WO2010119934A4 - 発光装置、光特性調整方法及び発光装置の製造方法 - Google Patents
発光装置、光特性調整方法及び発光装置の製造方法 Download PDFInfo
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- WO2010119934A4 WO2010119934A4 PCT/JP2010/056800 JP2010056800W WO2010119934A4 WO 2010119934 A4 WO2010119934 A4 WO 2010119934A4 JP 2010056800 W JP2010056800 W JP 2010056800W WO 2010119934 A4 WO2010119934 A4 WO 2010119934A4
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- light
- wavelength conversion
- light emitting
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- emitting device
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- 238000000034 method Methods 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 230000003287 optical effect Effects 0.000 title description 4
- 238000006243 chemical reaction Methods 0.000 claims description 195
- 239000000758 substrate Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 34
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 29
- 230000003746 surface roughness Effects 0.000 claims description 15
- 229910010293 ceramic material Inorganic materials 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 abstract description 4
- 239000002245 particle Substances 0.000 description 35
- 238000012986 modification Methods 0.000 description 22
- 230000004048 modification Effects 0.000 description 22
- 238000001228 spectrum Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 12
- 238000009792 diffusion process Methods 0.000 description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000003086 colorant Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229910052765 Lutetium Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052771 Terbium Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- the present invention relates to a light emitting device including a light emitting element and a wavelength conversion member for converting the wavelength of light emitted from the light emitting element, a method of adjusting light characteristics, and a method of manufacturing the light emitting device.
- a light emitting diode (hereinafter, simply referred to as "LED") including a semiconductor multilayer film is known.
- the LEDs that are GaN-based and emit blue light are combined with a wavelength conversion member including a phosphor material (hereinafter also referred to as “phosphor”) that converts the wavelength of blue light to the wavelength of yellow light. It can apply to the light emitting device etc. which emit white light (for example, refer to patent documents 1).
- the phosphor includes a light absorbing material that absorbs light of at least a part of the wavelength of the light emitted by the LED, or a wavelength different from the wavelength of the light emitted by the LED and emitted by the light emission of the LED.
- the phosphor contains a fluorescent substance that emits light.
- a phosphor paste obtained by dispersing a phosphor in a translucent resin for example, a silicone resin etc.
- a translucent resin for example, a silicone resin etc.
- the phosphor paste is formed in advance in a plate shape, and is disposed or laminated on the upper surface of the LED
- the phosphor paste is, for example, printing method or potting method
- so-called ceramic plate containing phosphor in ceramic which is formed in advance, and pasted this ceramic plate on the upper surface of LED is generally adopted. ing.
- an optical characteristic can be controlled by adjusting the thickness of a wavelength conversion member (for example, refer patent documents 2, 3).
- the light characteristics can be similarly controlled by adjusting the concentration of the phosphor material contained in the wavelength conversion member.
- the composite color of the light emitted from the LED and the light wavelength-converted by the wavelength conversion member has the light characteristics required for the device.
- the thickness of the wavelength conversion member, the concentration of the phosphor material, and the like are designed based on the intensity and the wavelength of the emitted light.
- the intensity and wavelength of the light emitted from the LED, the thickness of the wavelength conversion member, and the concentration of the phosphor material vary, the balance between the light emitted from the LED and the light wavelength-converted by the wavelength conversion member collapses. It is not possible to obtain the desired light characteristics.
- An apparatus combining the LED and the wavelength conversion member when there is a color shift in the light emitted from the wavelength conversion member using the wavelength conversion member with respect to the LED whose emission color is nonstandard Will be treated as defective.
- An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a light emitting device capable of outputting light having desired characteristics even if the light emitting element and the wavelength conversion member have variations.
- a light emitting device comprises: a light emitting light source; and a wavelength converter for converting at least a part of the wavelength of light emitted from the light emitting light source into one or more other wavelengths.
- the light emitting surface for outputting a composite color of light of two or more wavelengths emitted from the wavelength conversion member as an output light, a surface state of at least a part of the light incident surface and the light emission surface in the wavelength conversion member Are adjusted in accordance with the intensity of the light emitted from the light emitting source.
- a light emitting device comprises a light emitting light source, and a wavelength converter for converting at least a part of the wavelength of light emitted from the light emitting light source into one or more other wavelengths, and emitting light from the wavelength conversion member
- the surface state of at least a portion of the light incident surface and the light emitting surface in the wavelength conversion member excludes the portion It is characterized in that it is different from the surface state of other parts.
- the “light property” is a property related to light, and includes, for example, color unevenness, chromaticity (including color temperature), and the like.
- surface state refers to the surface roughness of the wavelength conversion member, the depth of the unevenness on the surface of the wavelength conversion member, the pitch of the unevenness, and a combination of these.
- the difference between the surface states of “the surface state of at least a part of the light incident surface and the light exit surface in the wavelength conversion member is different from the surface state of the other part excluding the part”
- the surface roughness of at least a part of the light incident surface and the light exit surface in the conversion member is different from the surface roughness of the other part, and the uneven depth and depth of at least a part of the light incident surface and the light exit surface. It means that the pitch and the uneven depth and pitch of other parts are different from one another, or at least one of them is different in the state of combining these.
- the surface roughness when the surface roughness is different, it can be judged by the difference of the numerical value of “Ra” indicating the arithmetic average roughness of the surface, and in the case of the uneven depth and pitch, it can be judged by the actual measurement value.
- the surface state of at least a part of the light incident surface and the light emitting surface in the wavelength conversion member is adjusted, desired characteristics can be obtained even if the light emitting element or the wavelength conversion member has variations. Light can be output.
- the surface state of at least a part of the light incident surface and the light emission surface in the wavelength conversion member is different from the surface state of the other part excluding the part, the characteristics of the light output from the part are adjusted As a result, even if there are variations in the light emitting element and the wavelength conversion member, it is possible to output light of desired characteristics.
- the surface state is a surface roughness, or the light incident surface and the light emitting surface of the wavelength conversion member have an uneven shape, and the surface state is a depth of the uneven portion and And / or pitch.
- the light emitting light source is a plurality of light emitting elements, and the plurality of light emitting elements are mounted on the main surface of the substrate, and at least one of the light incident surface and the light emitting surface in the wavelength conversion member It is characterized in that the surface state gradually changes from the center to the end of the surface, or the wavelength conversion member is characterized in that the light-transmissive member contains a phosphor material, or The light transmitting member is characterized by being made of a ceramic material.
