WO2010114307A2 - 내장형 안테나 모듈 - Google Patents
내장형 안테나 모듈 Download PDFInfo
- Publication number
- WO2010114307A2 WO2010114307A2 PCT/KR2010/001979 KR2010001979W WO2010114307A2 WO 2010114307 A2 WO2010114307 A2 WO 2010114307A2 KR 2010001979 W KR2010001979 W KR 2010001979W WO 2010114307 A2 WO2010114307 A2 WO 2010114307A2
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- WIPO (PCT)
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- signal
- radiator pattern
- frequency band
- pattern
- conductive pad
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0025—Modular arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
- H01Q9/27—Spiral antennas
Definitions
- the present invention relates to a built-in antenna module, and more particularly to a built-in antenna module embedded in the terminal.
- the antenna receiving FM since the antenna receiving FM has to resonate in the low frequency band of about 87.5 ⁇ 108MHz, the radiation line of the antenna has to be formed long, and the physical size of the antenna has to be increased. Therefore, in recent years, it has not been easy to implement a miniaturized built-in antenna suitable for a miniaturized and slimmed mobile communication terminal (the antenna's physical size becomes larger as the frequency to be used is low, that is, the wavelength is longer).
- the low frequency band built-in antenna module that can be applied to a mobile communication terminal to achieve a miniaturization and slimming of the terminal and to receive FM radio with a high level of signal strength inception (RSSI). It is a required situation.
- RSSI signal strength inception
- the mobile communication terminal is equipped with a separate Bluetooth antenna for receiving a signal of the Bluetooth frequency band for communication with the Bluetooth device. Then, since the internal antenna module and the Bluetooth antenna module for the low frequency band must be installed respectively, there is a problem that miniaturization and slimming of a mobile communication terminal which is a recent trend.
- the present invention has been proposed in view of the above-mentioned conventional problems, and an object thereof is to provide a built-in antenna module capable of receiving an FM frequency and a Bluetooth frequency so as to be miniaturized and slimmed in a terminal. .
- a built-in antenna module a chip antenna of the polyhedron formed with the first radiator pattern and the coupling pattern; A flexible circuit board having a first conductive pad connected to the first radiator pattern, a second conductive pad connected to the coupling pattern of the chip antenna, and a second radiator pattern connected to the first radiator pattern; And a second conductive pad formed between the second conductive pad and the ground to block a signal of one frequency band from the signal of the first frequency band and the signal of the second frequency band received through the chip antenna and the flexible circuit board from being passed to the ground. It includes a signal switching unit.
- the second radiator pattern is formed in the form of meander lines.
- the signal switching unit blocks the passage of the signal of the second frequency band to the ground and transmits the signal of the second frequency band to the Bluetooth signal processing module.
- the reception switching unit is configured of an inductor which blocks a signal of the Bluetooth frequency band from being passed to ground.
- the signal of the second frequency band is a signal of the Bluetooth frequency band.
- the signal of the first frequency band is a signal of the FM frequency band.
- a filter unit for removing high frequency components from the signal of the first frequency band.
- the filter unit further includes a low noise amplifier configured to amplify the received signal from which the high frequency component has been removed.
- a matching capacitor formed between the second conductive pad and the second radiator pattern to correct an impedance difference between circuits mounted on the substrate on which the second conductive pad and the flexible circuit board are mounted.
- a matching inductor formed on the second conductive pad and correcting an impedance difference between the circuit mounted on the substrate on which the second conductive pad and the flexible circuit board are mounted.
- a built-in antenna module includes a chip antenna of a polyhedron formed with a first radiator pattern and a coupling pattern; A flexible circuit board having a first conductive pad connected to the first radiator pattern, a second conductive pad connected to the coupling pattern of the chip antenna, and a second radiator pattern connected to the first radiator pattern; And a signal branching unit branching the signal of the first frequency band and the signal of the second frequency band received through the chip antenna and the flexible circuit board.
- the signal branching unit branches the signal of the first frequency band to the FM signal processing module, and branches the signal of the second frequency band to the Bluetooth signal processing module.
- the signal of the first frequency band is a signal of the FM frequency band
- the signal of the second frequency band is a signal of the Bluetooth frequency band.
- the signal branching unit is composed of a diplexer for branching a signal in the FM band to the FM signal processing module and branching a signal in the Bluetooth frequency band to the Bluetooth signal processing module.
- a built-in antenna module includes a chip antenna of a polyhedron formed with a first radiator pattern and a coupling pattern; A flexible circuit board having a first conductive pad connected to the first radiator pattern, a second conductive pad connected to the coupling pattern of the chip antenna, and a second radiator pattern connected to the first radiator pattern; And a third radiator pattern formed on the flexible circuit board adjacent to the second radiator pattern.
- the third radiator pattern is electrically connected to the Bluetooth signal processing module.
- a fourth radiator pattern adjacent to the third radiator pattern is further formed on the flexible circuit board, and the fourth radiator pattern is electrically connected to the GPS signal processing module.
- the third radiator pattern is electrically connected to the GPS signal processing module.
- a fourth radiator pattern adjacent to the third radiator pattern is further formed on the flexible circuit board, and the fourth radiator pattern is electrically connected to the Bluetooth signal processing module.
- a built-in antenna module includes a chip antenna of a polyhedron block on which a first radiator pattern and a coupling pattern are formed; And a flexible printed circuit board having a first conductive pad connected to the first radiator pattern, a second conductive pad connected to the coupling pattern of the chip antenna, and a second radiator pattern connected to the first radiator pattern.
- the conductive pad is electrically connected to the FM signal processing module and the Bluetooth signal processing module, and transmits a received signal received through the chip antenna and the flexible circuit board to the FM signal processing module and the Bluetooth signal processing module.
- the apparatus may further include a filter unit to remove high frequency components of the received signal transmitted to the FM signal processing module.
- the filter unit further includes a low noise amplifier configured to amplify the received signal from which the high frequency component has been removed.
- a built-in antenna module includes a chip antenna of a polyhedron formed with a first radiator pattern and a coupling pattern;
- a flexible circuit board including a first conductive pad connected to a first radiator pattern, a second conductive pad connected to a coupling pattern of a chip antenna, and a second radiator pattern adjacent to the second conductive pad.
- the substrate is formed between the second radiator pattern and the first radiator pattern switching element for blocking any one of the first frequency band signal and the second frequency band signal received through the second radiator pattern to pass through the first radiator pattern It is further provided.
- the switching device cuts off the second frequency band signal received through the second radiator pattern and transmits the signal to the Bluetooth signal processing module.
- the second frequency band signal is a signal of the Bluetooth frequency band.
- the switching element is composed of an inductor which blocks the signal of the Bluetooth frequency band from passing through the first radiator pattern.
- the built-in antenna module according to the present invention simultaneously receives the FM frequency and the Bluetooth frequency, it does not need a separate antenna for Bluetooth, and thus can be applied to a mobile communication terminal, thereby miniaturizing and slimming the terminal.
- the built-in antenna module according to the present invention is capable of receiving FM radio with a high level of signal strength (RSSI).
- RSSI signal strength
- the built-in antenna module according to the present invention when the built-in antenna module according to the present invention is mounted on the main printed circuit board, the burden on space is reduced, so that the space utilization can be increased and the degree of freedom for the component installation structure inside the terminal can be improved.
- the built-in antenna module according to the present invention does not need any additional means such as earphones for FM radio reception, the configuration is simplified. Accordingly, in the case of a Bluetooth mobile communication terminal, even if a wireless earphone is used, it is possible to maintain a constant reception quality without degrading a different FM radio broadcast reception rate.
- FIG. 1 is a perspective view illustrating a chip antenna applied to a built-in antenna module according to an embodiment of the present invention.
- FIG. 2 is an exploded view for explaining the structure of the radiator pattern and coupling pattern of the chip antenna shown in FIG.
- 3A to 3C are plan views illustrating the structure of a flexible circuit board connected to the chip antenna of FIG.
- FIG. 4 is a plan view illustrating a state in which the chip antenna of FIG. 1 is mounted on the flexible circuit board of FIGS. 3A to 3C.
- FIG. 5 is a view for explaining the built-in antenna module according to the first embodiment of the present invention.
- 6 and 7 illustrate the signal switching unit of FIG. 5.
- FIG. 8 to 10 are views for explaining the filter unit and the low noise amplifier of FIG.
- FIG. 11 is a diagram showing a frequency band of the built-in antenna module according to the first embodiment of the present invention.
- FIG. 12 is a view for explaining a built-in antenna module according to a second embodiment of the present invention.
- FIG. 13 is a view for explaining the built-in antenna module according to a third embodiment of the present invention.
- FIG. 14 is a view for explaining the built-in antenna module according to a fourth embodiment of the present invention.
- 15A to 15C are plan views illustrating the structure of a flexible circuit board electrically connected to the chip antenna of FIG.
- FIG. 16 is a plan view illustrating a state in which the chip antenna of FIG. 1 is mounted on the flexible circuit board of FIGS. 15A to 15C.
