４３ｃをフレーム部４２ａの貫通穴４２ｄに圧入することで行ってもよいが、図２８に示した方法と同様、フレーム部４２ａの貫通穴４２ｄに反射枠４３の突起４３ｃをかしめることで行ってもよい。また、図３１に示した方法と同様、フレーム部４２ａの貫通穴４２ｄと反射枠４３の突起４３ｃと間に間隙を設け、その間隙に固着部材４７の一部を埋め込むようにしてもよい。 By the way, the fixing of the reflection frame 43 to the frame portion 42a may be performed by press-fitting the projection 43c of the reflection frame 43 into the through hole 42d of the frame portion 42a. However, as in the method shown in FIG. Alternatively, the protrusion 43c of the reflection frame 43 may be caulked in the through hole 42d of 42a. Similarly to the method shown in FIG. 31, a gap may be provided between the through hole 42d of the frame portion 42a and the projection 43c of the reflection frame 43, and a part of the fixing member 47 may be embedded in the gap.
　第４実施形態では、上記のように、固着部材４６～４８の構成材料を白色のシリコーン系接着材料とすることによって、第１実施形態と同様、発光特性、放熱特性および信頼性が向上するなどの効果を得ることができる。 In the fourth embodiment, as described above, the light emitting characteristics, the heat dissipation characteristics, and the reliability are improved by using a white silicone-based adhesive material as the constituent material of the fixing members 46 to 48, as in the first embodiment. The effect of can be obtained.
　また、第４実施形態では、上記のように、反射枠４３に突出部４３ｂを形成し、その反射枠４３の突出部４３ｂをフレーム部４２ａに直接接触させることによって、フレーム部４２ａと反射枠４３との間の熱伝導がより良好になるので、さらに効率的な放熱を行うことができる。なお、この場合には、フレーム部４２ｂには反射枠４３が直接接触しないので、反射枠４３を介してフレーム部４２ａとフレーム部４２ｂとが電気的に接続されることはない。 In the fourth embodiment, as described above, the projection 43b is formed in the reflection frame 43, and the projection 43b of the reflection frame 43 is brought into direct contact with the frame 42a, whereby the frame 42a and the reflection frame 43 are formed. Therefore, more efficient heat dissipation can be performed. In this case, since the reflection frame 43 is not in direct contact with the frame portion 42b, the frame portion 42a and the frame portion 42b are not electrically connected via the reflection frame 43.
　また、第４実施形態では、上記のように、フレーム部４２ａに貫通穴４２ｄを形成するとともに、反射枠４３に突起４３ｃを形成し、フレーム部４２ａの貫通穴４２ｄに反射枠４３の突起４３ｃを圧入することによって、フレーム部４２ａと反射枠４３との間の固着強度を強固にすることができる。さらに、フレーム４２に対して反射枠４３が横方向に位置ずれしてしまうのを抑制することもできる。また、反射枠４３の突起４３ｃをサーマルビアとして機能させることができるので、放熱がより効率的になる。 In the fourth embodiment, as described above, the through hole 42d is formed in the frame portion 42a, the projection 43c is formed in the reflective frame 43, and the projection 43c of the reflective frame 43 is formed in the through hole 42d of the frame portion 42a. By press-fitting, the fixing strength between the frame part 42a and the reflection frame 43 can be strengthened. Furthermore, it is also possible to suppress the displacement of the reflection frame 43 in the lateral direction with respect to the frame 42. In addition, since the projection 43c of the reflection frame 43 can function as a thermal via, heat dissipation becomes more efficient.
