WO2010044391A1 - Metal foil with electric resistance film and method for manufacturing the metal foil - Google Patents

Metal foil with electric resistance film and method for manufacturing the metal foil Download PDF

Info

Publication number
WO2010044391A1
WO2010044391A1 PCT/JP2009/067716 JP2009067716W WO2010044391A1 WO 2010044391 A1 WO2010044391 A1 WO 2010044391A1 JP 2009067716 W JP2009067716 W JP 2009067716W WO 2010044391 A1 WO2010044391 A1 WO 2010044391A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal foil
electric resistance
foil
resistance film
electric
Prior art date
Application number
PCT/JP2009/067716
Other languages
French (fr)
Japanese (ja)
Inventor
重雄 大坂
俊雄 黒沢
隆 夏目
Original Assignee
日鉱金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日鉱金属株式会社 filed Critical 日鉱金属株式会社
Priority to KR1020117007765A priority Critical patent/KR101384821B1/en
Priority to EP09820569.3A priority patent/EP2338680A4/en
Priority to JP2010533893A priority patent/JP5425801B2/en
Priority to US13/123,127 priority patent/US8749342B2/en
Priority to CN2009801404809A priority patent/CN102177015A/en
Publication of WO2010044391A1 publication Critical patent/WO2010044391A1/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Definitions

