WO2010074398A3 - 분진 방지 및 진동에 강한 산업용 컴퓨터 - Google Patents
분진 방지 및 진동에 강한 산업용 컴퓨터 Download PDFInfo
- Publication number
- WO2010074398A3 WO2010074398A3 PCT/KR2009/006250 KR2009006250W WO2010074398A3 WO 2010074398 A3 WO2010074398 A3 WO 2010074398A3 KR 2009006250 W KR2009006250 W KR 2009006250W WO 2010074398 A3 WO2010074398 A3 WO 2010074398A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heatsink
- case
- heat
- industrial computer
- dust
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980145952.XA CN102216871B (zh) | 2008-12-26 | 2009-10-28 | 防粉尘及抗振动的产业用电脑 |
US13/129,517 US8472184B2 (en) | 2008-12-26 | 2009-10-28 | Industrial computer capable of dust prevention and resistant to vibration |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080134743A KR100934124B1 (ko) | 2008-12-26 | 2008-12-26 | 분진 방지 및 진동에 강한 산업용 컴퓨터 |
KR10-2008-0134743 | 2008-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010074398A2 WO2010074398A2 (ko) | 2010-07-01 |
WO2010074398A3 true WO2010074398A3 (ko) | 2010-08-12 |
Family
ID=41684784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/006250 WO2010074398A2 (ko) | 2008-12-26 | 2009-10-28 | 분진 방지 및 진동에 강한 산업용 컴퓨터 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8472184B2 (ko) |
KR (1) | KR100934124B1 (ko) |
CN (1) | CN102216871B (ko) |
WO (1) | WO2010074398A2 (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110108250A1 (en) * | 2009-11-09 | 2011-05-12 | Alex Horng | Heat Dissipating device |
EP2503257B9 (de) * | 2011-03-22 | 2014-06-04 | Erwin Gasser | Shelter |
US8830680B2 (en) * | 2011-07-18 | 2014-09-09 | Public Wireless, Inc. | Systems and methods for heat extraction in a power supply |
CN103209567A (zh) * | 2012-01-13 | 2013-07-17 | 鸿富锦精密工业(深圳)有限公司 | 密闭式控制装置 |
CN103249275A (zh) * | 2012-02-07 | 2013-08-14 | 鸿富锦精密工业(深圳)有限公司 | 散热*** |
CN103634703A (zh) * | 2012-08-24 | 2014-03-12 | 四川联友电讯技术有限公司 | 高散热数字配线架 |
US11026347B2 (en) * | 2012-12-21 | 2021-06-01 | Smart Embedded Computing, Inc. | Configurable cooling for rugged environments |
CN104597997A (zh) * | 2015-02-05 | 2015-05-06 | 吴传涛 | 一种散热模组 |
US10638639B1 (en) * | 2015-08-07 | 2020-04-28 | Advanced Cooling Technologies, Inc. | Double sided heat exchanger cooling unit |
JP6426595B2 (ja) * | 2015-12-24 | 2018-11-21 | Necプラットフォームズ株式会社 | 冷却装置 |
DE102016119095B4 (de) * | 2016-10-07 | 2018-11-22 | Fujitsu Technology Solutions Intellectual Property Gmbh | Computersystem |
CN106774751B (zh) * | 2017-01-03 | 2023-05-05 | 北京飞讯数码科技有限公司 | 一种外表面散热装置 |
JP2019003965A (ja) * | 2017-06-09 | 2019-01-10 | 富士通株式会社 | 電子機器 |
JP7041746B2 (ja) * | 2017-12-08 | 2022-03-24 | ケーエムダブリュ・インコーポレーテッド | 電子素子の放熱装置 |
CN112667036A (zh) * | 2019-10-16 | 2021-04-16 | 北京百度网讯科技有限公司 | 计算机服务器 |
KR102187472B1 (ko) | 2020-06-23 | 2020-12-07 | 장영술 | 열전소자 방식의 방열핀 조립체를 이용한 산업용 컴퓨터 |
CN112083772B (zh) * | 2020-09-09 | 2022-03-04 | 齐鲁理工学院 | 一种节能的多功能计算机科学技术设备 |
CN112486297A (zh) * | 2020-11-30 | 2021-03-12 | 武汉东湖学院 | 一种新型计算机散热冷却装置 |
CN112762973B (zh) * | 2020-12-23 | 2022-03-22 | 安徽科达自动化集团股份有限公司 | 防尘防水溅浸入的光电编码器 |
CN112930064B (zh) * | 2021-03-18 | 2022-10-28 | 江苏伟正电气科技有限公司 | 一种具有防渗水及耐寒的工业传感器核心部件用安装柜 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010041932A (ko) * | 1998-03-16 | 2001-05-25 | 이목형 | 컴퓨터의 냉각 시스템 |
JP2002100892A (ja) * | 2000-09-25 | 2002-04-05 | Hitachi Ltd | 密閉型電子機器筐体 |
JP2003069269A (ja) * | 2001-08-23 | 2003-03-07 | Furukawa Electric Co Ltd:The | 密閉型冷却装置 |
KR20030097299A (ko) * | 2002-06-20 | 2003-12-31 | 삼성전자주식회사 | 컴퓨터 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4807441A (en) * | 1987-07-17 | 1989-02-28 | Allied-Signal Inc. | Cooling system for a sealed enclosure |
