WO2009069345A1 - 蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法 - Google Patents
蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法 Download PDFInfo
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- WO2009069345A1 WO2009069345A1 PCT/JP2008/064761 JP2008064761W WO2009069345A1 WO 2009069345 A1 WO2009069345 A1 WO 2009069345A1 JP 2008064761 W JP2008064761 W JP 2008064761W WO 2009069345 A1 WO2009069345 A1 WO 2009069345A1
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- phosphor
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title abstract 9
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000460 chlorine Substances 0.000 abstract 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract 3
- 229910052801 chlorine Inorganic materials 0.000 abstract 3
- 239000011777 magnesium Substances 0.000 abstract 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 abstract 2
- 229910052749 magnesium Inorganic materials 0.000 abstract 2
- 229910052693 Europium Inorganic materials 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000004090 dissolution Methods 0.000 abstract 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/734,872 US8030839B2 (en) | 2007-11-30 | 2008-08-19 | Phosphor activated with europium, light emitting device using the same and method of manufacturing the phosphor |
EP08854273A EP2216385B1 (en) | 2007-11-30 | 2008-08-19 | Phosphor, light-emitting device using the same, and method for producing phosphor |
JP2009519727A JP5544881B2 (ja) | 2007-11-30 | 2008-08-19 | 蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法 |
CN2008801184541A CN101878280B (zh) | 2007-11-30 | 2008-08-19 | 荧光体及使用其的发光装置以及荧光体的制造方法 |
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JP2007311599 | 2007-11-30 | ||
JP2007-311599 | 2007-11-30 |
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WO2009069345A1 true WO2009069345A1 (ja) | 2009-06-04 |
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PCT/JP2008/064761 WO2009069345A1 (ja) | 2007-11-30 | 2008-08-19 | 蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法 |
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US (1) | US8030839B2 (ja) |
EP (1) | EP2216385B1 (ja) |
JP (1) | JP5544881B2 (ja) |
CN (1) | CN101878280B (ja) |
TW (1) | TWI383035B (ja) |
WO (1) | WO2009069345A1 (ja) |
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US20100320487A1 (en) * | 2010-08-30 | 2010-12-23 | Rene Peter Helbing | Light-emitting device array with individual cells |
JP2013502711A (ja) * | 2009-08-17 | 2013-01-24 | オスラム アクチエンゲゼルシャフト | 高い演色評価数を有するコンバージョンled |
JP2013542595A (ja) * | 2010-09-28 | 2013-11-21 | コーニンクレッカ フィリップス エヌ ヴェ | 有機フォスファーを備える発光装置 |
US9373606B2 (en) | 2010-08-30 | 2016-06-21 | Bridgelux, Inc. | Light-emitting device array with individual cells |
JP2016136587A (ja) * | 2015-01-23 | 2016-07-28 | 日亜化学工業株式会社 | 発光装置 |
JP2016540070A (ja) * | 2013-11-13 | 2016-12-22 | エルジー イノテック カンパニー リミテッド | 青緑色蛍光体、それを含む発光素子パッケージ及び照明装置 |
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JP6107136B2 (ja) | 2012-12-29 | 2017-04-05 | 日亜化学工業株式会社 | 発光装置用パッケージ及びそれを備える発光装置、並びにその発光装置を備える照明装置 |
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- 2008-08-19 WO PCT/JP2008/064761 patent/WO2009069345A1/ja active Application Filing
- 2008-08-19 CN CN2008801184541A patent/CN101878280B/zh active Active
- 2008-08-19 JP JP2009519727A patent/JP5544881B2/ja active Active
- 2008-08-19 EP EP08854273A patent/EP2216385B1/en active Active
- 2008-08-26 TW TW097132555A patent/TWI383035B/zh active
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US9234132B2 (en) | 2009-08-17 | 2016-01-12 | Osram Opto Semiconductors Gmbh | Conversion LED with high color rendition index |
JP2013502711A (ja) * | 2009-08-17 | 2013-01-24 | オスラム アクチエンゲゼルシャフト | 高い演色評価数を有するコンバージョンled |
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KR101728005B1 (ko) * | 2009-08-17 | 2017-04-18 | 오스람 옵토 세미컨덕터스 게엠베하 | 높은 연색지수를 갖는 변환 led |
US9373606B2 (en) | 2010-08-30 | 2016-06-21 | Bridgelux, Inc. | Light-emitting device array with individual cells |
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US10756066B2 (en) | 2010-08-30 | 2020-08-25 | Bridgelux Inc. | Light-emitting device array with individual cells |
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JP2013542595A (ja) * | 2010-09-28 | 2013-11-21 | コーニンクレッカ フィリップス エヌ ヴェ | 有機フォスファーを備える発光装置 |
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Also Published As
Publication number | Publication date |
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EP2216385A4 (en) | 2011-12-07 |
TWI383035B (zh) | 2013-01-21 |
JP5544881B2 (ja) | 2014-07-09 |
EP2216385B1 (en) | 2013-03-27 |
CN101878280A (zh) | 2010-11-03 |
EP2216385A1 (en) | 2010-08-11 |
US8030839B2 (en) | 2011-10-04 |
JPWO2009069345A1 (ja) | 2011-04-07 |
CN101878280B (zh) | 2013-05-01 |
TW200930791A (en) | 2009-07-16 |
US20100301738A1 (en) | 2010-12-02 |
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