WO2010055872A1 - Contact à coque sphérique et procédé de fabrication - Google Patents

Contact à coque sphérique et procédé de fabrication Download PDF

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Publication number
WO2010055872A1
WO2010055872A1 PCT/JP2009/069250 JP2009069250W WO2010055872A1 WO 2010055872 A1 WO2010055872 A1 WO 2010055872A1 JP 2009069250 W JP2009069250 W JP 2009069250W WO 2010055872 A1 WO2010055872 A1 WO 2010055872A1
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WO
WIPO (PCT)
Prior art keywords
resist
spherical shell
sphere
spring
spring portion
Prior art date
Application number
PCT/JP2009/069250
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English (en)
Japanese (ja)
Inventor
眞司 村田
Original Assignee
アルプス電気株式会社
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Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Publication of WO2010055872A1 publication Critical patent/WO2010055872A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2478—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point spherical
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic

Definitions

  • the present invention relates to a spherical shell type contactor and a method for manufacturing the same, and more particularly to a spherical shell type contactor that can be suitably used as a probe arranged in an array and a method for manufacturing the same.
  • a probe card is used to perform a wafer test before separating a wafer into individual chips.
  • a terminal used for electrical connection with the wafer is a contact called a probe.
  • the conventional contactor structure can be broadly divided into a cantilever structure composed of an elongated cantilever plate arranged horizontally or inclined, and a vertical composed of a vertically extendable needle or spring standing upright in the vertical direction (height direction).
  • a cantilever structure composed of an elongated cantilever plate arranged horizontally or inclined
  • a vertical composed of a vertically extendable needle or spring standing upright in the vertical direction (height direction).
  • molds There are two structures called molds.
  • the contact of the cantilever structure is said to be advantageous in that the structure is simple and the mechanical characteristics can be easily adjusted by changing the lever length and lever width.
  • the vertical contact has a merit in that the layout of the contact is higher than that of the cantilever contact and can be arranged in an array (see Patent Document 1). .
  • this is not an ideal case where the electrode of the wafer in contact with the contact is pushed in the expansion / contraction direction of the contact, usually in the vertical direction (height direction).
  • the electrode of the wafer is in contact with the contact while being inclined due to the formation surface being inclined.
  • the external force applied from the electrode of the wafer works not only in the vertical direction (height direction) of the contact but also in any one of the horizontal directions.
  • the conventional cantilever type contactor is formed assuming only expansion and contraction in the vertical direction (height direction), when it is bent in any direction in the horizontal direction, the contactor shape is changed. Depending, it will cause irregular elastic deformation. In other words, the conventional cantilever type contactor has a problem that its elastic force depends on the directionality of the external force application direction. If the elastic force of the contact depends on the directionality of the direction in which the external force is applied, the contact cannot be reliably brought into contact with the electrode of the wafer, and it becomes difficult to accurately perform the wafer test.
  • the conventional vertical contact is formed to be vertically extendable by a spring that expands and contracts in the vertical direction (height direction) imparting a bias in the vertical direction (height direction) to the needle that becomes the contact portion. Therefore, as described above, there is a problem that the structure becomes complicated as well as the problem that the elastic force cannot be exhibited without depending on the directionality of the application direction of the external force. When the structure of the contact is complicated, it is difficult to arrange the contacts at high density, so that the merit that the array can be arranged cannot be fully utilized.
  • the present invention has been made in view of these points, and a sphere capable of exerting a large elastic force without depending on the directionality of the external force application direction and realizing it with a simple structure. It is an object of the present invention to provide a shell-type contact and a method for manufacturing the same.
  • a first embodiment of the spherical shell contactor of the present invention is a partially embedded ball in which a part of a spherical shell is embedded in a wiring board used in a probe card. It is characterized by having a spring portion that is formed in a shell shape and is provided with one or a plurality of through holes or through grooves.
  • the spring portion is curved based on the spherical curvature, the spring elastic force is uniform in the vertical direction (height direction) and the horizontal direction. Can be demonstrated. Further, the resist resin present in the spherical shell contactor during the manufacture of the spherical shell contactor can be removed from the through hole or the through groove.
  • the spherical shell-type contact of the second aspect of the present invention is the spherical shell-type contact of the first aspect, wherein the partially embedded spherical shell shape means that a portion exceeding half of the spherical shell is buried, It is characterized in that a portion that is less than half of the shell is exposed as a spring portion.
  • the spherical shell type contactor of the second aspect of the present invention since the entire spring part is formed inside the boundary part between the spring part and the wiring board, the spherical shell type contactor is strong in the horizontal direction. Even when an external force is applied, it is possible to prevent the spherical shell-type contactor from being separated from the boundary portion.
  • the spherical shell-type contact of the third aspect of the present invention is the spherical shell-type contact of the first aspect, wherein the partially embedded spherical shell shape means that a portion less than half of the spherical shell is embedded. In addition, it is characterized in that a part exceeding half of the spherical shell is exposed as a spring part.
  • a portion passing through the center of the spherical shell and perpendicular to the height direction of the spherical shell intersects with the spherical shell. Since the spherical shell contactor performs a spring action such as a pantograph expansion / contraction operation as a bent part of the part, the shape of the spherical shell contactor can be enlarged or reduced at a constant ratio when the spherical shell contactor is deformed.
  • the spherical shell contact of the fourth aspect of the present invention is characterized in that, in the spherical shell contact of the first aspect, one through hole is formed at the top of the spring portion.
  • the contact portion of the spherical shell-type contact is changed from a point contact to an annular contact by the top through hole.
  • the contact area is enlarged, and the contact object of the spherical shell contact can be easily brought into contact.
  • the spherical shell contact of the fifth aspect of the present invention is the virtual shell contact of the first aspect, wherein the through hole passes through the apex of the spring portion in the height direction at the bottom periphery of the spring portion.
