WO2010114222A3 - Flexible copper clad laminate having a buffer layer, and method for manufacturing same - Google Patents

Flexible copper clad laminate having a buffer layer, and method for manufacturing same Download PDF

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Publication number
WO2010114222A3
WO2010114222A3 PCT/KR2010/000756 KR2010000756W WO2010114222A3 WO 2010114222 A3 WO2010114222 A3 WO 2010114222A3 KR 2010000756 W KR2010000756 W KR 2010000756W WO 2010114222 A3 WO2010114222 A3 WO 2010114222A3
Authority
WO
WIPO (PCT)
Prior art keywords
buffer layer
clad laminate
copper clad
manufacturing same
flexible copper
Prior art date
Application number
PCT/KR2010/000756
Other languages
French (fr)
Korean (ko)
Other versions
WO2010114222A2 (en
Inventor
김정식
조강래
박은규
Original Assignee
주식회사 서흥플라즈마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 서흥플라즈마 filed Critical 주식회사 서흥플라즈마
Publication of WO2010114222A2 publication Critical patent/WO2010114222A2/en
Publication of WO2010114222A3 publication Critical patent/WO2010114222A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B32B5/147—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces by treatment of the layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a flexible copper clad laminate (FCCL) having a buffer layer, and to a method for manufacturing same. The present invention provides a flexible copper clad laminate in which a buffer layer made of silicon compounds or silicon compound analogs is formed on at least one side of a base substrate made of polymer materials, and a copper foil layer is formed on the buffer layer, as well as a method for manufacturing same. As the flexible copper clad laminate according to the present invention has the buffer layer which is made of silicon compounds or silicon compound analogs, and formed between the base substrate and the copper foil layer, an etching process can be easily performed on the copper foil layer while maintaining excellent bonding force between the base substrate and the copper foil layer, and a degradation in the reliability of products caused by dielectric breakdown resulting from ion migration can be prevented.
PCT/KR2010/000756 2009-04-03 2010-02-08 Flexible copper clad laminate having a buffer layer, and method for manufacturing same WO2010114222A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090028954A KR20100110563A (en) 2009-04-03 2009-04-03 Fccl having buffer layer and method for manufacturing thereof
KR10-2009-0028954 2009-04-03

Publications (2)

Publication Number Publication Date
WO2010114222A2 WO2010114222A2 (en) 2010-10-07
WO2010114222A3 true WO2010114222A3 (en) 2010-11-25

Family

ID=42828795

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000756 WO2010114222A2 (en) 2009-04-03 2010-02-08 Flexible copper clad laminate having a buffer layer, and method for manufacturing same

Country Status (2)

Country Link
KR (1) KR20100110563A (en)
WO (1) WO2010114222A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101745053B1 (en) * 2014-02-13 2017-06-08 현대자동차주식회사 Surface treatment of the metallic member using on transmission path of the radar and a method of manufacturing it
KR101647199B1 (en) * 2014-10-20 2016-08-09 티-킹덤 컴퍼니 리미티드 Flexible copper-clad substrate
CN104591074B (en) * 2015-01-22 2017-01-04 华东师范大学 Flexible silicon film based on sandwich structure and preparation method thereof
CN114559712B (en) * 2022-02-15 2023-04-18 江苏诺德新材料股份有限公司 High-temperature-resistant low-loss copper-clad plate and preparation process thereof
CN117265470A (en) * 2023-07-11 2023-12-22 安徽立光电子材料股份有限公司 Preparation method of ultrathin composite copper foil and ultrathin composite copper foil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004001429A (en) * 2002-04-01 2004-01-08 Konica Minolta Holdings Inc Substrate and organic electroluminescent element having the substrate
JP2004351832A (en) * 2003-05-30 2004-12-16 Toppan Printing Co Ltd Transparent gas-barrier laminated film
KR100613018B1 (en) * 2002-03-19 2006-08-14 가부시끼가이샤 에키쇼 센탄 기쥬츠 가이하쯔 센터 Method for forming interconnection metal layer, method for selectively forming metal

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100613018B1 (en) * 2002-03-19 2006-08-14 가부시끼가이샤 에키쇼 센탄 기쥬츠 가이하쯔 센터 Method for forming interconnection metal layer, method for selectively forming metal
JP2004001429A (en) * 2002-04-01 2004-01-08 Konica Minolta Holdings Inc Substrate and organic electroluminescent element having the substrate
JP2004351832A (en) * 2003-05-30 2004-12-16 Toppan Printing Co Ltd Transparent gas-barrier laminated film

Also Published As

Publication number Publication date
WO2010114222A2 (en) 2010-10-07
KR20100110563A (en) 2010-10-13

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