WO2009123608A8 - Multilayer uv-curable adhesive film - Google Patents

Multilayer uv-curable adhesive film Download PDF

Info

Publication number
WO2009123608A8
WO2009123608A8 PCT/US2008/058867 US2008058867W WO2009123608A8 WO 2009123608 A8 WO2009123608 A8 WO 2009123608A8 US 2008058867 W US2008058867 W US 2008058867W WO 2009123608 A8 WO2009123608 A8 WO 2009123608A8
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive film
multilayer
curable adhesive
curable
wafer
Prior art date
Application number
PCT/US2008/058867
Other languages
French (fr)
Other versions
WO2009123608A1 (en
Inventor
Byoungchul Lee
Original Assignee
National Starch And Chemical Investment Holding Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch And Chemical Investment Holding Corporation filed Critical National Starch And Chemical Investment Holding Corporation
Priority to JP2011502911A priority Critical patent/JP2011516658A/en
Priority to EP08733023A priority patent/EP2265682A1/en
Priority to CN2008801289280A priority patent/CN102099431A/en
Priority to PCT/US2008/058867 priority patent/WO2009123608A1/en
Priority to KR1020107024388A priority patent/KR20110010601A/en
Publication of WO2009123608A1 publication Critical patent/WO2009123608A1/en
Priority to US12/894,816 priority patent/US20110018127A1/en
Publication of WO2009123608A8 publication Critical patent/WO2009123608A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)

Abstract

This invention is an adhesive film comprising (a) a top layer that is substantially UV curable and that has a glass transition temperature of 50°C or less; and (b) a bottom layer that is substantially not UV-curable. Additional embodiments include a bundled wafer lamination film, a semiconductor wafer with a multilayer adhesive film attached, a process for attaching a semiconductor die to a substrate, and a method of preventing individually diced dies from sticking to one another.
PCT/US2008/058867 2008-03-31 2008-03-31 Multilayer uv-curable adhesive film WO2009123608A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011502911A JP2011516658A (en) 2008-03-31 2008-03-31 Multilayer UV curable adhesive film
EP08733023A EP2265682A1 (en) 2008-03-31 2008-03-31 Multilayer uv-curable adhesive film
CN2008801289280A CN102099431A (en) 2008-03-31 2008-03-31 Multilayer uv-curable adhesive film
PCT/US2008/058867 WO2009123608A1 (en) 2008-03-31 2008-03-31 Multilayer uv-curable adhesive film
KR1020107024388A KR20110010601A (en) 2008-03-31 2008-03-31 Multilayer uv-curable adhesive film
US12/894,816 US20110018127A1 (en) 2008-03-31 2010-09-30 Multilayer UV-Curable Adhesive Film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2008/058867 WO2009123608A1 (en) 2008-03-31 2008-03-31 Multilayer uv-curable adhesive film

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/894,816 Continuation US20110018127A1 (en) 2008-03-31 2010-09-30 Multilayer UV-Curable Adhesive Film

Publications (2)

Publication Number Publication Date
WO2009123608A1 WO2009123608A1 (en) 2009-10-08
WO2009123608A8 true WO2009123608A8 (en) 2010-11-04

Family

ID=41135848

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/058867 WO2009123608A1 (en) 2008-03-31 2008-03-31 Multilayer uv-curable adhesive film

Country Status (5)

Country Link
EP (1) EP2265682A1 (en)
JP (1) JP2011516658A (en)
KR (1) KR20110010601A (en)
CN (1) CN102099431A (en)
WO (1) WO2009123608A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100963675B1 (en) * 2008-03-14 2010-06-15 제일모직주식회사 Multi-function tape for semiconductor package and method for fabricating the semiconductor device thereby
KR20120080385A (en) * 2011-01-07 2012-07-17 삼성전자주식회사 Composition for patternable adhesive film, patternable adhesive film having the same and method for packaging semiconductor using the same
US8969177B2 (en) * 2012-06-29 2015-03-03 Applied Materials, Inc. Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film
SG10201800482RA (en) 2012-07-03 2018-03-28 Heptagon Micro Optics Pte Ltd Use of vacuum chucks to hold a wafer or wafer sub-stack
TWI494410B (en) * 2013-04-10 2015-08-01 Hon Hai Prec Ind Co Ltd Adhesive tape
KR20150047926A (en) * 2013-10-25 2015-05-06 삼성전기주식회사 Method for Manufacturing Printed Circuit Board
EP3187556B1 (en) * 2014-08-29 2023-08-30 Furukawa Electric Co., Ltd. Adhesive film
JP2016063060A (en) * 2014-09-18 2016-04-25 株式会社ディスコ Processing method for wafer
EP3098277A1 (en) 2015-05-27 2016-11-30 Henkel AG & Co. KGaA Pre-cut film and a production method thereof
JP6956074B2 (en) * 2016-04-28 2021-10-27 リンテック株式会社 Protective film forming film and protective film forming composite sheet
TWI772293B (en) * 2016-04-28 2022-08-01 日商琳得科股份有限公司 Method for producing semiconductor chip with protective film, and method for producing semiconductor device
TWI731964B (en) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 Complex sheet for forming protective film
TWI778960B (en) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film
KR102410096B1 (en) * 2016-04-28 2022-06-17 린텍 가부시키가이샤 Manufacturing method of semiconductor chip with protective film and manufacturing method of semiconductor device
CN108886023B (en) * 2016-04-28 2023-09-08 琳得科株式会社 Film for forming protective film and composite sheet for forming protective film
US20180258321A1 (en) * 2017-03-13 2018-09-13 Federal-Mogul Powertrain, Llc Textile sleeve having a low melt adhesive coating with protective layer thereover and method of construction thereof
KR20210058164A (en) 2019-11-13 2021-05-24 주식회사 비티씨 Method for Producing Agrimony Extract, and Composition for Improving Liver Function or Treating Liver Desease Containing the Same

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JP2732021B2 (en) * 1993-10-22 1998-03-25 株式会社巴川製紙所 Adhesive tape and liquid adhesive for electronic parts
US5912282A (en) * 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
JP2002158276A (en) * 2000-11-20 2002-05-31 Hitachi Chem Co Ltd Adhesive sheet for sticking wafer and semiconductor device
DE10140145A1 (en) * 2001-08-16 2003-03-06 Basf Coatings Ag Coating materials curable thermally and with actinic radiation and their use
JP2003277699A (en) * 2002-03-22 2003-10-02 Dainippon Ink & Chem Inc Radiation curable adhesive tape for processing semiconductor wafer
JP4284922B2 (en) * 2002-05-13 2009-06-24 日立化成工業株式会社 Adhesive sheet, semiconductor device and manufacturing method thereof
US6818680B2 (en) * 2002-09-23 2004-11-16 Corning Incorporated Curable adhesive compositions
CN101447413B (en) * 2003-06-06 2013-03-27 日立化成株式会社 Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
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JP4979063B2 (en) * 2006-06-15 2012-07-18 日東電工株式会社 Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
WO2009123608A1 (en) 2009-10-08
JP2011516658A (en) 2011-05-26
EP2265682A1 (en) 2010-12-29
CN102099431A (en) 2011-06-15
KR20110010601A (en) 2011-02-01

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