- 17 and 18 are diagrams for describing the signal switching unit of FIG. 16.
- 19 to 21 are views for explaining the filter unit and the low noise amplifier of FIG.
- 22 is a diagram showing a frequency band of the built-in antenna module according to the fourth embodiment of the present invention.
- 23 and 24 are views for explaining the internal antenna module according to the fifth embodiment of the present invention.
- 25 and 26 are views for explaining the internal antenna module according to a modification of the fifth embodiment of the present invention.
- 27 and 28 illustrate a built-in antenna module according to a sixth embodiment of the present invention.
- 29 and 30 are views for explaining the built-in antenna module according to a modification of the sixth embodiment of the present invention.
- 31 and 32 illustrate a built-in antenna module according to a seventh embodiment of the present invention.
- 33 is a diagram showing a frequency band of the built-in antenna module according to the seventh embodiment of the present invention.
- FIG. 1 is a perspective view illustrating a chip antenna applied to a built-in antenna module according to an exemplary embodiment of the present invention
- FIG. 2 is an exploded view for explaining the structure of a radiator pattern and a coupling pattern of the chip antenna illustrated in FIG. 1. .
- the chip antenna 100 is a polyhedron block 110 of the magnetic material, a couple formed by being spaced apart from the first radiator pattern 120 and the first radiator pattern 120 formed in a winding form along the outer surface of the polyhedral block 110.
- the ring pattern 125 is provided.
- the polyhedron block 110 may be composed of a magnetic material of a magnetic body.
- Magnetic material Magnetic-dielectric refers to a material that can be magnetic, and there are iron oxide, chromium oxide, cobalt, ferrite and the like.
- Equation 1 is an equation indicating that the bandwidth (BW) of the antenna increases as the ratio between the permeability and the dielectric constant increases when the antenna size does not change.
- ⁇ 0 is the wavelength
- ⁇ r is the permeability
- ⁇ r is the dielectric constant
- t is the thickness of the antenna.
- the permeability of the high dielectric constant applied to the antenna is less than the permittivity.
- a magnetic material having a permeability greater than the permittivity the magnetic permeability applied in the embodiment of the present invention is about 18 and the permittivity is about 10
- a dielectric having a high dielectric constant at the same antenna size is used based on Equation 1. It is possible to implement a wider bandwidth than when.
- the antenna for the low frequency band is implemented using a high dielectric constant dielectric block for miniaturization, the narrowing of the bandwidth is overcome by using the low dielectric constant and permeability of the magnetic material, thereby minimizing the antenna while maintaining the bandwidth.
- the polyhedral block 110 to be applied to the present invention has a different permeability and permittivity, it is a matter of course that can be selected according to the resonance frequency to be implemented.
- the size and shape of the polyhedron block 110 may vary depending on the frequency band to be implemented.
- the conductor pattern formed on the polyhedron block 110 is referred to as a first radiator pattern 120, and in the embodiment of the present invention described below, the conductor pattern formed on the flexible circuit board 200 is a second radiator pattern. Called 230.
- the first radiator pattern I 1 to I k formed on one side 110a of the polyhedral block 110 may include the first radiator I 1 to I k formed on the bottom surface 110b of the polyhedral block 110. It is connected with the pattern 120, respectively.
- the first radiator pattern 120 is formed in a winding form along the outer surface of the polyhedral block 110 starting from one side of the bottom surface 110b of the polyhedral block 110.
- the radiation line of is formed.
- the length and line width of the first radiator pattern 120 and the distance between the first radiator patterns 120 may vary depending on the resonance frequency to be implemented.
- the coupling pattern 125 is formed on the lower surface 110b of the polyhedral block 110 independently of the first radiator pattern 120 by a predetermined distance.
- the coupling pattern 125 couples the flow of current flowing into the first radiator pattern 120 to widen the bandwidth of the antenna.
- one coupling pattern 125 is formed on the bottom surface 110b of the polyhedral block 110 to resonate in the FM radio frequency band (87.5 ⁇ 108MHz). Only one coupling pattern 125 is illustrated in FIG. 2, but is not limited thereto.
- the number of coupling patterns 125 causing coupling may vary depending on the frequency band and bandwidth to be implemented, and the resonance frequency and bandwidth to be implemented may be adjusted by increasing or decreasing the number of coupling patterns 125.
- FIG. 3A to 3C are plan views illustrating a structure of a flexible circuit board electrically connected to the chip antenna of FIG. 1, and FIG. 4 shows the chip antenna of FIG. It is a top view for demonstrating the state mounted on the flexible printed circuit board shown in c).
- the chip antenna 100 is mounted on any one surface of the flexible circuit board 200 (eg, the upper surface of the flexible circuit board 200).
- the flexible printed circuit board 200 includes a first conductive pad 210, a second conductive pad 220, and a second radiator pattern 230.
- the second conductive pad 220 is used as a ground pad.
- the second conductive pads 220 are soldered and electrically connected to the coupling pattern 125 formed on the bottom surface 110b of the polyhedral block 110.
- the second radiator pattern 230 is soldered and electrically connected to the first radiator pattern 120 (I k + 1 ) formed at the other end of the lower surface 110b of the polyhedral block 110. To this end, the second radiator pattern 230 extends to a connection part connected to the first radiator pattern 120 (I k + 1 ) and the connection part outside of the region where the polyhedral block 110 is mounted on the flexible circuit board 200. It has a radiating portion formed in. Here, the connection portion and the radiating portion may be divided based on the bent portion 235 shown in FIG. 3.
- the portion of the second radiator pattern 230 soldered to the first radiator pattern 120 (I k + 1 ) based on the bent portion 235 corresponds to the connection portion, and the connection portion extends to the flexible portion of the flexible circuit board 200.
- a portion formed outside the region where the polyhedral block 110 is mounted corresponds to the radiating portion. This also applies to the drawings described below.
- the second radiator pattern 230 When the second radiator pattern 230 is electrically connected to the first radiator pattern 120 (I k + 1 ) formed at the other end of the lower surface 110b of the polyhedral block 110, the first radiator pattern 120 and the flexible circuit board
- the second radiator pattern 230 formed at 200 forms one radiation line (see FIG. 4).
- FIG. 5 is a view for explaining the internal antenna module according to the first embodiment of the present invention.
- 6 and 7 illustrate the signal switching unit of FIG. 5
- FIGS. 8 through 10 illustrate the filter unit and the low noise amplifier of FIG. 5.
- the chip antenna and the flexible circuit board of the embedded antenna module according to the first embodiment of the present invention are the same as the chip antenna and the flexible circuit board described above with reference to FIGS. 1 to 4, the description thereof is omitted, and the same reference numerals are added. Let's do it.
- the FM signal processing module and the Bluetooth signal processing module are technical matters that can be easily implemented by those skilled in the art using well-known technology, further detailed description will be omitted.
- the embedded antenna module includes a chip antenna 100, a flexible circuit board 200, a signal switching unit 300, a filter unit 400, and a low noise amplifier 500.
- the signal switching unit 300 has one side connected to the second conductive pad 220 and the other side connected to the GND (ground). That is, one side of the signal switching unit 300 is electrically connected to the second conductive pad 220 of the flexible printed circuit board 200 by soldering, and the other side of the signal switching unit 300 is electrically connected to the GND (ground).
- the signal switching unit 300 is composed of an inductor that passes the received signal of the FM frequency band, and blocks the received signal of the Bluetooth band. When the passing frequency increases, the impedance rises to operate as a low pass filter, and when the passing frequency falls, the impedance falls to operate as a high pass filter. This is to separate the received signal of.
- the inductor composed of the signal switching unit 300 is about 22nH to pass the received signal in the FM frequency band (about 87.5 ⁇ 108MHz), and to block the received signal in the Bluetooth band (about 2.45GHz) is used. do.
- the signal switching unit 300 cuts off the connection with the GND (ground) based on the frequency of the received signal received through the chip antenna 100 and the flexible circuit board 200. At this time, the signal switching unit 300 maintains the connection with the GND (ground) when the frequency of the received signal is low-frequency, and transmits the received signal to the Bluetooth signal processing module 700 when the frequency of the received signal is a high frequency. ) To disconnect. That is, when the signal switching unit 300 receives the received signal of the low frequency FM frequency band, it maintains the connection with the GND (ground) to serve as a line. When the signal switching unit 300 receives a reception signal of a high frequency Bluetooth frequency band, the signal switching unit 300 blocks the connection with the GND (ground) to block the transmission of the corresponding reception signal to the GND (ground).
- the signal switching unit 300 composed of an inductor of 22 nH is described in detail.
- the inductor When a signal received in a low frequency FM frequency band is received through the chip antenna 100 and the flexible circuit board 200, the inductor is connected to the connection part and the GND ( It maintains the connection status of the ground and acts as a line that passes the received signal to GND (ground).
- the second conductive pad 220 serves as a ground, and the built-in antenna module operates in the configuration as shown in FIG.
