WO2009119426A1 - 光電変換モジュールおよびその組み立て方法ならびにそれを用いた光電対応情報処理機器 - Google Patents
光電変換モジュールおよびその組み立て方法ならびにそれを用いた光電対応情報処理機器 Download PDFInfo
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- WO2009119426A1 WO2009119426A1 PCT/JP2009/055392 JP2009055392W WO2009119426A1 WO 2009119426 A1 WO2009119426 A1 WO 2009119426A1 JP 2009055392 W JP2009055392 W JP 2009055392W WO 2009119426 A1 WO2009119426 A1 WO 2009119426A1
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- Prior art keywords
- photoelectric conversion
- optical fiber
- optical
- conversion module
- ferrule
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
Definitions
- the present invention relates to a photoelectric conversion module capable of attaching an optical fiber after being mounted on a circuit board, a method for assembling the photoelectric conversion module, and a photoelectric-compatible information processing apparatus using the photoelectric conversion module.
- Japanese Patent Laid-Open No. 2006-59867 describes a photoelectric conversion header (photoelectric conversion module) used for optical transmission between LSIs, which includes a lead insert molding ferrule into which a photoelectric conversion element and an optical fiber are inserted.
- the photoelectric conversion element and the optical fiber are directly optically coupled without using an optical component such as a lens.
- the photoelectric conversion element is a light emitting element (for example, Vertical Cavity Surface Emitting Laser (VCSEL)) or a light receiving element.
- VCSEL Vertical Cavity Surface Emitting Laser
- FIG. 10 is a plan cross-sectional view of the main part showing the flow of resin during resin molding when manufacturing such a conventional photoelectric conversion module.
- the photoelectric conversion element 9 is mounted on the optical ferrule 3 having the through hole (optical fiber insertion hole) 7 into which the optical fiber (or optical waveguide) 5 is inserted.
- the photoelectric conversion element 9 and the electrode (not shown) of the optical ferrule 3 are connected by using, for example, thermocompression bonding of Au bumps 11.
- the optical fiber 5 is inserted into the optical ferrule 3. Thereby, the optical fiber 5 is positioned with respect to the photoelectric conversion element 9.
- the optical ferrule 3 and the photoelectric conversion element 9 are molded with resin (not shown).
- the module 1 in which the optical fiber 5 is inserted is mounted on a circuit board (not shown) and connected to an optical element driving IC (driver, receiver, etc.) with a bonding wire, and then the optical ferrule 3, the photoelectric conversion element 9, and the light
- the element driving IC and the circuit board are integrally resin-molded. According to the module 1, since the optical fiber 5 is directly inserted and connected to the optical ferrule 3 mounted on the substrate, it is possible to expect a reduction in size and cost.
- the coating resin of the assembled optical fiber 5 deteriorates at a high temperature
- the module 1 cannot be mounted on a circuit board as a normal electric component by high-temperature heating using reflow or the like.
- the module on which the module 1 is mounted photoelectric conversion element, optical ferrule, and circuit board integrally molded with resin
- the resin for molding the photoelectric conversion element 9, the optical ferrule 3, and the circuit board is formed in the optical fiber insertion hole 7 that opens at one end surface 3 a of the optical ferrule 3. It entered from the opening 7a as indicated by the arrow in FIG. 10 and became an obstacle to insertion of the optical fiber 5 later.
- An object of the present invention is to provide a photoelectric conversion module in which an optical fiber can be inserted even after an optical ferrule is mounted on a circuit board, a method for assembling the photoelectric conversion module, and a photoelectric information processing apparatus using the photoelectric conversion module.
- an optical ferrule having an optical fiber insertion hole formed therethrough, a transparent material that closes the opening of the optical fiber insertion hole on one end surface of the optical ferrule, an active layer, and the active layer is an opening
- a photoelectric conversion module including a photoelectric conversion element attached to one end face so as to face the electric element, an electric component to which the photoelectric conversion element is electrically connected, and a circuit board on which the optical ferrule and the electric component are placed.
- the transparent substance may be a transparent film.
- the transparent film preferably has a two-layer structure including a hard layer and a soft layer, and the soft layer is preferably disposed on the optical ferrule side.
- the transparent substance may be an adhesive body or an anisotropic conductive film.
