WO2010017979A1 - Verfahren und vorrichtung zur herstellung eines strukturierten gegenstands sowie strukturierter gegenstand - Google Patents
Verfahren und vorrichtung zur herstellung eines strukturierten gegenstands sowie strukturierter gegenstand Download PDFInfo
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- WO2010017979A1 WO2010017979A1 PCT/EP2009/005873 EP2009005873W WO2010017979A1 WO 2010017979 A1 WO2010017979 A1 WO 2010017979A1 EP 2009005873 W EP2009005873 W EP 2009005873W WO 2010017979 A1 WO2010017979 A1 WO 2010017979A1
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- WIPO (PCT)
- Prior art keywords
- structured
- sacrificial layer
- structuring
- base body
- structures
- Prior art date
Links
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- -1 tungsten carbides Chemical class 0.000 claims description 15
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- 238000003825 pressing Methods 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000000470 constituent Substances 0.000 claims description 9
- 238000004049 embossing Methods 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 7
- 238000000608 laser ablation Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229920002120 photoresistant polymer Polymers 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 239000002241 glass-ceramic Substances 0.000 claims description 6
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical class [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 6
- 239000002178 crystalline material Substances 0.000 claims description 5
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
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- 239000004698 Polyethylene Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000001015 X-ray lithography Methods 0.000 claims description 3
- VFYPSWGDJSPEQI-UHFFFAOYSA-N [B].[P].[Ni] Chemical compound [B].[P].[Ni] VFYPSWGDJSPEQI-UHFFFAOYSA-N 0.000 claims description 3
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000003353 gold alloy Substances 0.000 claims description 3
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004922 lacquer Substances 0.000 claims description 3
- 238000001459 lithography Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 238000003980 solgel method Methods 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/082—Construction of plunger or mould for making solid articles, e.g. lenses having profiled, patterned or microstructured surfaces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/10—Die base materials
- C03B2215/11—Metals
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/10—Die base materials
- C03B2215/12—Ceramics or cermets, e.g. cemented WC, Al2O3 or TiC
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
- C03B2215/16—Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals
- C03B2215/17—Metals or alloys, e.g. Ni-P, Ni-B, amorphous metals comprising one or more of the noble meals, i.e. Ag, Au, platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
- C03B2215/24—Carbon, e.g. diamond, graphite, amorphous carbon
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/30—Intermediate layers, e.g. graded zone of base/top material
- C03B2215/32—Intermediate layers, e.g. graded zone of base/top material of metallic or silicon material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/30—Intermediate layers, e.g. graded zone of base/top material
- C03B2215/34—Intermediate layers, e.g. graded zone of base/top material of ceramic or cermet material, e.g. diamond-like carbon
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/40—Product characteristics
- C03B2215/41—Profiled surfaces
- C03B2215/412—Profiled surfaces fine structured, e.g. fresnel lenses, prismatic reflectors, other sharp-edged surface profiles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Definitions
- the invention relates to a method and a device for producing a structured article, in particular for structuring a non-planar surface of an article, and the structured article.
- Such optical elements often also include micro-optical elements having Fresnel lens structures disposed on the surface of a transparent body.
- Blankpreß Kunststoffe In the production of these elements in high quantities preferably embossing or pressing, in particular Blankpreßclar be used with high precision. Traditionally, plastics have been used for this, in particular polymers which were structurable at relatively moderate temperatures.
- US 5,436,764 A further describes a method of press molding a micro-optical element made of glass. In this process, structures are introduced into the flat surface of a glass body during press-forming.
- the invention is based on the object, a method and an apparatus for producing a structured To provide an object, in which the structuring of a non-planar surface of an object is made possible, so that, for example, optical systems, in particular for use at shorter wavelengths, such as blue light, is made possible.
- an edge steepness of the Fresnel structures can be achieved by this method of greater than 70 ° relative to the main plane of the optical element. With many materials even flank steepnesses of up to almost 90 ° could be achieved relative to the main plane of the optical element, that is to say an almost compressive surface is produced.
- Optical systems with the optical components produced according to the invention achieve, for example, values of the numerical aperture NA of greater than 0.6.