- the embedded antenna module operates as a monopole antenna by operating in a circuit configuration including no inductor and GND, as shown in FIG. That is, as shown in FIG. 7, the radiating portions of the second conductive pad 220 and the second radiating pattern 230 are separated by a predetermined distance to generate a coupling, and the radiating portion has a resonance of ⁇ / 4 in the Bluetooth frequency band. It acts as a track and acts as a Bluetooth antenna.
- the received signal of the Bluetooth frequency band blocked by the signal switching unit 300 is input to the Bluetooth signal processing module 700.
- the filter unit 400 is provided on the flexible circuit board 200, one side of which is electrically connected to the first radiator pattern 120 formed on the polyhedron block 110 through the first conductive pad 210, and the other side thereof. It is electrically connected to the low noise amplifier 500. Accordingly, the filter unit 400 removes high frequency components from the received signal received through the chip antenna 100 and the flexible circuit board 200.
- a transmission signal of a Bluetooth frequency band is periodically generated by the terminal and the Bluetooth device for communication between the terminal and the Bluetooth device. Therefore, the received signal of the FM frequency band may generate signal interference due to the transmission signal of the Bluetooth frequency band.
- the filter unit 400 removes high frequency components in order to prevent signal interference generated in the received signal due to the transmission signal of the Bluetooth frequency band.
- the low noise amplifier 500 is provided on the flexible circuit board 200 and is electrically connected to the filter unit 400. Accordingly, the low noise amplifier 500 amplifies a received signal from which the high frequency component has been removed from the filter unit 400 (that is, a received signal of the FM frequency band from which signal interference due to a transmission signal of the Bluetooth frequency band has been removed). Signal strength (RSSI) enables FM radio reception.
- the low noise amplifier 500 is designed by grabbing the operating point and the matching point so that the received signal is low NF (Noise Index).
- the received signal amplified by the low noise amplifier 500 is generally input to the FM signal processing module 600.
- the low noise amplifier 500 applied to the present invention is a technical matter that can be easily implemented by those skilled in the art using a known technique, and thus detailed description thereof will be omitted.
- the filter unit 400 and the low noise amplifier 500 are provided in the flexible circuit board 200, separate regions on the same plane as the chip antenna 100 are illustrated in FIGS. 8 to 9.
- the chip antenna 100 may be provided on the other surface (the 'A' region of FIG. 10) opposite to one surface on the flexible printed circuit board 200 on which the chip antenna 100 is mounted.
- the filter unit 400 and the low noise amplifier 500 may be provided on different surfaces.
- the built-in antenna module according to the present invention is mounted on the main printed circuit board (not shown), the burden on space can be reduced and the space utilization can be increased, thereby improving the degree of freedom of the component installation structure inside the terminal. .
- FIG. 11 is a diagram illustrating a frequency band of an embedded antenna module according to a first embodiment of the present invention.
- FIG. 11 is a diagram illustrating a frequency of a received signal received from the first conductive pad 210 and the second conductive pad 220 and signal interference of the received signal when the built-in antenna module according to the first embodiment of the present invention is used. to be.
- "A” is the frequency of the received signal received from the first conductive pad 210
- "B” is the frequency of the received signal received through the second conductive pad 220
- “C” is a magnitude (ie, magnitude of signal interference) that the received signal received from the second conductive pad 220 passes to the first conductive pad 210.
- the resonant frequency band is formed at approximately 87.5 MHz to 108 MHz. That is, the radiation unit formed on the flexible circuit board 200 and the first radiator pattern 120 formed on the chip antenna 100 form one radiation line to form a low frequency band (ie, an FM frequency band (87.5 MHz to 108 MHz). Will receive the received signal.
- the resonant frequency band is formed at about 2.4 GHz. That is, the second conductive pad 220 is spaced apart from the radiating part to generate a coupling, and the radiating part serves as a resonant line of ⁇ / 4 in the Bluetooth band. Therefore, the built-in antenna module operates as a monopole antenna using coupling to receive a received signal having a frequency of the Bluetooth band.
- FIG. 12 is a view for explaining the built-in antenna module according to the second embodiment of the present invention.
- the chip antenna and the flexible circuit board of the embedded antenna module according to the second embodiment of the present invention are the same as the chip antenna and the flexible circuit board described with reference to FIGS. 1 to 4, the description thereof is omitted, and the same reference numerals are added. Let's do it.
- the FM signal processing module and the Bluetooth signal processing module are technical matters that can be easily implemented by those skilled in the art using well-known techniques, further detailed description will be omitted.
- the embedded antenna module includes a chip antenna 100, a flexible circuit board 200, a signal branch 800, and a low noise amplifier 500.
- the signal branch unit 800 includes a diplexer for branching the received signal based on the frequency of the received signal through the chip antenna 100 and the flexible circuit board 200.
- the diplexer includes a low pass filter (LPF) and a high pass filter (HPF), and branches the received signals of the low frequency and the high frequency into different paths based on the frequency of the received signal.
- the signal branch unit 800 branches the received signal based on the frequency of the received signal received through the chip antenna 100 and the flexible circuit board 200. That is, the signal branching unit 800 branches the received signal to the FM signal processing module 600 through the low noise amplifier 500 or branches to the Bluetooth signal processing module 700 based on the frequency of the received signal. .
- the signal branch unit 800 branches the received signal of the low frequency FM frequency band received through the chip antenna 100 and the flexible circuit board 200 to the FM signal processing module 600, and the high frequency Bluetooth frequency band. Branching the received signal to the Bluetooth signal processing module 700.
- the low noise amplifier 500 is provided on the flexible circuit board 200 and is electrically connected to the signal branch 800. Accordingly, the low noise amplifier 500 amplifies the low frequency received signal (that is, the received signal of the FM frequency band) branched from the signal branch 800 to enable FM radio reception at a high level of signal strength (RSSI). .
- the low noise amplifier 500 is designed by grabbing the operating point and the matching point so that the received signal is low NF (Noise Index).
- the received signal amplified by the low noise amplifier 500 is generally input to the FM signal processing module 600.
- the low noise amplifier 500 applied to the present invention is a technical matter that can be easily implemented by those skilled in the art using a known technique, and thus detailed description thereof will be omitted.
- FIG. 13 is a diagram for describing an embedded antenna module according to a third embodiment of the present invention.
- the chip antenna and the flexible circuit board of the embedded antenna module according to the third embodiment of the present invention are the same as the chip antenna and the flexible circuit board described above with reference to FIGS. 1 to 4, the description thereof is omitted, and the same reference numerals are added. Let's do it.
- the FM signal processing module and the Bluetooth signal processing module are technical matters that can be easily implemented by those skilled in the art using well-known techniques, further detailed description will be omitted.
- the built-in antenna module includes a chip antenna 100, a flexible circuit board 200, a filter unit 400, and a low noise amplifier 500.
- the first conductive pad 210 of the flexible circuit board 200 is electrically connected to the filter unit 400 and the Bluetooth signal processing module 700.
- the received signals received through the chip antenna 100 and the flexible circuit board 200 are simultaneously input to the filter unit 400 and the Bluetooth signal processing module 700.
- the filter unit 400 is provided on the flexible circuit board 200, one side of which is electrically connected to the first radiator pattern 120 formed on the polyhedron block 110 through the first conductive pad 210, and the other side thereof. It is electrically connected to the low noise amplifier 500. Accordingly, the filter unit 400 blocks the received signal corresponding to the Bluetooth frequency band from the received signal received through the chip antenna 100 and the flexible circuit board 200, and passes the received signal corresponding to the FM frequency band to low noise amplification. Input to the unit 500.
- the filter unit 400 removes the high frequency component in order to prevent signal interference generated in the received signal due to the transmission signal of the Bluetooth frequency band. Since this is the same as the filter unit 400 of the first embodiment described above, a detailed description thereof will be omitted.
- the low noise amplifier 500 is provided on the flexible circuit board 200 and is electrically connected to the filter unit 400. Accordingly, the low noise amplifier 500 receives a received signal from which the high frequency component is removed from the filter unit 400 (that is, a received signal of the FM frequency band from which signal interference from a transmission signal of the Bluetooth frequency band and a received signal of the Bluetooth frequency band have been removed). Amplification enables high frequency signal strength (RSSI) for FM radio reception.
- the low noise amplifier 500 is designed by grabbing the operating point and the matching point so that the received signal is low NF (Noise Index).
- the received signal amplified by the low noise amplifier 500 is generally input to the FM signal processing module 600.
- the low noise amplifier 500 applied to the present invention is a technical matter that can be easily implemented by those skilled in the art using a known technique, and thus detailed description thereof will be omitted.
- FIG. 14 is a view for explaining the internal antenna module according to the fourth embodiment of the present invention.
- 15A to 15C are plan views illustrating a structure of a flexible circuit board electrically connected to the chip antenna of FIG. 1, and FIG. 16 is a cross section of FIGS. It is a top view for demonstrating the state mounted on the flexible printed circuit board shown in c).