- the portion of the optical ferrule except the optical fiber insertion port is integrally covered with a molding resin.
- the optical ferrule fixes the optical fiber in a region removed from the molding resin. It is preferable to have a resin injection hole.
- the optical ferrule has a retaining means for holding the optical fiber inserted through the optical fiber insertion hole and preventing the rearward disconnection. Further, in these photoelectric conversion modules, it is preferable that a part of the optical fiber insertion hole is a flexure accommodating space for accommodating the bent portion of the optical fiber.
- a step of closing the opening of the optical fiber insertion hole on one end face of the optical ferrule with a transparent material, and a material formed on the one end face to break the transparent material on the bumps of the photoelectric conversion element A step of electrically connecting, a step of mounting an electrical component and an optical ferrule on a circuit board equipped with external electrodes, an optical ferrule excluding an opening of an optical fiber insertion hole on the other end surface, a photoelectric conversion element, and an electrical component
- a method for assembling a photoelectric conversion module including a step of covering the substrate with a mold resin integrally with a circuit board is provided.
- the module according to the present invention is a photoelectric-compatible information processing device mounted on a device-side substrate, and the light is cut with respect to the optical fiber insertion hole of the module after being mounted on the device-side substrate.
- a photoelectric-compatible information processing apparatus in which a fiber is inserted and assembled is provided.
- the module according to the present invention it is possible to prevent the mold resin from entering from the opening with a transparent substance and to integrally configure the photoelectric conversion element, the optical ferrule, the electrical component, and the circuit board before inserting the optical fiber.
- the optical fiber can be inserted after the optical ferrule is mounted on the circuit board, and further, the optical fiber can be inserted after the module itself is mounted on the device side substrate.
- the module assembling method of the present invention it is possible to obtain a module that can be assembled after the optical fiber.
- the module can be mounted on the device-side substrate by high-temperature heating using reflow or the like, and mass productivity can be improved.
- the area is a cross-sectional view cut along another arrangement surface of the optical fiber in the optical ferrule in the photoelectric conversion module of the embodiment, (b) the cross-sectional view cut perpendicularly to the arrangement surface It is.
- Each of the areas (a) to (d) is a conceptual diagram showing each step of the method for assembling the module 100.
- FIG. 1 is a side view showing a photoelectric conversion module 100 according to an embodiment of the present invention.
- the module 100 is obtained by mounting the optical ferrule 33 and the electrical component 57 on one surface of the circuit board 35. External electrodes 63 are formed on the other surface of the circuit board 35.
- the surface of the circuit board 35 on which components are mounted is covered with a mold resin 55 including a part of the optical ferrule 33 and the electrical components 57.
- the module 100 can attach an optical fiber later.
- the electrical component 57 is, for example, an optical element driving IC (driver, transimpedance amplifier, etc.).
- the electrical component 57 is connected to the optical ferrule 33 and the circuit board 35 via bonding wires 65.
- the optical ferrule 33 is formed of a material containing any of polyester resin, PPS resin, and epoxy resin.
- FIG. 2 is an enlarged view of a main part of the photoelectric conversion module 100.
- a plurality of lead electrodes 49 which are electric circuits, are arranged in parallel, and the electrodes 49 are continuously formed so as to extend to an intersecting surface (upper surface in FIG. 2) adjacent to the coupling surface 43.
- a photoelectric conversion element 31 is provided on the coupling surface 43 of the optical ferrule 33.
- the photoelectric conversion element 31 is, for example, a VCSEL or a photodiode (PD).
- a plurality of active layers 39 are arranged on the coupling surface 37 of the photoelectric conversion element 31.
- the active layer 39 has a plurality of Au bumps 41 arranged along the active layer 39 as connection terminals.
- the photoelectric conversion element 31 is mounted on the optical ferrule 33 by connecting the bump 41 to the electrode 49.
- the Au bump 41 can be fixed to the electrode 49 by ultrasonic pressure bonding.
- a plurality of optical fiber insertion holes 47 for positioning and holding the optical fiber 45 are arranged on the coupling surface 43 of the fluorescent ferrule 33 according to the active layer 39.
- the optical fiber insertion hole 47 is opened as an optical fiber insertion port 51 on the other end surface 48 of the optical ferrule 33.