  • the present invention relates to a metal foil with an electric resistance film in which a film made of electric resistance is formed on a metal foil.
  • Copper foil is generally used as a wiring material for printed circuit boards. This copper foil is divided into an electrolytic copper foil and a rolled copper foil depending on the production method. The range of the copper foil can be arbitrarily adjusted from a very thin copper foil having a thickness of 5 ⁇ m to a thick copper foil having a thickness of about 140 ⁇ m.
  • copper foils are bonded to a substrate made of a resin such as epoxy or polyimide and used as a printed circuit board. Copper foils are required to have sufficient adhesive strength with the resin used as the substrate. For this reason, electrolytic copper foils generally use a rough surface called a matte surface that is formed during foil making. Is used after surface roughening treatment. Similarly, rolled copper foil is used after its surface is roughened.
  • a resin such as epoxy or polyimide
  • Patent Documents 1 and 2 Recently, it has been proposed to form a thin film layer made of an electric resistance material on a copper foil as a wiring material (see Patent Documents 1 and 2).
  • An electric resistance element is indispensable for an electronic circuit board.
  • a copper foil provided with a resistance layer is used, an electric resistance film layer formed on the copper foil is removed by using an etching solution such as cupric chloride. It is only necessary to expose the resistance element. Therefore, by incorporating the resistor into the substrate, the limited surface area of the substrate can be effectively used compared to the conventional method of mounting the chip resistor element on the substrate using the solder bonding method. Is possible.
  • the conventionally used built-in resistor is composed of one kind of substance on a copper foil.
  • two resistors and more than one resistor increase the tolerance of circuit design and reduce the man-hour than one resistor. It is an object of the present invention to provide a resistor built-in metal foil having two or more types of resistors on one metal foil.
  • the present invention 1) A copper foil with an electric resistance film having a film having a higher electric resistivity than the metal foil on the metal foil, and a plurality of electric resistance films having different electric resistances are juxtaposed on the same metal foil.
  • a layer having a high electric resistivity generally means an electric resistance film.
  • “electric resistance film” will be described.
  • cross-sectional shape means “thickness” and “width”. Even if the electrical resistance is a material having the same resistivity, the electrical resistance varies depending on the thickness and length. Therefore, the present invention includes changing the electric resistance value by changing the “thickness” and “width”, that is, the cross-sectional shape of the film. 4)
  • the plurality of electric resistance films are constituted by a combination of resistors having different electric resistivity and resistors having different cross-sectional shapes, respectively.
  • the metal with an electric resistance film according to any one of 1) to 4) above, wherein the electric resistance film is configured by placing different resistors in the length direction of the metal foil.
  • Foil 6 Any one of the above 1) to 4), wherein the plurality of electric resistance films are configured such that different resistors are placed in a direction transverse to the length direction of the metal foil. 7) The metal foil with an electric resistance film according to any one of 1) to 6) above, wherein the metal of the metal foil is copper or a copper alloy. provide.
  • the present invention also provides: 8) A cathode made of an electric resistance material is placed in a vacuum apparatus, and the metal foil is transported while facing the cathode, and the cathode is used as a target for sputtering, and an electric resistance film is formed on the metal foil.
  • a method for producing a metal foil characterized in that at least two or more cathodes are juxtaposed to face the metal foil, and a plurality of electric resistance films having different electric resistances are formed on the same metal foil.
  • a cathode made of an electric resistance material is placed in a vacuum apparatus, and the metal foil is transported while facing the cathode, and the cathode is used as a target, and a target material is formed on the metal foil.
  • a method for producing a metal foil with an electric resistance film wherein a shutter is juxtaposed between a target and the metal foil, and the film thickness is controlled by the shutter.
  • the metal foil is a copper or copper alloy foil
  • the copper foil incorporating two or more types of electric resistance film layers of the present invention it is not necessary to newly form another electric resistance element independently at the time of circuit design.
  • the electrical resistance film layer only needs to be exposed by using an etching solution such as cupric chloride, so that the solder bonding becomes unnecessary or greatly reduced, and the mounting process is remarkably simplified.
  • an etching solution such as cupric chloride
  • Another example of the present invention is shown, and shows a structure manufactured so that two types of resistance layers do not overlap.
  • An example is shown in which the resistance is different in the winding direction and the internal copper foil structure is different, and different resistors are manufactured by changing the thickness with the same resistor.
  • It is explanatory drawing which shows the example which can make the thickness of a resistance layer variable by providing a shutter between copper foil and a target, and moving this shutter mechanically.
  • It is explanatory drawing which shows the example which manufactured the resistance layers 1a and 5a from which thickness differs alternately.
  • FIG. 1a The structure of a conventional resistor built-in copper foil is shown in FIG. 1a is a built-in thin film resistor, and 1b is a base copper foil.
  • the thin film resistor 1a NiCr or the like is used, and a manufacturing method in which a copper foil is wound on the surface of the thin film resistor by a sputtering method is used.
  • 2 and 3 are explanatory views showing an example of manufacturing a conventional resistor built-in copper foil.
  • the copper foil 2c wound around the rewinding roll 2b is wound around the winding roll 2a via the rotating cooling drum 2d.
  • Argon gas is introduced into the vacuum chamber 2e, and the pressure is maintained at about 0.4 pa.
  • FIG. 3 is a plan view of the positional relationship between the target and the copper foil.
  • 2f is a cathode
  • 2g is a target
  • 2c is a copper foil
  • an arrow indicates a winding direction of the copper foil.
  • FIG. 4 shows an embodiment of the present invention.
  • 1b is a base copper foil
  • 1a and 3a are resistors, for example, NiCr.
  • the addition of 3a is the basic structure of the present invention.
  • 1a and 3a are made of the same resistor, NiCr
  • two types of built-in resistors having different thicknesses can be obtained.
  • 1a is set to 200 mm
  • 3a is set to 100 mm.
  • 5 and 6 are explanatory views showing a manufacturing example of the resistor built-in copper foil of the present invention.
  • the copper foil 2c wound around the rewinding roll 2b is wound around the winding roll 2a via the rotating cooling drum 2d.
  • FIG. 5 shows a configuration obtained by adding a second cathode 3f to the conventional method shown in FIG. 1, and FIG. 6 shows a positional relationship in a plan view. While winding the copper foil, the first cathode and the second cathode are operated simultaneously and sputtered onto the copper foil. As a result, a copper foil with a built-in resistor having the structure shown in FIG. 4 is obtained. By changing the lengths of the first and second cathodes, two types of resistors can be manufactured with arbitrary widths. Further, when the third and fourth cathodes are further added, several types of resistors can be built on one copper foil.
  • FIG. 7 shows another embodiment.
  • 1a is an example of a NiCr resistor
  • 1b is a copper foil
  • 4a is another resistor, for example CrSiO.
  • the difference between the two built-in resistors can be increased.
  • a NiCr thickness of 300 ⁇ when sputtering a thickness 500 ⁇ of CrSiO, 50 [Omega / cm 2 and 400 [Omega / cm 2 to increase two different types of internal resistors can.
  • the manufacturing method is the same as the method shown in FIGS. 5 and 6.
  • the target 3g shown in FIGS. 5 and 6 is made of CrSiO so that the cathode length of 2f is shortened so as not to overlap, and sputtering is performed. Then, the structure of FIG. 7 is formed.
  • FIG. 8 shows still another embodiment, which is a structure of a built-in copper foil having different resistances in the winding direction.
  • FIG. 8 shows a method of manufacturing different resistors by changing the thickness with the same resistor.
  • 1b is a base copper foil
  • 1a is, for example, a NiCr resistor
  • 5a is, for example, a NiCr resistor having a reduced thickness.
  • a method of manufacturing the resistor shown in FIG. 8 is shown in FIG.
  • FIG. 9 the positional relationship between the cathode 2f, the copper foil 2c, and the shutter 6a is shown in a plan view.
  • the shutter 6a in FIG. 9 can be mechanically moved to cover the target 2g. Therefore, by moving the shutter at a high speed, a partially thin resistor as shown in 5a of FIG. 8 can be produced at an arbitrary location.
  • FIG. 10 shows an embodiment in which 1a and 5a are produced alternately.
  • two or more types of thin film resistors are metal foils with built-in resistors, but the resistor built-in metal foils with two or more types of resistors are arbitrarily determined according to the circuit design.
  • the type of the electric resistance material and the selection of the film thickness and shape of the resistance film are determined in consideration of the function of the resistance element, and are not particularly limited.
  • the material used for the electric resistance element include materials such as vanadium, tungsten, zirconium, molybdenum, tantalum, nickel, and chromium.
  • it is a metal with a comparatively high electric resistance, it can each be used as an independent film
  • the material has a relatively low electrical resistance, such as aluminum, silicon, copper, iron, indium, zinc, tin, etc.
  • it should be a material whose electrical resistance is increased by alloying it with other elements.
  • electric resistance elements such as NiCr alloy and NiCrAlSi alloy are materials that are attracting attention.
  • material oxides, nitrides and silicides selected from the group of oxides, nitrides and silicides of the above elements can be used. As described above, it is to be understood that the selection of these materials is arbitrarily selected according to the circuit design and is not limited to these materials.
  • a physical surface treatment method such as sputtering, vacuum deposition, ion beam plating, chemical surface treatment such as thermal decomposition, gas phase reaction, or electroplating, It can be formed using a wet surface treatment method such as an electroless plating method.
  • the electroplating method can be manufactured at low cost.
  • the sputtering method has an advantage that a high-quality resistive element can be obtained because it is a film having a uniform thickness and isotropic.
  • the formation of the electric resistance film layer is formed according to the use of the film, and it is desirable that the adhesion method or the plating method in that case is appropriately selected according to the properties of the electric resistance film layer. I can say that.
  • a copper foil is a typical material.
  • a copper foil having a thickness of 5 to 70 ⁇ m, particularly a copper foil of 5 to 35 ⁇ m can be used.
  • the thickness of this copper foil can be arbitrarily selected according to a use, there exists a restriction
  • this invention can form an electrical resistance layer in the surface which gave the roughening process of the electrolytic copper foil or the rolled copper foil. Further, it is possible to perform a roughening treatment in which knot-shaped particles are further adhered to the mat surface of the electrolytic copper foil.
  • the roughening process to a rolled copper foil can also be performed as needed.
  • a rough surface such as a low profile copper foil having a Rz of 0.3 to 10.0 ⁇ m or a standard profile can be obtained.
  • two or more kinds of electric resistance film layers can be incorporated in these metal foils.
  • the metal foil incorporating two or more types of electric resistance film layers of the present invention it is not necessary to newly form another electric resistance element independently at the time of circuit design.
  • the electrical resistance film layer only needs to be exposed by using an etching solution such as cupric chloride, so that the solder bonding becomes unnecessary or greatly reduced, and the mounting process is remarkably simplified.
  • an etching solution such as cupric chloride
  • the solder bonding becomes unnecessary or greatly reduced, and the mounting process is remarkably simplified.
  • a resistance built-in copper foil containing several kinds of resistors can be manufactured by one manufacturing.
  • the space can be expanded and the size and weight can be reduced.
  • the degree of freedom in circuit design can be improved.
  • a single resistor built-in copper foil has an excellent effect that the design range is widened on the mounting surface of the electronic component. It is extremely useful as a substrate.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Provided is a copper foil with electric resistance films, wherein the films having electrical resistivities higher than the electrical resistivity of the metal foil are arranged on the metal foil.  The metal foil with the electric resistance films is characterized in that a plurality of electric resistance films having different electrical resistivities are arranged in parallel to each other on the same metal foil.  Conventionally used built-in resistive elements have one resistive element formed of one kind of substance on a copper foil.  However, in the case of actually mounting the resistive element, circuit design latitude is increased and man-hours are reduced more with two resistive elements and furthermore with a plurality of resistive elements, compared with the case with one resistive element.  The metal foil with built-in resistor having two or more kinds of resistive elements on one metal foil is provided.