  • the elastic force of the spring portion is adjusted according to the size and number of the through holes without breaking the symmetry of the spring elastic force in the spherical shell contactor. can do.
  • the spherical shell contact of the sixth aspect of the present invention is the spherical shell contact of the first aspect, wherein the through groove is formed in a slit shape from the top of the spring portion to the bottom thereof, and A plurality of rotationally symmetrical arrangements are made with a virtual axis passing through the apex of the spring portion in the height direction as a symmetry axis.
  • the elasticity of the spring portion is determined according to the width, length, or number of the through grooves without breaking the symmetry of the spring elastic force in the spherical shell type contactor.
  • the power can be adjusted.
  • the spherical shell contact of the seventh aspect of the present invention is the spherical shell contact of the sixth aspect, wherein the plurality of through grooves are formed in a spiral shape with the top of the spring portion as the center. It is characterized by.
  • the distance from the top to the bottom of the spring part becomes long, so that it is possible to make it difficult to cause permanent deformation of the spring part due to fatigue.
  • the spherical shell contact of the eighth aspect of the present invention is the spherical shell contact of the sixth aspect, wherein the through hole is the top of the spring portion and the center of the through hole is displaced from the center of the top of the spring portion.
  • One spring portion is formed, and the spring portion is divided into a plurality of independent spring pieces having different heights by one through-hole that is shifted from the top portion.
  • the plurality of spring pieces having different heights are sequentially brought into contact with the contact object in the descending order of the spring pieces.
  • the spring elastic force of the spring portion can be increased stepwise.
  • thermosetting resin for resist is thermoset on the surface of a wiring board used for a probe card.
  • a resist column forming process in which a resist column formed in a cylindrical shape, an elliptical column shape or a polygonal column shape is provided, and a resist column is thermally cured to form a partially embedded spherical shape in which a part of a sphere is embedded
  • a resist sphere having a spherical curvature can be formed by thermally curing a resist column before thermosetting.
  • the spring part of the spherical shell contactor that is curved can be accurately and easily plated.
  • the manufacturing method of the spherical shell type contactor according to the second aspect of the present invention is the method of manufacturing the spherical shell type contactor according to the first aspect, wherein the resist ball has a partially embedded spherical shape in which a portion exceeding half of the spherical body is included. It is characterized in that a portion less than half of the sphere is exposed as a resist sphere by being buried.
  • a spherical shell contact in which a portion less than half of the spherical shell is exposed as a spring portion.
  • the method for manufacturing a spherical shell-type contact according to the third aspect of the present invention is the method for manufacturing the spherical shell-type contact according to the first aspect, wherein the partially embedded spherical shape of the resist sphere is a portion less than half of the sphere. As a result, it is characterized in that a portion exceeding half of the sphere is exposed as a resist sphere.
  • a plane that passes through the center of the spherical shell and intersects perpendicularly to the height direction of the spherical shell intersects the spherical shell. It is possible to form a spherical shell-type contact having the portion to be bent as a bent portion of the spring portion.
  • the method for manufacturing a spherical shell contactor according to a fourth aspect of the present invention is the method for manufacturing a spherical shell contactor according to the first aspect, wherein the pattern forming method of the thin film of the spring material in the spring portion forming step is for resist.
  • the pattern forming method of the thin film of the spring material in the spring portion forming step is for resist.
  • the contact portion of the spherical shell contact is changed from a point contact to a ring contact by the top through-hole.
  • the initial contact area of the child is enlarged, and the contact object of the spherical shell contact can be easily brought into contact.
  • a spherical shell contactor manufacturing method wherein the thin film pattern forming method of the spring material in the spring portion forming step is a resist sphere.
  • a plurality of rotationally symmetrical arrangements are made with the virtual axis passing through the apex of the spring portion in the height direction as the symmetry axis.
  • the elasticity of the spring part according to the size and the number of the through holes without breaking the symmetry of the spring elastic force in the spherical shell type contactor.
  • the power can be adjusted.
  • the manufacturing method of the spherical shell type contactor according to the sixth aspect of the present invention is the method of manufacturing the spherical shell type contactor according to the first aspect, wherein the pattern forming method of the thin film of the spring material in the spring forming step is a resist sphere.
  • Resist resin is used to form resist stripes that are arranged in a rotationally symmetrical manner with a virtual axis that protrudes linearly from the surface of the resist sphere from the top to the bottom of the resist and passes through the apex of the resist sphere in the height direction.
  • the spring according to the width, length or number of the through-grooves without breaking the symmetry of the spring elastic force in the spherical shell type contactor.
  • the elastic force of the part can be adjusted.
  • a seventh aspect of the present invention there is provided a method of manufacturing a spherical shell contactor according to the sixth aspect of the present invention, wherein the resist line and the through groove of the spring portion are the resist sphere or the top of the spring portion. It is characterized by being formed in a spiral shape with the center at the center.
  • the manufacturing method of the spherical shell type contactor of the seventh aspect of the present invention since the distance from the top to the bottom of the spring part becomes long, the permanent deformation of the spring part due to fatigue can be made difficult to occur.
  • the method for manufacturing a spherical shell-type contact according to the eighth aspect of the present invention is the method for manufacturing a spherical shell-type contact according to the first aspect, wherein there are two or more types of resist spheres. Is characterized in that it is determined based on the diameter, major axis, minor axis or width of the resist column.
  • the height of the resist sphere can be adjusted without changing the height of the resist pillar and its thermosetting condition. Resist spheres having different heights can be formed simultaneously and easily.
  • the partially embedded spherical shell-shaped spring portion that does not have a complicated structure exhibits a uniform spring elastic force in the vertical direction (height direction) and the horizontal direction. There is an effect that a large elastic force can be exhibited without depending on the directionality of the external force application direction, and that it can be realized with a simple structure.
  • the spring portion of the spherical shell contactor that is curved based on the spherical curvature is formed, so that it is applied in the vertical direction (height direction) and the horizontal direction.