- the light characteristic adjusting method of the present invention at least a part of light emitted from a light emitting light source is converted into one or more wavelengths by a wavelength conversion member, and emitted from the wavelength conversion member And adjusting the characteristics of the light, the adjustment of the characteristics of the light may be performed between the light incident surface and the light emission surface of the wavelength conversion member. It is characterized in that it is performed by changing at least a part of the surface state.
- the “light property” is a property related to light, and includes, for example, color unevenness, chromaticity (including color temperature), and the like.
- a method of manufacturing a light emitting device comprises: a light emitting light source; and wavelength conversion for converting at least a part of the wavelength of light emitted from the light emitting light source into one or more other wavelengths.
- a method of manufacturing a light emitting device comprising: a body, combining light of at least two or more wavelengths emitted from the wavelength conversion member and outputting the combined light as light of a light color within a predetermined range, from the wavelength conversion member
- a measurement step of measuring whether or not combined light of at least two or more wavelengths emitted is a light characteristic within a predetermined range, and the combined light is not within the light characteristic within the predetermined range
- the “light property” is a property related to light, and includes, for example, color unevenness, chromaticity (including color temperature), and the like.
- FIG. 7 is a schematic view of a light emitting device according to a first modification.
- FIG. 7 is a schematic view of a light emitting device according to a first modification.
- FIG. 7 is a schematic view of a light emitting device according to a second modification. It is a figure which shows the relationship between the surface state of the wavelength conversion member for red, and chromaticity. It is a figure explaining the light-emitting device which concerns on the modification 3, (a) is the top view which removed the wavelength conversion member from the light-emitting device, (b) is a top view of the light-emitting device which mounted the wavelength conversion member, (C) is a figure which shows the surface state of a wavelength conversion member. It is the schematic of the light-emitting device which concerns on a reference example.
- FIG. 1 is a plan view of the light emitting device according to the first embodiment
- FIG. 2 is a front view of the light emitting device according to the first embodiment. In both figures, a part is shown in a cross-sectional view so that the internal state can be seen.
- the light emitting device 1 includes a substrate 3 and LEDs 5A, 5B, 5C, and 5D which are a plurality of (here, four) light emitting elements mounted on the substrate 3.
- a wavelength conversion member 7 for converting the wavelength of light from the LEDs 5A, 5B, 5C, 5D into another desired wavelength, and a mounting frame 9 for mounting the wavelength conversion member 7 on the substrate 3 are provided.
- LED5A, 5B, 5C, 5D is only set as "LED5", when pointing the whole without pointing to each LED.
- the substrate 3 includes a wiring pattern 11 electrically connected to the LED 5 on the main surface 3a and terminals 13a and 13b for connection to an external power supply (not shown).
- the wiring pattern 11 includes a land 11a connected to the p-side electrode of the LED 5, a land 11b connected to the n-side electrode of the LED 5, and a connection land 11c connecting the land 11b and the land 11a between the adjacent LEDs 5.
- the connection terminals 13 a and 13 b are electrically connected via the wiring pattern 11 and the LED 5.
- FIG. 3 is a view of a cross section taken along the line X-X in FIG. 1 as viewed in the arrow direction.
- the LEDs 5A, 5B, 5C, and 5D have the same specifications (configurations) except for manufacturing variations, and therefore, the LED 5B will be described below with reference to FIG.
- the LED 5B is a rectangular parallelepiped having a square shape in a plan view (here, as viewed from the direction orthogonal to the major surface 3a of the substrate 3), and is mounted on the major surface 3a of the substrate 3 described above.
- the surface of the LED 5B mounted on the substrate 3 is referred to as the lower surface of the LED 5B
- the surface parallel to the substrate 3 and far from the substrate 3 is referred to as the upper surface (also a light emitting surface).
- the LED 5B includes, for example, an electrode pattern (p side) 5Ba made of AuSn, Au, etc., a conductive substrate 5Bb made of Si, Ge etc., a bonding member 5Bc such as AuSn, Ag, Al, Rh etc. Consisting of a highly reflective member 5Bd, a P-GaN conductive layer 5Be, an InGaN (MQW structure) light emitting layer 5Bf, an N-GaN conductive layer 5Bg, and an electrode pattern (n side) 5Bh made of Au or the like For example, it emits blue light.
- the conductive layer 5Bg serves as the light emitting surface of the LED 5B.
- the LED 5B is a so-called single-sided dual electrode type, and is mounted on the substrate 3 using, for example, bumps 15a and 15b. Note that, precisely, the electrodes 5Ba and 5Bh of the LED 5B are connected to the lands 11a and 11b of the wiring pattern 11 via the bumps 15a and 15b, whereby the LED 5B is mounted on the substrate 3.
- the wavelength conversion member 7 is a material that converts the wavelength of (part of) the light emitted from the LED 5, specifically, a light-transmitting material containing a phosphor that converts blue light emitted from the LED 5 into yellow light It is made of a material.
- the blue light emitted from the LED 5 and the yellow light wavelength-converted by the phosphor are mixed to output white light (synthetic color).
- the surface condition of the surface 7 a of the wavelength conversion member 7 is adjusted according to the color of the light emitted from the LED 5.
- the surface 7 a of the wavelength conversion member 7 will be described later.
- the mounting frame 9 surrounds the circumference of the four LEDs 5 as shown in FIGS. 1 to 3, and the height thereof is set such that the wavelength conversion member 7 is in contact with the upper surface of the LEDs 5.
- the light emitting device 1 described above includes a mounting step of mounting the LED 5 on the substrate 3, a mounting step of mounting the mounting frame 9 on the substrate 3, a mounting step of mounting the wavelength conversion member 7 on the mounting frame 9, and light emission of the LED 5. Measurement step of measuring the light characteristic (for example, light color) of the combined light of the light (the light emitted from the LED 5 and the light converted in wavelength) emitted from the wavelength conversion member 7.
- the light emitting diode it is manufactured through an adjusting process of adjusting the state of the surface (7a) of the wavelength conversion member 7 (hereinafter, also referred to as “surface state” at the end).
- the mounting process, the mounting process, the mounting process, and the measurement process described above can be implemented by using known techniques. Note that, for example, an integrating sphere or a color light meter is used to measure the light color that is the light characteristic.
- the adjustment process is performed by changing the surface state of the wavelength conversion member 7.
- the finish state of the surface (7a) of the wavelength conversion member 7 is changed.
- the surface (7a) of the wavelength conversion member 7 is mirror-finished (surface roughness In this case, the surface (7a) of the wavelength conversion member 7 is polished by, for example, # 220 buffing (the surface roughness is increased).
- the light characteristics (light color) of the light output from the light emitting device 1 can be adjusted.