Description

電気抵抗膜付き金属箔及びその製造方法Metal foil with electric resistance film and manufacturing method thereof
　多くの電子装置は、機能の異なる部品のハイブリットで構成されている。これらの電子装置は、近年実装面においても小型軽量化の要求があり、基板面積の縮小化あるいは能動デバイスの大規模化に対応した各部品の効率的配置が要求されている。近年、特にこれらの部品を実装する際に、薄膜の抵抗体が利用されている。本発明は、金属箔に電気抵抗からなる膜を形成した電気抵抗膜付金属箔に関する。 Many electronic devices are composed of hybrid parts with different functions. In recent years, these electronic apparatuses are also required to be reduced in size and weight in terms of mounting, and there is a demand for efficient arrangement of each component corresponding to a reduction in substrate area or an increase in the scale of active devices. In recent years, thin film resistors have been used particularly when these components are mounted. The present invention relates to a metal foil with an electric resistance film in which a film made of electric resistance is formed on a metal foil.
　プリント回路基板の配線材料として、一般に銅箔が使用されている。この銅箔は、その製造法により電解銅箔と圧延銅箔に分けられる。この銅箔は、厚さは５μｍの非常に薄い銅箔から１４０μｍ程度の厚い銅箔まで、その範囲を任意に調整することができる。 Copper foil is generally used as a wiring material for printed circuit boards. This copper foil is divided into an electrolytic copper foil and a rolled copper foil depending on the production method. The range of the copper foil can be arbitrarily adjusted from a very thin copper foil having a thickness of 5 μm to a thick copper foil having a thickness of about 140 μm.
　これら銅箔は、エポキシやポリイミド等の樹脂からなる基板に接合され、プリント回路用基板として使用される。銅箔には基板となる樹脂との接着強度を十分確保することが求められるが、その為に、電解銅箔は一般に製箔時に形成されるマット面と呼ばれる粗面を利用し、更にその上に表面粗化処理を施して使用する。又、圧延銅箔も同様にその表面に粗化処理を施して使用される。 These copper foils are bonded to a substrate made of a resin such as epoxy or polyimide and used as a printed circuit board. Copper foils are required to have sufficient adhesive strength with the resin used as the substrate. For this reason, electrolytic copper foils generally use a rough surface called a matte surface that is formed during foil making. Is used after surface roughening treatment. Similarly, rolled copper foil is used after its surface is roughened.
　最近、配線材料である銅箔に、更に電気抵抗材料からなる薄膜層を形成することが提案されている（特許文献１、２参照）。電子回路基板には、電気抵抗素子が不可欠であるが、抵抗層を備えた銅箔を使用すれば、銅箔に形成された電気抵抗膜層を、塩化第二銅等のエッチング溶液を用いて、抵抗素子を露出させるだけでよい。したがって、抵抗の基板内蔵化により、従来のようにチップ抵抗素子を、半田接合法を用いて基板上に表面実装する手法しかなかったものに比べ、限られた基板の表面積を有効に利用することが可能となる。 Recently, it has been proposed to form a thin film layer made of an electric resistance material on a copper foil as a wiring material (see Patent Documents 1 and 2). An electric resistance element is indispensable for an electronic circuit board. However, if a copper foil provided with a resistance layer is used, an electric resistance film layer formed on the copper foil is removed by using an etching solution such as cupric chloride. It is only necessary to expose the resistance element. Therefore, by incorporating the resistor into the substrate, the limited surface area of the substrate can be effectively used compared to the conventional method of mounting the chip resistor element on the substrate using the solder bonding method. Is possible.
　また、多層基板内部に抵抗素子を形成することによる設計上の制約が少なくなり、回路長の短縮が可能となることにより電気的特性の改善も図れる。したがって、抵抗層を備えた銅箔を使用すれば、半田接合が不要となるか又は大きく軽減され、軽量化・信頼性向上が図れる。このように、電気抵抗膜を内蔵した基板は多くの利点を持っている。
　しかしながら、従来は金属箔の上に、特定の電気抵抗膜を形成するに留まり、多品種の電気抵抗膜を形成するという発想はなかった。
特許第３３１１３３８号公報 特許第３４５２５５７号公報 In addition, design restrictions due to the formation of resistance elements inside the multilayer substrate are reduced, and the circuit length can be shortened, so that the electrical characteristics can be improved. Therefore, if a copper foil provided with a resistance layer is used, solder bonding becomes unnecessary or greatly reduced, and weight reduction and reliability improvement can be achieved. As described above, a substrate incorporating an electric resistance film has many advantages.
However, conventionally, there has been no idea of forming a wide variety of electric resistance films, only forming a specific electric resistance film on a metal foil.
Japanese Patent No. 331338 Japanese Patent No. 3425557
　従来利用されている内蔵抵抗体は、銅箔の上に１種類の物質で１抵抗体が構成されている。しかし、実際に実装する場合一つの抵抗体よりは、二つの抵抗体、更には複数の抵抗体の方が、回路設計の許容度の増加及び工数の低減になる。本発明は１枚の金属箔上へ２種類以上の抵抗体を持つ抵抗内蔵金属箔を提供することを課題とする。 The conventionally used built-in resistor is composed of one kind of substance on a copper foil. However, when actually mounted, two resistors and more than one resistor increase the tolerance of circuit design and reduce the man-hour than one resistor. It is an object of the present invention to provide a resistor built-in metal foil having two or more types of resistors on one metal foil.
　本発明者等は、上記課題を解決するために鋭意研究した結果、比較的簡便な方法で、１枚の金属箔上へ、２種類以上の抵抗体を持つ抵抗内蔵金属箔が有効であるとの知見を得た。 As a result of intensive studies to solve the above problems, the present inventors have found that a metal foil with a built-in resistor having two or more types of resistors is effective on a single metal foil by a relatively simple method. I got the knowledge.
　この知見に基づき、本発明は、
１）金属箔上に、該金属箔より電気抵抗率の高い膜を有する電気抵抗膜付銅箔であって、当該同一金属箔上に電気抵抗の異なる複数の電気抵抗膜が並置されていることを特徴とする電気抵抗膜付金属箔
　この場合、電気抵抗率の高い層というのは、一般に電気抵抗膜のことを意味する。以下の記載では、「電気抵抗膜」として説明する。
２）複数の電気抵抗膜の形状が同一で、それぞれ電気抵抗率が異なる抵抗体により構成されていることを特徴とする上記１）記載の電気抵抗膜付金属箔
３）複数の電気抵抗が、それぞれ断面形状が異なる抵抗体により構成されていることを特徴とする上記１）記載の電気抵抗膜付金属箔
　この場合、「断面形状」とは「厚み」と「幅」を意味する。電気抵抗は、同一抵抗率を有する材料であっても、厚さや長さによって電気抵抗が変化する。したがって、本願発明は、このような「厚み」と「幅」、すなわち膜の断面形状を変えることにより、電気抵抗値を変化させることを含むものである。
４）複数の電気抵抗膜が、それぞれ電気抵抗率が異なる抵抗体と断面形状が異なる抵抗体の組合せにより構成されていることを特徴とする上記１）記載の電気抵抗膜付金属箔
５）複数の電気抵抗膜が、金属箔の長さ方向に、異なる抵抗体が載置されて構成されていることを特徴とする上記１）～４）のいずれか一項に記載の電気抵抗膜付金属箔
６）複数の電気抵抗膜が、金属箔の長さ方向に対して横断する方向に異なる抵抗体が載置された構成であることを特徴とする上記１）～４）のいずれか一項に記載の電気抵抗膜付金属箔
７）金属箔の金属が、銅または銅合金であることを特徴とする上記１）～６）のいずれか一項に記載の電気抵抗膜付金属箔、を提供する。 Based on this finding, the present invention
1) A copper foil with an electric resistance film having a film having a higher electric resistivity than the metal foil on the metal foil, and a plurality of electric resistance films having different electric resistances are juxtaposed on the same metal foil. In this case, a layer having a high electric resistivity generally means an electric resistance film. In the following description, “electric resistance film” will be described.
