WO2009066780A1 - 光合成抑制光源及びそれを用いた照明装置 - Google Patents

光合成抑制光源及びそれを用いた照明装置 Download PDF

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Publication number
WO2009066780A1
WO2009066780A1 PCT/JP2008/071269 JP2008071269W WO2009066780A1 WO 2009066780 A1 WO2009066780 A1 WO 2009066780A1 JP 2008071269 W JP2008071269 W JP 2008071269W WO 2009066780 A1 WO2009066780 A1 WO 2009066780A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
light source
phosphor
photosynthesis inhibiting
ultraviolet light
Prior art date
Application number
PCT/JP2008/071269
Other languages
English (en)
French (fr)
Inventor
Munehiro Kawamura
Kazumasa Yoshimura
Yuji Ano
Kazunori Nagayama
Original Assignee
Yamaguchi Prefectural Government
Nagayama Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaguchi Prefectural Government, Nagayama Electric Industrial Co., Ltd. filed Critical Yamaguchi Prefectural Government
Priority to US12/734,769 priority Critical patent/US20100232135A1/en
Priority to JP2009542613A priority patent/JP4670108B2/ja
Publication of WO2009066780A1 publication Critical patent/WO2009066780A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cultivation Of Plants (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)

Abstract

【課題】光合成生物の生育や繁殖を抑制・阻害しながら人体に悪影響を及ぼさない略白色光を放射する光合成抑制光源を提供する。 【解決手段】近紫外光を発する半導体層と、この近紫外光により励起されて発光する少なくとも１種類の蛍光体とを有し、近紫外光は、波長３００～３８０nmの間に発光帯を有する紫外光と、波長３８０～４００nmの間に発光帯を有する紫色光とを含み、少なくとも１種類の蛍光体は、波長４３０～４９０nmに発光ピークを有して青色光を発する蛍光体及び波長６４０～６８０nmに発光ピークを有して赤色光を発する蛍光体の組合せを含まないものであり、近紫外光と少なくとも１種類の蛍光体が発する光との混合光は略白色であることを特徴とする光合成抑制光源による。
PCT/JP2008/071269 2007-11-23 2008-11-21 光合成抑制光源及びそれを用いた照明装置 WO2009066780A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/734,769 US20100232135A1 (en) 2007-11-23 2008-11-21 Photosynthesis inhibiting light source and illuminating device that uses the same
JP2009542613A JP4670108B2 (ja) 2007-11-23 2008-11-21 光合成抑制光源及びそれを用いた照明装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007303804 2007-11-23
JP2007-303804 2007-11-23

Publications (1)

Publication Number Publication Date
WO2009066780A1 true WO2009066780A1 (ja) 2009-05-28

Family

ID=40667602

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071269 WO2009066780A1 (ja) 2007-11-23 2008-11-21 光合成抑制光源及びそれを用いた照明装置

Country Status (3)

Country Link
US (1) US20100232135A1 (ja)
JP (1) JP4670108B2 (ja)
WO (1) WO2009066780A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012048975A (ja) * 2010-08-26 2012-03-08 Panasonic Electric Works Co Ltd 間接照明装置
JP2013505009A (ja) * 2009-09-18 2013-02-14 ヴァロヤ・オーイュー 照明アセンブリ
JP2013147584A (ja) * 2012-01-20 2013-08-01 Solidlite Corp 植物育成用発光ダイオード
JP2018533400A (ja) * 2015-06-26 2018-11-15 ケノール マニュファクチャリング カンパニー 病原体を不活性化するのに充分な積算輝度値を生み出すための最小限のパワーを出力するシングルエミッタ照明装置
JPWO2018124036A1 (ja) * 2016-12-26 2019-04-11 株式会社坪田ラボ 表示システム、電子機器及び照明システム