- a bonding wire 65 is connected to the electrode 49 of the fluorescent ferrule 33. That is, the electrical component 57 is electrically connected to the photoelectric conversion element 31 via the electrode 49 on the optical ferrule 33.
- the optical fiber 45 inserted into the optical fiber insertion hole 47 of the optical ferrule 33 is optically connected to the active layer 39 of the photoelectric conversion element 31.
- the opening 52 of the optical ferrule 33 is blocked with a transparent substance 61.
- the surface of the transparent substance 61 opposite to the opening 52 is in close contact with the coupling surface 37 of the photoelectric conversion element 31. Accordingly, it is possible to prevent the mold resin 55 from entering from the opening 52 when molding with the resin 55.
- the optical fiber 45 can be retrofitted, and the module 100 can be mounted by high-temperature heating using reflow or the like, which was difficult with the conventional module in which the optical fiber 45 was attached in advance.
- the optical ferrule 33 has a portion 53 except the optical fiber insertion port 51 that is integrally covered with the photoelectric conversion element 31, the circuit board 35, and the electrical component 57 with the mold resin 55. For this reason, the bonding strength between the photoelectric conversion element and the optical ferrule is reinforced, the bonding wire between the optical ferrule and the electrical component is protected, and the circuit board is equipped with external electrodes.
- the optical fiber can be easily mounted after being mounted on the substrate.
- the transparent material 61 is a transparent film.
- the transparent substance 61 By making the transparent substance 61 into a transparent film, the attachment of the transparent substance 61 to the opening 52 is facilitated. In other words, if it is a film, it can be easily attached by the adhesive layer formed on the sticking surface. Moreover, the impact at the time of an optical fiber insertion assembly is absorbed by the elasticity of a film thickness direction, and damage to the photoelectric conversion element 31 can be prevented.
- the material of the transparent film 61 include acrylic resins, styrene resins, silicone resins, and olefin resins.
- the silicone-based resin has a high heat-resistant temperature and does not deteriorate even at a reflow temperature used in electrical mounting.
- the whole transparent film can also be formed with an adhesive. If it does in this way, the effect which reinforces the bond strength of an optical ferrule and a photoelectric conversion element can also be expected.
- the transparent film 61 is preferably provided in common to each of the plurality of optical fiber insertion holes 47.
- the plurality of optical fiber insertion holes 47 can be covered with one transparent film 61 at a time, and the assembling work becomes easy.
- the transparent film 61 preferably has a function of suppressing return light noise.
- the transparent film 61 can be a refractive index matching film.
- the transparent film 61 cannot necessarily realize perfect refractive index matching with the optical fiber 45, a slight residual reflection remains. Since the transparent film 61 has a refractive index higher than that of the surrounding air, the light resulting from the residual reflection is reflected inside at the interface and confined in the transparent film 61. This residual reflected light becomes return light, which raises the noise level of the VCSEL and causes an increase in jitter and the like when performing very high-speed optical transmission. In order to solve such a light confinement problem, it is desirable to provide a light absorbing resin in a portion corresponding to the air interface of the transparent film 61.
- FIG. 3 is an enlarged view of an example of the vicinity of the opening 52 after the optical fiber 45 is inserted.
- the transparent film 61 has a two-layer structure including a hard layer 66 and a soft layer 67, and the soft layer 67 is disposed on the optical ferrule 33 side. Protrusions 69 and irregularities generated when the optical fiber 45 is cut are absorbed by the soft layer 67, and the optical fiber 45 and the photoelectric conversion element 31 can be bonded satisfactorily. Further, the hard layer 66 prevents the active layer 39 and the like from being damaged.
- a resin injection hole 59 may be formed in the optical ferrule 33 as in the module 100 (FIG. 2).
- the resin injection hole 59 is molded so as not to be covered with the molding resin 55.
- the optical fiber 45 inserted and assembled in the module 100 after being mounted on the board can be securely fixed with the adhesive injected into the resin injection hole 59.
- FIG. 4 is a cross-sectional view showing a modification of the optical ferrule in the photoelectric conversion module 100.
- the optical ferrule 33 ⁇ / b> B has an optical fiber 45 that is inserted into the optical fiber insertion hole 47, and has a retaining means 71 that prevents the optical fiber 45 from coming backward.