- the intensity of the yellow component decreases and the intensity of the blue component increases.
- the surface of the wavelength conversion member 7 is subjected to a # 220 buffing finish (to increase the surface roughness), whereby the intensity of the blue component decreases and the intensity of the yellow component increases.
- the present invention is not limited to the light emitting device having another configuration as long as there is a measurement step and an adjustment step. Applicable
- the light emitting device includes the base, the substrate and the mounting frame attached to the base, the LED mounted on the substrate, and the wavelength conversion member mounted on the mounting frame
- the light emitting device In the manufacturing method, the step of attaching the substrate and the mounting frame to the base, the step of mounting the LED on the substrate, the attaching step of attaching the wavelength conversion member to the mounting frame, and the emission of light from the wavelength conversion member Measuring the light color of the combined light of the light, and adjusting the surface of the wavelength conversion member when the measured light color is out of the predetermined range.
- the wavelength conversion member may be temporarily attached to the base or the substrate, and after the surface of the wavelength conversion member is adjusted, it may be formally attached.
- Example The LED 5 has a light emitting layer of InGaN (MQW structure), and emits blue light. One side of the bottom surface in plan view is about 1 (mm), and the distance between the adjacent LEDs 5 is 100 ( ⁇ m).
- the wavelength conversion member 7 is an inorganic molded body provided with a translucent wavelength conversion layer containing a phosphor material having a garnet crystal structure, and the phosphor material is Mg, Ca, Sr, Ba, Y, La, A component element group including at least one element selected from Gd, Tb, and Lu is included, and a part of the component element group is substituted by Ce 3+ .
- the thickness of this wavelength conversion member is 120 ( ⁇ m). 4.
- the surface state of the wavelength conversion member Generally, when the wavelength conversion member is polished or W / E finished, the wavelength conversion member becomes thinner and the transmittance of the light emitted from the LED increases, and as a result, the light emitting device emits light.
- FIG. 4 is a schematic view of the light emitting device subjected to the test
- FIG. 4A is a plan view of the light emitting device, in which a part of the wavelength conversion member is removed so that the internal state can be seen.
- (B) is the figure which looked at the Y-Y line cross section of (a) from the arrow direction.
- the light emitting device 51 includes a substrate 53, an LED 55, a wavelength conversion member 57, and a mounting frame 59, and the materials of the LED 55 and the wavelength conversion member 57 are the same as those in the above embodiment.
- the wiring pattern 61 is formed on the surface of the substrate 53.
- the LED 55 is a single-sided dual-electrode type in which both the p-side electrode and the n-side electrode are provided on the lower surface, and is connected to the wiring pattern 61 via the bumps 63 (mounted on the substrate 53).
- the LED 55 is an InGaN-based element that emits blue light
- the wavelength conversion member 57 includes a ceramic material (YAG) that is a translucent material, and a group of constituent elements that convert part of light from the LED 55 into yellow light. And a phosphor material.
- the light emitting device 51 outputs white light in which the blue light of the LED 55 and the yellow light wavelength-converted by the wavelength conversion member 57 are mixed.
- the ceramic material of the wavelength conversion member 57 subjected to the test has a total of 20 types of particle diameters of 5 types and 4 types of surface finish for each particle size.
- the particle size of the ceramic material is 8 ( ⁇ m), 23 ( ⁇ m), 30 ( ⁇ m), 45 ( ⁇ m), 60 ( ⁇ m), and wavelength conversion members having different particle sizes are main materials Obtained by changing the firing conditions of the ceramic material of
- surface finish is mirror finish, # 220 buff finish, wet etching finish after mirror finish, wet etch finish after # 220 buff finish.
- the wet etching finish may be hereinafter referred to as a W / E finish.
- the etching solution is sulfuric acid (96%), and the etching conditions are 3 hours at a temperature of 150 (° C.).
- FIG. 5 to FIG. 9 are diagrams showing the state of the surface after each surface finish at each particle diameter.
- FIG. 5 shows the state of the surface after each surface finish at a particle diameter of 8 ( ⁇ m)
- FIG. 6 shows the state of the surface after each surface finish at a particle diameter of 23 ( ⁇ m)
- 7 shows the state of the surface after each surface finish at a particle size of 30 ( ⁇ m)
- FIG. 8 shows the state of the surface after each surface finish at a particle size of 45 ( ⁇ m)
- FIG. The state of the surface after each surface finish in ( ⁇ m) is shown.
- the surface of the wavelength conversion member shown in the above figure has a shape and surface state in which at least a part of grain boundaries are exposed to the surface, and the direction of the exposed grain boundaries is irregular. There is. As a result, it is considered that light is dispersed and emitted uniformly.
- 10 to 13 are diagrams showing spectra in the case of using wavelength conversion members of each surface state.
- a spectrum is distribution of the wavelength of light, and the emitted light intensity of the wavelength, and it measures using the integrating sphere in this experiment.
- FIG. 10 shows a spectrum of a light emitting device using a wavelength conversion member mirror finished
- FIG. 11 shows a spectrum of a light emitting device using a wavelength conversion member finished W / E after mirror finishing
- 12 shows a spectrum of a light emitting device using a wavelength conversion member finished with # 220 buffing
- FIG. 13 shows a spectrum of a light emitting device using a wavelength converting member finished with # 220 buffing and then W / E.
- the surface condition is rougher (more uneven) in the # 220 buff-polished surface, and it was emitted from the LED
- the intensity of the light (the wavelength is about 440 (nm)) is reduced, and conversely, the intensity of the wavelength-converted light (the wavelength is about 550 (nm)) by the wavelength conversion member is increased.
- W / E finishing slightly weakens the intensity of the light emitted from the LED (wavelength is about 440 (nm)), and conversely wavelength conversion It can be seen that the intensity of the light (wavelength is 550 (nm)) wavelength-converted by the member is slightly increased.
- FIG. 14 is a view showing the spectrum of each surface state in the wavelength conversion member having a particle diameter of 45 ( ⁇ m).