2) The metal foil with an electric resistance film according to 1) above, wherein the plurality of electric resistance films have the same shape and are composed of resistors having different electric resistivities, respectively. The metal foil with an electric resistance film as described in 1) above, wherein the cross-sectional shapes are composed of resistors having different cross-sectional shapes. In this case, “cross-sectional shape” means “thickness” and “width”. Even if the electrical resistance is a material having the same resistivity, the electrical resistance varies depending on the thickness and length. Therefore, the present invention includes changing the electric resistance value by changing the “thickness” and “width”, that is, the cross-sectional shape of the film.
4) The plurality of electric resistance films are constituted by a combination of resistors having different electric resistivity and resistors having different cross-sectional shapes, respectively. The metal with an electric resistance film according to any one of 1) to 4) above, wherein the electric resistance film is configured by placing different resistors in the length direction of the metal foil. Foil 6) Any one of the above 1) to 4), wherein the plurality of electric resistance films are configured such that different resistors are placed in a direction transverse to the length direction of the metal foil. 7) The metal foil with an electric resistance film according to any one of 1) to 6) above, wherein the metal of the metal foil is copper or a copper alloy. provide.
　また、本発明は、
８）真空装置内に電気抵抗材料からなるカソードを配置し、金属箔をカソードに対面させて搬送しつつ、カソードをターゲットとしてスパッタリングし、該金属箔上にターゲット材を成膜する電気抵抗膜付金属箔の製造方法であって、金属箔に対面させて、少なくとも２つ以上のカソードを並置し、同一金属箔上に電気抵抗の異なる複数の電気抵抗膜を成膜することを特徴とする電気抵抗膜付金属箔の製造方法
９）真空装置内に電気抵抗材料からなるカソードを配置し、金属箔をカソードに対面させて搬送しつつ、カソードをターゲットとしてスパッタリングし、該金属箔上にターゲット材を成膜する電気抵抗膜付金属箔の製造方法であって、ターゲットと金属箔の間にシャッターを並置して、当該シャッターにより膜厚を制御することにより、同一金属箔上に電気抵抗の異なる複数の電気抵抗膜を成膜することを特徴とする電気抵抗膜付金属箔の製造方法
１０）金属箔が、銅又は銅合金箔であることを特徴とする上記８）又は９）記載の電気抵抗膜付金属箔の製造方法、を提供する。 The present invention also provides:
8) A cathode made of an electric resistance material is placed in a vacuum apparatus, and the metal foil is transported while facing the cathode, and the cathode is used as a target for sputtering, and an electric resistance film is formed on the metal foil. A method for producing a metal foil, characterized in that at least two or more cathodes are juxtaposed to face the metal foil, and a plurality of electric resistance films having different electric resistances are formed on the same metal foil. Manufacturing method of metal foil with resistance film 9) A cathode made of an electric resistance material is placed in a vacuum apparatus, and the metal foil is transported while facing the cathode, and the cathode is used as a target, and a target material is formed on the metal foil. A method for producing a metal foil with an electric resistance film, wherein a shutter is juxtaposed between a target and the metal foil, and the film thickness is controlled by the shutter. A method for producing a metal foil with an electric resistance film, wherein a plurality of electric resistance films having different electric resistances are formed on the same metal foil 10) The metal foil is a copper or copper alloy foil The method for producing a metal foil with an electric resistance film as described in 8) or 9) above.
　本発明の２種以上の電気抵抗膜層を内蔵した銅箔を使用することにより、回路設計の際に、新たに別の電気抵抗素子を単独に形成する必要がなく、銅箔に形成された電気抵抗膜層を、塩化第二銅等のエッチング溶液を用いて、抵抗素子を露出させるだけでよいので、半田接合が不要となるか又は大きく軽減され、実装工程が著しく簡素化されるという効果を有する。
　また、実装部品や半田数が低減される結果、スペースが拡張でき小型軽量になるという利点もある。これによって回路設計の自由度を向上させることができる。また、このように銅箔に２種以上の抵抗体が内蔵されることにより、高周波領域での信号特性が改善される効果を備えている。 By using the copper foil incorporating two or more types of electric resistance film layers of the present invention, it is not necessary to newly form another electric resistance element independently at the time of circuit design. The electrical resistance film layer only needs to be exposed by using an etching solution such as cupric chloride, so that the solder bonding becomes unnecessary or greatly reduced, and the mounting process is remarkably simplified. Have
In addition, as a result of the reduction in the number of mounted parts and solder, there is an advantage that the space can be expanded and the apparatus becomes small and light. As a result, the degree of freedom in circuit design can be improved. In addition, by incorporating two or more types of resistors in the copper foil in this way, the signal characteristics in the high frequency region are improved.
従来の抵抗層付金属箔の構造を示す説明図である。It is explanatory drawing which shows the structure of the conventional metal foil with a resistance layer. 従来の抵抗層付金属箔の製造例を示す説明図である。It is explanatory drawing which shows the manufacture example of the conventional metal foil with a resistance layer. 従来の抵抗層付金属箔の製造の際のターゲットと銅箔の位置関係を平面的に観た図である。It is the figure which looked at the positional relationship of the target and copper foil in the case of manufacture of the metal foil with a conventional resistance layer planarly. 本願発明の、銅箔上に二種類の内蔵抵抗体を作製した抵抗層付金属箔の構造の１例を示す説明図である。It is explanatory drawing which shows an example of the structure of the metal foil with a resistance layer which produced two types of built-in resistors on copper foil of this invention. 本発明の抵抗層付金属箔の製造例を示す説明図である。It is explanatory drawing which shows the manufacture example of metal foil with a resistance layer of this invention. 本発明の抵抗層付金属箔の製造の際の、ターゲットと銅箔の位置関係を平面的に観た図である。It is the figure which looked at the positional relationship of the target and copper foil planarly in the case of manufacture of the metal foil with a resistance layer of this invention. 本発明の他の例を示すもので、２種類の抵抗層が重ならないように作製した構造を示す。Another example of the present invention is shown, and shows a structure manufactured so that two types of resistance layers do not overlap. 巻取り方向での抵抗が異なった内蔵銅箔の構造であり、同じ抵抗体で厚さを変えることによって異なる抵抗体を製造する例を示す。An example is shown in which the resistance is different in the winding direction and the internal copper foil structure is different, and different resistors are manufactured by changing the thickness with the same resistor. 銅箔とターゲットとの間にシャッターを設け、このシャッターを機械的に動かすことにより、抵抗層の厚さを可変にすることができる例を示す説明図である。It is explanatory drawing which shows the example which can make the thickness of a resistance layer variable by providing a shutter between copper foil and a target, and moving this shutter mechanically. 厚さの異なる抵抗層１ａと５ａを交互に製造した例を示す説明図である。It is explanatory drawing which shows the example which manufactured the resistance layers 1a and 5a from which thickness differs alternately.
