WO2011006301A1 - Notebook type computer and its enclosure and motherboard - Google Patents

Notebook type computer and its enclosure and motherboard Download PDF

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Publication number
WO2011006301A1
WO2011006301A1 PCT/CN2009/072785 CN2009072785W WO2011006301A1 WO 2011006301 A1 WO2011006301 A1 WO 2011006301A1 CN 2009072785 W CN2009072785 W CN 2009072785W WO 2011006301 A1 WO2011006301 A1 WO 2011006301A1
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WO
WIPO (PCT)
Prior art keywords
main board
peripheral interface
motherboard
main
air inlet
Prior art date
Application number
PCT/CN2009/072785
Other languages
French (fr)
Chinese (zh)
Inventor
秦彪
Original Assignee
Qin Biao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qin Biao filed Critical Qin Biao
Priority to PCT/CN2009/072785 priority Critical patent/WO2011006301A1/en
Publication of WO2011006301A1 publication Critical patent/WO2011006301A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position

Definitions

  • the present invention is in the field of personal computer technology, and relates to a portable computer, and in particular, a computer which is called a notebook type together with a host computer for a hinged connection.
  • the invention is directed to the imperfection of the above patent, and proposes to realize the standardization of the notebook computer, the specific key structure of the main box and the design layout of the main components therein, and the design layout of the key components on the main board, and propose an optimized design. Program.
  • the external structure is similar to the current notebook computer, and includes: a flat panel display and a host computer; the display and the host are hinged connections, and also have a hinged connection; the host is a flat type, and the keyboard is on the upper surface of the main body.
  • the main unit's main box includes an upper case and a lower cover.
  • the main unit is provided with a main board, a hard disk and a battery; the main board is mounted in the upper case, a CPU or a GPU chip, and those devices that require a heat sink to be installed on the main board are disposed on the main board.
  • the hard drive and the optical drive are also mounted in the upper case.
  • the present invention is characterized in that: the front end of the main board is opposite to the front side wall of the main box, and one of the left and right sides of the main board is provided with a peripheral interface, and the side is opposite to the side wall corresponding to the main box;
  • the front end has an air inlet hole, the fan abuts on the downward facing surface of the main board, the air inlet of the fan overlaps with the air inlet hole on the main board, or the air inlet hole on the main board directly enters the air inlet of the fan;
  • An air intake window is formed on the front side wall of the upper shell or on the upper wall of the front end; the air intake window is elongated, and the air inlet hole on the main board is directly opposite to the air inlet window or the front panel of the main board and the main box
  • the air intake window is placed at the front end of the main unit. It directly sucks the air outside the case (cold air) and blows it onto the heat sink of the CPU or GPU. It is beneficial for the heat dissipation of the CPU or GPU, and the air intake window is not easily blocked.
  • the intake window and the intake chamber are designed to be elongated, which not only increases the intake area, but also reduces the intake flow resistance. More importantly: the position, number and size of the air intake holes on the main board can be changed as long as they are satisfied.
  • the air inlet hole is opposite to the air intake window or the condition of the air inlet cavity, which is not only convenient for the motherboard wiring design, but also a very important structural feature for the standardization of the notebook computer.
  • the existing notebook computer, CPU and GPU heat dissipation fins are arranged in the air outlet on the side wall of one side of the main box, and the heat on the CPU or GPU chip is transmitted to the heat dissipation fins by the heat pipe, and the air outlet of the centrifugal fan is used.
  • the fan For the heat sink, the fan must have a hood with a concentrated air outlet. With such a structure, the heat transfer distance of the heat pipe is long, and the fan hood takes up a large space, which not only limits the position of the CPU or the GPU on the motherboard, but more importantly, generates heat to the CPU and GPU on the motherboard (involving computer performance) Configuration) is closely related to the size and position of the vent on the side wall of the main box and the size and shape of the fan.
  • the heat generated by chips such as CPU and GPU is less than 5W to 40W.
  • the heat dissipation is from simple heat dissipation from the metal case of the main box to the heat dissipation rib that extends from the CPU and GPU chip to the inside of the exhaust port by using multiple heat pipes.
  • On-chip, fan cooling is used again, which means that it is impossible to develop a standard notebook computer heatsink, so it is impossible to develop a standard for the mainframe, and the standard of the motherboard is more difficult to formulate.
  • the fan is directly mounted on the main board, and the position of the fan on the main board (ie, the position of the air intake hole), the size and the number can be varied within a wide range, and the heat sink of the CPU and the like are all in the main board.
  • the fan diameter and number, and the type, number, and size of the heat sink (heat sink) to meet the heat dissipation requirements of all devices (mainly CPU and GPU) on the motherboard, the association with the host box involves only the thickness of the main box. And it can be solved by replacing the lower cover of the main box.
  • the motherboard is also associated with the mainframe box and is the peripheral interface on the motherboard.
  • the main board is also associated with the mainframe box and is the peripheral interface on the motherboard.
  • only one side of the two sides of the main board is provided with a peripheral interface, and the other side is located in the main box.
  • the peripheral interface devices are all standard components, as long as the standardized position of the peripheral interface device on the motherboard matches the standardized position of the peripheral interface holes on the side wall corresponding to the host box. If the corresponding side wall of the main box opens a large open rectangular peripheral interface window, the limitation of the peripheral interface device on the main board is reduced.
  • the obstacles restricting the standardization of the main board are eliminated, and the hard disk and the optical drive are already standard components, and the keyboard and the battery are plastically large, and can vary with the specific structure and size of the main box, so that the standardization of the main box can naturally be performed.
  • the motherboard, hard disk, optical drive, and battery are all mounted in the upper case of the main unit, and the upper case becomes a mounting platform for all components in the main unit.
  • This structure is easy to assemble and repair.
  • the lower cover can be designed into multiple specifications for easy replacement.
  • the benefits are: CPU or GPU upgrade, radiator heightening, battery thickening, just replace a thicker
  • the lower cover can be achieved.
  • FIG. 1 is a schematic cross-sectional perspective view of a notebook computer of the present invention.
  • the CPU heat sink employs a heat pipe, the fan is centrifugal, and the fin ribs surround the fan impeller.
  • FIG. 2 is a rear view showing the feature of the notebook computer of the present invention opening the lower cover, and the heat sink is directly attached to a chip such as a CPU and a GPU.
  • Fig. 3 is a rear elevation view showing the feature of the notebook computer of the present invention, which is designed for a 14.1 inch display, and the CPU and GPU are heat pipe type heat sinks.
  • Fig. 4 is a rear elevational view showing the feature of the notebook computer of the present invention opening the lower cover, which is designed for a 12.1 inch display screen.
  • Fig. 5 is a rear elevational view showing the feature of the notebook computer of the present invention in which the lower cover is opened.
  • the main unit is provided with a 14.1 inch display screen, but the main board is a 12.1 inch display type motherboard as shown in Fig. 4.
  • Figure 6 is a cross-sectional view showing the features of the CPU heat sink of Figures 3, 4, and 5, with a centrifugal fan and heat radiating fins surrounding the fan impeller.
  • Figure 7 is a cross-sectional view showing the features of a notebook computer of the present invention, showing the structure of the battery and the battery cover.
  • Figure 8 is a perspective view of a main assembly of the present invention with a display and a keyboard.
  • a peripheral interface window with a long, large opening structure is formed on the left side wall.
  • Figure 9 is a cross-sectional view showing a feature of a main assembly with a keyboard of the present invention.
  • Figure 10 is a characteristic view of a main board of the present invention.
  • the orientation of the notebook computer as viewed by the computer operator is the front view direction, and the viewed face is the front side.
  • the end of the display connected to the main box is the front end, and the opposite end is the lower end. Turn the computer so that the keyboard is facing down, the direction of view is the rear view direction, and the left or right side is the left or right side of the rear view.
  • Hard drives include mechanically rotating hard drives and solid state drives.