- the surface state is mirror finish, # 600 buff polished finish, # 220 buff polished finish, # 140 buff polished finish According to the intensity of the light emitted from the LED (the wavelength is about 440 (nm)) and the intensity of the light (the wavelength is 550 (nm)) wavelength converted by the wavelength conversion member. It can be seen that the intensity of the light emitted from the LED (the wavelength is about 440 (nm)) and the intensity of the light (the wavelength is 550 (nm)) wavelength converted by the wavelength conversion member. It can be seen that the intensity of the light emitted from the LED (the wavelength is about 440 (nm)) and the intensity of the light (the wavelength is 550 (nm)) wavelength converted by the wavelength conversion member. It can be seen that the intensity of the light emitted from the LED (the wavelength is about 440 (nm)) and the intensity of the light (the wavelength is 550 (nm)) wavelength converted by the wavelength conversion member. It can be seen that the intensity of the light emitted from the LED (the wavelength is
- FIG. 15 is a diagram showing the chromaticity of output light from a light emitting device using a wavelength conversion member having a particle diameter of 45 ( ⁇ m) and different surface states, as a chromaticity coordinate.
- the surface state (grain size of the grinding wheel) and the chromaticity of light output from the light emitting device using the wavelength conversion member of each surface state are as follows: It can also be seen that they are plotted on a substantially straight line.
- the chromaticity of the light emitted from the LED is shifted from the blue side to the yellow side as the surface state shifts from mirror finish to # 140 buff polishing finish, and the surface state By changing, it is understood that the chromaticity of the light emitted from the LED can be shifted.
- FIG. 16 is a diagram showing the chromaticity of output light from a light emitting device using wavelength conversion members having different particle diameters and surface states, as coordinates of chromaticity coordinates. Note that, in the figure, the "surface state” is simply represented as the "state”.
- Each chromaticity in the figure is not plotted on the chromaticity coordinates, but if the particle diameter of the wavelength conversion member is the same, the chromaticity of light emitted from the LED may shift when the surface state is converted. I understand.
- FIG. 17 is a diagram showing the relationship between the finishing number of the surface of the wavelength conversion member and the shift amount of the chromaticity x.
- the “surface finish number” is a numerical value representing the particle size of the grindstone when the buffing process is performed. For example, in the case of # 220 buffing finish, it is “220” and the mirror finish is “2000”.
- the chromaticity of the output light from the light emitting device using the wavelength conversion member of each surface state is measured, and each of the cases with the mirror finish (surface finish number is 2000) based on the wavelength conversion member
- the shift amount of the chromaticity of the output light from the surface state light emitting device is shown.
- the shift amount of the chromaticity x in each surface state with reference to the mirror-finished wavelength conversion member has a linear relationship of falling to the right, and the smaller the surface finish number, that is, It can be seen that the rougher the surface condition, the larger the surface condition.
- FIG. 18 is a diagram showing the relationship between the finishing number of the surface of the wavelength conversion member and the shift amount of the chromaticity x.
- This figure shows the relationship between the difference in surface state and the shift amount of the chromaticity x when the first surface state is changed to the second surface state.
- first surface state having a # 220 buff finish
- second surface state having a # 140 buff finish
- the larger the difference in the surface state for example, in the case of buffing, the larger the difference in the particle size (surface finish number) of the grinding wheel, the larger the shift amount of the light chromaticity.
- the surface condition of the wavelength conversion member of the light emitting device that outputs a desired chromaticity can be known, and the surface condition (for example, surface finish number) to be adjusted can be known.
- FIG. 19 is a figure which shows the surface roughness in each surface finish number
- (b) is a figure which shows the relationship between surface roughness and the shift amount of the chromaticity x.
- FIG. 20 is a diagram showing an example of a light emitting device whose light characteristics are adjusted.
- the example described here is the light emitting device 1 including four LEDs 5 in a row, and the direction in which the LEDs 5 are arranged is taken as the row direction.
- the wavelength conversion member 7 covers all four LEDs 5A, 5B, 5C, 5D, and corresponding to each of the LEDs 5A, 5B, 5C, 5D, the area located above is 7A, 7B, 7C. , 7D in the figure.
- both ends of the surface of the wavelength conversion member 7 arranged on the device surface are adjusted. That is, in the wavelength conversion member 7, the regions 7A and 7D located above the two LEDs 5A and 5D located at the end are finished in a mirror surface.
- one end portion (“7D" in the figure) of the wavelength conversion member 7 is adjusted. That is, in the wavelength conversion member 7, the surface of the region 7D located above the LED 5D located on one end side (here, the side opposite to the feeding terminals 13a and 13b) is roughly finished.
- the surface condition of the region 7D at the end of the wavelength conversion member 7 is roughened to weaken the blue light intensity at the end portion of the light output surface of the light emitting device 1 and output desired white light as a whole. It will be.
- the wavelength conversion member 7 By changing the surface state, the light characteristics of the light output from the light emitting device 1 can be adjusted, and further, the color unevenness can be further reduced.
- FIG. 21 is a diagram schematically showing the surface shape of the wavelength conversion member subjected to the test.
- the surface of the wavelength conversion member 7 has an uneven shape, and the cross-sectional shape of the uneven portion has, for example, a frustum shape as shown in the enlarged view of FIG. 21 (in other words, V-shaped) With a ditch).
- the surface of the wavelength conversion member 7 shown in FIG. 21 is first obtained by preparing ceramic materials (including phosphor materials) having different particle sizes, finishing the surface once to a mirror surface, and then wet etching. That is, the grain boundary portion of the ceramic material having a mirror-like surface is etched in the thickness direction of the wavelength conversion member 7, resulting in a frustum shape as shown in FIG. 21 (the grain boundary portion is etched and V-shaped Groove)).
- L1 indicates the base diameter which is the base of the frustum, that is, the size of the particle diameter
- D indicates the height of the frustum, that is, the etching depth (simply referred to as "depth") D.
- the depth D and the etching width are adjusted by the etching time.
- the particle diameter of the wavelength conversion member 7 is four types of 8 ( ⁇ m), 23 ( ⁇ m), 45 ( ⁇ m), and 60 ( ⁇ m).
- FIG. 22 is a diagram showing the relationship between the depth and the shift amount of chromaticity.
- the shift amount of the chromaticity x increases, and further, if the depth is the same, regardless of the size of the particle diameter, the chromaticity It can be seen that the shift amount of x is substantially the same.
- FIG. 23 is a diagram showing the relationship between the pedestal diameter and the shift amount of chromaticity.
- the chromaticity D follows the depth D becoming larger (from 0 ( ⁇ m) to 4 ( ⁇ m)). It can be seen that the shift amount of x increases, and further, the shift amount of the chromaticity x with respect to the depth D increases as the pedestal diameter L1 decreases.
- the depth D is the same (for example, 3 ( ⁇ m))
- the smaller the pedestal diameter L1 the larger the shift amount of the chromaticity
- the pedestal diameter L1 is more than 60 ( ⁇ m) or more , The shift amount of the chromaticity x does not change much.