- 17 and 18 are views for explaining the signal switching unit of FIG. 16, and
- FIGS. 19 to 21 are views for explaining the filter unit and the low noise amplifier of FIG. 16.
- the chip antenna of the embedded antenna module according to the fourth embodiment of the present invention is the same as the chip antenna described above with reference to FIGS.
- the embedded antenna module includes a chip antenna 100, a flexible circuit board 200, a signal switching unit 300, a filter unit 400, and a low noise amplifier 500.
- the chip antenna 100 is mounted on any one surface of the flexible circuit board 200 (eg, the upper surface of the flexible circuit board 200).
- the flexible printed circuit board 200 includes a first conductive pad 210, a second conductive pad 220, a second radiator pattern 230, a matching capacitor 240, and a matching inductor 250. ) Is provided.
- the second conductive pad 220 is used as a ground pad.
- the second conductive pads 220 are soldered and electrically connected to the coupling pattern 125 formed on the bottom surface 110b of the polyhedral block 110.
- the second radiator pattern 230 is formed as a meander line having a predetermined shape (for example, "c" shape), and the first radiator pattern 120 formed at the other end of the lower surface 110b of the polyhedron block 110 (I k +). 1 ) soldered and electrically connected. To this end, the second radiator pattern 230 extends to a connection part connected to the first radiator pattern 120 (I k + 1 ) and the connection part outside of the region where the polyhedral block 110 is mounted on the flexible circuit board 200. It has a radiating portion formed in.
- the radiating part of the second radiator pattern 230 may be formed in a meander line shape, and the radiating part and the connecting part may be divided based on the bent part 235.
- the portion of the second radiator pattern 230 soldered to the first radiator pattern 120 (I k + 1 ) based on the bent portion 235 corresponds to the connection portion, and the connection portion extends to the flexible portion of the flexible circuit board 200.
- a portion formed outside the region in which the polyhedral block 110 is mounted corresponds to a radiator having a meander line shape. This also applies to the drawings described below. As such, by forming the second radiator pattern 230 as a meander line, it is possible to reduce the area of the flexible printed circuit board 200 and to miniaturize and slim the mobile communication terminal.
- the second radiator pattern 230 When the second radiator pattern 230 is electrically connected to the first radiator pattern 120 (I k + 1 ) formed at the other end of the lower surface 110b of the polyhedral block 110, the first radiator pattern 120 and the flexible circuit board
- the second radiator pattern 230 formed at 200 forms one radiation line (see FIG. 16).
- the matching capacitor 240 is formed between the second conductive pad 220 and the second radiator pattern 230 and is disposed between the circuit mounted on the substrate on which the second conductive pad 220 and the flexible circuit board 200 are mounted. Correct the impedance difference. That is, the matching capacitor 240 matches (ie, matches) the impedance between the mobile communication terminal in which the embedded antenna module is mounted and the embedded antenna module to optimize the antenna characteristics of the Bluetooth band.
- the matching capacitor 240 is a capacitor having a different value depending on the state of the mobile communication terminal in which the embedded antenna module is embedded. Incidentally, the matching capacitor 240 may optimize the antenna characteristics of the FM band together with the antenna characteristics of the Bluetooth band.
- the matching inductor 250 is formed on the second conductive pad 220 to correct the impedance difference between the circuit mounted on the substrate on which the second conductive pad 220 and the flexible circuit board 200 are mounted. That is, the matching inductor 250 matches (ie, matches) the impedance between the mobile communication terminal in which the embedded antenna module is mounted and the embedded antenna module to optimize antenna characteristics of the Bluetooth band.
- the matching inductor 250 uses an inductor having a different value according to the state of the mobile communication terminal in which the embedded antenna module is embedded. Incidentally, the matching inductor 250 may optimize the antenna characteristics of the FM band together with the antenna characteristics of the Bluetooth band.
- the signal switching unit 300 has one side connected to the second conductive pad 220 and the other side connected to the ground GND. That is, one side of the signal switching unit 300 is electrically connected to the second conductive pad 220 of the flexible printed circuit board 200 by soldering, and the other side of the signal switching unit 300 is electrically connected to the ground GND.
- the signal switching unit 300 is composed of an inductor that passes the received signal of the FM frequency band, and blocks the received signal of the Bluetooth band. When the passing frequency increases, the impedance rises to operate as a low pass filter, and when the passing frequency falls, the impedance falls to operate as a high pass filter. This is to separate the received signal of.
- the inductor composed of the signal switching unit 300 is about 22nH to pass the received signal in the FM frequency band (about 87.5 ⁇ 108MHz), and to block the received signal in the Bluetooth band (about 2.45GHz) is used. do.
- the signal switching unit 300 cuts off the connection with the ground GND based on the frequency of the received signal received through the chip antenna 100 and the flexible circuit board 200. At this time, the signal switching unit 300 maintains the connection with the ground (GND) when the frequency of the received signal is low-frequency, and ground (GND) to transmit the received signal to the Bluetooth signal processing module 700 when the frequency of the received signal is a high frequency. ) To disconnect. That is, when the signal switching unit 300 receives the received signal of the low frequency FM frequency band, it maintains the connection with the ground (GND) and serves as a line. When the signal switching unit 300 receives the received signal of the high frequency Bluetooth frequency band, the signal switching unit 300 blocks the connection with the ground GND to block the transmission of the received signal to the ground GND.
- the signal switching unit 300 including an inductor of 22 nH is described in detail.
- the inductor When a signal received in a low frequency FM frequency band is received through the chip antenna 100 and the flexible circuit board 200, the inductor is connected to the connection part and the ground ( It maintains the connection state of GND and serves as a line for passing the corresponding received signal to ground (GND). Accordingly, the second conductive pad 220 serves as a ground, and the built-in antenna module operates in the configuration as shown in FIG. 17A.
- the internal antenna module operates as a monopole antenna by operating in a circuit configuration including no inductor and GND, as shown in FIG. That is, as shown in FIG. 18, the radiating portions of the second conductive pad 220 and the second radiating pattern 230 are adjacent to each other to generate a coupling, and the radiating portion has a resonance of ⁇ / 4 in the Bluetooth frequency band. It acts as a track and acts as a Bluetooth antenna.
- the received signal of the Bluetooth frequency band blocked by the signal switching unit 300 is input to the Bluetooth signal processing module 700.
- the filter unit 400 is provided on the flexible circuit board 200, one side of which is electrically connected to the first radiator pattern 120 formed on the polyhedron block 110 through the first conductive pad 210, and the other side thereof. It is electrically connected to the low noise amplifier 500. Accordingly, the filter unit 400 removes high frequency components from the received signal received through the chip antenna 100 and the flexible circuit board 200.
- a transmission signal of a Bluetooth frequency band is periodically generated by the terminal and the Bluetooth device for communication between the terminal and the Bluetooth device. Therefore, the received signal of the FM frequency band may generate signal interference due to the transmission signal of the Bluetooth frequency band.
- the filter unit 400 removes high frequency components in order to prevent signal interference generated in the received signal due to the transmission signal of the Bluetooth frequency band.
- the low noise amplifier 500 is provided on the flexible circuit board 200 and is electrically connected to the filter unit 400. Accordingly, the low noise amplifier 500 amplifies a received signal from which the high frequency component has been removed from the filter unit 400 (that is, a received signal of the FM frequency band from which signal interference due to a transmission signal of the Bluetooth frequency band has been removed). Signal strength (RSSI) enables FM radio reception.
- the low noise amplifier 500 is designed by grabbing the operating point and the matching point so that the received signal is low NF (Noise Index).
- the received signal amplified by the low noise amplifier 500 is generally input to the FM signal processing module 600.
- the low noise amplifier 500 applied to the present invention is a technical matter that can be easily implemented by those skilled in the art using a known technique, and thus detailed description thereof will be omitted.
- the filter unit 400 and the low noise amplifier 500 are provided in the flexible circuit board 200, separate regions on the same plane as the chip antenna 100 are illustrated in FIGS. 19 to 20.
- the chip antenna 100 may be provided on the other surface (the 'A' region of FIG. 21) opposite to one surface on the flexible printed circuit board 200 on which the chip antenna 100 is mounted.
- the filter unit 400 and the low noise amplifier 500 may be provided on different surfaces.
- the built-in antenna module according to the present invention is mounted on the main printed circuit board (not shown), the burden on space can be reduced and the space utilization can be increased, thereby improving the degree of freedom of the component installation structure inside the terminal. .
- 22 is a diagram illustrating a frequency band of an embedded antenna module according to a fourth embodiment of the present invention. 22 is a diagram showing the frequency of the received signal received from the first conductive pad 210 and the second conductive pad 220 and the signal interference of the received signal when the built-in antenna module according to the fourth embodiment of the present invention is used. to be.
- a received signal (that is, the first radiator pattern 120 and the second radiator pattern 230 operated by the first conductive pad 210 is operated as one antenna. Is the frequency of the received signal (ie, received signal of FM frequency). "B” denotes a received signal received through the second conductive pad 220 (that is, a received signal received from the second radiator pattern 230 (that is, a received signal of Bluetooth frequency)) and the first conductive pad 210. Isolation with the received signal received through.