  • the display 5 is mounted on the upper casing 3 of the main casing through the hinge type connecting device 4.
  • the air intake window 2 composed of the arrangement of the small holes is opened between the front end of the upper casing 3 and the keyboard 1, and has an elongated shape.
  • the space between the inner side of the air intake window 2 and the main plate 13 is the air inlet chamber 11, and the strip is used.
  • the intake air window structure adopts an intake air structure; the air inlet hole 6 on the main board 13 directly faces the air intake window 2, and the intake air chamber 11 is provided, thereby effectively reducing the intake flow resistance; the fan 10 For the centrifugal type, it is mounted on the face of the main board 13 facing downward, and the CPU or GPU chip 12 is also disposed on the face of the main board 13 facing downward; a heat pipe type heat sink is adopted, and the heat dissipation fins 7 are disposed on the heat pipe 8 and dissipated The rib 7 surrounds the fan impeller 9; the front end of the main board 13 is placed against the front side wall of the main casing (the front side wall of the upper casing 3 in the figure), and the main board 13 sets the fan inlet area (cold air area) and the exhaust area.
  • the main board memory adopts the structure of the memory stick slot of the memory stick inserted on the main board, and two memory sticks 16 are inserted in the memory strip slot 15; the main board 13 and the upper shell 3 upper wall (keyboard 1) There is a gap on the inside of the upper wall) so that the main board is provided with the chip component on the surface; the lower cover 14 basically hits the heat pipe 8, that is, the height of the heat dissipation fin (or the heat sink) has reached the maximum If you want to increase the height of the heat dissipation fins to increase the heat dissipation, you must replace the thicker lower cover 14.
  • the air intake window 2 in Fig. 1 utilizes the neutral space between the keyboard 1 and the front end of the upper casing 3, and can also open a hole in the front side wall of the upper casing 3 to increase the intake air area of the intake window.
  • the gap between the button and the button on the keyboard is also possible to use the gap between the button and the button on the keyboard as the air inlet, and the air intake window on the upper case is expanded under the keyboard.
  • the strip-shaped air intake window is opened only on the front side wall of the upper casing 3.
  • Fig. 2 shows a rear view of a feature of the computer of the present invention opening the lower cover, provided with two fans 10, which are directly attached to three chips (including a CPU and a GPU).
  • the heat sink on the three chips and the front side wall of the main box and the battery 17 surround the two fans 10 so that the air driven by the fan 10 flows through the heat sink.
  • the optical drive 19 and the hard disk 18 are already standard parts.
  • the size of the battery 17 mainly the width
  • the size specifications of the main board are determined.
  • the dimensions (specifications) of the motherboard are the same, they can be interchanged.
  • the motherboard configuration chip model such as CPU or GPU and location on the motherboard, heat sink
  • the standard specifications of the motherboard are closely related to the size of the mainframe. That is to say, only motherboards of the same specification can be interchanged.
  • the hard disk 18 is disposed at the rear end of the host, and on the side of the peripheral interface 20, the optical drive 19 and the battery 17 are juxtaposed against a side wall of the main box (the peripheral interface 20 is opposite) Side wall).
  • the battery 17 is at the front end (of course, the optical drive is also in front of it), the width of the battery 17 is equivalent to that of the optical drive 19, and the main board 13 is rectangular, and a front-end peripheral interface 21 is also provided. Whether the front-end peripheral interface 21 or the side peripheral interface 20 is disposed at a corner of the front end corners of the main board (also one of the two front end angles of the main unit).
  • the computer shown in Figure 3 was designed for a 14.1-inch display.
  • the computer shown in Figure 4 is designed for a 12.1-inch display.
  • the motherboard 13 is smaller than the motherboard 13 shown in Figure 4, but its peripheral interface 20 and front-end peripheral interface 21 are identical in position ( Figure 4 There is one less device in the peripheral interface 20).
  • the size and position of the computer shown in FIG. 5, the main unit box, the hard disk 18, the battery 17 and the optical drive 19 are the same as those shown in FIG. 3, but the main board 13 uses the main board shown in FIG. 4, that is, each specification (each The motherboard of the size) can be replaced with a large-size motherboard as long as the positions of the devices in the peripheral interface are the same (designed according to the same standard) and the fixed holes of the motherboard are designed according to the same standard. Therefore, according to the design layout shown in FIG. 3 and FIGS. 4 and 5, the standardization degree of the main board is higher and the compatibility is stronger.
  • the hard disk 18 in FIG. 3 is disposed on the same side as the main board 13 and is horizontally disposed.
  • the short side of the hard disk is aligned with the side of the main board, so that the length of the side of the main board by the side wall of the main box is larger, so that more outer portions can be disposed.
  • Set the interface to reduce the front-end peripheral interface The number of motherboards has a larger fan space at the front end. The number of fans that can be set is larger, the position can be changed, and the versatility of the motherboard is better.
  • the small-size motherboard is housed in a large-size mainframe, and the extra space can be set with a built-in extended battery.
  • a built-in extended battery 23 is provided between the battery 17 and the main board 13.
  • the back end of the motherboard can be extended to the hard disk, that is, the hard disk is attached to the motherboard.
  • the thickness of the optical drive is larger than the thickness of the hard disk, this arrangement does not cause excessive thickness increase of the host.
  • the CPU and GPU heat sinks in Figure 3 use a heat pipe heatsink.
  • the CPU heatsink has two fans 10, the GPU has only one fan, and the other chip is directly attached to the heat sink.
  • Fig. 6 shows a more detailed structure of the heat pipe type heat sink used in the CPU and the GPU.
  • the fan 10 is centrifugal, the heat radiating fins 7 are disposed on the heat pipe 8, and most of the heat radiating fins 7 are arranged in a circular arc shape.
  • the fan 10 Around the fan impeller 9, the fan 10 has no hood, and the main board 13 is directly the front side panel of the fan 10, that is, the air inlet 6 of the main board 13 is the air inlet of the fan 10.
  • the heat pipe type radiator of such a structure has no components that can be omitted, the space utilization rate has been maximized, the length of the heat pipe is short, and standardization is easy.
  • the heat pipe 8 shown in Figures 1, 3, 4, 5, and 6 is a tubular heat pipe, and a plate type heat pipe can also be used, which has a stronger heat transfer capability.
  • the air is sucked from one side of the main board by the driving of the fan 10, directly blown onto the heat radiating fins 7, and then flows along the main board, and an exhaust window 22 is opened on the side wall of the main body near the hard disk 18, as shown in FIG.
  • This design allows air to flow through a large area of the motherboard, dissipating heat from other components on the motherboard, and the hard drive can be effectively dissipated.
  • the venting window 22 is remote from the intake window to reduce hot air backflow into the intake window.
  • the heat generation of the battery 17 is also large, so it should be considered that an exhaust window is opened on the side wall beside the battery 17, so that air flows through the battery.
  • the diagram shown in FIG. 3 is a rear view. From the front view, the peripheral interface 20 on the main board and the front peripheral interface 21 are disposed on the left front end corner of the main unit, that is, the peripheral interface is disposed on the left side, and the right side is disposed. Without a peripheral interface, this design is more convenient for the operator. Because people are used to operating the mouse in the right hand direction, placing items, such as cups, books, etc. If the peripheral interface is set on the right side, it is easy to interfere, and the air outlet 22 next to the hard disk will also face the right hand of the mouse. The hot air blown out in the summer will feel bad.
  • the design advantages of the front end of the battery 17 and the rear end of the optical drive 19 are as follows: As shown in FIG.
  • the lower cover 14 is opened with a window of the battery 17, and a battery cover 24 is provided, and the gap of the optical drive 19 is used.
  • the battery cover fastener 25 is provided to increase the space of the battery 17, and the capacity of the battery is also large.
  • the battery 17 and the battery cover 24 are shown as separate components, and the battery 17 and the battery cover 24 may be designed as a unitary structure.