- the pedestal diameter L1 is in the range of 60 ( ⁇ m) or less preferable.
- a pedestal diameter shows the pitch of uneven
- the minimum particle diameter is 8 ( ⁇ m), and if the particle diameter can be made smaller than this, it is preferable to use a pedestal diameter L1 of 8 ( ⁇ m) or less. This is because the light characteristics can be adjusted effectively.
- the depth D which is also the height of the pedestal is preferably as deep as possible in the range of 4 ( ⁇ m) or less.
- the change in the shift amount of the chromaticity is small at the depth D of 3 ( ⁇ m) and 4 ( ⁇ m), but if the depth D is larger than 4 ( ⁇ m), Since the chromaticity shifts even if the shift amount is small according to the depth, it can be said that the chromaticity adjustment range is broadened not only in the range of 4 ( ⁇ m) or less but also in the deeper depth D.
- the light emitting device 1 including the four LEDs 5A, 5B, 5C, and 5D has been described. However, even in the case of a light emitting device using one LED, the light output surface of the light emitting device is colored Problems such as unevenness may occur and a desired light color may not be obtained depending on the LED used.
- FIG. 24 is a view for explaining the wavelength conversion member according to the second embodiment, and (a) is a view showing the surface state of the wavelength conversion member when color unevenness occurs in a part of the light output surface 7B is a view showing the surface state of the wavelength conversion member after adjusting the light color.
- the output is from the area 57A corresponding to one corner (corresponding to one corner of the LED) of the light output surface of the wavelength conversion member 57.
- the light color of the light is shifted to the yellow side.
- the yellow light in the area 57A is reduced by bringing the surface of the area 57A in which color unevenness is occurring close to the mirror surface (reducing the roughness). Blue light can be increased, and as a result, color unevenness can be suppressed.
- (B) of FIG. 24 changes the surface state as it approaches the periphery from the center of the light output surface.
- the peripheral portion is weaker than the central portion in the distribution of blue light on the emission surface of the LED 55, the blue light moves from the central portion to the peripheral portion on the light output surface of the light emitting device 51 It is time when it becomes weak and the desired light color can not be obtained as a whole.
- a low pressure mercury lamp is used as a light source.
- Light Emitting Element (1) Type In the embodiment and the like, an LED which is a semiconductor light emitting element is used as the light emitting element, but another semiconductor light emitting element may be used. Specifically, it is a laser diode (LD).
- LD laser diode
- Electrode In the embodiment and the like, a single-sided and dual-electrode type LED is used, but of course, a double-sided electrode type LED may be used. In such a case, for example, the electrode on the upper surface is connected to the wiring pattern on the substrate using a wire or the like.
- an InGaN-based element is used as an LED having a light emitting layer that emits blue light, but of course, LEDs of other light emitting layers may be used.
- the light emitting device is configured using four LEDs, and in the second and third embodiments, the light emitting device is configured using one LED. However, the number of light emitting elements (LEDs) may be one or more than one. A modification of the number of LEDs will be described in the section of the light emitting device described later. 3.
- Wavelength Converting Member (1) Number Although the light emitting devices 1 and 57 in the first and second embodiments are provided with one wavelength converting member 7 and 57, they are light emitting devices provided with a plurality of wavelength converting members. It is good.
- Modification 1 a light emitting device provided with two or more wavelength conversion members
- Modification 2 a light emitting device provided with two or more wavelength conversion members
- FIG. 25 is a schematic view of a light emitting device according to a first modification.
- the light emitting device 101 includes the substrate 103, one LED 105, multiple types (here, three types) of wavelength conversion members 107R, 107G, and 107B, and wavelength converted light in a predetermined direction.
- a reflector 109 to be reflected and a diffusion plate 111 for mixing the wavelength-converted light are provided.
- the present embodiment differs from the first embodiment and the like in that a plurality of types of wavelength conversion members 107R, 107G, and 107B are provided.
- the LED 105 emits, for example, purple, near-ultraviolet, or UV.
- the light emitting layer is epitaxially grown on a substrate such as sapphire, SiC, GaN, Si, GaAs or the like.
- Formula B z Al x Ga 1-x -y-z In y N 1-v-w As v P w (0 ⁇ x ⁇ 1,0 ⁇ y ⁇ 1,0 ⁇ z0 ⁇ 1,0 ⁇ x + y + z0 ⁇ 1 ,
- a semiconductor multi-layer obtained by crystal growth of a group III-V nitride semiconductor (generally described as BAlGaInNAsP and hereinafter referred to as a GaN-based semiconductor) represented by 0 ⁇ v0 ⁇ 1, 0 ⁇ w0 ⁇ 1, 0 ⁇ v + w0 ⁇ 1) It is composed of a membrane.
- a GaN-based semiconductor material is known as a material capable of emitting light in a wide range of an ultraviolet region 200 (nm) to an infrared region 1700 (nm) depending on the composition.
- the wavelength conversion member includes a wavelength conversion member for red 107R that converts violet, near-ultraviolet and UV from the LED 105 into red light, and a wavelength conversion member 107G for green that converts violet, near-ultraviolet and UV from the LED 105 to green light , And three types of wavelength conversion members for blue 107B that convert purple, near-ultraviolet and UV from the LED 105 into blue light.
- the reflector 109 has a cone-shaped through hole whose diameter gradually expands toward the diffuser plate 111, and the surface forming the through hole is a reflective surface 109a.
- the light emitting device 101 outputs white light, which is a composite color of wavelength-converted red light, green light, and blue light, by having the above configuration, in particular, by having three types of wavelength conversion members 107R, 107G, and 107B.
- FIG. 26 is a schematic view of a light emitting device according to a second modification.
- the light emitting device 201 includes the substrate 203, the LED 205 emitting blue light, two types of wavelength conversion members, the yellow wavelength conversion member 207Y and the red wavelength conversion member 207R, and the inner surface is the reflection surface 209a.
- a reflector 209 and a diffusion plate 211 are provided.
- the second embodiment differs from the first embodiment in that the red wavelength conversion member 207R is provided in addition to the yellow wavelength conversion member 207Y.
- the color temperature can be adjusted by adjusting the surface state of the wavelength conversion member for red.
- the color temperature is used as a concept included in the chromaticity.
- FIG. 27 is a diagram showing the relationship between the surface state of the red wavelength conversion member and the chromaticity.
- the surface of the wavelength conversion member for red 207R should be brought closer to a mirror surface, and conversely, when the color temperature is to be lowered, the surface of the wavelength conversion member for red 207R is roughened. Just do it.
- ceramic YAG
- other materials can also be used as the main material.
