WO2010074398A3 - 분진 방지 및 진동에 강한 산업용 컴퓨터 - Google Patents

분진 방지 및 진동에 강한 산업용 컴퓨터 Download PDF

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Publication number
WO2010074398A3
WO2010074398A3 PCT/KR2009/006250 KR2009006250W WO2010074398A3 WO 2010074398 A3 WO2010074398 A3 WO 2010074398A3 KR 2009006250 W KR2009006250 W KR 2009006250W WO 2010074398 A3 WO2010074398 A3 WO 2010074398A3
Authority
WO
WIPO (PCT)
Prior art keywords
heatsink
case
heat
industrial computer
dust
Prior art date
Application number
PCT/KR2009/006250
Other languages
English (en)
French (fr)
Other versions
WO2010074398A2 (ko
Inventor
장영술
Original Assignee
에이스트로닉스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이스트로닉스 주식회사 filed Critical 에이스트로닉스 주식회사
Priority to CN200980145952.XA priority Critical patent/CN102216871B/zh
Priority to US13/129,517 priority patent/US8472184B2/en
Publication of WO2010074398A2 publication Critical patent/WO2010074398A2/ko
Publication of WO2010074398A3 publication Critical patent/WO2010074398A3/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 분진 방지 및 진동에 강한 산업용 컴퓨터에 관한 것으로서 케이스를 밀폐하도록 케이스 외면에 방열핀 조립체를 설치하고, 발열부품과 방열핀 사이를 연통하는 순환파이프 또는 발열부품과 방열핀 사이의 열을 전도하는 히트파이프를 포함하여 분진이 발생되는 것이 방지된 상태에서 방열이 이루어지는 가능한 산업용 컴퓨터를 제공한다. 본 발명은 순차적으로 적층된 발열부품, 히트싱크 및 냉각팬을 포함한 인쇄회로기판, 내부에 인쇄회로기판이 설치되며 상부에는 하나 이상의 통공이 형성되고 하부에는 개구된 윈도우가 형성된 측면부를 갖는 케이스, 내면에는 내부방열핀이 상하 간에 지그재그 형태로 배열되고 외면에는 외부방열핀이 일정 간격으로 이격 형성된 방열면과, 방열면을 둘러싸도록 케이스에 결합되어 케이스와의 사이에 밀폐공간을 제공하는 측면부를 갖는 방열핀 조립체 및 냉각팬과 케이스 사이를 연통하는 순환파이프를 포함하는 산업용 컴퓨터를 개시한다. 이에 따라, 본 발명은 산업 현장에서 발생되는 먼지의 유입이 차단되고 냉각팬에 의한 케이스 내부의 분진 발생이 방지되는 효과가 있다.
PCT/KR2009/006250 2008-12-26 2009-10-28 분진 방지 및 진동에 강한 산업용 컴퓨터 WO2010074398A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980145952.XA CN102216871B (zh) 2008-12-26 2009-10-28 防粉尘及抗振动的产业用电脑
US13/129,517 US8472184B2 (en) 2008-12-26 2009-10-28 Industrial computer capable of dust prevention and resistant to vibration

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080134743A KR100934124B1 (ko) 2008-12-26 2008-12-26 분진 방지 및 진동에 강한 산업용 컴퓨터
KR10-2008-0134743 2008-12-26

Publications (2)

Publication Number Publication Date
WO2010074398A2 WO2010074398A2 (ko) 2010-07-01
WO2010074398A3 true WO2010074398A3 (ko) 2010-08-12

Family

ID=41684784

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/006250 WO2010074398A2 (ko) 2008-12-26 2009-10-28 분진 방지 및 진동에 강한 산업용 컴퓨터

Country Status (4)

Country Link
US (1) US8472184B2 (ko)
KR (1) KR100934124B1 (ko)
CN (1) CN102216871B (ko)
WO (1) WO2010074398A2 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110108250A1 (en) * 2009-11-09 2011-05-12 Alex Horng Heat Dissipating device
EP2503257B9 (de) * 2011-03-22 2014-06-04 Erwin Gasser Shelter
US8830680B2 (en) * 2011-07-18 2014-09-09 Public Wireless, Inc. Systems and methods for heat extraction in a power supply
CN103209567A (zh) * 2012-01-13 2013-07-17 鸿富锦精密工业（深圳）有限公司 密闭式控制装置
CN103249275A (zh) * 2012-02-07 2013-08-14 鸿富锦精密工业（深圳）有限公司 散热***
CN103634703A (zh) * 2012-08-24 2014-03-12 四川联友电讯技术有限公司 高散热数字配线架
US11026347B2 (en) * 2012-12-21 2021-06-01 Smart Embedded Computing, Inc. Configurable cooling for rugged environments
CN104597997A (zh) * 2015-02-05 2015-05-06 吴传涛 一种散热模组
US10638639B1 (en) * 2015-08-07 2020-04-28 Advanced Cooling Technologies, Inc. Double sided heat exchanger cooling unit
JP6426595B2 (ja) * 2015-12-24 2018-11-21 Ｎｅｃプラットフォームズ株式会社 冷却装置
DE102016119095B4 (de) * 2016-10-07 2018-11-22 Fujitsu Technology Solutions Intellectual Property Gmbh Computersystem
CN106774751B (zh) * 2017-01-03 2023-05-05 北京飞讯数码科技有限公司 一种外表面散热装置
JP2019003965A (ja) * 2017-06-09 2019-01-10 富士通株式会社 電子機器
JP7041746B2 (ja) * 2017-12-08 2022-03-24 ケーエムダブリュ・インコーポレーテッド 電子素子の放熱装置
CN112667036A (zh) * 2019-10-16 2021-04-16 北京百度网讯科技有限公司 计算机服务器
KR102187472B1 (ko) 2020-06-23 2020-12-07 장영술 열전소자 방식의 방열핀 조립체를 이용한 산업용 컴퓨터
CN112083772B (zh) * 2020-09-09 2022-03-04 齐鲁理工学院 一种节能的多功能计算机科学技术设备
CN112486297A (zh) * 2020-11-30 2021-03-12 武汉东湖学院 一种新型计算机散热冷却装置
CN112762973B (zh) * 2020-12-23 2022-03-22 安徽科达自动化集团股份有限公司 防尘防水溅浸入的光电编码器
CN112930064B (zh) * 2021-03-18 2022-10-28 江苏伟正电气科技有限公司 一种具有防渗水及耐寒的工业传感器核心部件用安装柜