  • Figure 8 shows a main assembly box of the present invention, and is equipped with a display 5 and a keyboard 1.
  • the air intake window opening 2 is disposed between the front end of the upper wall of the upper casing 3 of the main assembly and the keyboard 1, and has an elongated shape for the purpose of adding
  • the intake air flow area can also open a long air intake window on the front side wall of the upper casing.
  • a peripheral interface window 26 having a long and large opening structure is opened.
  • the peripheral interface port of the individual peripherals can be used to standardize the necessary interfaces of the computer, such as the network cable interface, the power socket, and the two USB interfaces (the position of each device is standardized).
  • the side walls of the case 3 and the lower cover 14 are respectively opened in half, which facilitates the mounting of the main board and facilitates the use of the plastic injection process.
  • the upper case and the lower cover can be designed as a two-injection molded overall structure, which has high production efficiency and low cost.
  • Figure 9 is a cross-sectional view showing a main assembly of the present invention, the upper wall of the upper casing 3 where the air intake window 2 is located is higher than the upper wall of the upper casing 3, so that the thickness of the keyboard 1 is increased.
  • the air chamber is high.
  • the height of the air inlet chamber should be more than 3 mm, that is, the inner surface of the front wall of the upper shell 3 is higher than the fixed surface of the main board (the main board fixing column 27 shown in the figure) The countertop) 3 mm or more.
  • the motherboard of the present invention shown in FIG. 10 is a motherboard in the computer shown in FIG.
  • the memory module slot 15 is disposed at the rear end of the position where the CPU or GPU is located, parallel to the front end side of the main board, and is adjacent to the opposite side of the side where the peripheral interface is located.
  • the memory module slot 15 is arranged such that the space between the hard disk and the optical drive (or battery) is used to place the memory module, as shown in FIG.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A notebook type computer and its motherboard and enclosure are provided, which can realize standard generalization for the structure size of the motherboard and the enclosure, and have high compatibility and interchangeability, the key feature structures are: the motherboard (13), a hard disk and a optical disk drive are mounted in the upper shell (3) of the enclosure, a CPU or a GPU chip (12) is arranged on the downward side of the motherboard (13), an air intake window (2) in strip form is formed on the front end of the upper shell (3), and there is also an air intake cavity (11), a cooling fan (10) is stuck on the motherboard (13), an air intake hole (6) of the cooling fan on the motherboard (13) is directly against the air intake window (2) or the air intake cavity (11), the hard disk is set on the bottom end of the enclosure and on the same side with the motherboard, the peripheral equipment interfaces of the motherboard are set at a front corner of the enclosure.

Description

笔记本式计算机及其主机盒与主板  Notebook computer and its mainframe and motherboard
所属技术领域 Technical field
本发明属于个人计算机技术领域， 涉及到便携式计算机， 特别是那种平板显示器与主机 为合页式连接一起的、 被称为笔记本式的计算机。  The present invention is in the field of personal computer technology, and relates to a portable computer, and in particular, a computer which is called a notebook type together with a host computer for a hinged connection.
背景技术 Background technique
散热问题一直制约着笔记本式计算机性能提高、 减小厚度和重量、 实现像台式机那样机 箱和主板通用标准化、 DIY化， 因而成本居高不下。 中国发明专利申请 《扁形电子芯片散热 器》 (申请号: 200710077392.1 ) 和 《便携式计算机》 (申请号: 200810067795.2), 公开了一 种散热器和笔记本式计算机采用该散热器的设计方案， 不仅能有效解决笔记本式计算机的散 热问题， 也为实现笔记本式计算机标准化打开了大门。 但是， 所述专利申请中没有示出主机 盒的关键结构， 以及其内主要部件（如电池、 硬盘、 光驱、 主板及其外设接口） 的设计布局， 也没有详细论述笔记本式计算机的标准化是如何实现的。  The problem of heat dissipation has always restricted the performance of notebook computers, reduced thickness and weight, and the standardization and DIY of chassis and motherboards like desktop computers, so the cost is high. Chinese invention patent application "flat electronic chip radiator" (application number: 200710077392.1) and "portable computer" (application number: 200810067795.2), discloses a radiator and notebook computer using the design of the radiator, not only effective Solving the problem of heat dissipation in notebook computers has also opened the door to standardization of notebook computers. However, the patent application does not show the key structure of the mainframe, and the design layout of the main components (such as the battery, the hard disk, the optical drive, the motherboard and its peripheral interfaces), and the standardization of the notebook computer is not discussed in detail. How to achieve it.
发明内容 Summary of the invention
本发明就是针对上述专利的不完善之处， 提出了为实现笔记本式计算机标准化， 主机盒 具体的关键结构及其内部主要部件的设计布局、 以及主板上关键器件的设计布局， 并且提出 了优化设计方案。  The invention is directed to the imperfection of the above patent, and proposes to realize the standardization of the notebook computer, the specific key structure of the main box and the design layout of the main components therein, and the design layout of the key components on the main board, and propose an optimized design. Program.
本发明的技术方案是： 外形结构和现笔记本计算机类似， 包括有： 平板式显示器和主机， 显示器与主机是合页式连接， 也有称铰链式连接； 主机呈平板式， 键盘在主机上表面， 主机 的主机盒包括有上壳和下盖， 主机盒内设置有主板、 硬盘和电池； 主板挂装在上壳内， CPU 或 GPU芯片以及那些发热量大需要加装散热片的器件设置在主板朝下的面上;硬盘以及光驱 (如果配有光驱） 也是挂装在上壳内。 本发明的特征在于： 主板的前端靠着主机盒的前端侧 壁， 主板的左右两侧中的一侧设置有外设接口， 并且该侧靠着主机盒相对应的一侧侧壁； 靠 近主板的前端开有进气孔， 风扇贴靠在主板上朝下的面上， 风扇的进风口与主板上的进气孔 重叠， 或主板上的进气孔直接就是风扇的进风口； 在主机盒上壳的前端侧壁上或靠前端的上 壁上开有进气窗； 进气窗呈长条形， 主板上的进气孔直对着进气窗、 或主板与主机盒上壳靠 前端的上壁之间留有空间， 构成进气腔， 进气腔呈长条形， 进气窗和进气腔与主板上的进气 孔相互贯通， 进气腔还能使进入主板进气孔的空气流动更畅通。  The technical solution of the present invention is: The external structure is similar to the current notebook computer, and includes: a flat panel display and a host computer; the display and the host are hinged connections, and also have a hinged connection; the host is a flat type, and the keyboard is on the upper surface of the main body. The main unit's main box includes an upper case and a lower cover. The main unit is provided with a main board, a hard disk and a battery; the main board is mounted in the upper case, a CPU or a GPU chip, and those devices that require a heat sink to be installed on the main board are disposed on the main board. On the face down; the hard drive and the optical drive (if equipped with an optical drive) are also mounted in the upper case. The present invention is characterized in that: the front end of the main board is opposite to the front side wall of the main box, and one of the left and right sides of the main board is provided with a peripheral interface, and the side is opposite to the side wall corresponding to the main box; The front end has an air inlet hole, the fan abuts on the downward facing surface of the main board, the air inlet of the fan overlaps with the air inlet hole on the main board, or the air inlet hole on the main board directly enters the air inlet of the fan; An air intake window is formed on the front side wall of the upper shell or on the upper wall of the front end; the air intake window is elongated, and the air inlet hole on the main board is directly opposite to the air inlet window or the front panel of the main board and the main box There is a space between the upper walls of the end to form an air inlet chamber, and the air inlet chamber has a long strip shape, and the air inlet window and the air inlet chamber communicate with the air inlet holes on the main board, and the air inlet chamber can also enter the main board air inlet hole. The air flow is smoother.