- a resin such as epoxy, silicone, fluorine or the like, or a glass material can be used. However, these materials need to be light transmitting materials.
- the phosphor material contains a group of constituent elements including at least one element selected from Mg, Ca, Sr, Ba, Y, La, Gd, Tb, and Lu, although one in which a part of the constituent element group is substituted by Ce 3+ is used, another phosphor material may be used.
- the configuration is a phosphor material that converts blue light into yellow light as the phosphor material
- one containing an element group is used, in the case of LEDs of other light emission colors or light emitting devices that output other light colors, it goes without saying that other phosphor materials can be used.
- the light characteristics are adjusted by changing the surface condition of a part of the wavelength conversion member. That is, the light characteristics are adjusted by making the surface state of a part of the wavelength conversion member different from the surface state of the other part excluding the part.
- the adjustment of the light characteristics can also be performed by changing the surface state of the entire surface of the wavelength conversion member.
- the light emitting device according to the second embodiment when the intensity of blue light emitted from the LED is weak, the light output from the light emitting device is yellowed by bringing the entire surface of the wavelength conversion member close to mirror finish. It can be shifted to the side and the desired light characteristics can be obtained.
- the surface whose surface state is changed is the outer surface of the wavelength conversion member (which is the “light emitting surface” of the present invention), that is, the surface facing the light emitting element (LED)
- the surface opposite to the surface may be the inner surface, and the surface on which the surface state is changed may be both the inner and outer surfaces. But it is good. At this time, all the surface states of the inner and outer surfaces may be changed, or part of the surface states may be changed.
- the surface of the wavelength conversion member (the outer surface and / or the inner surface) was buff polished (buff polished) or W / E finished (W / E finished), but it is a surface by other methods. You may change the state. As another method, dimple processing (for example, laser processing) can be used.
- dimple processing for example, laser processing
- the light emitting device configured by two LEDs has been described, it is needless to say that the light emitting device may be provided with light emitting elements other than those described in the embodiments.
- LEDs are arranged in a row, but naturally, they may be arranged in another shape, and in the following, sixteen LEDs are arranged in four rows and four columns.
- a light emitting device disposed in a positive matrix of the above will be described as a third modification. Needless to say, other shapes may be arranged.
- FIG. 28 is a view for explaining the light emitting device according to the third modification, wherein (a) is a plan view with the wavelength converting member removed from the light emitting device, and (b) is a plan view of the light emitting device mounted with the wavelength converting member It is a figure and (c) is a figure showing the surface state of a wavelength conversion member.
- the light emitting device 301 is mounted on the substrate 303 in a state where sixteen LEDs are arranged in a positive matrix, as shown in FIG.
- the sign of the LED is indicated by Anm (n and m are natural numbers), n indicates a row, and m indicates a column.
- Anm n and m are natural numbers
- n indicates a row
- m indicates a column.
- LED-A23 is 2 Point the LED located in the third column of the line.
- the wavelength conversion member 305 has an area larger than the mounting area
- the wavelength conversion member 305 is disposed above the LED-Anm as in the eleventh embodiment described with reference to FIGS. 2 and 3.
- the surface condition of each of the central region 305A of the wavelength conversion member 305, the intermediate region 305B located on the outer periphery of the central region 305A, and the peripheral region 305C located on the outer periphery of the intermediate region 305B are different from each other. .
- the central area 305A is an area located above the four LEDs-A22, A23, A32 and A33 located at the central part of the 4 rows and 4 columns matrix
- the intermediate area 305B is 4 rows and 4 columns It is an area located above 12 LED-A11, A12, A13, A14, A21, A24, A31, A34, A42, A43, A44 located on the periphery of the matrix
- the peripheral area 305C is an LED -It is a region located above the portion where Anm is not disposed.
- the roughness gradually or stepwise decreases as it moves from the central region 305A to the peripheral region 305C.
- the central region 305A is W / E-finished (cross hatched portion) after # 220 buffing and the middle region 305B is # 220 buff-polished (upper right hatching), and the periphery is
- the area 305C is a mirror-finished one (hatched downward to the right).
- the portion where the optical path length of the light emitted from the LED-A nm is long is finished close to the mirror surface, and the portion where the optical path length is short is rough (# 220 buffing finish) It is finished in the state. 4.
- the characteristic part has been described individually, but the configuration described in each embodiment and each modification is the same as the configuration of another embodiment or another modification. You may combine them. 5.
- the light emitting device includes a light emitting element and a wavelength conversion member, and changes the surface state of part or all of the surface (outside surface and / or inside surface) of the wavelength conversion member, It has been described that adjustment of chromaticity (including color temperature) and further reduction of color unevenness can be achieved.
- a light emitting device which uses a plurality of light emitting elements of different luminescent colors and mixes light of light emitted from each light emitting element by a diffusion plate and outputs the mixed light.
- problems such as uneven color and desired light color can not be obtained on the surface of the diffusion plate which is the light emitting surface of the device.
- FIG. 29 is a schematic view of a light emitting device according to a reference example.
- the light emitting device 501 includes a substrate 503, two or more light emitting elements (LEDs) 505 having different emission colors, a reflector 507 for reflecting light from the light emitting element 505 in a predetermined direction, and a light emitting element And a diffuser plate 509 for mixing the light from the light source 505 and the reflected light.
- LEDs light emitting elements
- the light emitting element 505 includes three light emitting elements having different emission colors. Specifically, three light emitting elements 505R for emitting red light, light emitting elements 505G for emitting green light, and light emitting elements 505B for emitting blue light It is.
- the color characteristics can be improved by making the surface state of a part of the diffusion plate 509 different from the surface state of the other part. Specifically, for example, when the ratio of blue light in the light output from the light emitting device 501 is small, the surface portion of the diffusion plate 509 located above the light emitting element 505B for blue light is brought closer to a mirror state. The amount of light transmission can be increased to bring it closer to the desired light color as a whole.
- the adjustment method of the light color etc. in this case has a plurality of light emission light sources emitting light of a predetermined wavelength, and the light emitted from the plurality of light emission light sources is diffused by the diffusion member and emitted from the diffusion member It is a light characteristic adjustment method of adjusting the characteristic of the light which combines the light of a plurality of wavelengths, and the adjustment of the light characteristic is the surface state of at least one part of the light incidence surface and the light emission surface in the diffusion member.