- the invention comprises a method for producing a structured article, in particular for structuring a nonplanar surface of an article, comprising the provision of a basic body, in particular with at least one non-planar surface, the production of a structure, in particular on the at least one non-planar surface of the object, the structuring of a sacrificial layer, the transfer of the structure from the
- Sacrificial layer on a surface wherein the surface is a surface of the base body, in particular a non-planar surface of the base body or a surface on at least one further body which is attachable to the base body during the transferring .der structure of the sacrificial layer on the surface, the thickness the sacrificial layer is at least reduced or changed and thereby the surface is structured.
- the above method enables the transfer of the structure, in particular the transfer of the lateral structure and the transfer of a similar vertical structure.
- the sacrificial layer is completely consumed.
- the transfer of the structure can advantageously comprise dry etching, in particular reactive ion etching.
- this may comprise wet-chemical etching, in particular directed etching along preferred crystalline directions, for the transfer of the structure.
- the structured body may preferably be an embossing or pressing mold, in particular a blank-pressing mold for the production an optical element, in particular for the production of a glass or glass ceramic comprehensive optical element, which preferably has diffractive and / or refractive structures.
- the base body can be structured at least in part by means of grinding, polishing or lapping on the surface and can in this case, for example, a basic shape with high surface precision with a (average, maximum) deviation of better than 2 microns compared to the desired shape arise.
- the base body can be spherically, aspherically or freely formed at least in parts of the surface.
- the main body may contain or consist of components of a material selected from the group consisting of ceramic materials and crystalline materials.
- Tungsten carbides aluminum carbides, silicon carbides, titanium carbides, aluminum oxides, zirconium oxides, silicon nitrides,
- Aluminum titanates and / or aluminum sintered materials and / or mixtures of these materials in particular as
- the crystalline materials preferably comprise silicon or sapphire.
- the base body is coated with an anti-adhesive layer.
- the non-stick layer may comprise a platinum-gold alloy, in particular Pt5Au, and / or platinum, iridium and rhodium-containing alloys.
- platinum-gold alloy in particular Pt5Au
- platinum, iridium and rhodium-containing alloys platinum, iridium and rhodium-containing alloys.
- carbon layers preferably DLC (diamond like carbon), are also suitable as an anti-adhesion layer.
- the base body is structured and then applied the non-stick layer.
- the non-stick layer can be applied and patterned, in particular also be structured using a, preferably additional sacrificial layer.
- the sacrificial layer may advantageously comprise metals and / or metallic alloys, in particular nickel, nickel-boron, nickel-phosphorus-boron, or a nickel-phosphorus alloy.
- the sacrificial layer is structured by means of a removal method, in particular by means of lithography, in particular X-ray lithography,
- the sacrificial layer may also or alternatively comprise a dielectric; in particular a lacquer, preferably a photoresist, a polymerizable, in particular a photopolymerisable substance and / or a glass, or a ceramic produced with a sol-gel process, such as zirconium oxide.
- the sacrificial layer can be structured by means of an application method, in particular by means of laser polymerization, printing, in particular three-dimensional printing, preferably with nanoparticulate constituents, in particular with nanoparticulate metal constituents,
- Plastic components and / or ceramic components is structured.
- a thick photoresist with a thickness in the range of up to 50 .mu.m can be applied in a structured manner and this can be finished with a precision of approximately contour error better than 2 .mu.m by means of single-grain diamond grinding in its thickness.
- the removal rate of the sacrificial layer is advantageously greater than or equal to the removal rate of the sacrificial layer Base body or the other body, since in this case the structure of the structured body does not exceed the tolerances of the sacrificial layer. If the erosion rate of the sacrificial layer is for example ten times higher than the ablation rate of the main body, on average only one tenth of the structural depth of the sacrificial layer is transferred into the main body, but also the surface errors or deviations become only one tenth in the structured body to be available.
- the erosion rate of the sacrificial layer is smaller than the ablation rate of the main body or the further body, deeper structures can be introduced into the main body and increased attention must be paid to the precision of the surface of the structured sacrificial layer.
- the further body may comprise a film of polymeric material, in particular a material comprising polycarbonate, polyethylene and / or methyl methacrylate.
- the structured body or in particular the structured optical component may comprise Fresnel structures, diffractive optical structures and / or refractive optical structures.
