WO2009089820A3 - Strip electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip - Google Patents

Strip electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip Download PDF

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Publication number
WO2009089820A3
WO2009089820A3 PCT/DE2009/000029 DE2009000029W WO2009089820A3 WO 2009089820 A3 WO2009089820 A3 WO 2009089820A3 DE 2009000029 W DE2009000029 W DE 2009000029W WO 2009089820 A3 WO2009089820 A3 WO 2009089820A3
Authority
WO
WIPO (PCT)
Prior art keywords
strip
electrically conductive
electroplating plant
electrically
electrolyte bath
Prior art date
Application number
PCT/DE2009/000029
Other languages
German (de)
French (fr)
Other versions
WO2009089820A2 (en
Inventor
Manfred Danziger
Original Assignee
Manfred Danziger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Manfred Danziger filed Critical Manfred Danziger
Publication of WO2009089820A2 publication Critical patent/WO2009089820A2/en
Publication of WO2009089820A3 publication Critical patent/WO2009089820A3/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0657Conducting rolls

Abstract

The invention relates to a strip electroplating plant for the electrochemical reinforcement of electrically conductive outer layers of a strip (2), particularly a foil strip (2), wherein the strip (2) having the electrically conductive outer layers passes through an electrolyte bath (3) in which the anodes (5) are disposed. A strip electroplating plant according to the invention comprises at least one rotatable contact roller (4), which is disposed in the electrolyte bath (3) and around which the belt (2) is wrapped at least in some regions and which has a segmented structure transversely to the rotational axis thereof, wherein the lateral surface of the contact roller (4) is formed by alternating electrically conductive (6) and electrically non-conductive segments (7), and wherein the electrically conductive segments (6) can be electrically contacted individually or in groups. An electrically conductive layer to be reinforced is cathodically contacted by those electrically conductive segments (6) that are completely covered by the strip (2). As a result of the cathodic contacting of the electrically conductive layer of the strip (2) in the electrolyte bath (3), those galvanic current-conducting regions of the electrically conductive layer on which no electrochemical material application takes place can be kept very short. This increases not only the effectiveness of the electroplating process, it also enables a very compact design of a strip electroplating plant.
PCT/DE2009/000029 2008-01-16 2009-01-14 Strip electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip WO2009089820A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008004592A DE102008004592A1 (en) 2008-01-16 2008-01-16 Belt electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip
DE102008004592.6 2008-01-16

Publications (2)

Publication Number Publication Date
WO2009089820A2 WO2009089820A2 (en) 2009-07-23
WO2009089820A3 true WO2009089820A3 (en) 2009-10-15

Family

ID=40785771

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/000029 WO2009089820A2 (en) 2008-01-16 2009-01-14 Strip electroplating plant for the electrochemical reinforcement of an electrically conductive outer layer of a strip

Country Status (2)

Country Link
DE (1) DE102008004592A1 (en)
WO (1) WO2009089820A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114717623A (en) * 2022-02-07 2022-07-08 昆山鑫美源电子科技有限公司 Conductive film production equipment and production method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900383A (en) * 1974-07-24 1975-08-19 Nat Steel Corp Apparatus for electroplating
EP0264510A1 (en) * 1986-10-20 1988-04-27 Clecim Sa Process and apparatus for electrolytically treating metal strips
WO2003038158A2 (en) * 2001-10-25 2003-05-08 Infineon Technologies Ag Electroplating device and electroplating system for coating already conductive structures

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2949741A1 (en) 1979-12-11 1981-06-19 Siemens AG, 1000 Berlin und 8000 München ELECTROLYSIS SYSTEM FOR GALVANIC REINFORCEMENT OF CONDUCTED PRE-COATED BAND-SHAPED PLASTIC FILMS
DE10342512B3 (en) 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region
DE102006044673B3 (en) * 2006-09-21 2008-01-17 Maschinenbau Hofer Gmbh Electrical contact application unit for galvanic deposition has contact region with at least two segments through which current can flow independently

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900383A (en) * 1974-07-24 1975-08-19 Nat Steel Corp Apparatus for electroplating
EP0264510A1 (en) * 1986-10-20 1988-04-27 Clecim Sa Process and apparatus for electrolytically treating metal strips
WO2003038158A2 (en) * 2001-10-25 2003-05-08 Infineon Technologies Ag Electroplating device and electroplating system for coating already conductive structures

Also Published As

Publication number Publication date
DE102008004592A1 (en) 2009-07-23
WO2009089820A2 (en) 2009-07-23

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