  • the perspective view which shows the spherical shell type contact of 1st Embodiment The perspective view which shows the case where the shape which the part exceeding half of a spherical shell body is exposed is employ
  • the longitudinal cross-sectional view which shows the case where the shape which the part exceeding half of a spherical shell body is exposed is employ
  • the longitudinal cross-sectional view which shows the case where the through-hole of a spring part is shifted from the top center of a spring part in the spherical shell type contactor of 1st Embodiment 1 is a longitudinal sectional view showing a manufacturing method of a spherical shell contact according to a first embodiment in the order of A to D; Perspective view showing two types of resist cylinders with different diameters A perspective view showing a resist sphere obtained by thermosetting two types of resist cylinders having different diameters FIG.
  • FIG. 4 is a longitudinal sectional view showing a method for forming a thin film pattern of a spring material in the order of A to C in the first embodiment.
  • the perspective view which shows the state which the spherical shell type contact of 1st Embodiment pressed and contracted
  • mold contactor of 2nd Embodiment The longitudinal cross-sectional view which shows the pattern formation method of the thin film of the spring material in 2nd Embodiment in order of AC
  • the perspective view which shows the spherical shell type contactor of 3rd Embodiment, and the through groove was formed in linear form
  • the top view which shows what is the spherical shell type contactor of 3rd Embodiment, and the through groove was formed in linear form
  • the perspective view which shows the spherical shell type contactor of 3rd Embodiment, and the through groove was formed in the spiral shape
  • the plane which shows the spherical shell type contactor of a 3rd embodiment, and the penetration groove was formed in the shape of a spiral.
  • the longitudinal cross-sectional view which shows the pattern formation method of the thin film of the spring material in 3rd Embodiment in order of AC
  • the perspective view which shows the spherical shell type contactor of 4th Embodiment The longitudinal cross-sectional view which shows the spherical shell type contactor of 4th Embodiment Stress-strain diagram showing the elastic characteristics of the spherical shell contact of the fourth embodiment
  • the perspective view which shows an example of the spherical shell type contactor of other embodiment The perspective view which shows an example of the spherical shell type contactor of other embodiment
  • the perspective view which shows an example of the spherical shell type contactor of other embodiment The perspective view which shows an example of the spherical shell type contactor of other embodiment
  • FIG. 1 shows a spherical shell contact 1A of the first embodiment.
  • the spherical shell contact 1 ⁇ / b> A of the first embodiment includes a spring portion 2 and a flange portion 3, and a plurality of arrays are formed on the surface 4 a of the wiring board 4 used for the probe card. Is arranged.
  • the spring portion 2 is formed in a partially embedded spherical shell shape in which a part of a spherical shell is embedded in the wiring board 4 used for the probe card.
  • the spherical shell may not be a true spherical shell, but may be a substantially spherical shell that is close to it or an elliptical spherical shell that expands or contracts in the height direction or in the horizontal direction.
  • the partially embedded spherical shell is a shape in which a portion less than half of the spherical shell is exposed and the remaining portion (the remaining portion exceeding half of the spherical shell) is buried. 2 and 3, as shown in FIG. 2 and FIG.
  • the part exceeding half of the spherical shell was exposed as the spring part 2, and the remaining part (the remaining part less than half of the spherical shell) was buried.
  • Such a shape may be used.
  • the part that exceeds half of the spherical shell means that the horizontal plane that passes through the center of the spherical shell (the plane that intersects the height of the spherical shell perpendicularly)
  • a circle formed by intersecting the surface of the body that is, a portion including the great circle 2c of the spherical shell (a portion not including the great circle 2c of the spherical shell if the portion is less than half of the spherical shell).
  • one or a plurality of through holes or through grooves are formed in the spring portion 2 as a common matter of the embodiments.
  • one through-hole 5 is formed in the top 2t of the spring portion 2 that is a contact portion of the spherical shell contact 1A with a wafer electrode (not shown).
  • the center 5c of the through hole 5 may be formed at the top center 2tc of the spring portion 2, or the top hole 2t of the spring portion 2 as shown in FIG. Although it is located, the center 5 c of the through hole 5 may be formed at a position shifted from the top center 2 tc of the spring portion 2.
  • the outer diameter is 100 ⁇ m to 200 ⁇ m in terms of the spherical shell diameter
  • the spherical shell thickness is 1 ⁇ m to 20 ⁇ m
  • the height is about 50 ⁇ m to 100 ⁇ m.
  • the pitch interval of the spring portions 2 is 100 ⁇ m to 500 ⁇ m.
  • values other than these values may be selected, and other values may be selected in the first embodiment. It does not mean that it cannot be technically created.
  • a Ni-based spring alloy such as Ni-P or Ni-Co is selected. Since the material of the spring part 2 is selected from the viewpoint of improving its spring characteristics, a highly conductive material such as Au is provided on the surface of the spring part 2 in order to improve the conductivity of the spherical shell contact 1A. It is preferable to form a conductive portion (not shown) in the spring portion 2 by forming a thin film.
  • the flange portion 3 is a thin film formed uniformly on the surface 4a of the wiring board 4 on which the spring portion 2 is formed.
  • the wafer and wiring connected to the conductive pattern of the wiring board 4 and in contact with the spherical shell contact 1A It plays a role of conducting the plate 4.
  • the flange 3 is auxiliary formed when the conductive pattern of the wiring board 4 does not exist below the spring 2. Therefore, the conductive pattern of the wiring board 4 exists below the spring part 2, and the conductive part formed on the surface of the spring part 2 or the spring part 2 makes the wafer and the wiring board 4 conductive. When not used as a part, it is not necessary to form the collar part 3 on the spherical shell contact 1A.
  • FIG. 5 shows the manufacturing method of the spherical shell contact 1A of the first embodiment in the order of steps from A to D.