- the structured body may preferably also comprise microfluidic structures.
- the device according to the invention for producing a structured body preferably comprises a receptacle for holding the main body as well as at least one first and one second device for structuring a surface.
- the first device for contouring or structuring comprises a grinding spindle, a polishing spindle, a lathe (Einkorndiamantmosmaschine), a milling machine (Einkorndiamantmosmmaschine) and / or a laser structuring device, in particular a
- Laser ablation device with an ablating laser and / or with an exposing laser, which is particularly suitable for the exposure of photoresists or photopolymers.
- the second device for structuring, in particular fine structuring advantageously comprises a lithographic, in particular photolithographic device for structuring, a galvanic device for structuring, a
- Lathe (preferably a Einkorndiamant loftmaschine) for structuring, a milling machine (preferably a Einkorndiamantreosmaschine) for structuring and / or means for embossing.
- the receptacle for holding the body is advantageously suitable, to hold the main body during processing by means of the first and by means of the second device for structuring, in particular without new receiving the main body and substantially without changing the positioning.
- a non-planar optically effective contour is introduced into the main body or the further body in a first step, and at least two non-optically active regions simultaneously
- These alignment marks can be designed in particular as mirror surfaces, even plan, convex or concave.
- the position of the optically effective contour to the Justier vom or marks is clearly defined.
- the position of the optically effective contour in the device can be accurately adjusted down to the nanometer range.
- optical adjustment surface or alignment mark can also be arranged within the optically active surface and thus be helpful, for example in the centering and also additionally or alternatively in the axial adjustment of an optical system or enable it only with the necessary precision.
- the adjustment surface is part of an optical system on the device or processing machine, so that a slight misalignment of a few nanometers already causes a detectable change in the optical performance of the system.
- the optical system consists of one for each adjustment surface collimated laser, the reflective alignment surface and a detector unit.
- the coated body can be re-introduced into the same or another processing device and precisely aligned by means of the alignment marks in order to introduce a fine structure into the sacrificial layer or anti-adhesion layer.
- Figure 1 is a first, but only exemplary embodiment of a structuring
- FIG 2 shows the first embodiment of an article with an inventively introduced structure in the at least partially nonplanar surface in a partial cross-sectional representation
- FIG 3 the first shown in Figs. 1 and 2
- FIG. 5 shows the first embodiment of an article illustrated in FIG. 4, in which the structure which was introduced into the sacrificial layer was transferred to the article 6 shows the first embodiment of a structured article illustrated in FIG. 5, in which a non-stick layer has been applied to at least part of the structure which has been transferred to the article, in a partial cross-sectional representation,
- FIG. 7 shows the first embodiment of a structured article illustrated in FIG. 6, in which at least part of the non-stick layer has been structured, in a partial cross-sectional representation, FIG.
- FIG. 8 shows an enlarged detail of the embodiment of a structured article illustrated in FIG. 7, in which at least part of the non-stick layer has been structured, in a partial cross-sectional representation, FIG.
- Figure 9 shows a first embodiment of another Body, which is structurable according to the invention and attachable to a base body, in a cross-sectional view,
- FIG. 10 shows the further body shown in FIG. 9, which has been structured according to the invention, in one
- FIG. 11 shows an alternative embodiment of a further body, which can be structured according to the invention and can be attached to a base body and to which a sacrificial layer has been attached, in a cross-sectional representation
- FIG. 12 shows the alternative shown in FIG.
- Embodiment of the other body, on which the attached thereto sacrificial layer was structured in one
- FIG. 13 shows the alternative shown in FIG.
- FIG. 14 shows the first but only exemplary embodiment of an object to be structured shown in FIG. 1 with an at least partially nonplanar surface to which the structured further body has been attached, a partial cross-sectional representation.
- a surface which is not planar comprises diffractive and / or refractive structures and / or, preferably rotationally symmetric or cylindrically symmetrical free forms and at least also all surfaces and shapes mentioned in DE 10 2004 38 727 A1.
- this surface may also be formed stepwise.
- the transferring of a structure, in particular of a sacrificial layer, which is arranged on a body into the body essentially comprises the transfer of the lateral structure as well as the transfer of a similar vertical structure.