- the resonant frequency band is formed at approximately 87.5 MHz to 108 MHz. That is, the radiation unit formed on the flexible circuit board 200 and the first radiator pattern 120 formed on the chip antenna 100 form one radiation line to form a low frequency band (ie, an FM frequency band (87.5 MHz to 108 MHz). Will receive the received signal.
- the isolation level of the received signal received from the first conductive pad 210 (ie, "B" in FIG. 22A) is approximately 17 dB, and the received signal received from the second radiator pattern 230 It can be seen that the signal interference to the received signal received through the first conductive pad 210 is weak.
- C illustrated in (b) of FIG. 22 is a received signal received through the second conductive pad 220 (that is, a received signal received from the second radiator pattern 230 (that is, a received signal of Bluetooth frequency). ) Frequency.
- D denotes a received signal received through the second conductive pad 220 (that is, a received signal of Bluetooth frequency) and a received signal received through the first conductive pad 210 (ie, the first radiator pattern 120). And an isolation of the received signal (ie, the received signal of the FM frequency) received by the second radiator pattern 230 operating as one antenna.
- the resonant frequency band is formed at about 2.4 GHz. That is, the second conductive pad 220 is adjacent to the meander line-shaped radiator to generate a coupling, and the meander line-shaped radiator serves as a ⁇ / 4 resonant line in the Bluetooth band. Therefore, the built-in antenna module operates as a monopole antenna using coupling to receive a received signal having a frequency of the Bluetooth band.
- the isolation level of the received signal received from the second conductive pad 220 (ie, "D" in FIG. 22B) is approximately 32.6 dB, and the received signal received from the first conductive pad 210 is It can be seen that the signal interference to the received signal received through the second conductive pad 220 is weak.
- FIGS. 23 and 24 illustrate a built-in antenna module according to a fifth embodiment of the present invention.
- the chip antenna of the built-in antenna module according to the fifth embodiment of the present invention is the same as the chip antenna described above with reference to FIGS. 1 and 2, a detailed description thereof will be omitted and the same reference numerals will be added.
- the FM signal processing module 600 and the Bluetooth signal processing module 700 are technical matters that can be easily implemented by those skilled in the art by using a known technology, a detailed description thereof will be omitted.
- the embedded antenna module includes a chip antenna 100 and a flexible circuit board 200.
- the chip antenna 100 is mounted on any one surface of the flexible circuit board 200 (eg, the upper surface of the flexible circuit board 200).
- the flexible circuit board 200 includes a first conductive pad 210, a second conductive pad 220, a second radiator pattern 230, and a third radiator pattern 260.
- the second conductive pad 220 is used as a ground pad.
- the second conductive pads 220 are soldered and electrically connected to the coupling pattern 125 formed on the bottom surface 110b of the polyhedral block 110. At this time, one side of the second conductive pad 220 is electrically connected to the ground (GND) region.
- GND ground
- the second radiator pattern 230 is formed as a meander line having a predetermined shape (for example, a "-" shape), and the first radiator pattern 120 formed at the other end of the lower surface 110b of the polyhedron block 110 (I k +). 1 ) soldered and electrically connected. To this end, the second radiator pattern 230 extends to a connection part connected to the first radiator pattern 120 (I k + 1 ) and the connection part outside of the region where the polyhedral block 110 is mounted on the flexible circuit board 200. It has a radiating portion formed in.
- the radiating part of the second radiator pattern 230 may be formed in a meander line shape, and the radiating part and the connecting part may be divided based on the bent part 235.
- the portion of the second radiator pattern 230 soldered to the first radiator pattern 120 (I k + 1 ) based on the bent portion 235 corresponds to the connection portion, and the connection portion extends to the flexible portion of the flexible circuit board 200.
- a portion formed outside the region in which the polyhedral block 110 is mounted corresponds to a radiator having a meander line shape. This also applies to the drawings described below.
- the second radiator pattern 230 When the second radiator pattern 230 is electrically connected to the first radiator pattern 120 (I k + 1 ) formed at the other end of the lower surface 110b of the polyhedral block 110, the first radiator pattern 120 and the flexible circuit board The second radiator pattern 230 formed at 200 forms one radiation line.
- the third radiator pattern 260 is adjacent to the second radiator pattern 230 at a predetermined interval and is formed in parallel with the second radiator pattern 230, and has a predetermined shape (for example, a combination of "c" and "a”). It is formed as a meander line.
- the third radiator pattern 260 is formed outside the region where the polyhedral block 110 is mounted on the flexible circuit board 200, and one side thereof is electrically connected to the Bluetooth signal processing module 700.
- the third radiator pattern 260 operates as a Bluetooth antenna that receives a signal of a Bluetooth frequency band and transmits the signal to the Bluetooth signal processing module 700.
- the built-in antenna module may further include a filter unit 400 and a low noise amplifier 500.
- the filter unit 400 is provided on the flexible circuit board 200, one side of which is electrically connected to the first radiator pattern 120 formed on the polyhedron block 110 through the first conductive pad 210, and the other side thereof. It is electrically connected to the low noise amplifier 500. Accordingly, the filter unit 400 removes high frequency components from the received signal received through the chip antenna 100 and the flexible circuit board 200.
- a transmission signal of a Bluetooth frequency band is periodically generated by the terminal and the Bluetooth device for communication between the terminal and the Bluetooth device. Therefore, the received signal of the FM frequency band may generate signal interference due to the transmission signal of the Bluetooth frequency band.
- the filter unit 400 removes high frequency components in order to prevent signal interference generated in the received signal due to the transmission signal of the Bluetooth frequency band.
- the low noise amplifier 500 is provided on the flexible circuit board 200 and is electrically connected to the filter unit 400. Accordingly, the low noise amplifier 500 amplifies a received signal from which the high frequency component has been removed from the filter unit 400 (that is, a received signal of the FM frequency band from which signal interference due to a transmission signal of the Bluetooth frequency band has been removed). Signal strength (RSSI) enables FM radio reception.
- the low noise amplifier 500 is designed by grabbing the operating point and the matching point so that the received signal is low NF (Noise Index).
- the received signal amplified by the low noise amplifier 500 is generally input to the FM signal processing module 600.
- the low noise amplifier 500 applied to the present invention is a technical matter that can be easily implemented by those skilled in the art using a known technique, and thus detailed description thereof will be omitted.
- 25 and 26 illustrate a built-in antenna module according to a modified example of the fifth embodiment of the present invention.
- the chip antenna of the built-in antenna module according to the modification of the fifth embodiment of the present invention is the same as the chip antenna described with reference to FIGS. 1 and 2, the detailed description thereof will be omitted and the same reference numerals will be added.
- the FM signal processing module 600, the Bluetooth signal processing module 700 and the GPS signal processing module 900 is a technical matter that can be easily implemented by those skilled in the art using a well-known technology, further detailed description thereof will be omitted. do.
- the embedded antenna module includes a chip antenna 100 and a flexible circuit board 200.
- the built-in antenna module may further include a filter unit 400 and a low noise amplifier 500.
- the filter unit 400 and the low noise amplifier 500 are the same as those of the fifth embodiment, detailed description thereof will be omitted.
- the chip antenna 100 is mounted on any one surface of the flexible circuit board 200 (eg, the upper surface of the flexible circuit board 200).
- the flexible circuit board 200 includes a first conductive pad 210, a second conductive pad 220, a second radiator pattern 230, a third radiator pattern 260, and a fourth radiator pattern 270.
- first conductive pad 210, the second conductive pad 220, the second radiator pattern 230, and the third radiator pattern 260 are the same as those of the fifth embodiment, detailed descriptions thereof will be omitted. .
- the fourth radiator pattern 270 is adjacent to the third radiator pattern 260 by a predetermined interval and is formed in parallel with the third radiator pattern 260, and is formed as a meander line having a predetermined shape (for example, a “” shape). .
- the fourth radiator pattern 270 is formed outside the region in which the polyhedral block 110 is mounted on the flexible circuit board 200, and one side thereof is electrically connected to the GPS signal processing module 900.
- the fourth radiator pattern 270 operates as a GPS antenna that receives a signal of a GPS frequency band and transmits the signal to the GPS signal processing module 900.
- the built-in antenna module according to the modification of the fifth embodiment of the present invention does not require a separate Bluetooth antenna and GPS antenna by receiving signals of FM frequency, Bluetooth frequency and GPS frequency, and thus is applied to a mobile communication terminal. Therefore, the terminal can be miniaturized and slimmed down.
- FIGS. 1 and 2 are diagrams for describing an embedded antenna module according to a sixth embodiment of the present invention.
- the chip antenna of the built-in antenna module according to the sixth embodiment of the present invention is the same as the chip antenna described above with reference to FIGS. 1 and 2, a detailed description thereof will be omitted and the same reference numerals will be added.
