WO2010044545A3 - 일체형 롤-투-롤 스퍼터 챔버 - Google Patents

일체형 롤-투-롤 스퍼터 챔버 Download PDF

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Publication number
WO2010044545A3
WO2010044545A3 PCT/KR2009/005031 KR2009005031W WO2010044545A3 WO 2010044545 A3 WO2010044545 A3 WO 2010044545A3 KR 2009005031 W KR2009005031 W KR 2009005031W WO 2010044545 A3 WO2010044545 A3 WO 2010044545A3
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WO
WIPO (PCT)
Prior art keywords
chamber
roll
chambers
integrated
film
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PCT/KR2009/005031
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English (en)
French (fr)
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WO2010044545A2 (ko
Inventor
김봉석
한기룡
김경훈
윤정상
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지.텍(주)
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Application filed by 지.텍(주) filed Critical 지.텍(주)
Publication of WO2010044545A2 publication Critical patent/WO2010044545A2/ko
Publication of WO2010044545A3 publication Critical patent/WO2010044545A3/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/206—Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

본 발명의 일체형 롤-투-롤 스퍼터 챔버는 기판의 필름에 부착된 이물질을 제거하는 전처리 공정을 수행하는 제1 챔버; 및 상기 필름 위에 물질을 증착하는 공정을 수행하는 제2 챔버를 구비하되, 상기 제1 챔버 및 상기 제2 챔버 각각의 상기 필름은 각각 제1 롤러 시스템 및 제2 롤러 시스템에 의해 연속적으로 상기 제1 챔버 및 상기 제2 챔버 각각의 작업 영역으로 이송되며, 상기 제1 챔버는 상기 제2 챔버에 대해서 서로 대향하여 마주보며 경계를 형성하는 격벽(partition)을 통해 상기 제2 챔버와 부착되어 있는 일체형의 스퍼터 챔버를 제공함에 기술적 특징이 있다. 본 발명의 일체형 롤-투-롤 스퍼터 챔버는 일체형 챔버를 제작, 유지, 보수하는데 종전에 비해 적은 비용이 소모될 뿐 아니라, 챔버 크기를 줄임으로써 작업 면적을 효율적으로 이용할 수 있으며, 탈부착 가능한 Rewinding Roller 와 Unwinding Roller를 바닥면에서 1m 내지 1.5 m 내외의 높이로 설치함으로써, 유지, 보수 작업을 할 때 종전의 크레인(crane)을 사용하지 않고 곧바로 작업이 가능하여 후속 공정을 신속히 처리할 수 있는 장점이 있다.
PCT/KR2009/005031 2008-10-13 2009-09-04 일체형 롤-투-롤 스퍼터 챔버 WO2010044545A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0100217 2008-10-13
KR1020080100217A KR100998057B1 (ko) 2008-10-13 2008-10-13 일체형 롤-투-롤 스퍼터 챔버

Publications (2)

Publication Number Publication Date
WO2010044545A2 WO2010044545A2 (ko) 2010-04-22
WO2010044545A3 true WO2010044545A3 (ko) 2010-06-24

Family

ID=42107004

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/005031 WO2010044545A2 (ko) 2008-10-13 2009-09-04 일체형 롤-투-롤 스퍼터 챔버

Country Status (2)

Country Link
KR (1) KR100998057B1 (ko)
WO (1) WO2010044545A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9115425B2 (en) 2010-10-18 2015-08-25 Electronics And Telecommunications Research Institute Thin film depositing apparatus
KR101512132B1 (ko) * 2010-10-27 2015-04-15 한국전자통신연구원 박막 증착 장치
JP2018530674A (ja) * 2015-09-21 2018-10-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェブ基材処理システム
CN108517509A (zh) * 2018-04-24 2018-09-11 广州市邦图机电科技有限公司 一种高真空卷绕式电容镀膜机的使用方法
CN111020522B (zh) * 2019-12-09 2022-05-27 王殿儒 基于气体放电型大功率电子枪的复合型基材连续镀膜***

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6082660A (ja) * 1983-10-08 1985-05-10 Konishiroku Photo Ind Co Ltd 酸化物層の形成装置
JPH0610117A (ja) * 1992-06-26 1994-01-18 Sony Corp 薄膜形成方法、薄膜形成装置、レーザー光照射装置及びボンバード装置
KR100307081B1 (ko) * 1999-10-29 2001-10-29 권용범 롤 플레이트 롤 및 롤 투 플레이트 진공증착 시스템
KR100757736B1 (ko) * 2005-12-02 2007-09-12 한국전기연구원 플라즈마 이온주입 및 증착법을 이용한 ｆｃｃｌ 제조장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6082660A (ja) * 1983-10-08 1985-05-10 Konishiroku Photo Ind Co Ltd 酸化物層の形成装置
JPH0610117A (ja) * 1992-06-26 1994-01-18 Sony Corp 薄膜形成方法、薄膜形成装置、レーザー光照射装置及びボンバード装置
KR100307081B1 (ko) * 1999-10-29 2001-10-29 권용범 롤 플레이트 롤 및 롤 투 플레이트 진공증착 시스템
KR100757736B1 (ko) * 2005-12-02 2007-09-12 한국전기연구원 플라즈마 이온주입 및 증착법을 이용한 ｆｃｃｌ 제조장치

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Publication number Publication date
KR100998057B1 (ko) 2010-12-03
KR20100041171A (ko) 2010-04-22
WO2010044545A2 (ko) 2010-04-22

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