- An example of the retaining means 71 is a plurality of elastic flexible claws 71 a that protrude in the insertion direction of the optical fiber 45 from the edge of the optical fiber insertion port 51.
- FIG. 5A is a cross-sectional view of another modification of the optical ferrule in the photoelectric conversion module 100 cut along the optical fiber array plane
- FIG. 5B is a cross-section cut perpendicular to the array plane.
- FIG. The optical ferrule 33 ⁇ / b> C has a bending accommodation space 73 that accommodates the bent portion 75 of the optical fiber 45 in a part of the optical fiber insertion hole 47.
- the bending accommodation space 73 can be formed by increasing the diameter of a part of the tip end side of the optical fiber insertion hole 47.
- a plurality of optical fibers (especially optical fiber ribbons) 45 cut and arranged in a state where the tip lengths are slightly uneven are inserted and assembled into the optical ferrule 33C at the same time (region (a)), and the most retracted position from the tip Even when the entire optical fiber 45a is pushed into the optical fiber 45a, the extra length of the long protruding optical fiber 45b is bent in the bending storage space 73 and accommodated as a bent portion 75 ((b) region) ). As a result, all the optical fiber front end surfaces and the transparent film 61 are well connected.
- FIG. 6 is a cross-sectional view for explaining a modification of the transparent substance in the photoelectric conversion module 100.
- the transparent material is the anisotropic conductive film 61b.
- the anisotropic conductive film 61b is obtained by dispersing metal particles in a refractive index matching film. When the anisotropic conductive film is sandwiched between two conductive films and pressed and heated, the resistance between the conductors is reduced and the conductive film is conductive. (SEI Technical Review, No. 168, page 93).
- the anisotropic conductive film 61b as a transparent material, the electrode 49 and the photoelectric conversion element 31 can be electrically connected without using a gold bump and while maintaining insulation between the adjacent electrodes 49.
- As the metal particles acicular nickel nanoparticles are particularly preferable. Since the acicular nickel nanoparticles reliably connect the conductors in a small amount, the amount of dispersion can be small and the transparency can be increased.
- FIG. 8 is a perspective view showing an example of one end face of an optical ferrule provided with a large number of electrodes.
- the transparent film 61 is broken (penetrated) to the electrode 49 formed on the coupling surface 43 of the optical ferrule 33 to electrically connect the bump 41 of the photoelectric conversion element 31.
- the coupling surface 43 can be covered with one transparent film 61 at a time, and it is not necessary to individually cover the optical fiber insertion holes 47, and the film installation work can be improved.
- the electrical component 57 and the optical ferrule 33 are mounted on the circuit board 35 equipped with the external electrode 63.
- the bonding wire 65 connects between the electrode 49 of the optical ferrule 33 and the electrical component 57 and between the electrical component 57 and the terminal of the circuit board 35.
- the optical ferrule 33 excluding the optical fiber insertion port 51 on the other end face 48, the photoelectric conversion element 31, the bonding wire 65, and the electrical component 57 are integrally molded with the circuit board 35 and molded resin. Cover with 55. Thereby, the module 100 which can be assembled
- the mold resin 55 that enters the gap between the photoelectric conversion element 31 and the optical ferrule 33 during resin molding is blocked by the transparent film 61 and does not enter the optical fiber insertion hole 47.
- the transparent material is destroyed and the bump is connected to the electrode, one end surface can be covered with one transparent material at a time, and it is not necessary to individually cover the optical fiber insertion holes, so the workability is good Can be.
- FIG. 9 is a side view of the main part showing the photoelectric-compatible information processing device 77 according to the embodiment of the present invention.
- the photoelectric-compatible information processing device 77 is a device in which the photoelectric conversion module 100 is mounted on the device-side substrate 79 and connected to a circuit on the device-side substrate 79 through the external electrode 63.
- the cut optical fiber 45 can be inserted and assembled into the optical fiber insertion hole 47 of the module 100 after being mounted on the device-side substrate 79.
- the module 100 can be mounted on the device-side substrate 79 by high-temperature heating using reflow or the like, which is difficult with a conventional module, and mass productivity can be improved.
- the optical fiber 45 is inserted after the optical ferrule 33 is mounted on the circuit board 35, and further, the module 100 itself is mounted on the equipment side substrate 79.