- the structure to be transferred can be embodied in the form of stages which digitally represent only an existing stage or a non-existing stage, such as the zero or the one in the binary numerical range.
- stages which digitally represent only an existing stage or a non-existing stage, such as the zero or the one in the binary numerical range.
- binary structures with different step heights, for example with two three or more than three step heights, in order, for example, to approximate sections of analog structures, such as Fresnel structures.
- the structures to be transferred can also have analogous, this means continuously changing thickness or depth with the location, which also have sections, jumps, as is the case, inter alia, in the case of analog Fresnel lenses.
- the structure to be transferred may also be a special surface texture. These may be moth-eye structures or surfaces with uniform, precisely defined roughness.
- the expression that a structure is similar means that the structure in the surface is substantially the same as the deviations introduced by the transmission, the same lateral ones
- a depth similar to the thickness therefore means, in the sense of this description and the claims, that the surface shape of the sacrificial layer is locally transferred to the underlying surface to be structured, but not necessarily transferred to its depth in a contour-consistent manner; the term "similar" means in this Context that the patterned surface will be deeper locally where the sacrificial layer was less thick or where the sacrificial layer was deeper, this may be a depth proportional to the depth of depression in the sacrificial layer if no saturation effects occur; however, this may also include a non-linear dependence on the local depth or of the local thickness of the sacrificial layer in the case of saturation or other effects.
- Deviations introduced by the transmission essentially comprise lateral effects which are brought about by shadows, undercuts or undesirable scattering of light at masks or sacrificial layer boundaries.
- FIG. 1 shows a first, but only exemplary embodiment of an object 1 to be structured with a non-planar, at least partially planar, in this embodiment, convex surface 2 in a partial cross-sectional representation.
- the main body has at its surface to be structured 2 a partially planar portion 3 and a non-planar convex portion 4.
- both the planar region 3 and the non-planar convex region 4 as well as both or only one of the regions 3, 4 can be structured.
- the main body 1 can assume essentially any shape, which are designed according to the respective application.
- the base body at least in parts of the surface and convex and can be shaped in particular spherical, aspherical or free.
- the body structured by the method according to the invention can be a stamping or pressing mold with high surface accuracy.
- the structured body is a stamping or pressing mold, in particular a blank mold for producing an optical element, in particular for producing an optical element comprising glass or glass ceramic, which preferably has diffractive and / or refractive structures.
- a surface can be patterned using the method according to the invention, or several surfaces can also be given their structure by this method.
- the structured optical component may comprise Fresnel structures, diffractive optical structures and / or refractive optical structures.
- the structured article or body may also comprise microfluidic structures, for example comprise channel systems formed in the surface, which are well-known to those skilled in the field of microfluidics and consequently need not be shown in the drawings.
- the base body consists of a crystalline or ceramic material or contains components of such a material.
- the ceramic materials may include tungsten carbides, aluminum carbides, silicon carbides, titanium carbides, aluminum oxides, zirconium oxides, silicon nitrides, aluminum titanates and / or aluminum sintered materials and / or mixtures of these materials, in particular as sintered materials and in particular as powder metallurgy materials
- the crystalline materials may preferably comprise silicon or sapphire.
- Surface 2 are processed so that it receives the plan area 3 and the non-planar area 4.
- its surface 2 if it consists for example of glass or a glass ceramic or comprises such material, can also be formed by embossing or pressing, in particular also precision pressing.
- the highest height of the bulge of the bulge indicated by x in the first surface treatment process in the figures unplaned area is typically 10 times larger than the subsequently introduced feature sizes, such as the depth of a step formed, for example, in a second surface finish operation.
- FIG. 2 shows the first embodiment of the article 1 shown in FIG. 1 with the structure introduced according to the invention in the at least partially nonplanar surface in a partial cross-sectional representation.
- the structuring of a sacrificial layer 5 is used for this purpose, which can be and is preferably structured more easily and / or precisely than the main body 1 itself Subsequently, the structure of the sacrificial layer on a surface 2 of the body 1 made.
- the surface 2 is a surface of the main body 1, in particular the non-planar surface in the area 4 of the main body 1.
- a sacrificial layer 5 is first applied to at least the region of the surface 4 to be subsequently structured, which can be carried out in different ways, depending on the material of the sacrificial layer.
