WO2009075320A1 - 冷却デバイスとその製造方法 - Google Patents
冷却デバイスとその製造方法 Download PDFInfo
- Publication number
- WO2009075320A1 WO2009075320A1 PCT/JP2008/072493 JP2008072493W WO2009075320A1 WO 2009075320 A1 WO2009075320 A1 WO 2009075320A1 JP 2008072493 W JP2008072493 W JP 2008072493W WO 2009075320 A1 WO2009075320 A1 WO 2009075320A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling device
- manufacture
- metal
- composite layer
- fine whisker
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
相手材との接触熱抵抗が小さい冷却デバイスを低コストで提供する。本発明は、冷却体と、少なくとも該冷却体の一面に形成された、微細髭状構造体と金属の複合体を有する複合層とを有し、該複合層において微細髭状構造体の一方の端部が金属表面から露出していることを特徴とする。微細髭状構造体は、カーボンナノチューブ、カーボンナノファイバー又はカーボンファイバー等の炭素系材料であることが好ましい。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007319100 | 2007-12-11 | ||
JP2007-319100 | 2007-12-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009075320A1 true WO2009075320A1 (ja) | 2009-06-18 |
Family
ID=40755559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/072493 WO2009075320A1 (ja) | 2007-12-11 | 2008-12-11 | 冷却デバイスとその製造方法 |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009075320A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011112330A (ja) * | 2009-11-30 | 2011-06-09 | Shinko Electric Ind Co Ltd | 放熱部品及びその製造方法 |
JP2013534363A (ja) * | 2010-07-23 | 2013-09-02 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 熱界面材料の性能を高めるための方法及びシステム |
US9082744B2 (en) | 2013-07-08 | 2015-07-14 | International Business Machines Corporation | Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field |
US9090004B2 (en) | 2013-02-06 | 2015-07-28 | International Business Machines Corporation | Composites comprised of aligned carbon fibers in chain-aligned polymer binder |
US9096784B2 (en) | 2010-07-23 | 2015-08-04 | International Business Machines Corporation | Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance |
US9245813B2 (en) | 2013-01-30 | 2016-01-26 | International Business Machines Corporation | Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance |
US9257359B2 (en) | 2011-07-22 | 2016-02-09 | International Business Machines Corporation | System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09126670A (ja) * | 1995-10-30 | 1997-05-16 | Furukawa Electric Co Ltd:The | ヒートパイプ式ヒートシンク |
JP2001322139A (ja) * | 2000-05-16 | 2001-11-20 | Jsr Corp | 複合シートの製造方法および複合シート |
JP2002146672A (ja) * | 2000-11-06 | 2002-05-22 | Polymatech Co Ltd | 熱伝導性充填剤及び熱伝導性接着剤並びに半導体装置 |
JP2003046038A (ja) * | 2001-07-27 | 2003-02-14 | Mitsubishi Electric Corp | 熱伝導基材とその製造方法及び半導体装置 |
JP2004156074A (ja) * | 2002-11-01 | 2004-06-03 | Univ Shinshu | めっき構造物とその製造方法 |
JP2006152372A (ja) * | 2004-11-29 | 2006-06-15 | Shinshu Univ | 金属−ファイバ複合めっき物およびその製造方法 |
JP2007162079A (ja) * | 2005-12-14 | 2007-06-28 | Nissan Motor Co Ltd | 自動車エンジン用摺動部材及びその製造方法 |
-
2008
- 2008-12-11 WO PCT/JP2008/072493 patent/WO2009075320A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09126670A (ja) * | 1995-10-30 | 1997-05-16 | Furukawa Electric Co Ltd:The | ヒートパイプ式ヒートシンク |
JP2001322139A (ja) * | 2000-05-16 | 2001-11-20 | Jsr Corp | 複合シートの製造方法および複合シート |
JP2002146672A (ja) * | 2000-11-06 | 2002-05-22 | Polymatech Co Ltd | 熱伝導性充填剤及び熱伝導性接着剤並びに半導体装置 |
JP2003046038A (ja) * | 2001-07-27 | 2003-02-14 | Mitsubishi Electric Corp | 熱伝導基材とその製造方法及び半導体装置 |
JP2004156074A (ja) * | 2002-11-01 | 2004-06-03 | Univ Shinshu | めっき構造物とその製造方法 |
JP2006152372A (ja) * | 2004-11-29 | 2006-06-15 | Shinshu Univ | 金属−ファイバ複合めっき物およびその製造方法 |
JP2007162079A (ja) * | 2005-12-14 | 2007-06-28 | Nissan Motor Co Ltd | 自動車エンジン用摺動部材及びその製造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011112330A (ja) * | 2009-11-30 | 2011-06-09 | Shinko Electric Ind Co Ltd | 放熱部品及びその製造方法 |
JP2013534363A (ja) * | 2010-07-23 | 2013-09-02 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 熱界面材料の性能を高めるための方法及びシステム |
US9096784B2 (en) | 2010-07-23 | 2015-08-04 | International Business Machines Corporation | Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance |
US9257359B2 (en) | 2011-07-22 | 2016-02-09 | International Business Machines Corporation | System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks |
US9245813B2 (en) | 2013-01-30 | 2016-01-26 | International Business Machines Corporation | Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance |
US9090004B2 (en) | 2013-02-06 | 2015-07-28 | International Business Machines Corporation | Composites comprised of aligned carbon fibers in chain-aligned polymer binder |
US9082744B2 (en) | 2013-07-08 | 2015-07-14 | International Business Machines Corporation | Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field |
US9406651B2 (en) | 2013-07-08 | 2016-08-02 | Globalfoundries Inc. | Chip stack with oleic acid-aligned nanotubes in thermal interface material |
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