　なお、上記した第４実施形態の構成において、図６０に示すように、フレーム４２と反射枠４３とを固着する固着部材（フレーム４２と反射枠４３との間に配置される固着部材）４７の一部を外側に意図的にはみ出させることによって、マイグレーションの抑制を図るようにしてもよい。また、この場合には、固着部材４７が外側にはみ出している分だけ接着面積が増大するので、フレーム４２と反射枠４３との固着をさらに強固にすることができる。 In the configuration of the fourth embodiment described above, as shown in FIG. 60, the fixing member 47 (fixing member disposed between the frame 42 and the reflecting frame 43) 47 that fixes the frame 42 and the reflecting frame 43 is fixed. Migration may be suppressed by intentionally protruding a portion outward. Further, in this case, since the adhesion area is increased by the extent that the fixing member 47 protrudes to the outside, the fixing between the frame 42 and the reflection frame 43 can be further strengthened.
　（第５実施形態）
　以下に、図６１を参照して、第５実施形態による発光装置５０の構成について詳細に説明する。 (Fifth embodiment)
Below, with reference to FIG. 61, the structure of the light-emitting device 50 by 5th Embodiment is demonstrated in detail.
　第５実施形態では、図６１に示すような形状の反射枠５３（反射面５３ａ）が用いられている。この反射枠５３は金属板を深絞り加工することにより得られるものであって、他の実施形態の反射枠よりも大きい高さ（たとえば、約５ｃｍ）を有している。そして、たとえば、第３実施形態と同様のフレーム３２に反射枠５３が装着されると、図６１に示したような状態となる。 In the fifth embodiment, a reflection frame 53 (reflection surface 53a) having a shape as shown in FIG. 61 is used. The reflection frame 53 is obtained by deep drawing a metal plate and has a height (for example, about 5 cm) larger than the reflection frame of other embodiments. For example, when the reflective frame 53 is attached to the frame 32 similar to that of the third embodiment, the state shown in FIG. 61 is obtained.
　第５実施形態では、上記のように、高さの大きい反射枠５３を用いることによって、より効率的に放熱を行うことができるとともに、集光性の向上を図ることが可能となる。なお、図６２に示すように、外部との接続を容易にするための電極リード３２ｇを延ばしてもよい。 In the fifth embodiment, as described above, by using the reflection frame 53 having a large height, it is possible to radiate heat more efficiently and to improve the light collecting property. As shown in FIG. 62, the electrode lead 32g for facilitating connection with the outside may be extended.
　今回開示された実施形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施形態の説明ではなく特許請求の範囲によって示され、さらに、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes meanings equivalent to the scope of claims for patent and all modifications within the scope.
　　１、２１、３１、４１　ＬＥＤ（発光素子）
　　２、２２、３２、４２　フレーム
　　２ａ、２２ａ、３２ａ、４２ａ　フレーム部（第１フレーム部）
　　２ｂ、２２ｂ、３２ｂ、４２ｂ　フレーム部（第２フレーム部）
　　３、２３、３３、４３、５３　反射枠
　　３ａ、２３ａ、３３ａ、４３ａ、５３ａ　反射面
　　４、２４、３４、４４　封止部材
　　６、２６、３６、４６　固着部材（第１固着部材）
　　７、２７、３７、４７　固着部材（第２固着部材）
　　８、２８、３８、４８　固着部材（第３固着部材）
　　１０、２０、３０、４０、５０　発光装置
　　２２ｄ、３２ｄ、４３ｂ　突出部
　　２２ｆ、２２ｇ、４２ｄ　貫通穴（凹部）
　　２３ｂ、３２ｆ、４３ｃ　突起（凸部）
　　３３ｂ　非貫通穴（凹部） 1, 21, 31, 41 LED (light emitting element)
2, 22, 32, 42 Frame 2a, 22a, 32a, 42a Frame part (first frame part)
2b, 22b, 32b, 42b Frame part (second frame part)
3, 23, 33, 43, 53 Reflecting frame 3a, 23a, 33a, 43a, 53a Reflecting surface 4, 24, 34, 44 Sealing member 6, 26, 36, 46 Fixing member (first fixing member)
7, 27, 37, 47 Adhering member (second adhering member)
8, 28, 38, 48 Adhering member (third adhering member)
10, 20, 30, 40, 50 Light emitting device 22d, 32d, 43b Protruding part 22f, 22g, 42d Through hole (recessed part)
23b, 32f, 43c Projection (convex part)
33b Non-through hole (concave)

Claims (11)

  1. 　発光素子と、
    　互いに電気的に絶縁された第１フレーム部および第２フレーム部を有し、前記第１フレーム部上に前記発光素子が搭載される金属製のフレームと、
    　前記フレーム上に配置され、前記発光素子を取り囲む枠状の反射面を有する反射枠と、を備え、
    　前記フレームに凹部および凸部の一方が形成されているとともに、前記反射枠に前記凹部および前記凸部の他方が形成されており、前記凹部に前記凸部が挿入されていることを特徴とする発光装置。     A light emitting element;
    A metal frame having a first frame portion and a second frame portion that are electrically insulated from each other, the light emitting element being mounted on the first frame portion;
    A reflective frame disposed on the frame and having a frame-shaped reflective surface surrounding the light-emitting element,
    One of a concave portion and a convex portion is formed on the frame, the other of the concave portion and the convex portion is formed on the reflective frame, and the convex portion is inserted into the concave portion. Light emitting device.