　従来の抵抗内蔵銅箔の構造を図１に示す。１ａは内蔵された薄膜抵抗体であり、１ｂはベースの銅箔である。１ａの薄膜抵抗体はＮｉＣｒ等が利用され、銅箔を巻取りながらその表面へスパッタリング方法により作り付けられる製造方法が利用されている。
　図２及び図３は、従来の抵抗内蔵銅箔の製造例を示す説明図である。図２において、２ｂの巻き戻しロールに巻かれている銅箔２ｃは、回転する冷却ドラム２ｄを介して巻取りロール２ａに巻き取られる。
　真空チャンバー２ｅ内には、アルゴンガスが導入され、圧力を約０．４ｐａに保たれる。次に、カソード２ｆに高圧電圧を印加すると、プラズマ状態となりターゲット材２ｇが飛び出し銅箔上へスパッタリングされる。
　図３は、ターゲットと銅箔の位置関係を平面的に観た図であり、２ｆはカソード、２ｇはターゲット、２ｃは銅箔で矢印は銅箔の巻取り方向を示す。 The structure of a conventional resistor built-in copper foil is shown in FIG. 1a is a built-in thin film resistor, and 1b is a base copper foil. As the thin film resistor 1a, NiCr or the like is used, and a manufacturing method in which a copper foil is wound on the surface of the thin film resistor by a sputtering method is used.
2 and 3 are explanatory views showing an example of manufacturing a conventional resistor built-in copper foil. In FIG. 2, the copper foil 2c wound around the rewinding roll 2b is wound around the winding roll 2a via the rotating cooling drum 2d.
Argon gas is introduced into the vacuum chamber 2e, and the pressure is maintained at about 0.4 pa. Next, when a high voltage is applied to the cathode 2f, the target material 2g jumps out and is sputtered onto the copper foil.
FIG. 3 is a plan view of the positional relationship between the target and the copper foil. 2f is a cathode, 2g is a target, 2c is a copper foil, and an arrow indicates a winding direction of the copper foil.
　図４は、本発明の実施例である。１ｂはベースの銅箔、１ａと３ａは抵抗体、例えばＮｉＣｒである。３ａを加えることが、本発明の基本的な構造である。
　図４の例では１ａと３ａを、同じ抵抗体であるＮｉＣｒで構成すると、厚さの異なった二種類の内蔵抵抗体とすることができる。
　例えば、５０Ω／ｃｍ２と１００Ω／ｃｍ２の、２種類のシート抵抗値の抵抗体を作る場合には、１ａを２００Åとし、３ａを１００Åの膜厚とする。
　図５及び図６は、本願発明の抵抗内蔵銅箔の製造例を示す説明図である。図５において、２ｂの巻き戻しロールに巻かれている銅箔２ｃは、回転する冷却ドラム２ｄを介して巻取りロール２ａに巻き取られる。 FIG. 4 shows an embodiment of the present invention. 1b is a base copper foil, 1a and 3a are resistors, for example, NiCr. The addition of 3a is the basic structure of the present invention.
In the example of FIG. 4, when 1a and 3a are made of the same resistor, NiCr, two types of built-in resistors having different thicknesses can be obtained.
For example, in the case of making two types of sheet resistance values of 50 Ω / cm 2 and 100 Ω / cm 2 , 1a is set to 200 mm and 3a is set to 100 mm.
5 and 6 are explanatory views showing a manufacturing example of the resistor built-in copper foil of the present invention. In FIG. 5, the copper foil 2c wound around the rewinding roll 2b is wound around the winding roll 2a via the rotating cooling drum 2d.
　この図５は、図１で示した従来方法に、第二のカソード３ｆを加えた構成であり、平面的に観た位置関係を図６に示す。銅箔を巻取りながら第一のカソードと第二のカソードは同時に動作させ銅箔へスパッタリングする。その結果、図４の構造の抵抗内蔵銅箔ができる。
　第一と第二のカソードの長さを変えることによって２種類の抵抗を任意の幅で製造出来る。また、更に第三、第四のカソードを追加していくと、１枚の銅箔上へ数種類の抵抗を内蔵させることができる。 FIG. 5 shows a configuration obtained by adding a second cathode 3f to the conventional method shown in FIG. 1, and FIG. 6 shows a positional relationship in a plan view. While winding the copper foil, the first cathode and the second cathode are operated simultaneously and sputtered onto the copper foil. As a result, a copper foil with a built-in resistor having the structure shown in FIG. 4 is obtained.
By changing the lengths of the first and second cathodes, two types of resistors can be manufactured with arbitrary widths. Further, when the third and fourth cathodes are further added, several types of resistors can be built on one copper foil.
　図７は、他の実施例である。１ａは、例えばＮｉＣｒ抵抗体、１ｂは銅箔、４ａは別の抵抗体、例えばＣｒＳｉＯとした例である。この実施例では２種類の抵抗体が、別々の物質である為、二つの内蔵抵抗の差を大きくすることが出来る。
　例えば、ＮｉＣｒ厚さを３００Å、ＣｒＳｉＯの厚さ５００Åをスパッタリングすると、５０Ω／ｃｍ２と４００Ω／ｃｍ２になり大きく異なった２種類の内蔵抵抗体が出来る。
　製造方法は、図５及び図６に示した方法と同じであるが、例えば図５及び図６に示すターゲット３ｇをＣｒＳｉＯにして、２ｆのカソード長を短くし重ならないように配置して、スパッタリングすると図７の構造ができる。 FIG. 7 shows another embodiment. 1a is an example of a NiCr resistor, 1b is a copper foil, 4a is another resistor, for example CrSiO. In this embodiment, since the two types of resistors are different materials, the difference between the two built-in resistors can be increased.
For example, a NiCr thickness of 300 Å, when sputtering a thickness 500Å of CrSiO, 50 [Omega / cm 2 and 400 [Omega / cm 2 to increase two different types of internal resistors can.
The manufacturing method is the same as the method shown in FIGS. 5 and 6. For example, the target 3g shown in FIGS. 5 and 6 is made of CrSiO so that the cathode length of 2f is shortened so as not to overlap, and sputtering is performed. Then, the structure of FIG. 7 is formed.
　図８は、さらに他の実施例であり、巻取り方向での抵抗が異なった内蔵銅箔の構造である。図８では、同じ抵抗体で厚さを変えることによって異なる抵抗体を製造する方法である。図８において、１ｂはベース銅箔、１ａは、例えばＮｉＣｒ抵抗体、５ａは厚さを薄くした、例えばＮｉＣｒ抵抗体であり、薄くした分、抵抗が高くなる。
　この図８の抵抗体を製造する方法を、図９に示す。図９では、カソード２ｆ、銅箔２ｃ、シャッター６ａの各位置関係を平面的に示してある。
　実際の装置では、図９において６ａのシャッターは、ターゲット２ｇを覆い隠すように機械的に動くことが出来る。それゆえシャッターを高速で動かすことにより、図８の５ａに示すような、部分的に薄い抵抗体を任意の場所で、作製することができる。図１０は、１ａと５ａを交互に製造した実施例である。 FIG. 8 shows still another embodiment, which is a structure of a built-in copper foil having different resistances in the winding direction. FIG. 8 shows a method of manufacturing different resistors by changing the thickness with the same resistor. In FIG. 8, 1b is a base copper foil, 1a is, for example, a NiCr resistor, and 5a is, for example, a NiCr resistor having a reduced thickness.
A method of manufacturing the resistor shown in FIG. 8 is shown in FIG. In FIG. 9, the positional relationship between the cathode 2f, the copper foil 2c, and the shutter 6a is shown in a plan view.
In an actual apparatus, the shutter 6a in FIG. 9 can be mechanically moved to cover the target 2g. Therefore, by moving the shutter at a high speed, a partially thin resistor as shown in 5a of FIG. 8 can be produced at an arbitrary location. FIG. 10 shows an embodiment in which 1a and 5a are produced alternately.
　このように、本願発明は、２種以上の薄膜抵抗体は抵抗を内蔵した金属箔であるが、２種類以上の抵抗体を持つ抵抗内蔵金属箔は、回路設計に応じて任意に決定されるものである。
　すなわち、電気抵抗材料の種類と抵抗膜の膜厚や形状の選択は、抵抗素子の機能を考慮して決定されるものであり、特に制限はない。
　電気抵抗素子の材料として用いられる例としては、例えばバナジウム、タングステン、ジルコニウム、モリブデン、タンタル、ニッケル、クロム等の材料を挙げることができる。このように電気抵抗が比較的高い金属であれば、それぞれ単独の膜として又は他の元素との合金膜として使用することができる。 As described above, in the present invention, two or more types of thin film resistors are metal foils with built-in resistors, but the resistor built-in metal foils with two or more types of resistors are arbitrarily determined according to the circuit design. Is.