  • the spherical shell contact 1A of the first embodiment is manufactured through a resist pillar forming step, a resist sphere forming step, a spring portion forming step, and a resist sphere removing step in this order.
  • the resist thermosetting resin is uniformly applied to a thickness of about 100 ⁇ m on the surface 4a of the wiring board 4 used in the probe card, leaving a cylindrical shape.
  • the resist cylinder 11 is provided by performing an appropriate patterning.
  • the resist cylinder 11 is formed without being thermally cured.
  • the resist cylinder 11 is formed only by exposure and development. The diameter and height of the resist cylinder 11 will be described in the next step.
  • the resist cylinder 11 is thermally cured at 130 ° C. to deform the resist cylinder 11 into a partially embedded sphere shape.
  • resist spheres 12 are formed on the surface 4 a of the wiring board 4.
  • the partially embedded sphere shape of the resist sphere 12 is a shape in which a part of the sphere is embedded.
  • the partially-embedded spherical shape may be a shape in which more than half of the sphere is buried and less than half of the sphere is exposed, or half of the sphere A shape in which a portion that is not filled is buried and a portion that exceeds half of the sphere is exposed as the resist sphere 12 may be used. This is selected according to the shape of the spring part 2 to be formed.
  • the resist sphere When forming a resist sphere with a shape where less than half of the sphere is exposed, set the height lower than the diameter of the resist cylinder, set the thermosetting temperature low, or set the thermosetting time short.
  • the resist sphere is formed under conditions such as On the other hand, when forming a resist sphere with a shape in which more than half of the sphere is exposed, the height of the resist cylinder is set high, the thermosetting temperature is set high, or the thermosetting time is set.
  • the resist sphere is formed under conditions such as setting it long.
  • the height of the resist spheres 12 is determined based on the diameter of the resist cylinder 11. This will be described with reference to FIGS.
  • FIG. 6 shows two types of resist cylinders 11A and 11B having the same height and different diameters.
  • FIG. 7 shows the two types of resist cylinders 11A and 11B shown in FIG. 6 thermally cured under the same thermosetting conditions. Two types of resist spheres 12A and 12B are shown.
  • the diameter of the resist cylinder 11A that sets the height of the resist sphere 12A to 90 ⁇ m is set to 130 ⁇ m.
  • the diameter of the resist cylinder 11B that sets the height of the sphere 12B to 75 ⁇ m is set to 100 ⁇ m.
  • the heights of these two types of resist cylinders 11A and 11B are set equal to 90 ⁇ m.
  • the resist cylinder 11A having a diameter of 130 ⁇ m becomes a resist sphere 12A having a diameter of 150 ⁇ m and a height of 90 ⁇ m.
  • the resist cylinder 11B having a diameter of 100 ⁇ m is a resist sphere 12B having a diameter of 120 ⁇ m and a height of 75 ⁇ m.
  • the spring portion forming step a thin film of spring material is formed on the surface of the resist sphere 12 as shown in FIG. 5C.
  • the spring material Ni-based spring alloys such as Ni-P and Ni-Co are selected.
  • the spring part 2 of the spherical shell contact 1 ⁇ / b> A is formed on the surface of the resist sphere 12.
  • the spring portion 2 has a partially embedded spherical shell shape in which a part of a spherical shell is embedded, and is formed in a shape in which one or a plurality of through holes 5 or through grooves are provided. .
  • the shape of the spring portion 2 is a partially embedded spherical shell shape having one through hole 5.
  • the conductive portion may be formed on the spring portion 2 by forming a thin film of a good conductive material such as Au on the surface of the spring portion 2 by sputtering or the like.
  • the spring material thin film pattern forming method includes a seed film forming process, a resist pin forming process, a plating process, a resist removing process, and a seed film removing process.
  • a seed film 21 is formed on the surface 4a of the wiring board (see FIG. 5B) 4 on which the resist spheres 12 are formed.
  • the material of the seed film 21 is a thin film having a thickness of about 0.3 ⁇ m using a highly conductive metal such as a two-layer film of Ti and Cu, and is formed by sputtering or the like.
  • a resist resin is applied to the surface 4a of the wiring board 4 on which the seed film 21 is formed to form a resist film.
  • the thickness of the resist film is set to about 150 ⁇ m.
  • the resist film 13 is patterned to form a pin-shaped resist pin 13 on the top of the resist sphere 12. When a plurality of resist spheres 12 are formed, a resist film is left between the resist spheres 12.
  • a plating film 22 thinner than the height of the resist pin 13 is formed on the surface of the resist sphere 12 on which the resist pin 13 is formed.
  • the thickness of the plating film 22 is about 10 ⁇ m.
  • the spring portion 2 having one through hole 5 in the top portion 2t is formed on the surface of the resist sphere 12.
  • Ni-based spring alloys such as Ni—P and Ni—Co are selected as the plating metal.
  • the flange portion 3 of the spherical shell contact 1 ⁇ / b> A is formed along with the formation of the spring portion 2. Note that the flange 3 is not formed unless there is a gap between the resist film 14 left between the resist spheres 12 and the spring portion 2.
  • the resist film 14 left between the resist pins 13 and the resist spheres 12 is removed using a resist remover.
  • NMP N-methyl-2-pyrrolidone
  • the resist film 14 and the resist pin 13 left between the resist spheres 12 are removed, and the exposed seed film 21a (see FIG. 8C) 21a is removed by dry etching.
  • ion milling can be selected.
  • a resist remover is supplied from the through hole 5 or the through groove of the spring portion 2 as shown in FIG. 5D. Thereby, the resist sphere 12 dissolved from the through hole or the through groove is removed.
  • a resist remover is supplied from the through hole 5 of the spring portion 2 to remove the resist sphere 12.
  • a partially embedded spherical shell-shaped spring portion 2 in which one through hole 5 is formed is formed.