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010041932A (ko) * 1998-03-16 2001-05-25 이목형 컴퓨터의 냉각 시스템
JP2002100892A (ja) * 2000-09-25 2002-04-05 Hitachi Ltd 密閉型電子機器筐体
JP2003069269A (ja) * 2001-08-23 2003-03-07 Furukawa Electric Co Ltd:The 密閉型冷却装置
KR20030097299A (ko) * 2002-06-20 2003-12-31 삼성전자주식회사 컴퓨터

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807441A (en) * 1987-07-17 1989-02-28 Allied-Signal Inc. Cooling system for a sealed enclosure
JP4290232B2 (ja) * 1997-02-24 2009-07-01 富士通株式会社 ヒートシンクとそれを使用する情報処理装置
US6113485A (en) * 1997-11-26 2000-09-05 Advanced Micro Devices, Inc. Duct processor cooling for personal computer
KR100317451B1 (ko) * 1998-11-04 2001-12-22 이태랑 전자기기 냉각방법 및 이를 이용한 전자기기 냉각장치
CN2398672Y (zh) * 1999-06-28 2000-09-27 陈业朋 电脑cpu散热装置
JP2001159931A (ja) * 1999-09-24 2001-06-12 Cybernetics Technology Co Ltd コンピュータ
TW588932U (en) * 2000-12-20 2004-05-21 Foxconn Prec Components Co Ltd Heat sink module
GB0122956D0 (en) * 2001-09-24 2001-11-14 Lucas Industries Ltd Fire resistant electronic engine controller
TW537428U (en) * 2002-02-08 2003-06-11 Foxconn Prec Components Co Ltd Air conducting device for computer
US6567267B1 (en) * 2002-02-14 2003-05-20 Terry Wang Apparatus capable of air-filtering and heat-dissipating and adapted for use in a computer
US6690577B2 (en) * 2002-07-02 2004-02-10 Hewlett-Packard Development Company, L.P. Air guide
EP1623309A2 (en) * 2003-05-13 2006-02-08 Zalman Tech Co., Ltd. Computer
TW200506586A (en) * 2003-08-07 2005-02-16 Wincomm Corp Fanless heat sink for computer equipment
US7418995B2 (en) * 2004-01-14 2008-09-02 Vanner, Inc. System for cooling environmentally sealed enclosures
JP4408224B2 (ja) * 2004-01-29 2010-02-03 富士通株式会社 放熱機能を有する筐体
JP2006003928A (ja) * 2004-06-15 2006-01-05 Toshiba Corp パソコンの冷却装置
KR100624092B1 (ko) * 2004-09-16 2006-09-18 잘만테크 주식회사 컴퓨터
US7251133B2 (en) * 2004-11-29 2007-07-31 Symbol Technologies, Inc. Device with an external heat sink arrangement
US7136286B2 (en) * 2005-01-10 2006-11-14 Aaeon Technology Inc. Industrial computer with aluminum case having fins as radiating device
CN1877825A (zh) * 2005-06-08 2006-12-13 上海雷硕医疗器械有限公司 一种医用仪器的散热结构
KR100683412B1 (ko) * 2005-06-11 2007-02-20 삼성전자주식회사 컴퓨터
US20070089862A1 (en) * 2005-10-20 2007-04-26 Cui-Jun Lu Heat dissipation device including dust mask
US7391610B2 (en) * 2006-09-29 2008-06-24 Rockwell Automation Technologies, Inc. Thermal cooling of industrial electronic module by conductive structure
US7643301B1 (en) * 2007-08-20 2010-01-05 Nvidia Corporation Heat exchanger system and method for circulating external air about a chipset
WO2010028350A1 (en) * 2008-09-08 2010-03-11 Intergraph Technologies Company Ruggedized computer capable of operating in high-temperature environments

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010041932A (ko) * 1998-03-16 2001-05-25 이목형 컴퓨터의 냉각 시스템
JP2002100892A (ja) * 2000-09-25 2002-04-05 Hitachi Ltd 密閉型電子機器筐体
JP2003069269A (ja) * 2001-08-23 2003-03-07 Furukawa Electric Co Ltd:The 密閉型冷却装置
KR20030097299A (ko) * 2002-06-20 2003-12-31 삼성전자주식회사 컴퓨터

Also Published As

Publication number Publication date
US20110228470A1 (en) 2011-09-22
CN102216871A (zh) 2011-10-12
US8472184B2 (en) 2013-06-25
CN102216871B (zh) 2014-07-23
KR100934124B1 (ko) 2009-12-29
WO2010074398A2 (ko) 2010-07-01

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