WO2010114222A3 - Flexible copper clad laminate having a buffer layer, and method for manufacturing same - Google Patents
Flexible copper clad laminate having a buffer layer, and method for manufacturing same Download PDFInfo
- Publication number
- WO2010114222A3 WO2010114222A3 PCT/KR2010/000756 KR2010000756W WO2010114222A3 WO 2010114222 A3 WO2010114222 A3 WO 2010114222A3 KR 2010000756 W KR2010000756 W KR 2010000756W WO 2010114222 A3 WO2010114222 A3 WO 2010114222A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- buffer layer
- clad laminate
- copper clad
- manufacturing same
- flexible copper
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
- B32B5/147—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces by treatment of the layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a flexible copper clad laminate (FCCL) having a buffer layer, and to a method for manufacturing same. The present invention provides a flexible copper clad laminate in which a buffer layer made of silicon compounds or silicon compound analogs is formed on at least one side of a base substrate made of polymer materials, and a copper foil layer is formed on the buffer layer, as well as a method for manufacturing same. As the flexible copper clad laminate according to the present invention has the buffer layer which is made of silicon compounds or silicon compound analogs, and formed between the base substrate and the copper foil layer, an etching process can be easily performed on the copper foil layer while maintaining excellent bonding force between the base substrate and the copper foil layer, and a degradation in the reliability of products caused by dielectric breakdown resulting from ion migration can be prevented.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090028954A KR20100110563A (en) | 2009-04-03 | 2009-04-03 | Fccl having buffer layer and method for manufacturing thereof |
KR10-2009-0028954 | 2009-04-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010114222A2 WO2010114222A2 (en) | 2010-10-07 |
WO2010114222A3 true WO2010114222A3 (en) | 2010-11-25 |
Family
ID=42828795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/000756 WO2010114222A2 (en) | 2009-04-03 | 2010-02-08 | Flexible copper clad laminate having a buffer layer, and method for manufacturing same |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20100110563A (en) |
WO (1) | WO2010114222A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101745053B1 (en) * | 2014-02-13 | 2017-06-08 | 현대자동차주식회사 | Surface treatment of the metallic member using on transmission path of the radar and a method of manufacturing it |
KR101647199B1 (en) * | 2014-10-20 | 2016-08-09 | 티-킹덤 컴퍼니 리미티드 | Flexible copper-clad substrate |
CN104591074B (en) * | 2015-01-22 | 2017-01-04 | 华东师范大学 | Flexible silicon film based on sandwich structure and preparation method thereof |
CN114559712B (en) * | 2022-02-15 | 2023-04-18 | 江苏诺德新材料股份有限公司 | High-temperature-resistant low-loss copper-clad plate and preparation process thereof |
CN117265470A (en) * | 2023-07-11 | 2023-12-22 | 安徽立光电子材料股份有限公司 | Preparation method of ultrathin composite copper foil and ultrathin composite copper foil |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004001429A (en) * | 2002-04-01 | 2004-01-08 | Konica Minolta Holdings Inc | Substrate and organic electroluminescent element having the substrate |
JP2004351832A (en) * | 2003-05-30 | 2004-12-16 | Toppan Printing Co Ltd | Transparent gas-barrier laminated film |
KR100613018B1 (en) * | 2002-03-19 | 2006-08-14 | 가부시끼가이샤 에키쇼 센탄 기쥬츠 가이하쯔 센터 | Method for forming interconnection metal layer, method for selectively forming metal |
-
2009
- 2009-04-03 KR KR1020090028954A patent/KR20100110563A/en not_active Application Discontinuation
-
2010
- 2010-02-08 WO PCT/KR2010/000756 patent/WO2010114222A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100613018B1 (en) * | 2002-03-19 | 2006-08-14 | 가부시끼가이샤 에키쇼 센탄 기쥬츠 가이하쯔 센터 | Method for forming interconnection metal layer, method for selectively forming metal |
JP2004001429A (en) * | 2002-04-01 | 2004-01-08 | Konica Minolta Holdings Inc | Substrate and organic electroluminescent element having the substrate |
JP2004351832A (en) * | 2003-05-30 | 2004-12-16 | Toppan Printing Co Ltd | Transparent gas-barrier laminated film |
Also Published As
Publication number | Publication date |
---|---|
WO2010114222A2 (en) | 2010-10-07 |
KR20100110563A (en) | 2010-10-13 |
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