That is, the type of the electric resistance material and the selection of the film thickness and shape of the resistance film are determined in consideration of the function of the resistance element, and are not particularly limited.
Examples of the material used for the electric resistance element include materials such as vanadium, tungsten, zirconium, molybdenum, tantalum, nickel, and chromium. Thus, if it is a metal with a comparatively high electric resistance, it can each be used as an independent film | membrane or an alloy film | membrane with another element.
　また、アルミニウム、シリコン、銅、鉄、インジウム、亜鉛、錫等の、比較的電気抵抗の低い材料であっても、それを他の元素と合金化することにより、電気抵抗が高くなる材料であれば、当然使用できる。
　例えば、ＮｉＣｒ合金、ＮｉＣｒＡｌＳｉ合金等の電気抵抗素子が注目されている材料である。また、上記の元素の酸化物、窒化物、ケイ化物の群から選択された材料酸化物、窒化物、ケイ化物も使用できる。上記の通り、これらの材料の選択は回路設計に応じて任意に選択されるものであり、これらの材料に制限されるものでないことは理解されるべきことである。 Even if the material has a relatively low electrical resistance, such as aluminum, silicon, copper, iron, indium, zinc, tin, etc., it should be a material whose electrical resistance is increased by alloying it with other elements. Of course, you can use it.
For example, electric resistance elements such as NiCr alloy and NiCrAlSi alloy are materials that are attracting attention. Also, material oxides, nitrides and silicides selected from the group of oxides, nitrides and silicides of the above elements can be used. As described above, it is to be understood that the selection of these materials is arbitrarily selected according to the circuit design and is not limited to these materials.
　この電気抵抗膜層の形成に際しては、スパッタリング法、真空蒸着法、イオンビームめっき法などの物理的表面処理方法、熱分解法、気相反応法などの化学的表面処理法、又は電気めっき法、無電解めっき法などの湿式表面処理法を用いて形成することができる。 In the formation of this electric resistance film layer, a physical surface treatment method such as sputtering, vacuum deposition, ion beam plating, chemical surface treatment such as thermal decomposition, gas phase reaction, or electroplating, It can be formed using a wet surface treatment method such as an electroless plating method.
　一般には、電気めっき法が低コストで製造できる利点がある。また、スパッタリング法は、均一な厚みの膜であり、かつ等方性を備えているので、品質の高い抵抗素子を得ることができるという利点がある。
　この電気抵抗膜層の形成は、膜の用途に応じて形成されるものであり、その場合の付着方法又はめっき方法は、その電気抵抗膜層の性質に応じて、適宜選択することが望ましいと言える。 In general, there is an advantage that the electroplating method can be manufactured at low cost. Further, the sputtering method has an advantage that a high-quality resistive element can be obtained because it is a film having a uniform thickness and isotropic.
The formation of the electric resistance film layer is formed according to the use of the film, and it is desirable that the adhesion method or the plating method in that case is appropriately selected according to the properties of the electric resistance film layer. I can say that.
　本願発明の抵抗膜層を備えた金属箔としては、銅箔が代表的な材料である。一般に、箔厚が５～７０μｍの銅箔、特に５～３５μｍ銅箔を使用することができる。この銅箔の厚みは、用途に応じて任意に選択できるが、製造条件からくる制約もあり、上記の範囲で製造するのが効率的である。さらに、本願発明は、電解銅箔又は圧延銅箔の粗化処理を施した面に、電気抵抗層を形成することができる。また、電解銅箔のマット面に、さらに節（ふし）こぶ状の粒子を付着させる粗化処理を行うこともできる。 As a metal foil provided with the resistive film layer of the present invention, a copper foil is a typical material. In general, a copper foil having a thickness of 5 to 70 μm, particularly a copper foil of 5 to 35 μm can be used. Although the thickness of this copper foil can be arbitrarily selected according to a use, there exists a restriction | limiting which comes from manufacturing conditions, and it is efficient to manufacture in said range. Furthermore, this invention can form an electrical resistance layer in the surface which gave the roughening process of the electrolytic copper foil or the rolled copper foil. Further, it is possible to perform a roughening treatment in which knot-shaped particles are further adhered to the mat surface of the electrolytic copper foil.
　また、必要に応じて、圧延銅箔への粗化処理も行うこともできる。上記粗化処理によって、Ｒｚ０．３～１０．０μｍの低プロファイル銅箔又は標準プロファイル等の粗化面を得ることができる。本発明は、これらの金属箔へ２種以上の電気抵抗膜層を内蔵させることができる。 Moreover, the roughening process to a rolled copper foil can also be performed as needed. By the roughening treatment, a rough surface such as a low profile copper foil having a Rz of 0.3 to 10.0 μm or a standard profile can be obtained. In the present invention, two or more kinds of electric resistance film layers can be incorporated in these metal foils.
　本発明の２種以上の電気抵抗膜層を内蔵した金属箔を使用することにより、回路設計の際に、新たに別の電気抵抗素子を単独に形成する必要がなく、銅箔に形成された電気抵抗膜層を、塩化第二銅等のエッチング溶液を用いて、抵抗素子を露出させるだけでよいので、半田接合が不要となるか又は大きく軽減され、実装工程が著しく簡素化されるという効果を有する。また、数種類の抵抗を内蔵した抵抗内蔵銅箔を、１回の製造で可能である効果もある。
　さらに、実装部品や半田数が低減される結果、スペースが拡張でき小型軽量になるという利点もある。これによって回路設計の自由度を向上させることができる。また、このように銅箔に２種以上の抵抗体が内蔵されることにより、１枚の抵抗内蔵銅箔で電子部品の実装面で設計の幅が広がるという優れた効果を有するので、プリント回路基板として極めて有用である。 By using the metal foil incorporating two or more types of electric resistance film layers of the present invention, it is not necessary to newly form another electric resistance element independently at the time of circuit design. The electrical resistance film layer only needs to be exposed by using an etching solution such as cupric chloride, so that the solder bonding becomes unnecessary or greatly reduced, and the mounting process is remarkably simplified. Have In addition, there is an effect that a resistance built-in copper foil containing several kinds of resistors can be manufactured by one manufacturing.
Furthermore, as a result of the reduction in the number of mounted parts and solder, there is an advantage that the space can be expanded and the size and weight can be reduced. As a result, the degree of freedom in circuit design can be improved. In addition, since two or more types of resistors are incorporated in the copper foil in this way, a single resistor built-in copper foil has an excellent effect that the design range is widened on the mounting surface of the electronic component. It is extremely useful as a substrate.
１ａ：内蔵された薄膜抵抗体
２ａ：巻取りロール
２ｂ：ベースの銅箔
２ｃ：巻き戻しロールに巻かれている銅箔
２ｄ：回転する冷却ドラム
２ｇ：ターゲット
３ａ：内蔵抵抗体
３ｆ：第二のカソード
３ｇ：ターゲット
４ａ：別の抵抗体
５ａ：厚さを薄くしたＮｉＣｒ抵抗体
６ａ：シャッター 1a: Built-in thin film resistor 2a: Winding roll 2b: Base copper foil 2c: Copper foil 2d wound around a rewinding roll: Rotating cooling drum 2g: Target 3a: Built-in resistor 3f: Second Cathode 3g: Target 4a: Another resistor 5a: NiCr resistor 6a with reduced thickness 6: Shutter