进气窗设置在主机前端， 直接将机盒外的空气 （冷空气） 吸入， 吹到 CPU或 GPU的散 热片上， 有利用于 CPU或 GPU的散热， 并且进气窗不容易被堵塞。 进气窗以及进气腔设计 成长条型， 不仅可以增大进气面积， 减小进气流动阻力， 更重要的是： 主板上的进气孔的位 置、 数量以及大小都可变化， 只要满足进气孔对着进气窗， 或与进气腔贯通的条件就可以， 这样不仅更方便主板布线设计， 而且是成就笔记本式计算机标准化非常重要的结构特征。  The air intake window is placed at the front end of the main unit. It directly sucks the air outside the case (cold air) and blows it onto the heat sink of the CPU or GPU. It is beneficial for the heat dissipation of the CPU or GPU, and the air intake window is not easily blocked. The intake window and the intake chamber are designed to be elongated, which not only increases the intake area, but also reduces the intake flow resistance. More importantly: the position, number and size of the air intake holes on the main board can be changed as long as they are satisfied. The air inlet hole is opposite to the air intake window or the condition of the air inlet cavity, which is not only convenient for the motherboard wiring design, but also a very important structural feature for the standardization of the notebook computer.
现有的笔记本式计算机， CPU和 GPU的散热肋片设置在主机盒一侧侧壁上的排风口内， 采用热管将 CPU或 GPU芯片上的热量传输到散热肋片上，离心式风扇的出风口对着散热片， 风扇必须带有集中出风口的风罩。 这样的结构， 热管的热量传输距离长， 风扇的风罩占空间 大， 不仅限制了 CPU或 GPU在主板上的位置， 更为重要的是将主板上的 CPU和 GPU发热 量（涉及到计算机性能配置）与主机盒侧壁上的排风口的大小、 位置以及风扇的大小和形状 紧密联系在一起。 CPU和 GPU等芯片的发热量从不到 5W到 40 W之多都有， 散热从简单 的靠主机盒金属外壳散热，到采用多根热管从 CPU以及 GPU芯片伸到排风口内侧的散热肋 片上， 再用风扇吹风散热， 也就是说不可能制定标准的笔记本式计算机散热器， 因而也就不 可能制定出主机盒的标准， 主板的标准也就更难以制定。 The existing notebook computer, CPU and GPU heat dissipation fins are arranged in the air outlet on the side wall of one side of the main box, and the heat on the CPU or GPU chip is transmitted to the heat dissipation fins by the heat pipe, and the air outlet of the centrifugal fan is used. For the heat sink, the fan must have a hood with a concentrated air outlet. With such a structure, the heat transfer distance of the heat pipe is long, and the fan hood takes up a large space, which not only limits the position of the CPU or the GPU on the motherboard, but more importantly, generates heat to the CPU and GPU on the motherboard (involving computer performance) Configuration) is closely related to the size and position of the vent on the side wall of the main box and the size and shape of the fan. The heat generated by chips such as CPU and GPU is less than 5W to 40W. The heat dissipation is from simple heat dissipation from the metal case of the main box to the heat dissipation rib that extends from the CPU and GPU chip to the inside of the exhaust port by using multiple heat pipes. On-chip, fan cooling is used again, which means that it is impossible to develop a standard notebook computer heatsink, so it is impossible to develop a standard for the mainframe, and the standard of the motherboard is more difficult to formulate.
本发明中， 风扇直接挂装在主板上， 风扇在主板上的位置 （即进气孔的位置）、 大小以及 数量在很大范围内可以变动， CPU等芯片的散热片都在主板内， 可以通过调整风扇直径和数 量、以及散热片（散热器）的类型、数量和大小，来满足主板上所有器件（主要是 CPU和 GPU) 的散热要求， 与主机盒的关联最多只涉及主机盒厚度， 而且可用更换主机盒下盖来解决。  In the present invention, the fan is directly mounted on the main board, and the position of the fan on the main board (ie, the position of the air intake hole), the size and the number can be varied within a wide range, and the heat sink of the CPU and the like are all in the main board. By adjusting the fan diameter and number, and the type, number, and size of the heat sink (heat sink) to meet the heat dissipation requirements of all devices (mainly CPU and GPU) on the motherboard, the association with the host box involves only the thickness of the main box. And it can be solved by replacing the lower cover of the main box.
主板与主机盒还有关联的是主板上的外设接口。 本发明中要求主板的两侧边中只有一侧 设置有外设接口， 另一侧边位于主机盒内。 外设接口器件都为标准件， 只要主板上外设接口 器件的标准化的位置与主机盒对应的侧壁上的外设接口孔的标准化的位置一致即可。 如果主 机盒对应的侧壁开设大开口长方形外设接口窗口， 那么就减少了主板上的外设接口器件的限 制。  The motherboard is also associated with the mainframe box and is the peripheral interface on the motherboard. In the present invention, only one side of the two sides of the main board is provided with a peripheral interface, and the other side is located in the main box. The peripheral interface devices are all standard components, as long as the standardized position of the peripheral interface device on the motherboard matches the standardized position of the peripheral interface holes on the side wall corresponding to the host box. If the corresponding side wall of the main box opens a large open rectangular peripheral interface window, the limitation of the peripheral interface device on the main board is reduced.
以上说明， 按本发明技术方案， 制约主板标准化的障碍消除了， 硬盘和光驱已经是标准 部件， 键盘和电池可塑性大， 可随主机盒具体结构以及大小变化， 因而， 主机盒的标准化自 然就可实现。 主板、 硬盘、 光驱以及电池都挂装在主机盒的上壳内， 上壳成为主机内所有部 件的安装固定平台。 这样的结构一是便于组装和维修， 二是下盖可设计成多规格， 便于更换， 带来的好处有： CPU或 GPU升级， 散热器加高， 电池也加厚， 只要更换一加厚的下盖就可以 实现。  As described above, according to the technical solution of the present invention, the obstacles restricting the standardization of the main board are eliminated, and the hard disk and the optical drive are already standard components, and the keyboard and the battery are plastically large, and can vary with the specific structure and size of the main box, so that the standardization of the main box can naturally be performed. achieve. The motherboard, hard disk, optical drive, and battery are all mounted in the upper case of the main unit, and the upper case becomes a mounting platform for all components in the main unit. This structure is easy to assemble and repair. Secondly, the lower cover can be designed into multiple specifications for easy replacement. The benefits are: CPU or GPU upgrade, radiator heightening, battery thickening, just replace a thicker The lower cover can be achieved.
附图说明 DRAWINGS
下面结合附图和实施例对本发明进一步说明。  The invention will now be further described with reference to the drawings and embodiments.
图 1为一种本发明的笔记本式计算机的特征剖面立体视图， CPU散热器采用了热管， 风 扇为离心式， 并且散热片肋片围着风扇叶轮。  BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional perspective view of a notebook computer of the present invention. The CPU heat sink employs a heat pipe, the fan is centrifugal, and the fin ribs surround the fan impeller.
图 2 为一种本发明的笔记本式计算机打开下盖的特征后视图， 散热片直接贴在 CPU 和 GPU等芯片上。  2 is a rear view showing the feature of the notebook computer of the present invention opening the lower cover, and the heat sink is directly attached to a chip such as a CPU and a GPU.
图 3为一种本发明的笔记本式计算机打开下盖的特征后视图， 是针对 14.1英寸显示屏设 计的， CPU和 GPU采用热管式散热器。  Fig. 3 is a rear elevation view showing the feature of the notebook computer of the present invention, which is designed for a 14.1 inch display, and the CPU and GPU are heat pipe type heat sinks.
图 4为一种本发明的笔记本式计算机打开下盖的特征后视示意图， 是针对 12.1英寸显示 屏设计的。  Fig. 4 is a rear elevational view showing the feature of the notebook computer of the present invention opening the lower cover, which is designed for a 12.1 inch display screen.