- the manufacturing method of the light emitting device includes: a plurality of light emitting light sources emitting light of a predetermined wavelength; and a diffusion member diffusing the plurality of lights emitted from the light emitting light source; A method of manufacturing a light emitting device which combines the lights of the above and outputs the light of light characteristics within a predetermined range, wherein the combined light obtained by combining a plurality of lights emitted from the diffusion member is a light characteristic within the predetermined range And adjusting the surface condition of at least a part of the light incident surface and the light exit surface of the diffusion member when the combined light is not within the light characteristics within the predetermined range. And is included.
- the present invention can be used to adjust the light emission color to be within a desired range while eliminating color unevenness in the light output from the light emitting device.
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Abstract
Description
1.構成
図1は、第1の実施の形態に係る発光装置の平面図であり、図2は、第1の実施の形態に係る発光装置の正面図である。両図とも、内部の様子が分かるように一部を断面図で示している。
2.製造方法
上記の発光装置1は、基板3にLED5を実装する実装工程、基板3に装着枠9を装着する装着工程、装着枠9に波長変換部材7を取着する取着工程、LED5を発光させて波長変換部材7から出射される光(LED5から発せられた光と波長変換された光)の合成光の光特性(例えば光色)を測定する測定工程、測定した光特性が所定範囲外にあるときに、波長変換部材7の表面(7a)の状態(以下、端に、「表面状態」ともいう。)を調整する調整工程を経て製造される。
3.実施例
LED5は、InGaN(MQW構造)の発光層を有するもので、青色光を出射する。平面視における底面の一辺が約1(mm)で、隣接するLED5間の距離は、100(μm)である。
4.波長変換部材の表面状態について
一般に波長変換部材を研磨したり、W/E仕上げしたりすると、波長変換部材が薄くなってLEDから発せられた光の透過率が高まり、その結果、発光装置から発せられた光は青色側にのみ色度がシフトすると考えられていたが、発明者らは、種々検討を重ねた結果、波長変換部材の表面状態によって、色度のシフトの仕方が異なることを見出したのである。以下、表面状態と光特性の変化について説明する。
(1)波長変換部材の仕上げ面状態
(1−1)実験
波長変換部材の表面状態と発光装置から出力される光の光特性(光色)との関係について実験を行った。
(1−2)具体例
以上の実験結果から、波長変換部材(7,57)の表面状態を変えることにより、発光装置(1,51)から出力される光の光特性を変更できる(調整できる)ことが分かる。
(2)波長変換部材の表面形状
波長変換部材7の表面形状と発光装置から出力される光の光特性との関係についての実験を行った。
<第2の実施の形態>
第1の実施の形態では、4つのLED5A,5B,5C,5Dを備える発光装置1について説明したが、1つのLEDを用いた発光装置の場合であっても、発光装置の光出力面に色むらが生じたり、使用するLEDによっては所望の光色が得られなかったりする等の課題は生じる。
<変形例>
以上、本発明を実施の形態等に基づいて説明したが、本発明の内容が、上記の実施の形態等に示された具体例に限定されないことは勿論であり、例えば、以下のような変形例を実施することができる。
1.発光光源
実施の形態等では、発光光源にLEDに代表される発光素子を用いたが、例えば、低圧水銀ランプであって、そのガラス管内面に蛍光体材料が塗布されていないランプを光源として利用することもできる。さらに、高圧ランプや電球等を光源としても利用することもできる。
2.発光素子
(1)種類
実施の形態等では、発光素子に半導体発光素子であるLEDを用いたが、他の半導体発光素子を用いても良い。具体的には、レーザーダイオード(LD)である。
(2)電極
実施の形態等では、片面両電極型のLEDを用いたが、当然、両面電極型のLEDであっても良い。このような場合、例えば、上面の電極は、ワイヤ等を利用して、基板上の配線パターンと接続される。
(3)発光層
実施の形態等では、例えば、青色光を発する発光層を有するLEDとしてInGaN系の素子を用いたが、当然、他の発光層のLEDであっても良い。
(4)数
第1の実施の形態では4つのLEDを用いて発光装置を構成し、第2及び第3の実施の形態では1つのLEDを用いて発光装置を構成した。しかしながら、発光素子(LED)の数は、1つでも良いし、2つ以上の複数個であっても良い。なお、LEDの数についての変形例を後述の発光装置の欄で説明する。
3.波長変換部材
(1)数
第1及び第2の実施の形態における発光装置1,57は、1つの波長変換部材7,57を備えていたが、複数の波長変換部材を備えた発光装置であっても良い。
(2)主材料
実施の形態では、波長変換部材の主材料としてセラミック(YAG)を利用したが、当然、他の材料を主材料として利用することもできる。他の材料としては、例えば、エポキシ、シリコーン、フッ素等の樹脂や、ガラス材料を利用することができる。但し、これらの材料は透光性材料である必要がある。
(3)蛍光体材料
実施の形態等では、蛍光体材料としてMg、Ca、Sr、Ba、Y、La、Gd、Tb、Luから選ばれる少なくとも一つの元素を含んでなる構成元素群を含み、前記構成元素群の一部がCe3+で置換されているものを利用したが、他の蛍光体材料であっても良い。
(4)面状態
実施の形態等では、波長変換部材の一部の面状態を変化させることで光特性を調整している。つまり、波長変換部材の一部の面状態と、当該一部を除く他の部分の面状態とを異なるようにすることで、光特性を調整している。
3.発光装置
(1)発光素子の数
第1の実施の形態では、例えば、図1~3及び図20に示すように、4つのLEDで構成した発光装置について、第2の実施の形態では、1つのLEDで構成した発光装置について、それぞれ説明したが、当然、実施の形態で説明した以外の個数の発光素子を備える発光装置でも良い。
(2)発光素子の配置
第1の実施の形態では、4つのLEDを列状に配置していたが、当然、他の形状に配置しても良く、以下、16つのLEDを4行4列の正マトリクス状に配した発光装置を変形例3として説明する。なお、言うまでもなく、他の形状に配置しても良い。
4.最後に
各実施の形態及び各変形例では、それぞれ個別に特徴部分について説明したが、各実施の形態及び各変形例での説明した構成を、他の実施の形態や他の変形例の構成と組み合わせても良い。
5.その他
実施の形態及び変形例等の発光装置は、発光素子と波長変換部材とを備え、波長変換部材の表面(外表面及び/又は内表面)の一部又は全部の表面状態を変えることにより、色度(色温度を含む。)の調整、さらには、色むらの低減を図ることができることを説明した。
3 基板
5 LED(発光素子)
7 波長変換部材
Claims (9)
- 発光光源と、当該発光光源から発せられた光の少なくとも一部の波長を1つ以上の別の波長に変換する波長変換体とを備え、前記波長変換部材から出射される2つ以上の波長の光の合成色を出力光として出力する発光装置において、