  • the spring portion 2 is curved based on the spherical curvature, so that a uniform spring elastic force can be exhibited in the vertical direction (height direction) and the horizontal direction.
  • the resist resin present in the spherical shell contact 1A can be removed from the through hole 5 or the through groove.
  • the circle 2c portion can be a bent portion of the spring portion 2. That is, when the spherical shell contact 1A is pushed in the vertical direction (height direction), as shown in FIG. 9, the great circle 2c portion of the spherical shell is bent, so that the spherical shell contact 1A becomes a pantograph. It performs a spring action like a telescopic action. Therefore, the shape of the spherical shell contact 1A can be enlarged or reduced at a certain ratio when the spring is deformed.
  • one through hole 5 of the spring portion 2 is formed at the top 2t of the spring portion 2.
  • the contact portion of the spherical shell contact 1A is point contact, but when the through hole 5 is formed at the top 2t of the spring part 2, Since the contact portion of the spherical shell contactor 1A can be changed from a point contact to an annular contact, the initial contact area of the spherical shell contactor 1A is expanded, and the contact object of the spherical shell contactor 1A can be easily changed. Can be contacted. Further, as shown in FIG.
  • the manufacturing method of the spherical shell contact 1A of the first embodiment includes the above-described resist column forming step, resist sphere forming step, spring portion forming step, and resist sphere removing step.
  • the resist sphere 12 having a spherical curvature can be formed by thermosetting the resist cylinder 11 before thermosetting created in the resist column forming step in the resist sphere forming step.
  • the spring portion 2 is formed by using the surface of the resist sphere 12 as a mold, the spring portion 2 of the spherical shell contact 1A that is curved based on the spherical curvature can be plated accurately and easily.
  • the spring portion 2 is formed based on the shape, as shown in FIG. A spherical shell-type contact 1A having a spring portion 2 with a shape in which less than half of the spherical shell is exposed as shown in FIG.
  • the height of the resist spheres 12A and 12B may be determined based on the diameters of the resist cylinders 11A and 11B. That is, the height of the resist spheres 12A and 12B can be adjusted by setting the height of the resist cylinders 11A and 11B and the thermosetting conditions to be the same and changing only the diameter of the resist cylinders 11A and 11B.
  • the thickness of the resist film for forming the resist cylinders 11A and 11B must be changed appropriately, which is complicated. Forced process.
  • the resist spheres 12A and 12B are determined based on the diameters of the resist cylinders 11A and 11B, the resist spheres 12A and 12B having different heights can be simultaneously and easily formed on the same wiring board 4. it can.
  • the pattern forming method of the spring material thin film in the spring portion forming step As shown in FIGS. 8A to 8C, the pattern forming method of the plating film 22 is adopted, so that a through hole is formed in the top portion 2t of the spring portion 2. 1A can be easily produced. In addition, since the thickness of the spring portion 2 can be easily increased, the thickness can be easily set.
  • the contact portion of the spherical shell contact 1A is changed from a point contact to an annular contact by the through hole 5 of the top 2t, the spherical shell contact 1A having the through hole 5 at the top 2t of the spring portion 2
  • the initial contact area of the shell-type contact 1A is enlarged, and it can be easily brought into contact with the wafer electrode that is the contact target of the spherical shell-type contact 1A.
  • FIG. 10 is a perspective view showing a spherical shell contact 1B of the second embodiment
  • FIG. 11 is a plan view showing the spherical shell contact 1B of the second embodiment.
  • the spherical shell contact 1 ⁇ / b> B of the second embodiment includes a spring portion 2 and a flange portion 3 as in the first embodiment, and is used for a probe card.
  • a plurality of arrays are arranged on the surface 4 a of the plate 4.
  • the part other than the through hole 5 of the spring part 2 and the flange part 3 are the same as those in the first embodiment.
  • the four through-holes 6 formed in the spring portion 2 are formed in a trapezoidal shape at the periphery of the bottom portion 2 b of the spring portion 2.
  • the four through-holes 6 are arranged in a rotationally symmetrical manner with an imaginary axis passing through the apex of the spring portion 2 in the height direction as an axis of symmetry by being arranged at intervals of 90 degrees.
  • the spherical shell contactor 1B of the second embodiment is manufactured through a resist column forming step, a resist sphere forming step, a spring portion forming step, and a resist sphere removing step in this order.
  • the steps other than the spring portion forming step are the same as those in the first embodiment.
  • the spring material thin film pattern forming method in the spring portion forming process includes a seed film forming process, a resist protrusion forming process, a plating process, a resist removing process, and a seed film removing process.
  • the seed film formation step and the seed film removal step are the same as those in the first embodiment.
  • resist protrusion forming step As shown in FIG. 12A, four (a plurality) resist protrusions 15 are formed using resist resin on the periphery of the bottom 2b of the resist sphere 12 on which the seed film 21 is formed in the seed film forming step. Form.
  • the four resist protrusions 15 are arranged at 90-degree intervals, so that they are formed rotationally symmetric with a virtual axis passing through the apex of the resist sphere 12 in the height direction as a symmetry axis.
  • a plating film 22 that is thinner than the height of the resist protrusion 15 is formed on the surface of the resist sphere 12 on which the resist protrusion 15 is formed, thereby arranging them at intervals of 90 degrees.
  • the spring portion 2 having the four through-holes 6 is formed on the surface of the resist sphere 12.
  • the through holes 6 of these four spring portions 2 are arranged rotationally symmetrically with an imaginary axis passing through the apex of the spring portion 2 in the height direction as a symmetry axis.
  • the resist film 14 left between the resist protrusions 15 and the resist spheres 12 is removed using a resist remover. Except for the point that the resist pin 13 in FIG. 8 is changed to the resist protrusion 15, it is the same as the resist removing process of the first embodiment.