图 5为一种本发明的笔记本式计算机打开下盖的特征后视图， 主机盒是配 14.1英寸显示 屏， 但主板为图 4所示的 12.1英寸显示屏规格的主板。  Fig. 5 is a rear elevational view showing the feature of the notebook computer of the present invention in which the lower cover is opened. The main unit is provided with a 14.1 inch display screen, but the main board is a 12.1 inch display type motherboard as shown in Fig. 4.
图 6为图 3、 4、 5中的 CPU散热器的特征剖视图， 离心式风扇， 散热肋片围着风扇叶轮。 图 7为一种本发明的笔记本式计算机特征剖面示意图， 示意电池和电池盖的结构。  Figure 6 is a cross-sectional view showing the features of the CPU heat sink of Figures 3, 4, and 5, with a centrifugal fan and heat radiating fins surrounding the fan impeller. Figure 7 is a cross-sectional view showing the features of a notebook computer of the present invention, showing the structure of the battery and the battery cover.
图 8 为一种本发明的主机盒， 装有显示器和键盘时的立体视图。 左侧壁上开有长条形大 开口结构的外设接口窗口。  Figure 8 is a perspective view of a main assembly of the present invention with a display and a keyboard. A peripheral interface window with a long, large opening structure is formed on the left side wall.
图 9为一种本发明的装有键盘的主机盒的特征剖面视图。  Figure 9 is a cross-sectional view showing a feature of a main assembly with a keyboard of the present invention.
图 10为一种本发明的主板的特征视图。  Figure 10 is a characteristic view of a main board of the present invention.
图中， 1、 键盘， 2、 进气窗， 3、 上壳， 4、 合页式连接装置， 5、 显示器， 6、 进气孔， 7、 散热肋片， 8、 热管， 9、 风扇叶轮， 10、 风扇， 11、 进气腔， 12、 CPU或 GPU芯片， 13、 主 板， 14、 下盖， 15、 内存条插槽， 16、 内存条， 17、 电池， 18、 硬盘， 19、 光驱， 20、 外设 接口， 21、 前端外设接口， 22、 排气窗， 23、 内置扩展电池， 24、 电池盖， 25、 电池盖扣件， 26、 外设接口窗口， 27、 主板固定柱。 定义： 计算机操作人所视笔记本式计算机的方向为正视方向， 所视的面为正面。 显示器 与主机盒连接的那端为前端， 相对的那端为下端。 翻转计算机使键盘朝下， 所视方向为后视 方向， 左侧或右侧为后视左侧或右侧。 In the figure, 1, keyboard, 2, air intake window, 3, upper shell, 4, hinged connection device, 5, display, 6, air intake, 7, heat dissipation fins, 8, heat pipe, 9, fan impeller , 10, fan, 11, air intake, 12, CPU or GPU chip, 13, motherboard, 14, lower cover, 15, memory slot, 16, memory, 17, battery, 18, hard drive, 19, optical drive 20, peripheral interface, 21, front-end peripheral interface, 22, exhaust window, 23, built-in extended battery, 24, battery cover, 25, battery cover fastener, 26, peripheral interface window, 27, motherboard fixed column . Definition: The orientation of the notebook computer as viewed by the computer operator is the front view direction, and the viewed face is the front side. The end of the display connected to the main box is the front end, and the opposite end is the lower end. Turn the computer so that the keyboard is facing down, the direction of view is the rear view direction, and the left or right side is the left or right side of the rear view.
硬盘包括机械转动硬盘和固态硬盘。  Hard drives include mechanically rotating hard drives and solid state drives.
图 1所示的本发明的笔记本式计算机， 显示器 5通过合页式连接装置 4安装在主机盒的 上壳 3上。 由小孔排列组成的进气窗 2开在上壳 3前端与键盘 1之间， 呈长条形， 进气窗 2 内侧与主板 13之间的空间就是进气腔 11，既采用了长条形进气窗结构，又采用了进气腔结构； 主板 13上的进气孔 6直接对着进气窗 2， 再加上有进气腔 11， 有效减小了进气流动阻力； 风 扇 10为离心式， 贴装在主板 13朝下的面上， CPU或 GPU芯片 12也设置在主板 13朝下的面 上； 采用了热管式散热器， 散热肋片 7设置在热管 8上， 并且散热肋片 7围着风扇叶轮 9; 主 板 13的前端顶着主机盒的前端侧壁（图中为上壳 3的前端侧壁），主板 13将风扇的进风区（冷 风区） 和排风区 （热风区） 隔开， 阻止在主机盒内热空气回流到风扇进气口。 图中示出， 主 板内存采用内存条插装在主板上的内存条插槽的结构，有两条内存条 16对插在内存条插槽 15 上； 主板 13与上壳 3上壁 （键盘 1所处的上壁） 内侧留有空隙， 以便主板在该表面设置贴片 式元器件； 下盖 14基本碰到热管 8， 也就是说， 散热肋片 （或者散热器） 的高已经到了最大 限度， 如果要增加散热肋片的高来提高散热量的话， 就必须更换加厚的下盖 14。  In the notebook computer of the present invention shown in Fig. 1, the display 5 is mounted on the upper casing 3 of the main casing through the hinge type connecting device 4. The air intake window 2 composed of the arrangement of the small holes is opened between the front end of the upper casing 3 and the keyboard 1, and has an elongated shape. The space between the inner side of the air intake window 2 and the main plate 13 is the air inlet chamber 11, and the strip is used. The intake air window structure adopts an intake air structure; the air inlet hole 6 on the main board 13 directly faces the air intake window 2, and the intake air chamber 11 is provided, thereby effectively reducing the intake flow resistance; the fan 10 For the centrifugal type, it is mounted on the face of the main board 13 facing downward, and the CPU or GPU chip 12 is also disposed on the face of the main board 13 facing downward; a heat pipe type heat sink is adopted, and the heat dissipation fins 7 are disposed on the heat pipe 8 and dissipated The rib 7 surrounds the fan impeller 9; the front end of the main board 13 is placed against the front side wall of the main casing (the front side wall of the upper casing 3 in the figure), and the main board 13 sets the fan inlet area (cold air area) and the exhaust area. (hot air zone) Separate to prevent hot air from flowing back into the fan inlet in the main box. The figure shows that the main board memory adopts the structure of the memory stick slot of the memory stick inserted on the main board, and two memory sticks 16 are inserted in the memory strip slot 15; the main board 13 and the upper shell 3 upper wall (keyboard 1) There is a gap on the inside of the upper wall) so that the main board is provided with the chip component on the surface; the lower cover 14 basically hits the heat pipe 8, that is, the height of the heat dissipation fin (or the heat sink) has reached the maximum If you want to increase the height of the heat dissipation fins to increase the heat dissipation, you must replace the thicker lower cover 14.
图 1中的进气窗 2利用了键盘 1与上壳 3前端之间的空档， 还可以在上壳 3前端侧壁开 孔， 增加进气窗的进气面积。 当然也可以利用键盘上按键与按键之间的空隙作为进气口， 上 壳上的进气窗扩大到键盘下。 或者， 只在上壳 3前端侧壁开长条形进气窗。  The air intake window 2 in Fig. 1 utilizes the neutral space between the keyboard 1 and the front end of the upper casing 3, and can also open a hole in the front side wall of the upper casing 3 to increase the intake air area of the intake window. Of course, it is also possible to use the gap between the button and the button on the keyboard as the air inlet, and the air intake window on the upper case is expanded under the keyboard. Alternatively, the strip-shaped air intake window is opened only on the front side wall of the upper casing 3.