前記波長変換部材における光入射面と光出射面との少なくとも一部の面状態が前記発光光源から発せられる光の強度に応じて調整されている
ことを特徴とする発光装置。 - 発光光源と、当該発光光源から発せられた光の少なくとも一部の波長を1つ以上の別の波長に変換する波長変換体とを備え、前記波長変換部材から出射される2つ以上の波長の光の合成色を出力光として出力する発光装置において、
前記波長変換部材における光入射面と光出射面との少なくとも一部の面状態が、前記一部を除く他の部分の面状態と異なる
ことを特徴とする発光装置。 - 前記面状態は、面の粗さである
ことを特徴とする請求項1又は2に記載の発光装置。 - 前記波長変換部材の光入射面と光出射面は、凹凸形状を有し、
前記面状態は、前記凹凸の深さ及び/又はピッチである
ことを特徴とする請求項1又は2に記載の発光装置。 - 前記発光光源は、複数の発光素子であり、
前記複数の発光素子は、基板の主面に実装され、
前記波長変換部材における光入射面と光出射面との少なくとも一方の面において、当該面の中心部から端部に移るに従って、前記面状態が漸次異なる
ことを特徴とする請求項1又は2に記載の発光装置。 - 前記波長変換部材は、透光性部材に蛍光体材料を含有している
ことを特徴とする請求項1又は2に記載の発光装置。 - 前記波長変換部材は、透光性部材に蛍光体材料を含有し、
前記透光性部材は、セラミックス材料からなる
ことを特徴とする請求項1に記載の発光装置。 - 発光光源から発せられた光の少なくとも一部を波長変換部材により1つ以上の波長に変換して、前記波長変換部材から出射される2つ以上の波長の光を合成してなる光の特性を調整する光特性調整方法であって、
前記光の特性の調整は、前記波長変換部材における光入射面と光出射面との少なくとも一部の面状態を変えることで行う
ことを特徴とする光特性調整方法。 - 発光光源と、当該発光光源から発せられた光の少なくとも一部の波長を1つ以上の別の波長に変換する波長変換体とを備え、前記波長変換部材から出射される少なくとも2つ以上の波長の光を合成して所定範囲内の光色の光として出力する発光装置の製造方法であって、
前記波長変換部材から出射される少なくとも2つ以上の波長の光を合成した合成光が所定範囲内の光特性であるか否かの測定を行う測定工程と、
合成光が前記所定範囲内の光特性にない場合に、前記波長変換部材における光入射面と光出射面との少なくとも一部の面状態を調整する調整工程と
を含むことを特徴とする発光装置の製造方法。
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JP2011509355A JPWO2010119934A1 (ja) | 2009-04-14 | 2010-04-09 | 発光装置、光特性調整方法及び発光装置の製造方法 |
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DE102011080179A1 (de) * | 2011-08-01 | 2013-02-07 | Osram Ag | Wellenlängenkonversionskörper und Verfahren zu dessen Herstellung |
TWI484610B (zh) | 2012-07-09 | 2015-05-11 | 矽品精密工業股份有限公司 | 半導體結構之製法與導電凸塊 |
CN103236483A (zh) * | 2013-03-15 | 2013-08-07 | 达亮电子(苏州)有限公司 | 发光二极管封装结构及封装方法 |
EP2803715B1 (en) * | 2013-05-16 | 2020-02-26 | LG Innotek Co., Ltd. | Phosphor and light emitting device package including the same |
JP6258619B2 (ja) | 2013-07-18 | 2018-01-10 | シチズン電子株式会社 | 照明装置 |
JP2015220330A (ja) * | 2014-05-16 | 2015-12-07 | 日本電気硝子株式会社 | 発光デバイス及びその製造方法 |
DE102016105988A1 (de) * | 2016-04-01 | 2017-10-05 | Osram Opto Semiconductors Gmbh | Konverter zur teilweisen Konversion einer Primärstrahlung und lichtemittierendes Bauelement |
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JP3399440B2 (ja) | 1999-04-26 | 2003-04-21 | 松下電器産業株式会社 | 複合発光素子と発光装置及びその製造方法 |
JP4045710B2 (ja) | 1999-12-16 | 2008-02-13 | 松下電器産業株式会社 | 半導体発光装置の製造方法 |
KR100712715B1 (ko) * | 2001-01-31 | 2007-05-04 | 도시바세라믹스가부시키가이샤 | 표면에 미세한 돌기를 형성시킨 세라믹스부재 및 그제조방법 |
JP4197109B2 (ja) | 2002-08-06 | 2008-12-17 | 静雄 藤田 | 照明装置 |
JP4292794B2 (ja) | 2002-12-04 | 2009-07-08 | 日亜化学工業株式会社 | 発光装置、発光装置の製造方法および発光装置の色度調整方法 |
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US7250715B2 (en) * | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
JP4020092B2 (ja) * | 2004-03-16 | 2007-12-12 | 住友電気工業株式会社 | 半導体発光装置 |
CN101032035A (zh) | 2004-09-28 | 2007-09-05 | 皇家飞利浦电子股份有限公司 | 具有改进转化层的发光器件 |
US7462502B2 (en) * | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
JP2006156187A (ja) | 2004-11-30 | 2006-06-15 | Mitsubishi Electric Corp | Led光源装置及びled電球 |
JP4739805B2 (ja) | 2005-04-22 | 2011-08-03 | スタンレー電気株式会社 | 光学特性制御ledデバイス及びその製造方法 |
RU2413335C2 (ru) * | 2005-05-25 | 2011-02-27 | Конинклейке Филипс Электроникс Н.В. | Электролюминесцентное устройство |
JP2007095807A (ja) | 2005-09-27 | 2007-04-12 | Sanyo Electric Co Ltd | 発光装置及びその製造方法 |
JP2007173397A (ja) | 2005-12-20 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 発光モジュールとこれを用いた表示装置及び照明装置 |
TWI433346B (zh) * | 2006-06-22 | 2014-04-01 | Ube Industries | A light conversion device, a light-emitting device and a color control method using the same |
DE102008021436A1 (de) * | 2008-04-29 | 2010-05-20 | Schott Ag | Optik-Konverter-System für (W)LEDs |
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WO2010119934A1 (ja) | 2010-10-21 |
US8648372B2 (en) | 2014-02-11 |
TW201044636A (en) | 2010-12-16 |
TWI497760B (zh) | 2015-08-21 |
US20120037940A1 (en) | 2012-02-16 |
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