Claims (10)

  1. 　金属箔上に、該金属箔より電気抵抗率の高い膜を有する電気抵抗膜付銅箔であって、当該同一金属箔上に電気抵抗の異なる複数の電気抵抗膜が並置されていることを特徴とする電気抵抗膜付金属箔。 A copper foil with an electric resistance film having a film having a higher electric resistivity than the metal foil on the metal foil, wherein a plurality of electric resistance films having different electric resistances are juxtaposed on the same metal foil Metal foil with electrical resistance film.
  2. 　複数の電気抵抗膜の形状が同一で、それぞれ電気抵抗率が異なる抵抗体により構成されていることを特徴とする請求項１記載の電気抵抗膜付金属箔。 2. The metal foil with an electric resistance film according to claim 1, wherein the plurality of electric resistance films have the same shape and are made of resistors having different electric resistivity.
  3. 　複数の電気抵抗が、それぞれ断面形状が異なる抵抗体により構成されていることを特徴とする請求項１記載の電気抵抗膜付金属箔。 2. The metal foil with an electric resistance film according to claim 1, wherein the plurality of electric resistances are constituted by resistors having different cross-sectional shapes.
  4. 　複数の電気抵抗膜が、それぞれ電気抵抗率が異なる抵抗体と断面形状が異なる抵抗体の組合せにより構成されていることを特徴とする請求項１記載の電気抵抗膜付金属箔。 2. The metal foil with an electric resistance film according to claim 1, wherein the plurality of electric resistance films are constituted by a combination of a resistor having a different electric resistivity and a resistor having a different cross-sectional shape.
  5. 　複数の電気抵抗膜が、金属箔の長さ方向に、異なる抵抗体が載置されて構成されていることを特徴とする請求項１～４のいずれか一項に記載の電気抵抗膜付金属箔。 The metal with electric resistance film according to any one of claims 1 to 4, wherein the plurality of electric resistance films are configured by placing different resistors in the length direction of the metal foil. Foil.
  6. 　複数の電気抵抗膜が、金属箔の長さ方向に対して横断する方向に異なる抵抗体が載置された構成であることを特徴とする請求項１～４のいずれか一項に記載の電気抵抗膜付金属箔。 The electricity according to any one of claims 1 to 4, wherein the plurality of electric resistance films are configured such that different resistors are placed in a direction transverse to the length direction of the metal foil. Metal foil with resistive film.
  7. 　金属箔の金属が、銅または銅合金であることを特徴とする請求項１～６のいずれか一項に記載の電気抵抗膜付金属箔。 The metal foil with an electric resistance film according to any one of claims 1 to 6, wherein the metal of the metal foil is copper or a copper alloy.
  8. 　真空装置内に電気抵抗材料からなるカソードを配置し、金属箔をカソードに対面させて搬送しつつ、カソードをターゲットとしてスパッタリングし、該金属箔上にターゲット材を成膜する電気抵抗膜付金属箔の製造方法であって、金属箔に対面させて、少なくとも２つ以上のカソードを並置し、同一金属箔上に電気抵抗の異なる複数の電気抵抗膜を成膜することを特徴とする電気抵抗膜付金属箔の製造方法。 A metal foil with an electric resistance film in which a cathode made of an electric resistance material is disposed in a vacuum apparatus, and the metal foil is transported while facing the cathode, and the cathode is used as a target to form a target material on the metal foil. An electrical resistance film characterized in that at least two or more cathodes are juxtaposed to face a metal foil and a plurality of electrical resistance films having different electrical resistances are formed on the same metal foil A method for manufacturing a metal foil.
  9. 　真空装置内に電気抵抗材料からなるカソードを配置し、金属箔をカソードに対面させて搬送しつつ、カソードをターゲットとしてスパッタリングし、該金属箔上にターゲット材を成膜する電気抵抗膜付金属箔の製造方法であって、ターゲットと金属箔の間にシャッターを並置して、当該シャッターにより膜厚を制御することにより、同一金属箔上に電気抵抗の異なる複数の電気抵抗膜を成膜することを特徴とする電気抵抗膜付金属箔の製造方法。 A metal foil with an electric resistance film in which a cathode made of an electric resistance material is disposed in a vacuum apparatus, and the metal foil is transported while facing the cathode, and the cathode is used as a target to form a target material on the metal foil. In this manufacturing method, a plurality of electric resistance films having different electric resistances are formed on the same metal foil by arranging a shutter between the target and the metal foil and controlling the film thickness by the shutter. The manufacturing method of the metal foil with an electrical resistance film characterized by these.
  10. 　金属箔が、銅又は銅合金箔であることを特徴とする請求項８又は９記載の電気抵抗膜付金属箔の製造方法。 The method for producing a metal foil with an electric resistance film according to claim 8 or 9, wherein the metal foil is a copper or copper alloy foil.
PCT/JP2009/067716 2008-10-14 2009-10-13 Metal foil with electric resistance film and method for manufacturing the metal foil WO2010044391A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020117007765A KR101384821B1 (en) 2008-10-14 2009-10-13 Metal foil with electric resistance film and method for manufacturing the metal foil
EP09820569.3A EP2338680A4 (en) 2008-10-14 2009-10-13 Metal foil with electric resistance film and method for manufacturing the metal foil
JP2010533893A JP5425801B2 (en) 2008-10-14 2009-10-13 Metal foil with electric resistance film and manufacturing method thereof
US13/123,127 US8749342B2 (en) 2008-10-14 2009-10-13 Metal foil with electric resistance film and method of producing the same
CN2009801404809A CN102177015A (en) 2008-10-14 2009-10-13 Metal foil with electric resistance film and method for manufacturing the metal foil