图 2示出了一种本发明计算机打开下盖的特征后视图， 设置有两个风扇 10， 散热片直接 贴在三个芯片上 （其中包括 CPU和 GPU)。 三个芯片上的散热片与主机盒的前端侧壁以及电 池 17将这两风扇 10围着， 使得风扇 10驱动的空气集中流经散热片。光驱 19和硬盘 18已经 是标准件， 只要确定了电池 17的尺寸 （主要是宽度）， 从图中可以看出， 就确定了主板的尺 寸规格。 只要主板的外形尺寸 （规格） 一致， 就可以互换， 而与主板配置 （CPU或 GPU等 芯片型号以及在主板上的位置、 散热器） 无关， 主板的标准规格与主机盒大小密切相关， 也 就是说只有相同规格的主板之间才可以互换。  Fig. 2 shows a rear view of a feature of the computer of the present invention opening the lower cover, provided with two fans 10, which are directly attached to three chips (including a CPU and a GPU). The heat sink on the three chips and the front side wall of the main box and the battery 17 surround the two fans 10 so that the air driven by the fan 10 flows through the heat sink. The optical drive 19 and the hard disk 18 are already standard parts. As long as the size of the battery 17 (mainly the width) is determined, it can be seen from the figure that the size specifications of the main board are determined. As long as the dimensions (specifications) of the motherboard are the same, they can be interchanged. Regardless of the motherboard configuration (chip model such as CPU or GPU and location on the motherboard, heat sink), the standard specifications of the motherboard are closely related to the size of the mainframe. That is to say, only motherboards of the same specification can be interchanged.
图 3所示的本发明计算机， 硬盘 18设置在靠主机的后端， 并且靠外设接口 20的那侧， 光驱 19和电池 17并列， 靠着主机盒的一侧壁（外设接口 20相对的侧壁）。 图中电池 17靠前 端 （当然光驱靠前也可以）， 电池 17的宽和光驱 19相当， 主板 13为矩形， 还设有前端外设 接口 21。 无论前端外设接口 21， 还是侧边的外设接口 20都设置在靠主板两前端角中的一角 (也是主机的两前端角中的一角）。  In the computer of the present invention shown in FIG. 3, the hard disk 18 is disposed at the rear end of the host, and on the side of the peripheral interface 20, the optical drive 19 and the battery 17 are juxtaposed against a side wall of the main box (the peripheral interface 20 is opposite) Side wall). In the figure, the battery 17 is at the front end (of course, the optical drive is also in front of it), the width of the battery 17 is equivalent to that of the optical drive 19, and the main board 13 is rectangular, and a front-end peripheral interface 21 is also provided. Whether the front-end peripheral interface 21 or the side peripheral interface 20 is disposed at a corner of the front end corners of the main board (also one of the two front end angles of the main unit).
图 3所示的计算机是针对 14.1英寸显示器设计的。 图 4所示的计算机是针对 12.1英寸显 示器设计的， 主板 13规格比图 4中所示的主板 13小， 但其外设接口 20以及前端外设接口 21中各器件位置一致 （图 4中的外设接口 20少一器件）。 图 5所示的计算机， 主机盒、 硬盘 18、电池 17和光驱 19的大小以及位置和图 3所示的一致，但主板 13采用了图 4所示的主板， 也就是说， 各规格 （各种尺寸） 的主板， 只要其外设接口中各器件的位置一致 （按同一标准 设计）、以及主板的固定孔按同一标准设计，小规格的主板就可替换大规格的主板。因而说明， 按照图 3以及图 4、 5所示的设计布局， 主板的标准化程度更高， 兼容性更强。  The computer shown in Figure 3 was designed for a 14.1-inch display. The computer shown in Figure 4 is designed for a 12.1-inch display. The motherboard 13 is smaller than the motherboard 13 shown in Figure 4, but its peripheral interface 20 and front-end peripheral interface 21 are identical in position (Figure 4 There is one less device in the peripheral interface 20). The size and position of the computer shown in FIG. 5, the main unit box, the hard disk 18, the battery 17 and the optical drive 19 are the same as those shown in FIG. 3, but the main board 13 uses the main board shown in FIG. 4, that is, each specification (each The motherboard of the size) can be replaced with a large-size motherboard as long as the positions of the devices in the peripheral interface are the same (designed according to the same standard) and the fixed holes of the motherboard are designed according to the same standard. Therefore, according to the design layout shown in FIG. 3 and FIGS. 4 and 5, the standardization degree of the main board is higher and the compatibility is stronger.
图 3中的硬盘 18设置在与主板 13同侧， 并且横置， 硬盘的短边与主板侧边方向一致， 使得主板靠主机盒侧壁的侧边长度更大， 因而可设置更多的外设接口， 减少前端外设接口的 数量， 主板靠前端则有更大的设置风扇的空间， 则可设置的风扇多、 位置可变化范围大， 主 板的通用性也就更好。 The hard disk 18 in FIG. 3 is disposed on the same side as the main board 13 and is horizontally disposed. The short side of the hard disk is aligned with the side of the main board, so that the length of the side of the main board by the side wall of the main box is larger, so that more outer portions can be disposed. Set the interface to reduce the front-end peripheral interface The number of motherboards has a larger fan space at the front end. The number of fans that can be set is larger, the position can be changed, and the versatility of the motherboard is better.
小规格的主板装在大规格的主机盒中， 多出的空间可设置内置扩展电池， 如图 5 中， 在 电池 17和主板 13之间设置有内置扩展电池 23。 为增加主板面积， 可将主板后端伸展到硬盘 上面， 即硬盘贴着主板， 如图 4中虚线所示， 由于光驱的厚度大于硬盘的厚度， 这样安排不 会造成主机厚度过多地增加。  The small-size motherboard is housed in a large-size mainframe, and the extra space can be set with a built-in extended battery. As shown in Fig. 5, a built-in extended battery 23 is provided between the battery 17 and the main board 13. In order to increase the area of the motherboard, the back end of the motherboard can be extended to the hard disk, that is, the hard disk is attached to the motherboard. As shown by the dotted line in Fig. 4, since the thickness of the optical drive is larger than the thickness of the hard disk, this arrangement does not cause excessive thickness increase of the host.
图 3中的 CPU和 GPU的散热器采用了热管式散热器， CPU的散热器有两个风扇 10，GPU 则只有一个风扇， 另外一芯片直接贴着散热片。 图 6示出了 CPU和 GPU所采用的热管式散 热器的较详细的结构， 风扇 10为离心式， 散热肋片 7设置在热管 8上， 并且有大部分散热肋 片 7排列成圆弧形围着风扇叶轮 9，风扇 10没有风罩，主板 13直接为风扇 10的进风前侧板， 也就是说， 主板 13的进气孔 6就是风扇 10的进风口。 这样结构的热管式散热器已经没有可 以再省去的部件， 空间利用率已经达到最大， 热管的长度短， 并且容易实现标准化。 图 1、 3、 4、 5、 6中所示的热管 8为管式热管， 另外还可采用板式热管， 其热传输能力更强。  The CPU and GPU heat sinks in Figure 3 use a heat pipe heatsink. The CPU heatsink has two fans 10, the GPU has only one fan, and the other chip is directly attached to the heat sink. Fig. 6 shows a more detailed structure of the heat pipe type heat sink used in the CPU and the GPU. The fan 10 is centrifugal, the heat radiating fins 7 are disposed on the heat pipe 8, and most of the heat radiating fins 7 are arranged in a circular arc shape. Around the fan impeller 9, the fan 10 has no hood, and the main board 13 is directly the front side panel of the fan 10, that is, the air inlet 6 of the main board 13 is the air inlet of the fan 10. The heat pipe type radiator of such a structure has no components that can be omitted, the space utilization rate has been maximized, the length of the heat pipe is short, and standardization is easy. The heat pipe 8 shown in Figures 1, 3, 4, 5, and 6 is a tubular heat pipe, and a plate type heat pipe can also be used, which has a stronger heat transfer capability.