- the sacrificial layer shown in FIG. 3, as mentioned above, can first be applied over the whole area and subsequently structured, or a structured application of the sacrificial layer 5 can take place.
- more than one sacrificial layer can be applied in order to achieve, for example, the required thicknesses of the sacrificial layer 5, and for this purpose also all application methods described above and below can be combined with one another.
- Alloys in particular nickel, nickel-boron, nickel-phosphorus-boron, or comprises a nickel-phosphorus alloy, have full-surface application of the sacrificial layer with their subsequent structuring proven.
- the sacrificial layer is structured by means of a removal method, in particular by means of lithography, in particular X-ray lithography, laser ablation and / or single-grain diamond machining, in particular single-grain diamond turning is structured.
- Metals can often be structured much more precisely and simply than, for example, glasses or ceramics, and in this case the preclistration of the sacrificial layer can in this case structurally transfer the precision that is possible here to the base body 1.
- the sacrificial layer comprises a dielectric, in particular a lacquer, preferably a photoresist, which can then be patterned by means of lithographic or for highest precision by means of mechanical processes, such as single-grain diamond turning.
- the sacrificial layer comprises a polymerizable, in particular a photopolymerizable substance and can be structured by means of an application method, in particular by means of laser polymerization, printing, preferably by means of three-dimensional printing.
- a sacrificial layer can also consist of PMMA. This can be sprayed or applied in the oven by heating and previous pouring.
- this contains in a further embodiment nanoparticulate constituents, in particular nanoparticulate metal constituents, plastic constituents and / or ceramic constituents.
- nanoparticulate constituents in particular nanoparticulate metal constituents, plastic constituents and / or ceramic constituents.
- material properties it is also possible to use mixtures with the corresponding required ratios of the various constituents.
- the sacrificial layer can also comprise a glass or a ceramic, in particular a glass or ceramic produced by a sol-gel process, such as, for example, zirconium oxide.
- This dielectric can be patterned after its application by means of laser ablation with high precision.
- sacrificial layer 5 as shown in Figure 3 was applied over the entire surface and structured or applied structured resulted in an arrangement as shown in Fig. 4 in which structures of the victim sight were formed, which have a defined depending depth or thickness depending on the location.
- the structure is transferred from the sacrificial layer 5 to the base body 1 and this is structured in its surface 2.
- Transferring the structure involves transferring the lateral structure as well as transferring a similar vertical structure.
- the transfer of the structure is in a first embodiment by dry etching, in particular by made reactive ion etching and thereby let the ion beam preferably directed substantially perpendicular to the surface 2 impinge on the victim's view 5.
- the direction of the normal to the planar region 3 should correspond substantially perpendicular to the surface 2.
- the structure is transferred by wet-chemical etching, in particular by directional etching along preferred crystalline directions of a crystalline base body 1.
- the thickness of the sacrificial layer is at least reduced or changed, and the surface 2 of the main body 5 is thereby structured.
- the sacrificial layer can be completely used up or even used up to a certain degree and its remaining components can be used to shape the surface 2.
- a surface is structured on at least one further body, which can be attached to the base body 1 and which initially does not have to be attached thereto.
- FIG. 9 shows a cross-sectional illustration of a first embodiment of a further body, which is structurable according to the invention and can be attached to a base body.
- This further body may be a film of polymeric material which comprises in particular polycarbonate, polyethylene and / or methyl methacrylate or mixtures thereof.
- high precision texturing techniques such as lithographic techniques
- lithographic techniques can be used without inaccuracies due to lack of depth of field, as would be the case with non-planar objects, and subsequently the further body may be attached to the surface 2 of the article 1
- the precision of a substantially two-dimensional shaping on three-dimensional, thus non-planar objects is transferable.
- Sacrificial view 8 are made, which can be applied as described above, resulting in the arrangement shown in Fig. 11.
- the sacrificial layer is then applied structured or structured, the arrangement shown in FIG. 12 results.
- the structured further body 7 shown in FIG. 13 is obtained, which can be subsequently attached to the surface 2, as shown for the state after its attachment in FIG ,
- the further body 7 can subsequently be used as a structuring element on the object 1 on its surface 2 or again as a sacrificial layer for the article 1 for structuring its surface 2.