  2. 　発光素子と、
    　互いに電気的に絶縁された第１フレーム部および第２フレーム部を有し、前記第１フレ
    ーム部上に前記発光素子が搭載される金属製のフレームと、
    　前記フレーム上に配置され、前記発光素子を取り囲む枠状の反射面を有する反射枠と、
    　前記第１フレーム部および前記第２フレーム部を互いに固着する第１固着部材と、
    　前記フレームおよび前記反射枠を互いに固着する第２固着部材とを備え、
    　前記第１固着部材および前記第２固着部材が共に白色のシリコーン系接着材料からなっ
    ており、
    　前記フレームに凹部および凸部の一方が形成されているとともに、前記反射枠に前記凹
    部および前記凸部の他方が形成されており、
    　前記凹部に前記凸部が挿入されていることを特徴とする発光装置。     A light emitting element;
    A metal frame having a first frame portion and a second frame portion that are electrically insulated from each other, the light emitting element being mounted on the first frame portion;
    A reflective frame disposed on the frame and having a frame-shaped reflective surface surrounding the light emitting element;
    A first fixing member for fixing the first frame part and the second frame part to each other;
    A second fixing member that fixes the frame and the reflective frame to each other;
    The first fixing member and the second fixing member are both made of a white silicone-based adhesive material,
    One of the concave portion and the convex portion is formed on the frame, and the other of the concave portion and the convex portion is formed on the reflective frame,
    The light emitting device, wherein the convex portion is inserted into the concave portion.
  3. 　前記第１フレーム部に前記凹部および前記凸部の一方が形成されており、
    　前記第１フレーム部に形成された前記凹部および前記凸部の一方に、前記反射枠に形成された前記凹部および前記凸部の他方がかしめられていることを特徴とする請求項１、２のいずれかに記載の発光装置。     One of the concave portion and the convex portion is formed in the first frame portion,
    The one of the concave portion and the convex portion formed in the first frame portion, and the other of the concave portion and the convex portion formed in the reflecting frame is caulked. The light-emitting device in any one.
  4. 　前記第１フレーム部に前記凹部および前記凸部の一方が形成されており、
    　前記第１フレーム部に形成された前記凹部および前記凸部の一方に、前記反射枠に形成された前記凹部および前記凸部の他方が圧入されていることを特徴とする請求項１、２、３のいずれかに記載の発光装置。     One of the concave portion and the convex portion is formed in the first frame portion,
    The other of the concave portion and the convex portion formed in the reflective frame is press-fitted into one of the concave portion and the convex portion formed in the first frame portion, 4. The light emitting device according to any one of 3.
  5. 　前記第１フレーム部に前記凹部および前記凸部の一方が形成されており、
    　前記第１フレーム部に形成された前記凹部および前記凸部の一方と、前記反射枠に形成された前記凹部および前記凸部の他方との間に固着部材が埋め込まれていることを特徴とする請求項１、２、３、４のいずれかに記載の発光装置。     One of the concave portion and the convex portion is formed in the first frame portion,
    A fixing member is embedded between one of the concave portion and the convex portion formed in the first frame portion and the other of the concave portion and the convex portion formed in the reflective frame. The light-emitting device according to claim 1.