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US10363325B2 (en) 2015-06-26 2019-07-30 Kenall Manufacturing Company Lighting device that deactivates dangerous pathogens while providing visually appealing light
US11273324B2 (en) 2015-07-14 2022-03-15 Illumipure Corp LED structure and luminaire for continuous disinfection
US10357582B1 (en) 2015-07-30 2019-07-23 Vital Vio, Inc. Disinfecting lighting device
US10918747B2 (en) 2015-07-30 2021-02-16 Vital Vio, Inc. Disinfecting lighting device
GB2556782B (en) 2015-07-30 2021-02-24 Vital Vio Inc Single diode disinfection
US10835627B2 (en) 2017-12-01 2020-11-17 Vital Vio, Inc. Devices using flexible light emitting layer for creating disinfecting illuminated surface, and related method
US10309614B1 (en) 2017-12-05 2019-06-04 Vital Vivo, Inc. Light directing element
US10413626B1 (en) 2018-03-29 2019-09-17 Vital Vio, Inc. Multiple light emitter for inactivating microorganisms
US11639897B2 (en) 2019-03-29 2023-05-02 Vyv, Inc. Contamination load sensing device
US11541135B2 (en) 2019-06-28 2023-01-03 Vyv, Inc. Multiple band visible light disinfection
US11369704B2 (en) 2019-08-15 2022-06-28 Vyv, Inc. Devices configured to disinfect interiors
US11878084B2 (en) 2019-09-20 2024-01-23 Vyv, Inc. Disinfecting light emitting subcomponent
US11499707B2 (en) 2020-04-13 2022-11-15 Calyxpure, Inc. Light fixture having a fan and ultraviolet sterilization functionality
US11628234B2 (en) 2020-06-01 2023-04-18 Know Labs, Inc. White light LED light bulbs for ambient lighting and pathogen inactivation
US11759540B2 (en) 2021-05-11 2023-09-19 Calyxpure, Inc. Portable disinfection unit

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JP2006282994A (ja) * 2005-03-30 2006-10-19 Samsung Electro Mech Co Ltd 波長変換用の蛍光体混合物及びこれを利用した白色発光装置
JP2007018936A (ja) * 2005-07-08 2007-01-25 Toyoda Gosei Co Ltd 光源装置
JP2007262357A (ja) * 2006-03-30 2007-10-11 Stanley Electric Co Ltd アルミン酸系青色蛍光体およびそれを用いた発光装置
JP2007294974A (ja) * 2006-04-25 2007-11-08 Samsung Electro Mech Co Ltd 発光ダイオードモジュール

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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006282994A (ja) * 2005-03-30 2006-10-19 Samsung Electro Mech Co Ltd 波長変換用の蛍光体混合物及びこれを利用した白色発光装置
JP2007018936A (ja) * 2005-07-08 2007-01-25 Toyoda Gosei Co Ltd 光源装置
JP2007262357A (ja) * 2006-03-30 2007-10-11 Stanley Electric Co Ltd アルミン酸系青色蛍光体およびそれを用いた発光装置
JP2007294974A (ja) * 2006-04-25 2007-11-08 Samsung Electro Mech Co Ltd 発光ダイオードモジュール

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013505009A (ja) * 2009-09-18 2013-02-14 ヴァロヤ・オーイュー 照明アセンブリ
US8850743B2 (en) 2009-09-18 2014-10-07 Valoya Oy Lighting assembly
US9516818B2 (en) 2009-09-18 2016-12-13 Valoya Oy Lighting assembly
US10485183B2 (en) 2009-09-18 2019-11-26 Valoya Oy Lighting assembly
US11089737B2 (en) 2009-09-18 2021-08-17 Valoya Oy Light emission source LED component, horticultural light, and horticultural lighting fixture
JP2012048975A (ja) * 2010-08-26 2012-03-08 Panasonic Electric Works Co Ltd 間接照明装置
JP2013147584A (ja) * 2012-01-20 2013-08-01 Solidlite Corp 植物育成用発光ダイオード
JP2018533400A (ja) * 2015-06-26 2018-11-15 ケノール マニュファクチャリング カンパニー 病原体を不活性化するのに充分な積算輝度値を生み出すための最小限のパワーを出力するシングルエミッタ照明装置
JPWO2018124036A1 (ja) * 2016-12-26 2019-04-11 株式会社坪田ラボ 表示システム、電子機器及び照明システム

Also Published As

Publication number Publication date
US20100232135A1 (en) 2010-09-16
JPWO2009066780A1 (ja) 2011-04-07
JP4670108B2 (ja) 2011-04-13

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