- the FM signal processing module 600 and the GPS signal processing module 700 are technical matters that can be easily implemented by those skilled in the art using well-known techniques, further detailed description will be omitted.
- the embedded antenna module includes a chip antenna 100 and a flexible circuit board 200.
- the chip antenna 100 is mounted on any one surface of the flexible circuit board 200 (eg, the upper surface of the flexible circuit board 200).
- the flexible circuit board 200 includes a first conductive pad 210, a second conductive pad 220, a second radiator pattern 230, and a third radiator pattern 260.
- the second conductive pad 220 is used as a ground pad.
- the second conductive pads 220 are soldered and electrically connected to the coupling pattern 125 formed on the bottom surface 110b of the polyhedral block 110. At this time, one side of the second conductive pad 220 is electrically connected to the ground (GND) region.
- GND ground
- the second radiator pattern 230 is formed as a meander line having a predetermined shape (for example, a "-" shape), and the first radiator pattern 120 formed at the other end of the lower surface 110b of the polyhedron block 110 (I k +). 1 ) soldered and electrically connected.
- the second radiator pattern 230 is extended to a connection part connected to the first radiator pattern 120 (Ik + 1) and the connection part, and outside the region where the polyhedral block 110 is mounted on the flexible circuit board 200. It has a radiating portion formed.
- the radiating part of the second radiator pattern 230 may be formed in a meander line shape, and the radiating part and the connecting part may be divided based on the bent part 235.
- the portion of the second radiator pattern 230 soldered to the first radiator pattern 120 (I k + 1 ) based on the bent portion 235 corresponds to the connection portion, and the connection portion extends to the flexible portion of the flexible circuit board 200.
- a portion formed outside the region in which the polyhedral block 110 is mounted corresponds to a radiator having a meander line shape. This also applies to the drawings described below.
- the second radiator pattern 230 When the second radiator pattern 230 is electrically connected to the first radiator pattern 120 (I k + 1 ) formed at the other end of the lower surface 110b of the polyhedral block 110, the first radiator pattern 120 and the flexible circuit board The second radiator pattern 230 formed at 200 forms one radiation line.
- the third radiator pattern 260 is adjacent to the second radiator pattern 230 at a predetermined interval and is formed in parallel with the second radiator pattern 230, and is formed as a meander line having a predetermined shape (for example, a “” shape). .
- the third radiator pattern 260 is formed outside the region where the polyhedral block 110 is mounted on the flexible circuit board 200, and one side thereof is electrically connected to the GPS signal processing module 900.
- the third radiator pattern 260 operates as a GPS antenna that receives a signal of a GPS frequency band and transmits the signal to the GPS signal processing module 900.
- the built-in antenna module may further include a filter unit 400 and a low noise amplifier 500.
- the filter unit 400 and the low noise amplifier 500 are the same as the filter unit 400 and the low noise amplifier of the fifth embodiment, detailed descriptions thereof will be omitted.
- 29 and 30 illustrate a built-in antenna module according to a modified example of the sixth embodiment of the present invention.
- the chip antenna of the built-in antenna module according to the modification of the sixth embodiment of the present invention is the same as the chip antenna described with reference to FIGS. 1 and 2, detailed descriptions thereof will be omitted and the same reference numerals will be added.
- the FM signal processing module 600, the Bluetooth signal processing module 700 and the GPS signal processing module 900 is a technical matter that can be easily implemented by those skilled in the art using a well-known technology, further detailed description thereof will be omitted. do.
- the embedded antenna module includes a chip antenna 100 and a flexible circuit board 200.
- the built-in antenna module may further include a filter unit 400 and a low noise amplifier 500.
- the filter unit 400 and the low noise amplifier 500 are the same as those of the sixth embodiment described above, a detailed description thereof will be omitted.
- the chip antenna 100 is mounted on any one surface of the flexible circuit board 200 (eg, the upper surface of the flexible circuit board 200).
- the flexible circuit board 200 includes a first conductive pad 210, a second conductive pad 220, a second radiator pattern 230, a third radiator pattern 260, and a fourth radiator pattern 270.
- the first conductive pad 210, the second conductive pad 220, the second radiator pattern 230, and the third radiator pattern 260 are the same as those of the sixth embodiment described above, and thus detailed description thereof will be omitted. .
- the fourth radiator pattern 270 is adjacent to the third radiator pattern 260 by a predetermined interval and is formed in parallel with the third radiator pattern 260, and has a predetermined shape (for example, a combination of "c" and "-"). Of meander lines are formed. In this case, the fourth radiator pattern 270 is formed outside the region in which the polyhedral block 110 is mounted on the flexible circuit board 200, and one side thereof is electrically connected to the Bluetooth signal processing module 700.
- the fourth radiator pattern 270 operates as a Bluetooth antenna which receives a signal of a Bluetooth frequency band and transmits the signal to the Bluetooth signal processing module 700.
- the built-in antenna module according to a modification of the sixth embodiment of the present invention does not require a separate Bluetooth antenna and GPS antenna by receiving signals of FM frequency, Bluetooth frequency and GPS frequency, and thus is applied to a mobile communication terminal. Therefore, the terminal can be miniaturized and slimmed down.
- 31 and 32 illustrate a built-in antenna module according to a seventh embodiment of the present invention.
- the chip antenna of the built-in antenna module according to the seventh embodiment of the present invention is the same as the chip antenna described above with reference to FIGS. 1 and 2, a detailed description thereof will be omitted and the same reference numerals will be added.
- the FM signal processing module 600 and the Bluetooth signal processing module 700 are technical matters that can be easily implemented by those skilled in the art by using a known technology, a detailed description thereof will be omitted.
- the embedded antenna module includes a chip antenna 100 and a flexible circuit board 200.
- the built-in antenna module may further include a filter unit 400 and a low noise amplifier 500.
- the filter unit 400 and the low noise amplifier 500 are the same as those of the sixth embodiment described above, a detailed description thereof will be omitted.
- the chip antenna 100 is mounted on any one surface of the flexible circuit board 200 (eg, the upper surface of the flexible circuit board 200).
- the flexible circuit board 200 includes a first conductive pad 210, a second conductive pad 220, a connection pad 225, a second radiator pattern 230, and a switching element 280.
- first conductive pad 210 and the second conductive pad 220 are the same as in the above-described fourth embodiment, a detailed description thereof will be omitted.
- connection pad 225 is soldered and electrically connected to the first radiator pattern 120 (I k + 1 ) formed on the bottom surface of the polyhedron block. In this case, the connection pad 225 is electrically connected to the second radiator pattern 230 through the switching element 280 which will be described later.
- the second radiator pattern 230 is formed of a meander line of a predetermined shape (eg, a combination of “c” and a curved “l”), and one side of the second radiator pattern 230 is electrically connected to the Bluetooth signal processing module 700.
- the second radiator pattern 230 is connected through a connection pad 225 connected to the first radiator pattern 120 (I k + 1 ) and a switching element 280 to be described later.
- the second radiator pattern 230 is electrically connected to the first radiator pattern 120 (I k + 1 ) formed at the other end of the lower surface 110b of the polyhedral block 110 through the switching element 280.
- the second radiator pattern 230 formed on the 120 and the flexible circuit board 200 forms one radiation line.
- the switching element 280 is formed on the flexible circuit board 200, one side of which is connected to the connection pad 225, and the other side of which is connected to the second radiator pattern 230. That is, one side of the switching element 280 is soldered and electrically connected to the connection pad 225, and the other side of the switching element 280 is soldered and electrically connected to the second conductive pad 220.
- the switching element 280 is composed of an inductor that passes the received signal of the FM frequency band, and blocks the received signal of the Bluetooth band. When the passing frequency increases, the impedance rises to operate as a low pass filter, and when the passing frequency falls, the impedance falls to operate as a high pass filter. This is to separate the received signal of.
- the inductor composed of the switching element 280 passes about a reception signal in the FM frequency band (about 87.5 to 108 MHz) and uses about 22 nH to block the reception signal in the Bluetooth band (about 2.45 GHz). .
- the switching element 280 blocks the connection of the connection pad 225 based on the frequency of the received signal receiving the second radiator pattern 230.
- the switching element 280 maintains the connection with the connection pad 225 when the frequency of the received signal is low, and blocks the connection with the connection pad 225 when the frequency of the received signal is the high frequency, thereby preventing the second radiator pattern 230.
- Operate with this monopole antenna That is, when the switching element 280 receives the received signal of the low frequency FM frequency band, the switching element 280 maintains the connection with the connection pad 225 so that the first radiator pattern and the second radiator pattern 230 serve as one radiation line.
- the switching element 280 blocks the connection with the connection pad 225 to serve as a monopole antenna for receiving the signal of the Bluetooth frequency band 230.
- the switching element 280 composed of an inductor of 22 nH is described in detail.
- the inductor When a reception signal of a low frequency FM frequency band is received through the second radiator pattern 230, the inductor is connected to the connection pad 225 and the second radiator pattern. Maintaining the connection state of the 230 serves as a line for passing the received signal to the first radiator pattern.