空气经风扇 10的驱动从主板的一侧吸入， 直接吹到散热肋片 7上， 然后沿着主板流动， 在硬盘 18所靠近的的主机侧壁上开有排气窗 22， 如图 3所示， 这样的设计可以使空气流经 大面积的主板， 对主板上的其它部件进行散热， 硬盘可得到有效的散热。排气窗 22远离进气 窗， 减小热空气回流进入进气窗。 电池 17的发热量也大， 因而应该考虑在电池 17旁边的侧 壁上开排气窗， 使得有空气流经电池。  The air is sucked from one side of the main board by the driving of the fan 10, directly blown onto the heat radiating fins 7, and then flows along the main board, and an exhaust window 22 is opened on the side wall of the main body near the hard disk 18, as shown in FIG. This design allows air to flow through a large area of the motherboard, dissipating heat from other components on the motherboard, and the hard drive can be effectively dissipated. The venting window 22 is remote from the intake window to reduce hot air backflow into the intake window. The heat generation of the battery 17 is also large, so it should be considered that an exhaust window is opened on the side wall beside the battery 17, so that air flows through the battery.
图 3所示的图为后视图， 从正视方向看， 主板上的外设接口 20以及前端外设接口 21设 置在靠主机的左侧前端角， 即左侧设置有外设接口， 而右侧没有外设接口， 这样的设计是更 方便操作人员。 因为， 人们习惯在右手方向操作鼠标、 放置物品， 比如水杯， 书本等， 如果 外设接口设置在右侧，就容易发生干涉，还有硬盘旁边的排风口 22还会对着操作鼠标的右手， 夏天吹出的热风会感到不好受。 电池 17靠前端、光驱 19靠后端的设计优点有： 如图 7所示， 为了便于电池 17的更换， 下盖 14开有电池 17的窗口， 并设有电池盖 24， 利用光驱 19的缺 口， 设置电池盖扣件 25， 增加了电池 17的空间， 电池的容量也就大。 图中示出， 电池 17和 电池盖 24为分开的两部件， 也可以设计成电池 17和电池盖 24为一体式结构。  The diagram shown in FIG. 3 is a rear view. From the front view, the peripheral interface 20 on the main board and the front peripheral interface 21 are disposed on the left front end corner of the main unit, that is, the peripheral interface is disposed on the left side, and the right side is disposed. Without a peripheral interface, this design is more convenient for the operator. Because people are used to operating the mouse in the right hand direction, placing items, such as cups, books, etc. If the peripheral interface is set on the right side, it is easy to interfere, and the air outlet 22 next to the hard disk will also face the right hand of the mouse. The hot air blown out in the summer will feel bad. The design advantages of the front end of the battery 17 and the rear end of the optical drive 19 are as follows: As shown in FIG. 7, in order to facilitate the replacement of the battery 17, the lower cover 14 is opened with a window of the battery 17, and a battery cover 24 is provided, and the gap of the optical drive 19 is used. The battery cover fastener 25 is provided to increase the space of the battery 17, and the capacity of the battery is also large. The battery 17 and the battery cover 24 are shown as separate components, and the battery 17 and the battery cover 24 may be designed as a unitary structure.
图 8示出了一种本发明的主机盒， 并装有显示器 5和键盘 1，进气窗开 2设在主机盒上壳 3上壁前端与键盘 1之间， 呈长条形， 为增加进气流通面积， 还可以在上壳前侧壁开长条形 进气窗。 在主机盒左侧壁不仅开有单独外设接口孔， 还开有长条形大开口结构的外设接口窗 口 26。 单独外设接口孔靠前端， 可将计算机必备的接口， 如网线接口、 电源插口、 两个 USB 接口标准化（各器件的位置标准化）， 主机盒靠前端的单独外设接口孔的型号和位置以及数量 标准化， 其他选配的外设接口设置在大开口结构的外设接口窗口 26上。 这样的设计， 使得主 板上的外设接口器件的限制减小， 因而标准化程度更高。  Figure 8 shows a main assembly box of the present invention, and is equipped with a display 5 and a keyboard 1. The air intake window opening 2 is disposed between the front end of the upper wall of the upper casing 3 of the main assembly and the keyboard 1, and has an elongated shape for the purpose of adding The intake air flow area can also open a long air intake window on the front side wall of the upper casing. In the left side wall of the main box, not only a separate peripheral interface hole but also a peripheral interface window 26 having a long and large opening structure is opened. The peripheral interface port of the individual peripherals can be used to standardize the necessary interfaces of the computer, such as the network cable interface, the power socket, and the two USB interfaces (the position of each device is standardized). The model and location of the individual peripheral interface holes on the front of the main box. As well as the number of standardizations, other optional peripheral interfaces are placed on the peripheral interface window 26 of the large opening structure. This design reduces the limitations of the peripheral interface devices on the main board and thus the degree of standardization.
图 8中示出， 无论单独外设接口孔， 还是大开口外设接口窗口 26呈对半地分别开上壳 3 和下盖 14的侧壁上， 这样便于主板安装， 也方便利用塑料注射工艺制造上壳和下盖， 可以将 上壳和下盖设计成两塑料注射成型的整体结构， 生产效率高、 成本低。  As shown in FIG. 8, regardless of the individual peripheral interface holes, or the large-open peripheral interface window 26, the side walls of the case 3 and the lower cover 14 are respectively opened in half, which facilitates the mounting of the main board and facilitates the use of the plastic injection process. By manufacturing the upper case and the lower cover, the upper case and the lower cover can be designed as a two-injection molded overall structure, which has high production efficiency and low cost.
图 9示出了一种本发明的主机盒的剖面图， 进气窗 2所处的上壳 3的上壁高于上壳 3键 盘 1所处的上壁， 这样利用键盘 1的厚度增加进气腔的高。 为保证进气腔内空气流动顺畅， 进气腔的高应该达到 3毫米以上， 也就是说上壳 3的前端上壁内表面要高于主板的固定台面 (图中所示的主板固定柱 27的台面） 3毫米以上。 图 10所示的本发明的主板， 为图 3所示计算机中的主板， 靠主板前端开有进气孔 6， 图 中有三个进气孔， 主板上的外设接口 20以及前端外设接口 21设置在靠两前端角中的一角， 主板的另一侧边没有设置外设接口。 内存条插槽 15设置在 CPU或 GPU所在的位置的后端， 与主板的前端边呈平行， 并且靠近外设接口所在的侧边的相对的那一侧边。 内存条插槽 15这 样设置， 是利用硬盘和光驱 （或电池） 之间空间， 放置内存条， 如图 3所示。 Figure 9 is a cross-sectional view showing a main assembly of the present invention, the upper wall of the upper casing 3 where the air intake window 2 is located is higher than the upper wall of the upper casing 3, so that the thickness of the keyboard 1 is increased. The air chamber is high. In order to ensure smooth air flow in the air inlet chamber, the height of the air inlet chamber should be more than 3 mm, that is, the inner surface of the front wall of the upper shell 3 is higher than the fixed surface of the main board (the main board fixing column 27 shown in the figure) The countertop) 3 mm or more. The motherboard of the present invention shown in FIG. 10 is a motherboard in the computer shown in FIG. 3, and has an air inlet hole 6 at the front end of the motherboard, three air inlet holes in the figure, a peripheral interface 20 on the main board, and a front peripheral interface. 21 is set at one corner of the two front corners, and the other side of the motherboard is not provided with a peripheral interface. The memory module slot 15 is disposed at the rear end of the position where the CPU or GPU is located, parallel to the front end side of the main board, and is adjacent to the opposite side of the side where the peripheral interface is located. The memory module slot 15 is arranged such that the space between the hard disk and the optical drive (or battery) is used to place the memory module, as shown in FIG.