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008264759 2008-10-14
JP2008-264759 2008-10-14

Publications (1)

Publication Number Publication Date
WO2010044391A1 true WO2010044391A1 (en) 2010-04-22

Family

ID=42106554

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/067716 WO2010044391A1 (en) 2008-10-14 2009-10-13 Metal foil with electric resistance film and method for manufacturing the metal foil

Country Status (7)

Country Link
US (1) US8749342B2 (en)
EP (1) EP2338680A4 (en)
JP (1) JP5425801B2 (en)
KR (1) KR101384821B1 (en)
CN (1) CN102177015A (en)
TW (1) TW201016865A (en)
WO (1) WO2010044391A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133567A1 (en) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Method for manufacturing metal foil provided with electrical resistance layer
JP5346408B2 (en) * 2011-03-28 2013-11-20 Ｊｘ日鉱日石金属株式会社 Metal foil provided with electric resistance film and method for manufacturing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2338680A4 (en) * 2008-10-14 2014-05-21 Jx Nippon Mining & Metals Corp Metal foil with electric resistance film and method for manufacturing the metal foil
JP2012201980A (en) * 2011-03-28 2012-10-22 Jx Nippon Mining & Metals Corp Metal foil with electric resistive layer and method for producing the same
WO2012132593A1 (en) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002115082A (en) * 2000-07-31 2002-04-19 Ga-Tek Inc Dba Gould Electronics Inc Method for forming chromium coated copper for printed circuit board
JP2002134301A (en) * 2000-09-22 2002-05-10 Ga-Tek Inc Dba Gould Electronics Inc Resistor component element having multilayered resistor material
JP3311338B2 (en) 2000-02-08 2002-08-05 ジーエイ−テック インク（ディービーエイ ゴールド エレクトロニックス インク） Method for forming chromium-coated copper for printed circuit boards

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
JPS5378050A (en) * 1976-12-21 1978-07-11 Nitto Electric Ind Co Multilayer resistance circuit board
JPS62257702A (en) * 1986-04-30 1987-11-10 イビデン株式会社 Manufacture of wiring board
TW289900B (en) * 1994-04-22 1996-11-01 Gould Electronics Inc
JP3789507B2 (en) 1995-03-30 2006-06-28 株式会社アルバック Sputtering equipment
JP3924849B2 (en) * 1997-07-04 2007-06-06 東洋紡績株式会社 Transparent conductive film and electromagnetic wave shielding filter using the same
US6622374B1 (en) * 2000-09-22 2003-09-23 Gould Electronics Inc. Resistor component with multiple layers of resistive material
EP1261241A1 (en) * 2001-05-17 2002-11-27 Shipley Co. L.L.C. Resistor and printed wiring board embedding those resistor
EP2338680A4 (en) * 2008-10-14 2014-05-21 Jx Nippon Mining & Metals Corp Metal foil with electric resistance film and method for manufacturing the metal foil

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3311338B2 (en) 2000-02-08 2002-08-05 ジーエイ−テック インク（ディービーエイ ゴールド エレクトロニックス インク） Method for forming chromium-coated copper for printed circuit boards
JP2002115082A (en) * 2000-07-31 2002-04-19 Ga-Tek Inc Dba Gould Electronics Inc Method for forming chromium coated copper for printed circuit board
JP3452557B2 (en) 2000-07-31 2003-09-29 グールド エレクトロニクス インコーポレイテッド Method of forming resistive material on copper layer used in printed circuit board and sheet material
JP2002134301A (en) * 2000-09-22 2002-05-10 Ga-Tek Inc Dba Gould Electronics Inc Resistor component element having multilayered resistor material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2338680A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346408B2 (en) * 2011-03-28 2013-11-20 Ｊｘ日鉱日石金属株式会社 Metal foil provided with electric resistance film and method for manufacturing the same
US20130344322A1 (en) * 2011-03-28 2013-12-26 Jx Nippon Mining & Metals Corporation Metal Foil Provided with Electrically Resistive Film, and Method for Producing Same
WO2012133567A1 (en) * 2011-03-31 2012-10-04 Jx日鉱日石金属株式会社 Method for manufacturing metal foil provided with electrical resistance layer

Also Published As

Publication number Publication date
JPWO2010044391A1 (en) 2012-03-15
EP2338680A1 (en) 2011-06-29
US8749342B2 (en) 2014-06-10
EP2338680A4 (en) 2014-05-21
CN102177015A (en) 2011-09-07
US20110236714A1 (en) 2011-09-29
TW201016865A (en) 2010-05-01
JP5425801B2 (en) 2014-02-26
KR101384821B1 (en) 2014-04-15
KR20110050728A (en) 2011-05-16

Similar Documents

Publication Publication Date Title
JP4332533B2 (en) Capacitor-embedded printed circuit board and manufacturing method thereof
JP5425801B2 (en) Metal foil with electric resistance film and manufacturing method thereof
US8389866B2 (en) Resin circuit board
JP2008218966A (en) Method for manufacturing printed circuit board with built-in capacitor, and printed circuit board with built-in capacitor
CN114554712A (en) Circuit board and manufacturing method thereof
US6910264B2 (en) Method for making a multilayer circuit board having embedded passive components
JP2012212761A (en) Metal foil with electrical resistance film and manufacturing method therefor
KR101012919B1 (en) flexible metal clad laminate without adhesion and method of manufacturing flexible metal clad laminate without adhesion
JP2006287138A (en) Lamination film for forming passive component, sheet type passive component, and its manufacturing method
JP2004014975A (en) Flexible circuit board with metal foil
US7241510B2 (en) Peelable circuit board foil
JP5835670B2 (en) Printed wiring board and manufacturing method thereof
JP2004071865A (en) Resistive layer laminated material and component using the same
US20130344322A1 (en) Metal Foil Provided with Electrically Resistive Film, and Method for Producing Same
JP7315102B2 (en) Resin multilayer substrate
WO2024009886A1 (en) Wiring circuit board and method for manufacturing same
JP4304659B2 (en) Metallized plastic film
WO2023017556A1 (en) Capacitor and method for manufacturing same
KR102119604B1 (en) Flexible printed circuit board and manufacturing method of the same
JP2006229097A (en) Capacitor film and manufacturing method therefor
TW202410751A (en) Printed circuit board and method of manufacturing same
JP2006310758A (en) Circuit wiring board and its manufacturing method
JP4857547B2 (en) Manufacturing method of multilayer wiring board with built-in components
JP2004071866A (en) Method of manufacturing resistive layer laminated material and method of manufacturing component using resistive layer laminated material
JP4645212B2 (en) Wiring circuit board built-in resistance element

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980140480.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09820569

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2010533893

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2009820569

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20117007765

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 13123127

Country of ref document: US