WO2009080642A3 - Process for manufacturing conductive tracks - Google Patents
Process for manufacturing conductive tracks Download PDFInfo
- Publication number
- WO2009080642A3 WO2009080642A3 PCT/EP2008/067705 EP2008067705W WO2009080642A3 WO 2009080642 A3 WO2009080642 A3 WO 2009080642A3 EP 2008067705 W EP2008067705 W EP 2008067705W WO 2009080642 A3 WO2009080642 A3 WO 2009080642A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive tracks
- manufacturing conductive
- reducing
- manufacturing
- substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1667—Radiant energy, e.g. laser
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08863608A EP2245212A2 (en) | 2007-12-20 | 2008-12-17 | Process for manufacturing conductive tracks |
JP2010538696A JP2011506775A (en) | 2007-12-20 | 2008-12-17 | Method for manufacturing conductive track |
US12/808,702 US20110008548A1 (en) | 2007-12-20 | 2008-12-17 | Process for manufacturing conductive tracks |
CN2008801271484A CN101946023A (en) | 2007-12-20 | 2008-12-17 | Make the method for conductive traces |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07024745.7 | 2007-12-20 | ||
EP07024745 | 2007-12-20 | ||
EP08166540.8 | 2008-10-14 | ||
EP08166540 | 2008-10-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009080642A2 WO2009080642A2 (en) | 2009-07-02 |
WO2009080642A3 true WO2009080642A3 (en) | 2009-09-17 |
Family
ID=40786554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/067705 WO2009080642A2 (en) | 2007-12-20 | 2008-12-17 | Process for manufacturing conductive tracks |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110008548A1 (en) |
EP (1) | EP2245212A2 (en) |
JP (1) | JP2011506775A (en) |
KR (1) | KR20100117061A (en) |
CN (1) | CN101946023A (en) |
RU (1) | RU2010130087A (en) |
WO (1) | WO2009080642A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010128107A1 (en) * | 2009-05-07 | 2010-11-11 | Neodec B.V. | Process for manufacturing conductive tracks |
JP5835947B2 (en) | 2011-05-30 | 2015-12-24 | セーレン株式会社 | Resin base material with metal film pattern |
KR101288106B1 (en) | 2012-12-20 | 2013-07-26 | (주)피이솔브 | Metal precursors and their inks |
JP5907310B2 (en) * | 2013-12-13 | 2016-04-26 | 大正製薬株式会社 | Crystal form of oxazinane compound and process for producing the same |
US9803098B2 (en) | 2014-07-30 | 2017-10-31 | Pesolve Co., Ltd. | Conductive ink |
WO2016021748A1 (en) | 2014-08-05 | 2016-02-11 | (주)피이솔브 | Silver ink |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1201787A2 (en) * | 2000-10-24 | 2002-05-02 | Shipley Company LLC | Plating catalysts |
EP1323721A2 (en) * | 2001-12-28 | 2003-07-02 | Samsung Electronics Co., Ltd. | Organic metal precursor for use in forming metal-containing patterned films |
EP1326136A1 (en) * | 2002-01-03 | 2003-07-09 | Samsung Electronics Co Ltd. | Process of forming a micro-pattern of a metal or a metal oxide |
US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
US20030207568A1 (en) * | 2002-04-30 | 2003-11-06 | Byun Young Hun | Organometallic precursor for forming metal pattern and method of forming metal pattern using the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7255782B2 (en) * | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
CN100366583C (en) * | 2005-07-04 | 2008-02-06 | 中国科学院理化技术研究所 | Method for preparing diamond film surface metal patternization |
-
2008
- 2008-12-17 JP JP2010538696A patent/JP2011506775A/en active Pending
- 2008-12-17 US US12/808,702 patent/US20110008548A1/en not_active Abandoned
- 2008-12-17 KR KR1020107016084A patent/KR20100117061A/en not_active Application Discontinuation
- 2008-12-17 WO PCT/EP2008/067705 patent/WO2009080642A2/en active Application Filing
- 2008-12-17 CN CN2008801271484A patent/CN101946023A/en active Pending
- 2008-12-17 EP EP08863608A patent/EP2245212A2/en not_active Withdrawn
- 2008-12-17 RU RU2010130087/02A patent/RU2010130087A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1201787A2 (en) * | 2000-10-24 | 2002-05-02 | Shipley Company LLC | Plating catalysts |