- the inductor When a received signal of a high frequency Bluetooth frequency band is received through the second radiator pattern 230, the inductor is opened to block the received signal from passing through the connection pad 225 to the first radiator pattern. Accordingly, the second radiator pattern 230 operates as a Bluetooth antenna.
- the received signal of the Bluetooth frequency band blocked by the switching element 280 is input to the Bluetooth signal processing module 700.
- 33 is a diagram illustrating a frequency band of an embedded antenna module according to a seventh embodiment of the present invention.
- 33 is a diagram showing the frequency of the received signal received from the first conductive pad 210 and the second conductive pad 220 and the signal interference of the received signal when the built-in antenna module according to the seventh embodiment of the present invention is used. to be.
- E is a frequency of a received signal received by the first conductive pad 210
- F is a received signal and a second conductive received through the first conductive pad 210. Isolation of the received signal received at the pad 220.
- the resonant frequency band is formed at approximately 87.5 MHz to 108 MHz. That is, the second radiator pattern 230 formed on the flexible circuit board 200 and the first radiator pattern 120 formed on the chip antenna 100 form one radiation line through the connection pad 225 to form a low frequency band ( That is, the reception signal is received in the FM frequency band (87.5MHz ⁇ 108MHz).
- the isolation level of the received signal received from the first conductive pad 210 (that is, "F" in FIG. 29A) is approximately 23.3 dB, and the received signal received from the second conductive pad 220 is It can be seen that the signal interference to the received signal received through the first conductive pad 210 is weak.
- G is a frequency of a received signal received by the second conductive pad 220
- H is a received signal and first conductive received through the second conductive pad 220. Isolation of the received signal received at the pad 210.
- the resonant frequency band is formed at about 2.4 GHz. That is, the second conductive pad 220 serves as a resonant line of ⁇ / 4 in the Bluetooth band to receive a received signal having a frequency of the Bluetooth band.
- the isolation level of the received signal received from the second conductive pad 220 (ie, "H" in FIG. 29B) is approximately 21.3 , and the received signal received from the first conductive pad 210 is It can be seen that the signal interference to the received signal received through the second conductive pad 220 is weak.
- the built-in antenna module receives the FM frequency and the Bluetooth frequency at the same time, does not require a separate antenna for Bluetooth, and thus can be applied to the mobile communication terminal to achieve miniaturization and slimming of the terminal Do.
- the built-in antenna module according to the present invention is capable of receiving FM radio with a high level of signal strength (RSSI).
- RSSI signal strength
- the built-in antenna module according to the present invention when the built-in antenna module according to the present invention is mounted on the main printed circuit board, the burden on space is reduced, so that the space utilization can be increased and the degree of freedom for the component installation structure inside the terminal can be improved.
- the built-in antenna module according to the present invention does not need any additional means such as earphones for FM radio reception, the configuration is simplified. Accordingly, in the case of a Bluetooth mobile communication terminal, even if a wireless earphone is used, it is possible to maintain a constant reception quality without degrading a different FM radio broadcast reception rate.
- the filter unit 400 and the low noise amplifier 500 are illustrated as being mounted on the flexible circuit board 200.
- the present invention is not limited thereto and may be configured with one of the FM signal processing modules to process the corresponding functions. .
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Description
Claims (24)
- 내장형 안테나 모듈에 있어서,제1방사체패턴 및 커플링패턴이 형성된 다면체의 칩 안테나;상기 제1방사체패턴과 접속되는 제1도전성패드와, 상기 칩 안테나의 커플링패턴과 접속되는 제2도전성패드, 및 상기 제1방사체패턴과 접속되는 제2방사체패턴이 형성된 연성회로기판; 및상기 제2도전성패드와 그라운드 사이에 형성되되, 상기 칩 안테나 및 연성회로기판을 통해 수신받은 제1주파수대역의 신호 및 제2주파수대역의 신호 중에서 어느 한 주파수대역의 신호가 상기 그라운드로 통과되는 것을 차단하는 신호 스위칭부를 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 1에 있어서,상기 신호 스위칭부는,상기 제2주파수대역의 신호가 상기 그라운드로 통과되는 것을 차단하여 상기 제2주파수대역의 신호를 블루투스 신호처리 모듈로 전송하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 1에 있어서,상기 신호 스위칭부는, 블루투스 주파수대역의 신호가 상기 그라운드로 통과되는 것을 차단하는 인덕터로 구성되는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 1에 있어서,상기 제1주파수대역의 신호는 FM 주파수 대역의 신호이고, 상기 제2주파수대역의 신호는 블루투스 주파수대역의 신호인 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 4에 있어서,상기 제1주파수대역의 신호에서 고주파 성분을 제거하는 필터부를 더 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 5에 있어서,상기 필터부에서 고주파 성분이 제거된 수신 신호를 증폭시키는 저잡음 증폭부를 더 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 1에 있어서,상기 제2방사체패턴은 미앤더 라인 형태로 형성되는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 1에 있어서,상기 제2도전성패드 및 상기 제2방사체패턴 사이에 형성되어 상기 제2도전성패드 및 상기 연성회로기판이 실장되는 기판상에 실장된 회로 사이의 임피던스 차이를 보정하는 매칭 커패시터를 더 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 1에 있어서,상기 제2도전성패드에 형성되어 상기 제2도전성패드 및 상기 연성회로기판이 실장되는 기판상에 실장된 회로 사이의 임피던스 차이를 보정하는 매칭 인덕터를 더 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 내장형 안테나 모듈에 있어서,제1방사체패턴 및 커플링패턴이 형성된 다면체의 칩 안테나;상기 제1방사체패턴과 접속되는 제1도전성패드와, 상기 칩 안테나의 커플링패턴과 접속되는 제2도전성패드, 및 상기 제1방사체패턴과 접속되는 제2방사체패턴이 형성된 연성회로기판; 및상기 칩 안테나 및 연성회로기판을 통해 수신되는 제1주파수대역의 신호 및 제2주파수대역의 신호를 분기시키는 신호 분기부를 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 10에 있어서,상기 신호 분기부는, 상기 제1주파수대역의 신호를 FM 신호처리 모듈로 분기시키고, 상기 제2주파수대역의 신호를 블루투스 신호처리 모듈로 분기시키는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 10에 있어서,상기 신호 분기부에서 분기된 상기 제1주파수 대역의 신호를 증폭시키는 저잡음 증폭부를 더 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 10에 있어서,상기 신호 분기부는, FM 대역의 신호를 FM 신호처리 모듈로 분기하고, 블루투스 주파수대역의 신호를 블루투스 신호처리 모듈로 분기시키는 다이플렉서로 구성된 것을 특징으로 하는 내장형 안테나 모듈.
- 내장형 안테나 모듈에 있어서,제1방사체패턴 및 커플링패턴이 형성된 다면체의 칩 안테나;상기 제1방사체패턴과 접속되는 제1도전성패드와, 상기 칩 안테나의 커플링패턴과 접속되는 제2도전성패드, 및 상기 제1방사체패턴과 접속되는 제2방사체패턴이 형성된 연성회로기판; 및상기 제2방사체패턴과 인접되게 상기 연성회로기판에 형성된 제3방사체패턴을 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 14에 있어서,상기 제3방사체패턴은 블루투스 신호처리 모듈과 전기적으로 연결되는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 15에 있어서,상기 연성회로기판에는 상기 제3방사체패턴과 인접된 제4방사체패턴이 더 형성되되, 상기 제4방사체패턴은 GPS 신호처리 모듈과 전기적으로 연결되는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 14에 있어서,상기 제3방사체패턴은 GPS 신호처리 모듈과 전기적으로 연결되는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 17에 있어서,상기 연성회로기판에는 상기 제3방사체패턴과 인접된 제4방사체패턴이 더 형성되되, 상기 제4방사체패턴은 블루투스 신호처리 모듈과 전기적으로 연결되는 것을 특징으로 하는 내장형 안테나 모듈.
- 내장형 안테나 모듈에 있어서,제1방사체패턴 및 커플링패턴이 형성된 다면체 블록의 칩 안테나; 및상기 제1방사체패턴과 접속되는 제1도전성패드와, 상기 칩 안테나의 커플링패턴과 접속되는 제2도전성패드, 및 상기 제1방사체패턴과 접속되는 제2방사체패턴이 형성된 연성회로기판을 구비하되,상기 제1도전성패드는 FM 신호처리 모듈 및 블루투스 신호처리 모듈과 전기적으로 연결되고, 상기 칩 안테나 및 연성회로기판을 통해 수신되는 수신 신호를 상기 FM 신호처리 모듈 및 블루투스 신호처리 모듈로 전송하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 19항에 있어서,상기 FM 신호처리 모듈로 전송되는 수신 신호의 고주파 성분을 제거하는 필터부를 더 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 20에 있어서,상기 필터부에서 고주파 성분이 제거된 수신 신호를 증폭시키는 저잡음 증폭부를 더 포함하는 것을 특징으로 하는 내장형 안테나 모듈.