- the subsequent insertion of the optical fiber 45 can be made possible.
- the photoelectric conversion module of the present invention is useful as a photoelectric conversion module used for optical transmission between LSIs.
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Abstract
Description
Claims (11)
- 光ファイバ挿通孔が貫通形成された光フェルールと、
前記光フェルールの一端面における前記光ファイバ挿通孔の開口部を塞ぐ透明な物質と、
活性層を有し、前記活性層が前記開口部と対向するように前記一端面に取り付けられた光電変換素子と、
前記光電変換素子が電気接続される電気部品と、
前記光フェルールと前記電気部品とを載せる回路基板と
を含む光電変換モジュール。 - 前記透明な物質が透明フィルムである請求項1記載の光電変換モジュール。
- 前記透明フィルムはハード層とソフト層からなる二層構造で、前記ソフト層が光フェルール側に配置されている請求項2記載の光電変換モジュール。
- 前記透明な物質が粘着体である
請求項1から3のいずれか1項記載の光電変換モジュール。 - 前記透明な物質が異方導電膜である請求項1記載の光電変換モジュール。
- 前記光フェルールの光ファイバ挿入口を除く部分は一体的にモールド樹脂で覆われている請求項1から5のいずれか1項記載の光電変換モジュール。
- 前記光フェルールは、前記モールド樹脂から外れた領域に光ファイバを固定するための樹脂注入穴を有する請求項6記載の光電変換モジュール。
- 前記光フェルールは、前記光ファイバ挿通孔に挿通される光ファイバを保持し後抜けを阻止する抜止手段を有する
請求項1から7のいずれか1項記載の光電変換モジュール。 - 前記光ファイバ挿通孔の一部が光ファイバの屈曲部を収容する撓み収容空間となっている請求項1から8のいずれか1項記載の光電変換モジュール。
- 光フェルールの一端面における光ファイバ挿通孔の開口部を透明な物質で塞ぐ工程と、
前記一端面に形成され電極に前記透明な物質を破壊して光電変換素子のバンプを電気的に接続する工程と、
外部電極を装備した回路基板上に電気部品および前記光フェルールを実装する工程と、
他端面における光ファイバ挿入孔の開口部を除く前記光フェルール、前記光電変換素子、および前記電気部品を前記回路基板と一体的にモールド樹脂で覆う工程と
を含む光電変換モジュールの組み立て方法。 - 請求項1から9のいずれか1項記載のモジュールを、機器側基板に搭載した光電対応情報処理機器であって、
前記機器側基板に搭載した後の前記モジュールの前記光ファイバ挿通孔に対し、切断した光ファイバが挿入組立された光電対応情報処理機器。
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JP2009543308A JP5327052B2 (ja) | 2008-03-26 | 2009-03-19 | 光電変換モジュールおよびそれを用いた光電対応情報処理機器 |
EP09725452.8A EP2256881A4 (en) | 2008-03-26 | 2009-03-19 | PHOTOELECTRIC CONVERSION MODULE, PROCESS FOR ITS MANUFACTURE AND PHOTOELECTRIC INFORMATION PROCESSING DEVICE THEREFOR |
US12/738,043 US8235603B2 (en) | 2008-03-26 | 2009-03-19 | Optoelectric conversion module, method for assembling same, and optoelectric information processor using same |
CN2009801006426A CN101821915B (zh) | 2008-03-26 | 2009-03-19 | 光电转换组件、其组装方法及使用该组件的光电信息处理器 |
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JP7176842B2 (ja) * | 2017-12-12 | 2022-11-22 | 日東電工株式会社 | 光電気混載基板 |
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Publication number | Publication date |
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KR20100133944A (ko) | 2010-12-22 |
JP5327052B2 (ja) | 2013-10-30 |
US20100220963A1 (en) | 2010-09-02 |
EP2256881A4 (en) | 2014-12-24 |
EP2256881A1 (en) | 2010-12-01 |
CN101821915A (zh) | 2010-09-01 |
US8235603B2 (en) | 2012-08-07 |
TW200944857A (en) | 2009-11-01 |
JPWO2009119426A1 (ja) | 2011-07-21 |
CN101821915B (zh) | 2013-10-23 |
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