- this surface 2 is optionally coated with an anti-adhesion layer, which is helpful for stamping or pressing, in particular for precision press molding, for demoulding after the embossing or pressing process has been carried out.
- the non-stick layer comprises a platinum-gold alloy, in particular Pt5Au, and / or platinum, iridium and rhodium-containing alloys, and further materials such as these are also described, for example, in the incorporated DE 10 2004 38 727 A1.
- the non-stick layer 9 can first be applied and then subsequently structured.
- This structuring leads to a layer structure, as shown in FIGS. 7 and 8.
- FIG. 7 shows the embodiment of a structured article in which at least part of the non-stick layer has been structured, in a partial cross-sectional view
- FIG. 8 shows an enlarged detail of the embodiment shown in FIG.
- the structuring of the non-stick layer is patterned in particular using a sacrificial layer.
- the invention is not limited to an anti-adhesion layer 9 but one or more layers can be applied to the article 1 and patterned and in this way thicker layers or deeper structures are produced.
- the invention is not limited to the implementation of certain devices or machines, but it may be advantageous to achieve particularly high precision, if this is a particularly suitable device is used, which includes a receptacle for holding the body and at least a first and a second means for Structuring of a surface, in particular of the base body 1 comprises.
- a particularly suitable device which includes a receptacle for holding the body and at least a first and a second means for Structuring of a surface, in particular of the base body 1 comprises.
- the first contouring or structuring device may comprise a grinding spindle, a polishing spindle, a lathe and / or a
- Laser structuring device in particular a laser ablation device with a laser ablating and / or with an exposing laser, in particular for photoresists include.
- the second structuring device has a lithographic, in particular photolithographic device for structuring, a galvanic device for structuring, a single grain diamond turning device, a
- the receptacle for holding the base body is suitable to hold the base body during processing by means of the first and by means of the second device for structuring, in particular without new recording of the body and substantially without changing positioning, in order by re-clamping the body during its processing to introduce unwanted errors or at least to avoid additional, time-consuming operations.
- the device already described comprises an active optical positioning device.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/058,577 US20110299164A1 (en) | 2008-08-13 | 2009-08-13 | Method and device for the production of a structured object, and structured object |
JP2011522436A JP5595397B2 (ja) | 2008-08-13 | 2009-08-13 | 構造化された対象物の作製および構造化された対象物のための方法および装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008038910A DE102008038910A1 (de) | 2008-08-13 | 2008-08-13 | Verfahren und Vorrichtung zur Herstellung eines strukturierten Gegenstands sowie strukturierter Gegenstand |
DE102008038910.2 | 2008-08-13 |
Publications (1)
Publication Number | Publication Date |
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WO2010017979A1 true WO2010017979A1 (de) | 2010-02-18 |
Family
ID=41120106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/EP2009/005873 WO2010017979A1 (de) | 2008-08-13 | 2009-08-13 | Verfahren und vorrichtung zur herstellung eines strukturierten gegenstands sowie strukturierter gegenstand |
Country Status (5)
Country | Link |
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US (1) | US20110299164A1 (de) |
JP (1) | JP5595397B2 (de) |
KR (1) | KR20110055630A (de) |
DE (1) | DE102008038910A1 (de) |
WO (1) | WO2010017979A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019111681A1 (de) * | 2019-05-06 | 2020-11-12 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Verfahren zum Glätten von Oberflächen |