  • the four through holes 6 arranged at intervals of 90 degrees on the periphery of the bottom 2b of the spring 2 are spring portions 2. Is formed. These four through holes 6 are provided for the purpose of weakening the elastic force of the spring part 2 and making the spring part 2 easily contract in the height direction. However, these four through-holes 6 are formed rotationally symmetric with a virtual axis passing through the apex of the spring part 2 in the height direction as the symmetry axis, so that the geometric symmetry of the spring part 2 is maintained. Yes. As a result, the elastic force of the spring portion 2 can be adjusted according to the size and number of the through holes 6 without breaking the symmetry of the spring elastic force in the spherical shell contact 1B.
  • the spring forming step is different from that of the first embodiment. Further, the pattern forming method of the spring material thin film in the spring portion forming step is different from that of the first embodiment in that the resist pin 13 is changed to the resist protrusion 15.
  • the resist projection forming step of the spring material thin film pattern forming method four resist projections 15 arranged at intervals of 90 degrees are arranged on the periphery of the bottom portion 2b of the resist sphere 12. Since the four resist protrusions 15 are formed in a rotationally symmetrical manner with a virtual axis passing through the apex of the resist sphere 12 in the height direction as a symmetry axis, when the spring portion 2 is formed on the surface of the resist sphere 12, A spring portion 2 having four through holes 6 arranged at intervals of 90 degrees based on the four resist protrusions 15 is formed. Therefore, it is possible to form the spring portion 2 that can adjust the elastic force of the spring portion 2 according to the size and number of the through holes 6 without breaking the symmetry of the spring elastic force in the spherical shell contact 1B. it can.
  • FIG. 13 shows a perspective view of a spherical shell contact 1C of the third embodiment
  • FIG. 14 shows a plan view of the spherical shell contact 1C of the third embodiment.
  • the spherical shell type contact 1 ⁇ / b> C of the third embodiment includes a spring portion 2 and a flange portion 3, as in the first embodiment, and is used for a probe card.
  • a plurality of arrays are arranged on the surface 4 a of the plate 4.
  • the part other than the through hole 5 of the spring portion 2 and the flange portion 3 in the third embodiment are the same as those in the first embodiment.
  • the spring portion 2 is formed with four (a plurality of) through grooves 7 instead of the through holes 5.
  • These four through-grooves 7 are formed in a slit shape from the top 2t of the spring portion 2 toward the bottom 2b, and an imaginary axis passing through the apex of the spring portion 2 in the height direction is used as an axis of symmetry. Arranged in rotational symmetry.
  • the width of the through groove 7 may be set so that the width dimension increases from the top 2 t of the spring portion 2 toward the bottom 2 b, or uniform. It may be a width dimension.
  • the through groove 7 may be formed in a straight line as shown in FIGS. 13 and 14, or as shown in FIGS. 15 and 16, a spiral shape with the top 2t of the spring part 2 as the center. It may be formed.
  • the spherical shell-type contact 1C of the third embodiment is manufactured through a resist pillar forming step, a resist sphere forming step, a spring portion forming step, and a resist sphere removing step in this order.
  • the steps other than the spring portion forming step are the same as those in the first embodiment.
  • the pattern forming method of the spring material thin film in the spring portion forming process includes a seed film forming process, a resist streak forming process, a plating process, a resist removing process, and a seed film removing process.
  • the seed film formation step and the seed film removal step are the same as those in the first embodiment.
  • the resist streak forming step as shown in FIG. 17A, four (plural) pieces of resist resin are used from the top to the bottom 2b of the resist sphere 12 on which the seed film 21 is formed in the seed film forming step.
  • Resist stripes 16 are formed.
  • the four resist stripes 16 bulge linearly from the surface of the resist sphere 12.
  • the four resist stripes 16 are arranged at 90 degree intervals, so that they are arranged rotationally symmetrically with a virtual axis passing through the apex of the resist sphere 12 in the height direction as a symmetry axis.
  • the width of the resist stripe 16 may be set so that its width dimension increases from the top of the resist sphere 12 toward its bottom 2b, or it may be a uniform width.
  • a plating film 22 thinner than the height of the resist streaks 16 is formed on the surface of the resist sphere 12 on which the resist streaks 16 are formed.
  • the spring portion 2 having four through grooves 7 arranged at intervals of 90 degrees based on the resist stripes 16 is formed on the surface of the resist sphere 12.
  • the four through grooves 7 are formed in a slit shape from the top 2t of the spring portion 2 toward the bottom portion 2b, and are rotationally symmetric with a virtual axis passing through the apex of the spring portion 2 in the height direction as a symmetry axis. Is formed. Since the through groove 7 is formed based on the resist stripe 16, the width dimension of the through groove 7 is set similarly to the setting of the width of the resist stripe 16.
  • the resist film 14 left between the resist streaks 16 and the resist spheres 12 is removed using a resist remover. Except for the point that the resist pin 13 of FIG. 8 is changed to the resist stripe 16, it is the same as the resist removing process of the first embodiment.
  • the resist stripes 16 may be formed linearly around the top of the resist sphere 12 or may be formed in a spiral shape. As shown in FIGS. 13 and 14, the through groove 7 of the spring portion 2 formed based on the linear resist stripes 16 is formed in a straight line with the top portion 2 t of the spring portion 2 as the center. Further, the through groove 7 of the spring portion 2 formed based on the spiral resist stripe 16 is formed in a spiral shape with the top portion 2t of the spring portion 2 as the center, as shown in FIGS.
  • these four through grooves 7 are arranged at 90 degree intervals, so that they are arranged rotationally symmetrically with an imaginary axis passing through the apex of the spring portion 2 in the height direction as a symmetry axis.
  • the through grooves 7 are not symmetrically arranged, the elasticity in the vertical direction (height direction) and the horizontal direction varies depending on the position of the spring portion 2, but by arranging the through grooves 7 symmetrically, The elastic force of the spring portion 2 can be adjusted without breaking the symmetry of the spring elastic force in the spherical shell contact 1C.