  6. 　前記第１フレーム部に前記凹部および前記凸部の一方が形成されており、
    　前記第１フレーム部に形成された前記凹部および前記凸部の一方と、前記反射枠に形成された前記凹部および前記凸部の他方との間に前記第２固着部材の一部が埋め込まれていることを特徴とする請求項２、３、４のいずれかに記載の発光装置。     One of the concave portion and the convex portion is formed in the first frame portion,
    A part of the second fixing member is embedded between one of the concave portion and the convex portion formed in the first frame portion and the other of the concave portion and the convex portion formed in the reflective frame. The light emitting device according to claim 2, wherein the light emitting device is a light emitting device.
  7. 　前記第２フレーム部に前記凹部および前記凸部の一方が形成されており、
    　前記第２フレーム部に形成された前記凹部および前記凸部の一方と、前記反射枠に形成された前記凹部および前記凸部の他方との間に固着部材が埋め込まれていることを特徴とする請求項１、２、３、４、５のいずれかに記載の発光装置。     One of the concave portion and the convex portion is formed in the second frame portion,
    A fixing member is embedded between one of the concave portion and the convex portion formed in the second frame portion and the other of the concave portion and the convex portion formed in the reflection frame. The light emitting device according to claim 1.
  8. 　前記第２フレーム部に前記凹部および前記凸部の一方が形成されており、
    　前記第２フレーム部に形成された前記凹部および前記凸部の一方と、前記反射枠に形成された前記凹部および前記凸部の他方との間に前記第２固着部材の一部が埋め込まれていることを特徴とする請求項２、３、４、６のいずれかに記載の発光装置。     One of the concave portion and the convex portion is formed in the second frame portion,
    A part of the second fixing member is embedded between one of the concave portion and the convex portion formed in the second frame portion and the other of the concave portion and the convex portion formed in the reflection frame. The light emitting device according to claim 2, wherein the light emitting device is a light emitting device.
  9. 　前記第１フレーム部および前記反射枠の一方に突出部が形成されており、
    　前記第１フレーム部および前記反射枠の他方に前記突出部が直接接触していることを特徴とする請求項１、２、３、４、５、６、７、８のいずれかに記載の発光装置。     A protrusion is formed on one of the first frame part and the reflection frame,
    The light emission according to any one of claims 1, 2, 3, 4, 5, 6, 7, and 8, wherein the protruding portion is in direct contact with the other of the first frame portion and the reflective frame. apparatus.
  10. 　前記フレームが複数のフレーム部を含んでおり、
    　前記複数のフレーム部のうちの平面積が最も大きいフレーム部が前記第１フレーム部となっていることを特徴とする請求項１、２、３、４、５、６、７、８、９のいずれかに記載の発光装置。     The frame includes a plurality of frame portions;
    The frame portion having the largest plane area among the plurality of frame portions is the first frame portion. The claim 1, 2, 3, 4, 5, 6, 7, 8, 9 The light-emitting device in any one.
  11. 　前記反射枠の反射面の前記フレーム側の部分が放射状に広がるような傾斜面となっている一方、前記反射枠の反射面の前記フレーム側とは反対側の部分が垂直面となっていることを特徴とする請求項１、２、３、４、５、６、７、８、９、１０のいずれかに記載の発光装置。 The frame side portion of the reflecting surface of the reflecting frame is an inclined surface that spreads radially, while the portion of the reflecting surface of the reflecting frame opposite to the frame side is a vertical surface. The light emitting device according to any one of claims 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10.
PCT/JP2010/069702 2009-11-06 2010-11-05 Light-emitting device WO2011055786A1 (en)

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JP2014072021A (en) * 2012-09-28 2014-04-21 Rohm Co Ltd Lighting system, led lamp and liquid crystal display
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