Families Citing this family (3)
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DE102010039757A1 (de) * | 2010-08-25 | 2012-03-01 | Carl Zeiss Ag | Verfahren zur Herstellung einer eine gekrümmte Wirkfläche nachstellenden Fresnel-Struktur |
DE102011056962B4 (de) * | 2011-12-23 | 2013-12-19 | Bpe E.K. | Verfahren zum Herstellen eines Keramikwerkstücks und Werkstück |
AU2013100685B4 (en) * | 2013-05-21 | 2013-09-12 | Innovia Security Pty Ltd | Optical device including vertical pixels |
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WO2002006860A1 (en) * | 2000-07-13 | 2002-01-24 | Network Photonics, Inc. | Diffraction grating with reduced polarization-dependent loss |
US6517734B1 (en) * | 2000-07-13 | 2003-02-11 | Network Photonics, Inc. | Grating fabrication process using combined crystalline-dependent and crystalline-independent etching |
WO2007043383A1 (ja) * | 2005-10-07 | 2007-04-19 | Nikon Corporation | 微小構造体およびその製造方法 |
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JP3147481B2 (ja) | 1992-04-21 | 2001-03-19 | 松下電器産業株式会社 | ガラス製回折格子の成形用金型及びその製造方法及びガラス製回折格子の製造方法 |
US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
JP4266732B2 (ja) * | 2002-08-30 | 2009-05-20 | キヤノン株式会社 | 積層型回折光学素子 |
JP2005002432A (ja) * | 2003-06-13 | 2005-01-06 | Konica Minolta Holdings Inc | プラズマエッチング装置並びにそれを用いた光学素子成形用金型に用いる母型の製作方法、光学素子成形用金型、光学素子成形用金型の製作方法、光学素子の製作方法及び光学素子 |
JP2005132679A (ja) * | 2003-10-30 | 2005-05-26 | Matsushita Electric Ind Co Ltd | 無反射構造を有する光学素子の製造方法、及び当該方法により製造された無反射構造を有する光学素子 |
DE102004020363A1 (de) * | 2004-04-23 | 2005-11-17 | Schott Ag | Verfahren zur Herstellung eines Masters, Master und Verfahren zur Herstellung von optischen Elementen sowie optischen Element |
DE102004038727A1 (de) | 2004-08-10 | 2006-02-23 | Schott Ag | Verfahren und Vorrichtung zum Herstellen von Hybridlinsen |
JP2006188416A (ja) * | 2004-12-07 | 2006-07-20 | Pentax Corp | ガラス光学素子用成形型の製造方法 |
US7399421B2 (en) * | 2005-08-02 | 2008-07-15 | International Business Machines Corporation | Injection molded microoptics |
US7265057B2 (en) * | 2005-11-18 | 2007-09-04 | Matsushita Electric Industrial Co., Ltd | 3D lithography with laser beam writer for making hybrid surfaces |
JP2007193249A (ja) * | 2006-01-23 | 2007-08-02 | Matsushita Electric Ind Co Ltd | 成形部品の製造方法 |
JP6073039B2 (ja) * | 2006-10-31 | 2017-02-01 | モディリス ホールディングス エルエルシー | 複雑な三次元形状をもつ光学製品の製造方法および製造機構 |
DE102006059775A1 (de) | 2006-12-15 | 2008-06-19 | Schott Ag | Beschichtung für Formwerkzeuge |
JP4445538B2 (ja) * | 2007-09-26 | 2010-04-07 | 株式会社東芝 | パターン形成方法 |
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2008
- 2008-08-13 DE DE102008038910A patent/DE102008038910A1/de not_active Withdrawn
-
2009
- 2009-08-13 JP JP2011522436A patent/JP5595397B2/ja not_active Expired - Fee Related
- 2009-08-13 KR KR1020117005862A patent/KR20110055630A/ko not_active Application Discontinuation
- 2009-08-13 WO PCT/EP2009/005873 patent/WO2010017979A1/de active Application Filing
- 2009-08-13 US US13/058,577 patent/US20110299164A1/en not_active Abandoned
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WO2002006860A1 (en) * | 2000-07-13 | 2002-01-24 | Network Photonics, Inc. | Diffraction grating with reduced polarization-dependent loss |
US6517734B1 (en) * | 2000-07-13 | 2003-02-11 | Network Photonics, Inc. | Grating fabrication process using combined crystalline-dependent and crystalline-independent etching |
WO2007043383A1 (ja) * | 2005-10-07 | 2007-04-19 | Nikon Corporation | 微小構造体およびその製造方法 |
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DE102019111681A1 (de) * | 2019-05-06 | 2020-11-12 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Verfahren zum Glätten von Oberflächen |
Also Published As
Publication number | Publication date |
---|---|
JP5595397B2 (ja) | 2014-09-24 |
US20110299164A1 (en) | 2011-12-08 |
DE102008038910A1 (de) | 2010-02-18 |
KR20110055630A (ko) | 2011-05-25 |
JP2012505811A (ja) | 2012-03-08 |
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