  • the spring portion 2 when the four through grooves 7 are formed in a spiral shape around the top 2t of the spring portion 2, the spring portion 2 has a spiral shape. The distance from the top 2t to the bottom 2b is increased by that amount. If the length of the spring portion 2 is increased, the fatigue applied to the spring portion 2 is alleviated by the length, so that the permanent deformation of the spring portion 2 due to fatigue can be made difficult to occur.
  • the spring forming step is different from that of the first embodiment.
  • the pattern forming method of the spring material thin film in the spring portion forming step is different from that of the first embodiment in that the resist pin 13 is changed to the resist stripe 16 as shown in FIGS. 17A to 17C. .
  • resist streaks 16 arranged at intervals of 90 degrees are formed from the top of the resist sphere 12 to its bottom 2b.
  • the spring portion 2 having the four through grooves 7 is formed on the surface of the resist sphere 12.
  • the four through grooves 7 are formed on the basis of the four resist stripes 16 formed on the surface of the resist sphere 12, so that they are formed in a slit shape from the top 2 t of the spring portion 2 toward the bottom 2 b thereof.
  • the elastic force of the spring portion 2 can be adjusted according to the width, length, or number of the through grooves 7 without breaking the symmetry of the spring elastic force in the spherical shell contact 1C.
  • these four resist stripes 16 may be formed in a spiral shape with the top of the resist sphere 12 as the center. By doing so, these four through grooves 7 formed on the basis of the resist stripes 16 are formed in a spiral shape with the top portion 2t of the spring portion 2 as the center. As a result, as described above, since the distance from the top 2t to the bottom 2b of the spring portion 2 is increased, it is possible to prevent permanent deformation of the spring portion 2 due to fatigue.
  • FIG. 18 shows a perspective view of a spherical shell contact 1D of the fourth embodiment
  • FIG. 19 shows a longitudinal sectional view of the spherical shell contact 1D of the fourth embodiment.
  • the spherical shell contact 1D of the fourth embodiment includes a spring portion 2 and a flange portion 3 as in the first embodiment, and is used for a probe card.
  • a plurality of arrays are arranged on the surface 4 a of the plate 4.
  • the through hole 5 is the top portion 2 t of the spring portion 2, and the center 5 c of the through hole 5 is from the top center 2 tc of the spring portion 2.
  • One is formed at a shifted position (see FIG. 4).
  • the four (plurality) of through grooves 7 are arranged at intervals of 90 degrees as in the third embodiment. These four through-grooves 7 are formed in a slit shape from the top 2t of the spring portion 2 toward the bottom 2b, and an imaginary axis passing through the apex of the spring portion 2 in the height direction is used as an axis of symmetry. Arranged in rotational symmetry.
  • the spring portion 2 is divided into four independent spring pieces 9A to 9D. Also, the heights of the four independent spring pieces 9A to 9D are different from each other by the single through hole 5 that is shifted from the top 2t.
  • the through-hole 5 is formed by utilizing the manufacturing method of 1st Embodiment, and the manufacturing method of 3rd Embodiment is utilized.
  • the through groove 7 is formed, so that the manufacturing method is obtained by adding the manufacturing method of the first embodiment and the manufacturing method of the third embodiment.
  • the resist pin 13 and the resist stripe 16 may be formed at the same time, or may be formed first.
  • the spring portion 2 of the spherical shell type contact 1D of the fourth embodiment as shown in FIGS. 18 and 19, as described above, the one through hole 5 shifted from the top center 2tc and the interval of 90 degrees. There are four through grooves 7 arranged. Further, the spring portion 2 is divided into four independent spring pieces 9A to 9D having different heights by the through holes 5 and the through grooves 7. By these four independent spring pieces 9A to 9D, the elastic characteristics of the spring portion 2 of the spherical shell contactor 1D behave differently from the other embodiments.
  • FIG. 20 shows a stress-strain diagram in the spherical shell contact 1D of the fourth embodiment.
  • the numbers 1 to 4 shown in FIG. 20 indicate the number of contacts of the spring pieces 9A to 9D that are in contact with the wafer electrode. If the heights of the four independent spring pieces 9A to 9D in the spring portion 2 are different, they come into contact in descending order from the highest spring piece 9A when contacting the wafer electrode. When the number of contacts of the spring pieces 9A to 9D is one, the spring pieces 9A to 9D are distorted with a slight stress. However, as the number of contacts of the spring pieces 9A to 9D increases to 2, 3, and 4, a large stress is required to distort the spring pieces 9A to 9D.
  • This phenomenon changes stepwise depending on the number of contacts of the spring pieces 9A to 9D. Therefore, in the initial contact stage of the spring pieces 9A to 9D, the spring part 2 is easily bent, and as the pushing amount of the spring part 2 increases, the number of contacts of the spring pieces 9A to 9D increases, and the elastic force of the spring part 2 also increases. Therefore, even when the heights of the plurality of electrodes formed on the wafer are different, the plurality of spherical shell-type contacts 1D are appropriately brought into contact with all the electrodes, respectively. Can do.
  • the partially embedded spherical shell-shaped spring part 2 having no complicated structure has a uniform spring elastic force in the vertical direction (height direction) and the horizontal direction. This produces the effect of exerting a large elastic force without depending on the directionality of the direction in which the external force is applied, and can be realized with a simple structure.
  • the spring portion 2 of the spherical shell contactor that is curved based on the spherical curvature is formed, so that the vertical direction (height direction) ) And the above-mentioned spherical shell-type contactor that appropriately corresponds to the external force applied in the horizontal direction can be produced accurately and easily.
  • FIG. 21 shows a spherical shell-type contact 1E according to an embodiment obtained by adding the first and second embodiments. That is, the spherical shell-type contact 1E according to the embodiment in which one circular through hole 5 is provided at the top 2t of the spring part 2 and four rectangular through holes 6 are provided around the bottom 2b of the spring part 2. It has become.
