WO2009091642A3 - Electrostatic surface cleaning - Google Patents

Electrostatic surface cleaning Download PDF

Info

Publication number
WO2009091642A3
WO2009091642A3 PCT/US2009/030272 US2009030272W WO2009091642A3 WO 2009091642 A3 WO2009091642 A3 WO 2009091642A3 US 2009030272 W US2009030272 W US 2009030272W WO 2009091642 A3 WO2009091642 A3 WO 2009091642A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
surface cleaning
cleaning
support
collecting tip
Prior art date
Application number
PCT/US2009/030272
Other languages
French (fr)
Other versions
WO2009091642A2 (en
Inventor
Banqiu Wu
Ajay Kumar
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Publication of WO2009091642A2 publication Critical patent/WO2009091642A2/en
Publication of WO2009091642A3 publication Critical patent/WO2009091642A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning

Abstract

Embodiments of the present invention generally provide apparatus and methods for cleaning a substrate, such as a mask. One embodiment of the present invention provides an apparatus for cleaning a substrate comprising a substrate support configured to receive and support the substrate, a collecting tip connected with an electrostatic power source, wherein the collecting tip is configured to pickup particles on a surface of the substrate using electrostatic force, and an indexing mechanism configured to provide relative movement between the collecting tip and the substrate support.
PCT/US2009/030272 2008-01-17 2009-01-07 Electrostatic surface cleaning WO2009091642A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/015,944 US20090183322A1 (en) 2008-01-17 2008-01-17 Electrostatic surface cleaning
US12/015,944 2008-01-17

Publications (2)

Publication Number Publication Date
WO2009091642A2 WO2009091642A2 (en) 2009-07-23
WO2009091642A3 true WO2009091642A3 (en) 2009-09-24

Family

ID=40875253

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/030272 WO2009091642A2 (en) 2008-01-17 2009-01-07 Electrostatic surface cleaning

Country Status (3)

Country Link
US (1) US20090183322A1 (en)
TW (1) TW200940194A (en)
WO (1) WO2009091642A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014102651B4 (en) * 2013-03-15 2020-12-17 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography system with embedded cleaning module and lithography exposure process
US10459353B2 (en) 2013-03-15 2019-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography system with an embedded cleaning module
US9993853B2 (en) 2014-11-28 2018-06-12 Applied Materials, Inc. Method and apparatus for backside cleaning of substrates

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159730A (en) * 1985-01-08 1986-07-19 Oki Electric Ind Co Ltd Method of removing particle in emulsion mask
KR960026325A (en) * 1994-12-28 1996-07-22 문정환 Semiconductor substrate cleaning equipment
US20070111476A1 (en) * 2005-11-16 2007-05-17 Denso Corporation Separating device for separating semiconductor substrate and method for separating the same
KR20070106834A (en) * 2006-05-01 2007-11-06 삼성전자주식회사 Apparatus for removing particles adhered onto upper side of chuck on which wafer is placed

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW285721B (en) * 1994-12-27 1996-09-11 Siemens Ag
IL127720A0 (en) * 1998-12-24 1999-10-28 Oramir Semiconductor Ltd Local particle cleaning
TWI243287B (en) * 1999-03-12 2005-11-11 Asml Netherlands Bv Lithographic projection apparatus and device manufacturing method using the same
US6827816B1 (en) * 1999-12-16 2004-12-07 Applied Materials, Inc. In situ module for particle removal from solid-state surfaces
US6526997B1 (en) * 2000-08-18 2003-03-04 Francois J. Henley Dry cleaning method for the manufacture of integrated circuits
WO2003034153A2 (en) * 2001-10-12 2003-04-24 Koninklijke Philips Electronics N.V. Lithographic apparatus and device manufacturing method
US6838684B2 (en) * 2002-08-23 2005-01-04 Asml Netherlands B.V. Lithographic projection apparatus and particle barrier for use therein
KR100563102B1 (en) * 2002-09-12 2006-03-27 에이에스엠엘 네델란즈 비.브이. A method of cleaning by removing particles from surfaces, a cleaning apparatus and a lithographic projection apparatus
US6829035B2 (en) * 2002-11-12 2004-12-07 Applied Materials Israel, Ltd. Advanced mask cleaning and handling
US7126671B2 (en) * 2003-04-04 2006-10-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7230258B2 (en) * 2003-07-24 2007-06-12 Intel Corporation Plasma-based debris mitigation for extreme ultraviolet (EUV) light source
US7167232B2 (en) * 2003-12-30 2007-01-23 Asml Netherlands B.V. Lithographic apparatus and radiation source comprising a debris-mitigation system and method for mitigating debris particles in a lithographic apparatus
US7251013B2 (en) * 2004-11-12 2007-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7277158B2 (en) * 2004-12-02 2007-10-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7193683B2 (en) * 2005-01-06 2007-03-20 Nikon Corporation Stage design for reflective optics
US20070229944A1 (en) * 2006-03-31 2007-10-04 Lee Sang H Reducing extreme ultraviolet flare in lithographic projection optics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159730A (en) * 1985-01-08 1986-07-19 Oki Electric Ind Co Ltd Method of removing particle in emulsion mask
KR960026325A (en) * 1994-12-28 1996-07-22 문정환 Semiconductor substrate cleaning equipment
US20070111476A1 (en) * 2005-11-16 2007-05-17 Denso Corporation Separating device for separating semiconductor substrate and method for separating the same
KR20070106834A (en) * 2006-05-01 2007-11-06 삼성전자주식회사 Apparatus for removing particles adhered onto upper side of chuck on which wafer is placed

Also Published As

Publication number Publication date
US20090183322A1 (en) 2009-07-23
TW200940194A (en) 2009-10-01
WO2009091642A2 (en) 2009-07-23

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