US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
EP1323721A2 (en) * | 2001-12-28 | 2003-07-02 | Samsung Electronics Co., Ltd. | Organic metal precursor for use in forming metal-containing patterned films |
EP1326136A1 (en) * | 2002-01-03 | 2003-07-09 | Samsung Electronics Co Ltd. | Process of forming a micro-pattern of a metal or a metal oxide |
US20030207568A1 (en) * | 2002-04-30 | 2003-11-06 | Byun Young Hun | Organometallic precursor for forming metal pattern and method of forming metal pattern using the same |
Also Published As
Publication number | Publication date |
---|---|
EP2245212A2 (en) | 2010-11-03 |
WO2009080642A2 (en) | 2009-07-02 |
US20110008548A1 (en) | 2011-01-13 |
RU2010130087A (en) | 2012-01-27 |
JP2011506775A (en) | 2011-03-03 |
CN101946023A (en) | 2011-01-12 |
KR20100117061A (en) | 2010-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200730583A (en) | Siloxane resin composition and the method for manufacturing the same | |
ZA200906528B (en) | Method for coating metal surfaces using an aqueous compound having polymers,the aqueous compound,and use of the coated substrates | |
TW200639269A (en) | Plating method | |
WO2006118903A3 (en) | Microporous article having metallic nanoparticle coating | |
WO2009080642A3 (en) | Process for manufacturing conductive tracks | |
WO2008103668A3 (en) | Silane coating compositions, coating systems, and methods | |
WO2009120344A3 (en) | Methods for coating a substrate | |
WO2010080613A3 (en) | Coated flow-through substrates and methods for making and using them | |
EP2458031A4 (en) | Chromium- and fluorine-free chemical conversion treatment solution for metal surfaces, metal surface treatment method, and metal surface coating method | |
WO2009112573A3 (en) | Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound | |
PL2161316T3 (en) | Antifouling coating composition, process for producing the composition, antifouling coating film formed from the composition, coated object having the coating film on surface, and method of antifouling treatment by formation of the coating film | |
WO2007011331A3 (en) | Water-soluble polymeric substrate having metallic nanoparticle coating | |
EP1986217A4 (en) | Method for manufacturing semiconductor substrate | |
WO2009086231A3 (en) | Post-deposition cleaning methods and formulations for substrates with cap layers | |
WO2010025696A3 (en) | Method for producing an organic radiation-emitting component and organic radiation-emitting component | |
PT2310549T (en) | Coating system, coated workpiece and method for manufacturing the same | |
WO2007046560A3 (en) | Inorganic substrate with a thin silica type glass layer, method of manufacturing the aforementioned substrate, coating agent, and a semiconductor device | |
WO2010039483A3 (en) | A method for coating metallic surfaces of medical devices with an anti-infective agent | |
WO2010011009A9 (en) | Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module | |
WO2007050502A3 (en) | Process for applying organophosphorus-based layers on substrates | |
MY180636A (en) | Method for producing metal oxide compositions and coated substrates | |
WO2010080602A3 (en) | Flow-through substrates and methods for making and using them | |
TWI265204B (en) | Method for coating substrates in inline installations | |
WO2012030807A3 (en) | Opacifying lotion | |
IL178084A0 (en) | Process for producing semi-conductor coated substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880127148.4 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08863608 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12808702 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 3784/CHENP/2010 Country of ref document: IN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010538696 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008863608 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20107016084 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010130087 Country of ref document: RU |