  • FIG. 22 shows a spherical shell type contact 1F according to an embodiment obtained by adding the second and third embodiments. That is, four rectangular through holes 6 are provided around the bottom 2b of the spring portion 2, and four through grooves 7 arranged at intervals of 90 degrees from the top 2t of the spring 2 to the bottom 2b are provided. In this embodiment, the spherical shell contact 1F is provided.
  • FIG. 23 shows a spherical shell-type contact 1G according to an embodiment obtained by adding the first to third embodiments. That is, one circular through hole 5 is provided at the top 2t of the spring portion 2, four rectangular through holes 6 are provided around the bottom 2b of the spring 2, and the top 2t to the bottom 2b of the spring 2 are provided.
  • the spherical shell contact 1G of the embodiment in which four through grooves 7 arranged at intervals of 90 degrees are provided.
  • the resist column 11 may not be a columnar shape but may be an elliptical column shape or a polygonal column shape.
  • the number of polygonal prisms increases as the number of polygonal columns increases, such as an octagonal column shape or a dodecagonal column shape, rather than a triangular column shape.
  • the diameter is a resist cylinder, but the diameter is long or short if it is an elliptical column, and the width is wide if it is a polygonal column. To the standard.

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

L'invention porte sur un contact à coque sphérique qui peut présenter une force élastique élevée indépendamment de la directivité d'une direction d'application de force externe grâce à l'utilisation d'une constitution simple. L'invention porte également sur un procédé pour fabriquer le contact à coque sphérique. Le contact à coque sphérique (1) est équipé d'une partie de ressort (2) en forme de coque sphérique partiellement enfouie d'une telle manière qu'une partie de la coque sphérique est enfouie dans un panneau de câblage (4) destiné à être utilisé dans une carte sonde, et qu'au moins un trou traversant est formé. Dans le procédé pour fabriquer le contact à coque sphérique (1), la partie de ressort (2) est plaquée par l’utilisation, comme moule, d'une sphère de réserve formée par le durcissement thermique d'un pilier de réserve formé sur le panneau de câblage (4).
PCT/JP2009/069250 2008-11-12 2009-11-12 Contact à coque sphérique et procédé de fabrication WO2010055872A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008289557A JP2012021773A (ja) 2008-11-12 2008-11-12 球殻型接触子およびその製造方法
JP2008-289557 2008-11-12

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WO2010055872A1 true WO2010055872A1 (fr) 2010-05-20

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014135171A (ja) * 2013-01-09 2014-07-24 Fujitsu Semiconductor Ltd 接触子及びコンタクタ
FR3022697A1 (fr) * 2014-06-24 2015-12-25 Commissariat Energie Atomique Dispositif de connexion electrique a elements de connexion comportant des membranes deformables
WO2017217253A1 (fr) * 2016-06-17 2017-12-21 アルプス電気株式会社 Contact de pression et son procédé de fabrication

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001056345A (ja) * 1999-08-19 2001-02-27 Tokyo Electron Ltd プロービングカード及びその製造方法
JP2002292689A (ja) * 2001-04-02 2002-10-09 Japan Aviation Electronics Industry Ltd コネクタの製造方法、及び開口中空部品の製造方法
JP2003124396A (ja) * 2001-10-15 2003-04-25 Taiko Denki Co Ltd 弾性電気接点
JP2004077183A (ja) * 2002-08-12 2004-03-11 Fujitsu Ltd 電気回路検査用マイクロプローブの製造方法
JP2006500583A (ja) * 2002-09-25 2006-01-05 ファイコム・コーポレーション Ｍｅｍｓ技術を利用した中空型マイクロプローブの製造方法及びこれによるマイクロプローブ
JP2006208289A (ja) * 2005-01-31 2006-08-10 Fuchigami Micro:Kk コンタクトプローブカード

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001056345A (ja) * 1999-08-19 2001-02-27 Tokyo Electron Ltd プロービングカード及びその製造方法
JP2002292689A (ja) * 2001-04-02 2002-10-09 Japan Aviation Electronics Industry Ltd コネクタの製造方法、及び開口中空部品の製造方法
JP2003124396A (ja) * 2001-10-15 2003-04-25 Taiko Denki Co Ltd 弾性電気接点
JP2004077183A (ja) * 2002-08-12 2004-03-11 Fujitsu Ltd 電気回路検査用マイクロプローブの製造方法
JP2006500583A (ja) * 2002-09-25 2006-01-05 ファイコム・コーポレーション Ｍｅｍｓ技術を利用した中空型マイクロプローブの製造方法及びこれによるマイクロプローブ
JP2006208289A (ja) * 2005-01-31 2006-08-10 Fuchigami Micro:Kk コンタクトプローブカード

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014135171A (ja) * 2013-01-09 2014-07-24 Fujitsu Semiconductor Ltd 接触子及びコンタクタ
FR3022697A1 (fr) * 2014-06-24 2015-12-25 Commissariat Energie Atomique Dispositif de connexion electrique a elements de connexion comportant des membranes deformables
WO2017217253A1 (fr) * 2016-06-17 2017-12-21 アルプス電気株式会社 Contact de pression et son procédé de fabrication
CN109075482A (zh) * 2016-06-17 2018-12-21 阿尔卑斯电气株式会社 压接接触器及其制造方法
TWI649923B (zh) * 2016-06-17 2019-02-01 日商阿爾普士電氣股份有限公司 Crimp type joint and manufacturing method thereof
JPWO2017217253A1 (ja) * 2016-06-17 2019-03-28 アルプスアルパイン株式会社 圧接コンタクトとその製造方法
US10446966B2 (en) 2016-06-17 2019-10-15 Alps Alpine Co., Ltd. Spring contact and method of manufacturing same

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