WO2010013819A1 - 整合回路、配線基板、整合回路を備える送信器、受信器、送受信器およびレーダ装置 - Google Patents

整合回路、配線基板、整合回路を備える送信器、受信器、送受信器およびレーダ装置 Download PDF

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Publication number
WO2010013819A1
WO2010013819A1 PCT/JP2009/063697 JP2009063697W WO2010013819A1 WO 2010013819 A1 WO2010013819 A1 WO 2010013819A1 JP 2009063697 W JP2009063697 W JP 2009063697W WO 2010013819 A1 WO2010013819 A1 WO 2010013819A1
Authority
WO
WIPO (PCT)
Prior art keywords
matching circuit
transceiver
transmitter
receiver
wiring board
Prior art date
Application number
PCT/JP2009/063697
Other languages
English (en)
French (fr)
Inventor
信樹 平松
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to US13/056,942 priority Critical patent/US8706050B2/en
Priority to JP2010522768A priority patent/JP5289445B2/ja
Priority to DE112009001919.6T priority patent/DE112009001919B4/de
Publication of WO2010013819A1 publication Critical patent/WO2010013819A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
    • G01S13/06—Systems determining position data of a target
    • G01S13/08—Systems for measuring distance only
    • G01S13/32—Systems for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated
    • G01S13/34—Systems for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated using transmission of continuous, frequency-modulated waves while heterodyning the received signal, or a signal derived therefrom, with a locally-generated signal related to the contemporaneously transmitted signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • G01S7/032—Constructional details for solid-state radar subsystems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

　本発明は、パターンの寸法ばらつきが生じたとしてもインピーダンス不整合が生じにくい整合回路、配線基板、整合回路を備えることで安定した特性が得られる送信器、受信器、送受信器およびレーダ装置に関する。スタブ部６を含む反射源２１と負荷であるボンディングワイヤ３との間で接続部７を含む第１伝送線路２２の特性インピーダンスを変化させる。接続部７と結合する背面導体層９ａとの距離と、スタブ部６、伝送線路部５と結合する内部導体層１０との距離を変化させることでインピーダンスの変化を実現する。
PCT/JP2009/063697 2008-07-31 2009-07-31 整合回路、配線基板、整合回路を備える送信器、受信器、送受信器およびレーダ装置 WO2010013819A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/056,942 US8706050B2 (en) 2008-07-31 2009-07-31 Matching circuit, wiring board, and transmitter, receiver, transceiver, and radar apparatus that have the matching circuit
JP2010522768A JP5289445B2 (ja) 2008-07-31 2009-07-31 整合回路、配線基板、整合回路を備える送信器、受信器、送受信器およびレーダ装置
DE112009001919.6T DE112009001919B4 (de) 2008-07-31 2009-07-31 Anpassungsschaltung sowie Leiterplatte, Sender, Empfänger, Sende-Empfänger und Radarvorrichtung, die die Anpassungsschaltung umfassen

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008199057 2008-07-31
JP2008-199057 2008-07-31

Publications (1)

Publication Number Publication Date
WO2010013819A1 true WO2010013819A1 (ja) 2010-02-04

Family

ID=41610514

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/063697 WO2010013819A1 (ja) 2008-07-31 2009-07-31 整合回路、配線基板、整合回路を備える送信器、受信器、送受信器およびレーダ装置

Country Status (4)

Country Link
US (1) US8706050B2 (ja)
JP (1) JP5289445B2 (ja)
DE (1) DE112009001919B4 (ja)
WO (1) WO2010013819A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104204878A (zh) * 2012-04-04 2014-12-10 德克萨斯仪器股份有限公司 使用嵌入式电介质波导的芯片间通信
JP2015226311A (ja) * 2014-05-30 2015-12-14 京セラサーキットソリューションズ株式会社 配線基板
JP2019140221A (ja) * 2018-02-09 2019-08-22 矢崎総業株式会社 電子部品実装品
WO2020121676A1 (ja) * 2018-12-14 2020-06-18 ソニーセミコンダクタソリューションズ株式会社 伝送路