JP4290232B2 (ja) * | 1997-02-24 | 2009-07-01 | 富士通株式会社 | ヒートシンクとそれを使用する情報処理装置 |
US6113485A (en) * | 1997-11-26 | 2000-09-05 | Advanced Micro Devices, Inc. | Duct processor cooling for personal computer |
KR100317451B1 (ko) * | 1998-11-04 | 2001-12-22 | 이태랑 | 전자기기 냉각방법 및 이를 이용한 전자기기 냉각장치 |
CN2398672Y (zh) * | 1999-06-28 | 2000-09-27 | 陈业朋 | 电脑cpu散热装置 |
JP2001159931A (ja) * | 1999-09-24 | 2001-06-12 | Cybernetics Technology Co Ltd | コンピュータ |
TW588932U (en) * | 2000-12-20 | 2004-05-21 | Foxconn Prec Components Co Ltd | Heat sink module |
GB0122956D0 (en) * | 2001-09-24 | 2001-11-14 | Lucas Industries Ltd | Fire resistant electronic engine controller |
TW537428U (en) * | 2002-02-08 | 2003-06-11 | Foxconn Prec Components Co Ltd | Air conducting device for computer |
US6567267B1 (en) * | 2002-02-14 | 2003-05-20 | Terry Wang | Apparatus capable of air-filtering and heat-dissipating and adapted for use in a computer |
US6690577B2 (en) * | 2002-07-02 | 2004-02-10 | Hewlett-Packard Development Company, L.P. | Air guide |
EP1623309A2 (en) * | 2003-05-13 | 2006-02-08 | Zalman Tech Co., Ltd. | Computer |
TW200506586A (en) * | 2003-08-07 | 2005-02-16 | Wincomm Corp | Fanless heat sink for computer equipment |
US7418995B2 (en) * | 2004-01-14 | 2008-09-02 | Vanner, Inc. | System for cooling environmentally sealed enclosures |
JP4408224B2 (ja) * | 2004-01-29 | 2010-02-03 | 富士通株式会社 | 放熱機能を有する筐体 |
JP2006003928A (ja) * | 2004-06-15 | 2006-01-05 | Toshiba Corp | パソコンの冷却装置 |
KR100624092B1 (ko) * | 2004-09-16 | 2006-09-18 | 잘만테크 주식회사 | 컴퓨터 |
US7251133B2 (en) * | 2004-11-29 | 2007-07-31 | Symbol Technologies, Inc. | Device with an external heat sink arrangement |
US7136286B2 (en) * | 2005-01-10 | 2006-11-14 | Aaeon Technology Inc. | Industrial computer with aluminum case having fins as radiating device |
CN1877825A (zh) * | 2005-06-08 | 2006-12-13 | 上海雷硕医疗器械有限公司 | 一种医用仪器的散热结构 |
KR100683412B1 (ko) * | 2005-06-11 | 2007-02-20 | 삼성전자주식회사 | 컴퓨터 |
US20070089862A1 (en) * | 2005-10-20 | 2007-04-26 | Cui-Jun Lu | Heat dissipation device including dust mask |
US7391610B2 (en) * | 2006-09-29 | 2008-06-24 | Rockwell Automation Technologies, Inc. | Thermal cooling of industrial electronic module by conductive structure |
US7643301B1 (en) * | 2007-08-20 | 2010-01-05 | Nvidia Corporation | Heat exchanger system and method for circulating external air about a chipset |
WO2010028350A1 (en) * | 2008-09-08 | 2010-03-11 | Intergraph Technologies Company | Ruggedized computer capable of operating in high-temperature environments |
-
2008
- 2008-12-26 KR KR1020080134743A patent/KR100934124B1/ko active IP Right Grant
-
2009
- 2009-10-28 CN CN200980145952.XA patent/CN102216871B/zh active Active
- 2009-10-28 US US13/129,517 patent/US8472184B2/en active Active
- 2009-10-28 WO PCT/KR2009/006250 patent/WO2010074398A2/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010041932A (ko) * | 1998-03-16 | 2001-05-25 | 이목형 | 컴퓨터의 냉각 시스템 |
JP2002100892A (ja) * | 2000-09-25 | 2002-04-05 | Hitachi Ltd | 密閉型電子機器筐体 |
JP2003069269A (ja) * | 2001-08-23 | 2003-03-07 | Furukawa Electric Co Ltd:The | 密閉型冷却装置 |
KR20030097299A (ko) * | 2002-06-20 | 2003-12-31 | 삼성전자주식회사 | 컴퓨터 |
Also Published As
Publication number | Publication date |
---|---|
US20110228470A1 (en) | 2011-09-22 |
CN102216871A (zh) | 2011-10-12 |
US8472184B2 (en) | 2013-06-25 |
CN102216871B (zh) | 2014-07-23 |
KR100934124B1 (ko) | 2009-12-29 |
WO2010074398A2 (ko) | 2010-07-01 |
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