WO2009089820A3 - Strip electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip - Google Patents
Strip electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip Download PDFInfo
- Publication number
- WO2009089820A3 WO2009089820A3 PCT/DE2009/000029 DE2009000029W WO2009089820A3 WO 2009089820 A3 WO2009089820 A3 WO 2009089820A3 DE 2009000029 W DE2009000029 W DE 2009000029W WO 2009089820 A3 WO2009089820 A3 WO 2009089820A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- strip
- electrically conductive
- electroplating plant
- electrically
- electrolyte bath
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
Abstract
The invention relates to a strip electroplating plant for the electrochemical reinforcement of electrically conductive outer layers of a strip (2), particularly a foil strip (2), wherein the strip (2) having the electrically conductive outer layers passes through an electrolyte bath (3) in which the anodes (5) are disposed. A strip electroplating plant according to the invention comprises at least one rotatable contact roller (4), which is disposed in the electrolyte bath (3) and around which the belt (2) is wrapped at least in some regions and which has a segmented structure transversely to the rotational axis thereof, wherein the lateral surface of the contact roller (4) is formed by alternating electrically conductive (6) and electrically non-conductive segments (7), and wherein the electrically conductive segments (6) can be electrically contacted individually or in groups. An electrically conductive layer to be reinforced is cathodically contacted by those electrically conductive segments (6) that are completely covered by the strip (2). As a result of the cathodic contacting of the electrically conductive layer of the strip (2) in the electrolyte bath (3), those galvanic current-conducting regions of the electrically conductive layer on which no electrochemical material application takes place can be kept very short. This increases not only the effectiveness of the electroplating process, it also enables a very compact design of a strip electroplating plant.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008004592A DE102008004592A1 (en) | 2008-01-16 | 2008-01-16 | Belt electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip |
DE102008004592.6 | 2008-01-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009089820A2 WO2009089820A2 (en) | 2009-07-23 |
WO2009089820A3 true WO2009089820A3 (en) | 2009-10-15 |
Family
ID=40785771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2009/000029 WO2009089820A2 (en) | 2008-01-16 | 2009-01-14 | Strip electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102008004592A1 (en) |
WO (1) | WO2009089820A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114717623A (en) * | 2022-02-07 | 2022-07-08 | 昆山鑫美源电子科技有限公司 | Conductive film production equipment and production method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900383A (en) * | 1974-07-24 | 1975-08-19 | Nat Steel Corp | Apparatus for electroplating |
EP0264510A1 (en) * | 1986-10-20 | 1988-04-27 | Clecim Sa | Process and apparatus for electrolytically treating metal strips |
WO2003038158A2 (en) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Electroplating device and electroplating system for coating already conductive structures |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2949741A1 (en) | 1979-12-11 | 1981-06-19 | Siemens AG, 1000 Berlin und 8000 München | ELECTROLYSIS SYSTEM FOR GALVANIC REINFORCEMENT OF CONDUCTED PRE-COATED BAND-SHAPED PLASTIC FILMS |
DE10342512B3 (en) | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region |
DE102006044673B3 (en) * | 2006-09-21 | 2008-01-17 | Maschinenbau Hofer Gmbh | Electrical contact application unit for galvanic deposition has contact region with at least two segments through which current can flow independently |
-
2008
- 2008-01-16 DE DE102008004592A patent/DE102008004592A1/en not_active Withdrawn
-
2009
- 2009-01-14 WO PCT/DE2009/000029 patent/WO2009089820A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900383A (en) * | 1974-07-24 | 1975-08-19 | Nat Steel Corp | Apparatus for electroplating |
EP0264510A1 (en) * | 1986-10-20 | 1988-04-27 | Clecim Sa | Process and apparatus for electrolytically treating metal strips |
WO2003038158A2 (en) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Electroplating device and electroplating system for coating already conductive structures |
Also Published As
Publication number | Publication date |
---|---|
DE102008004592A1 (en) | 2009-07-23 |
WO2009089820A2 (en) | 2009-07-23 |
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