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101309469B1 (ko) * 2011-09-26 2013-09-23 삼성전기주식회사 알에프 모듈
US20130265734A1 (en) * 2012-04-04 2013-10-10 Texas Instruments Incorporated Interchip communication using embedded dielectric and metal waveguides
CN104134844B (zh) * 2014-08-12 2016-03-23 南京邮电大学 一种基于基片集成技术的平面魔t
US20170245361A1 (en) * 2016-01-06 2017-08-24 Nokomis, Inc. Electronic device and methods to customize electronic device electromagnetic emissions
US10849220B1 (en) 2020-01-23 2020-11-24 Super Micro Computer, Inc. Setting the impedance of signal traces of a circuit board using a reference trace
US11297713B2 (en) 2020-01-23 2022-04-05 Super Micro Computer, Inc. Reference metal layer for setting the impedance of metal contacts of a connector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897611A (ja) * 1994-09-22 1996-04-12 Nippon Telegr & Teleph Corp <Ntt> 高周波伝送線路およびマイクロ波回路
JPH10256801A (ja) * 1997-03-06 1998-09-25 Mitsubishi Electric Corp マイクロ波回路
WO2008007303A1 (en) * 2006-07-07 2008-01-17 Nxp B.V. Circuit comprising transmission lines
JP2008160785A (ja) * 2006-11-30 2008-07-10 Kyocera Corp 整合回路、送信器、受信器、送受信器およびレーダ装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6053923B2 (ja) * 1978-01-27 1985-11-28 日本電気株式会社 超高周波トランジスタ増幅器
JPS5531373U (ja) * 1978-08-21 1980-02-29
JPH04322502A (ja) 1991-04-22 1992-11-12 Fukushima Nippon Denki Kk 分布定数型整合回路
DE4130925A1 (de) 1991-09-17 1993-03-18 Telefunken Systemtechnik Traeger fuer planare mikrowellenschaltungen
JPH07288409A (ja) * 1994-04-20 1995-10-31 Nec Corp マイクロ波集積回路装置
US6177872B1 (en) * 1998-03-13 2001-01-23 Intermec Ip Corp. Distributed impedance matching circuit for high reflection coefficient load
JP2001102820A (ja) * 1999-09-30 2001-04-13 Toyota Central Res & Dev Lab Inc 高周波回路
US6590468B2 (en) * 2000-07-20 2003-07-08 Paratek Microwave, Inc. Tunable microwave devices with auto-adjusting matching circuit
JP2003069313A (ja) 2001-08-24 2003-03-07 Toshiba Corp 半導体パッケージ
JP4097138B2 (ja) * 2003-03-10 2008-06-11 独立行政法人科学技術振興機構 インピーダンス整合回路とそれを用いた半導体素子及び無線通信装置
JP4629013B2 (ja) * 2006-09-28 2011-02-09 株式会社豊田中央研究所 高周波回路基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897611A (ja) * 1994-09-22 1996-04-12 Nippon Telegr & Teleph Corp <Ntt> 高周波伝送線路およびマイクロ波回路
JPH10256801A (ja) * 1997-03-06 1998-09-25 Mitsubishi Electric Corp マイクロ波回路
WO2008007303A1 (en) * 2006-07-07 2008-01-17 Nxp B.V. Circuit comprising transmission lines
JP2008160785A (ja) * 2006-11-30 2008-07-10 Kyocera Corp 整合回路、送信器、受信器、送受信器およびレーダ装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104204878A (zh) * 2012-04-04 2014-12-10 德克萨斯仪器股份有限公司 使用嵌入式电介质波导的芯片间通信
JP2015226311A (ja) * 2014-05-30 2015-12-14 京セラサーキットソリューションズ株式会社 配線基板
JP2019140221A (ja) * 2018-02-09 2019-08-22 矢崎総業株式会社 電子部品実装品
JP7005111B2 (ja) 2018-02-09 2022-01-21 矢崎総業株式会社 電子部品実装品
WO2020121676A1 (ja) * 2018-12-14 2020-06-18 ソニーセミコンダクタソリューションズ株式会社 伝送路
JPWO2020121676A1 (ja) * 2018-12-14 2021-10-21 ソニーセミコンダクタソリューションズ株式会社 伝送路
JP7300465B2 (ja) 2018-12-14 2023-06-29 ソニーセミコンダクタソリューションズ株式会社 伝送路

Also Published As

Publication number Publication date
DE112009001919T5 (de) 2011-07-21
US8706050B2 (en) 2014-04-22
DE112009001919B4 (de) 2015-11-26
JP5289445B2 (ja) 2013-09-11
US20110143687A1 (en) 2011-06-16
JPWO2010013819A1 (ja) 2012-01-12

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