- 내장형 안테나 모듈에 있어서,제1방사체패턴 및 커플링패턴이 형성된 다면체의 칩 안테나; 및상기 제1방사체패턴과 접속되는 제1도전성패드와, 상기 칩 안테나의 커플링패턴과 접속되는 제2도전성패드, 및 상기 제2도전성패드와 인접된 제2방사체패턴이 형성된 연성회로기판을 구비하되,상기 연성회로기판은 상기 제2방사체패턴과 상기 제1방사체패턴 사이에 형성되어 상기 제2방사체패턴으로 통해 수신되는 제1주파수대역 신호 및 제2주파수 대역 신호 중에 어느 하나가 상기 제1방사체패턴으로 통과되는 것을 차단하는 스위칭 소자를 더 구비하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 22항에 있어서,상기 스위칭 소자는, 상기 제2방사체패턴을 통해 수신된 제2주파수대역 신호를 차단하여 블루투스 신호처리 모듈로 전송하는 것을 특징으로 하는 내장형 안테나 모듈.
- 청구항 22에 있어서,상기 스위칭 소자는, 블루투스 주파수대역의 신호가 상기 제1방사체패턴으로 통과되는 것을 차단하는 인덕터로 구성되는 것을 특징으로 하는 내장형 안테나 모듈.
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US13/262,233 US20120280867A1 (en) | 2009-04-02 | 2010-03-31 | Internal antenna module |
CN201080020834.9A CN102422485B (zh) | 2009-04-02 | 2010-03-31 | 内置天线模块 |
EP10759032.5A EP2416442B1 (en) | 2009-04-02 | 2010-03-31 | Internal antenna module |
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KR1020090028341A KR101030148B1 (ko) | 2009-04-02 | 2009-04-02 | 내장형 안테나 모듈 |
KR10-2009-0028341 | 2009-04-02 | ||
KR1020090030229A KR101030141B1 (ko) | 2009-04-08 | 2009-04-08 | 내장형 안테나 모듈 |
KR10-2009-0030229 | 2009-04-08 |
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US (1) | US20120280867A1 (ko) |
EP (1) | EP2416442B1 (ko) |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102185177A (zh) * | 2011-02-25 | 2011-09-14 | 中兴通讯股份有限公司 | 一种调频天线的实现装置和移动终端 |
CN102457460A (zh) * | 2010-10-28 | 2012-05-16 | 中兴通讯股份有限公司 | 一种以射频天线共用为fm调制天线的装置及方法 |
CN102637946A (zh) * | 2011-02-14 | 2012-08-15 | 中兴通讯股份有限公司 | 一种调频天线实现装置及移动终端 |
CN103247856A (zh) * | 2012-02-03 | 2013-08-14 | 联想移动通信科技有限公司 | 天线装置及移动终端 |
CN112243066A (zh) * | 2020-10-20 | 2021-01-19 | Oppo广东移动通信有限公司 | 电子设备fm播放方式的选择方法及电子设备 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010131524A1 (ja) * | 2009-05-14 | 2010-11-18 | 株式会社村田製作所 | 回路基板及び回路モジュール |
US9716317B2 (en) * | 2011-04-22 | 2017-07-25 | Nec Tokin Corporation | Antenna device, communication module, portable electronic apparatus, and communication method using portable electronic apparatus |
WO2013099228A2 (en) | 2011-12-30 | 2013-07-04 | Makita Corporation | Charger, battery pack charging system and cordless power tool system |
US9781496B2 (en) | 2012-10-25 | 2017-10-03 | Milwaukee Electric Tool Corporation | Worksite audio device with wireless interface |
KR101970861B1 (ko) * | 2013-01-18 | 2019-04-19 | 미쓰비시 마테리알 가부시키가이샤 | 안테나 장치 |
CN104218306A (zh) * | 2013-06-03 | 2014-12-17 | 联想(北京)有限公司 | 天线装置和用于设置天线的方法 |
US9740248B2 (en) * | 2013-06-07 | 2017-08-22 | Western Digital Technologies, Inc. | Component placement within a solid state drive |
CN104425878A (zh) * | 2013-08-26 | 2015-03-18 | 卓英社有限公司 | 具有柔韧性的内置型天线 |
DE102013113258A1 (de) * | 2013-11-29 | 2015-06-03 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Sensor und Messanordnung |
CN104868225A (zh) * | 2014-02-21 | 2015-08-26 | 联想(北京)有限公司 | 一种电子设备及其天线的制作方法 |
US20150316419A1 (en) * | 2014-05-03 | 2015-11-05 | Seenath Punnakkal | Method and apparatus for monitoring body temperature and activity |
CN110875750B (zh) * | 2018-08-31 | 2021-09-21 | 荣耀终端有限公司 | Fm天线电路和终端设备 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7164387B2 (en) * | 2003-05-12 | 2007-01-16 | Hrl Laboratories, Llc | Compact tunable antenna |
KR20040104177A (ko) * | 2003-06-03 | 2004-12-10 | 삼성전기주식회사 | 시분할방식 전력증폭모듈 |
US20050212708A1 (en) * | 2004-03-26 | 2005-09-29 | Broadcom Corporation | Antenna configuration for wireless communication device |
US8000737B2 (en) * | 2004-10-15 | 2011-08-16 | Sky Cross, Inc. | Methods and apparatuses for adaptively controlling antenna parameters to enhance efficiency and maintain antenna size compactness |
KR20060100559A (ko) * | 2005-03-17 | 2006-09-21 | 엘지이노텍 주식회사 | 블루투스 모듈 및 그 구현방법 |
KR100771775B1 (ko) * | 2005-07-15 | 2007-10-30 | 삼성전기주식회사 | 수직배열 내장형 안테나 |
KR100816262B1 (ko) * | 2005-10-24 | 2008-03-26 | 주식회사 이엠따블유안테나 | 전자 기기 하우징 내장형 안테나 및 그 제조방법 |
US7872607B2 (en) * | 2006-01-27 | 2011-01-18 | Qualcomm, Incorporated | Diverse spectrum antenna for handsets and other devices |
KR101242676B1 (ko) * | 2006-06-08 | 2013-03-12 | 삼성전자주식회사 | 휴대용 단말기의 내장형 안테나 장치 |
KR100822475B1 (ko) * | 2006-10-19 | 2008-04-16 | 삼성전자주식회사 | 저주파대역 무선신호의 송수신이 가능한 능동형 안테나 및이를 구비한 이동통신 단말기 |
US20080129610A1 (en) * | 2006-12-01 | 2008-06-05 | Texas Instruments Incorporated | Adaptive antenna matching for portable radio operating at VHF with single-chip based implementation |
CN101316004A (zh) * | 2007-05-28 | 2008-12-03 | 日立金属株式会社 | 天线、天线装置及通信设备 |
KR100986049B1 (ko) * | 2008-08-11 | 2010-10-07 | 주식회사 에이스테크놀로지 | 다중 방송 수신용 모듈형 액티브 안테나 |
-
2010
- 2010-03-31 US US13/262,233 patent/US20120280867A1/en not_active Abandoned
- 2010-03-31 WO PCT/KR2010/001979 patent/WO2010114307A2/ko active Application Filing
- 2010-03-31 EP EP10759032.5A patent/EP2416442B1/en active Active
- 2010-03-31 CN CN201080020834.9A patent/CN102422485B/zh active Active
Non-Patent Citations (2)
Title |
---|
None |
See also references of EP2416442A4 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102457460A (zh) * | 2010-10-28 | 2012-05-16 | 中兴通讯股份有限公司 | 一种以射频天线共用为fm调制天线的装置及方法 |
CN102637946A (zh) * | 2011-02-14 | 2012-08-15 | 中兴通讯股份有限公司 | 一种调频天线实现装置及移动终端 |
CN102185177A (zh) * | 2011-02-25 | 2011-09-14 | 中兴通讯股份有限公司 | 一种调频天线的实现装置和移动终端 |
WO2012113175A1 (zh) * | 2011-02-25 | 2012-08-30 | 中兴通讯股份有限公司 | 一种调频天线的实现装置和移动终端 |
CN103247856A (zh) * | 2012-02-03 | 2013-08-14 | 联想移动通信科技有限公司 | 天线装置及移动终端 |
CN112243066A (zh) * | 2020-10-20 | 2021-01-19 | Oppo广东移动通信有限公司 | 电子设备fm播放方式的选择方法及电子设备 |
CN112243066B (zh) * | 2020-10-20 | 2021-07-23 | Oppo广东移动通信有限公司 | 电子设备fm播放方式的选择方法及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
US20120280867A1 (en) | 2012-11-08 |
CN102422485A (zh) | 2012-04-18 |
EP2416442B1 (en) | 2017-03-22 |
WO2010114307A3 (ko) | 2011-01-06 |
EP2416442A2 (en) | 2012-02-08 |
EP2416442A4 (en) | 2013-01-02 |
CN102422485B (zh) | 2014-09-17 |
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