Claims

权 利 要 求 书 Claim
1、 一种笔记本式计算机， 包括有： 平板式显示器和主机， 显示器 （5) 与主机为合页式 连接， 主机呈平板式， 键盘 （1 ) 设置在主机的上表面， 主机的主机盒包括有上壳和下盖， 主机盒内设置有主板、 硬盘 （18) 和电池 （17 )， 主板 （13) 挂装在上壳 （3) 内， CPU 或 GPU芯片（12)设置在主板朝下的面上， 其特征在于： 主板（13)前端靠着主机盒的前侧壁， 主板的左右两侧中的一侧设置有外设接口 （20)， 并且靠着主机盒相对应的一侧侧壁； 靠近 主板 （13) 的前端开有进气孔 （6)， 风扇 （10) 贴靠在主板朝下的面上， 风扇 （10) 的进风 口与主板上的进气孔（6)重叠、或主板上的进气孔（6)直接就是风扇的进风口； 在上壳（3) 的前端侧壁或靠前端的上壁上开有进气窗 （2)、 或者上壳 （3) 的前端侧壁和靠前端的上壁 上都开有进气窗 （2); 进气窗 （2) 呈长条形， 主板上的进气孔 （6) 直对着进气窗 （2)、 或者， 主板 （13) 与上壳靠前端的上壁之间留有空间， 构成进气腔 （11 )， 进气腔 （11 ) 呈长条形， 进气窗 （2) 和进气腔 （11 ) 与主板上的进气孔 （6) 相互贯通、  1. A notebook computer, comprising: a flat panel display and a host, the display (5) is hingedly connected to the host, the host is in a flat type, the keyboard (1) is disposed on the upper surface of the host, and the host box of the host includes There is an upper case and a lower cover. The main unit box is provided with a main board, a hard disk (18) and a battery (17), the main board (13) is mounted in the upper case (3), and the CPU or GPU chip (12) is disposed on the main board facing down. The front surface of the main board (13) is located on the front side wall of the main box, and one side of the left and right sides of the main board is provided with a peripheral interface (20), and the side corresponding to the main box Side wall; near the front of the main board (13), there is an air inlet hole (6), the fan (10) abuts the downward facing surface of the main board, the air inlet of the fan (10) and the air inlet hole on the main board (6) The air intake hole (6) on the overlapping or the main board is directly the air inlet of the fan; the air intake window (2) or the upper shell is opened on the front side wall of the upper casing (3) or the upper wall of the front end (3) The front side wall of the front end and the upper wall of the front end are provided with an air intake window (2); the air intake window (2) In the shape of a long strip, the air inlet hole (6) on the main board is directly opposite to the air intake window (2), or there is a space between the main board (13) and the upper wall of the front end of the upper case to form an air intake chamber (11). The intake chamber (11) has a long strip shape, and the air inlet window (2) and the air inlet chamber (11) communicate with the air inlet holes (6) on the main board.
或者， 既采用了长条形进气窗结构， 又采用了进气腔结构。  Alternatively, both a long air intake window structure and an air intake chamber structure are employed.
2、 根据权利要求 1所述的笔记本式计算机， 其特征在于： CPU或 GPU芯片（12) 的散 热风扇 （10) 为离心式风扇， 并采用了管式或板式热管， 有散热肋片 （7) 呈圆弧形排列， 围着风扇叶轮 （9)。  2. The notebook computer according to claim 1, wherein: the cooling fan (10) of the CPU or GPU chip (12) is a centrifugal fan, and adopts a tubular or plate heat pipe, and has a heat dissipation fin (7). ) Arranged in a circular arc around the fan impeller (9).
3、 根据权利要求 1所述的笔记本式计算机， 其特征在于： 主板上的外设接口 （20) 以 及前端外设接口 （21 )设置在靠主机的两前端角中的一角； 硬盘（18)设置在靠主机的后端， 并且靠外设接口 （20) 的那侧； 电池 （17) 或光驱 （19) 设置在主板 （13) 与主机盒的一侧 侧壁之间。  3. The notebook computer according to claim 1, wherein: the peripheral interface (20) on the main board and the front peripheral interface (21) are disposed at one corner of the two front corners of the main body; the hard disk (18) It is disposed on the back end of the host and on the side of the peripheral interface (20); the battery (17) or the optical drive (19) is disposed between the main board (13) and one side wall of the main box.
4、 根据权利要求 3所述的笔记本式计算机， 其特征在于： 主板上的外设接口 （20) 以 及前端外设接口 （21 )设置在靠主机的左侧前端角， 硬盘 （18)横置， 硬盘的短边与主板侧 边的方向一致。  4. The notebook computer according to claim 3, wherein: the peripheral interface (20) on the main board and the front peripheral interface (21) are disposed at a front end corner of the main unit, and the hard disk (18) is placed transversely. The short side of the hard disk is in the same direction as the side of the motherboard.
5、 根据权利要求 4所述的笔记本式计算机， 其特征在于： 电池 （17)靠主机盒的前端； 下盖 （14) 开有电池 （17) 的窗口， 并设有电池盖 （24)。  The notebook computer according to claim 4, wherein the battery (17) is located at a front end of the main unit case; the lower cover (14) has a window of the battery (17) and is provided with a battery cover (24).
6、 一种用于根据权利要求 1至 5所述的笔记本式计算机的主机盒， 包括有： 上壳 （3) 和下盖 （4)， 显示器 （5) 通过合页式连接装置安装在上壳 （3) 上， 其特征在于： 上壳 （3) 的前端侧壁或前端与键盘 （1 )之间的上壁开有长条形进气窗 （2)、 或者上壳 （3) 的前端侧 壁和上壁都开有长条形进气窗 （2); 上壳 （3) 的前端上壁内表面高于主板的固定台面 3mm 以上。  6. A mainframe for a notebook computer according to any of claims 1 to 5, comprising: an upper casing (3) and a lower cover (4), the display (5) being mounted on the hinged connection device The shell (3) is characterized in that: the front side wall or front end of the upper shell (3) and the upper wall between the front panel and the keyboard (1) are provided with an elongated air inlet window (2) or an upper shell (3) The front side wall and the upper wall are both provided with a long air inlet window (2); the inner surface of the front wall of the upper shell (3) is higher than the fixed surface of the main board by more than 3 mm.
7、 一种根据权利要求 6所述的主机盒， 其特征在于： 在主机盒的侧壁开有长条形大开 口结构的外设接口窗口 （26)。  7. A main unit casing according to claim 6, wherein: a peripheral interface window (26) having a long elongated opening structure is formed in a side wall of the main unit casing.
8、 一种根据权利要求 6所述的主机盒， 其特征在于： 上壳 （3)和下盖 （14) 分别为两 个塑料注射成型的整体结构， 外设接口孔或窗口呈对半地分别开在上壳 （3) 和下盖 （14) 的侧壁上。  8. A main assembly according to claim 6, wherein: the upper casing (3) and the lower cover (14) are respectively two plastic injection molded integral structures, and the peripheral interface holes or windows are half-to-ground. Open on the side walls of the upper case (3) and the lower cover (14).
9、 一种用于根据权利要求 1至 5中任何一项所述的笔记本式计算机的主板， 其特征在 于： 靠主板前端开有进气孔 （6)， 主板上的外设接口 （20) 以及前端外设接口 （21 ) 设置在 靠近两前端角中的一角。  9. A main board for a notebook computer according to any one of claims 1 to 5, characterized in that: an air inlet hole (6) is opened at the front end of the main board, and a peripheral interface (20) on the main board is provided. And the front-end peripheral interface (21) is placed near one of the two front corners.
10、 一种根据权利要求 9所述的主板， 其特征在于： 内存条插槽 （15) 设置在 CPU或 GPU所在位置的后端，与主板的前端边呈平行，并且靠近外设接口所在的侧边的相对的那一 侧边。  10. A motherboard according to claim 9, wherein: the memory module slot (15) is disposed at a rear end of the CPU or GPU, parallel to the front end of the motherboard, and adjacent to the peripheral interface. The opposite side of the side.
PCT/CN2009/072785 2009-07-16 2009-07-16 Notebook type computer and its enclosure and motherboard WO2011006301A1 (en)

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EP3865978A1 (en) * 2019-12-20 2021-08-18 INTEL Corporation Movable inlet for a fan
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