WO2009057988A3 - Radio frequency mems switch - Google Patents

Radio frequency mems switch Download PDF

Info

Publication number
WO2009057988A3
WO2009057988A3 PCT/MY2008/000122 MY2008000122W WO2009057988A3 WO 2009057988 A3 WO2009057988 A3 WO 2009057988A3 MY 2008000122 W MY2008000122 W MY 2008000122W WO 2009057988 A3 WO2009057988 A3 WO 2009057988A3
Authority
WO
WIPO (PCT)
Prior art keywords
mems switch
radio frequency
switch
mems
disclosed
Prior art date
Application number
PCT/MY2008/000122
Other languages
French (fr)
Other versions
WO2009057988A2 (en
Inventor
Suraya Sulaiman
Mohd Ismahadi Syono
Original Assignee
Mimos Berhad
Suraya Sulaiman
Mohd Ismahadi Syono
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos Berhad, Suraya Sulaiman, Mohd Ismahadi Syono filed Critical Mimos Berhad
Publication of WO2009057988A2 publication Critical patent/WO2009057988A2/en
Publication of WO2009057988A3 publication Critical patent/WO2009057988A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • H01G5/18Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes due to change in inclination, e.g. by flexing, by spiral wrapping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)

Abstract

There is disclosed a method of fabricating radio frequency surface microelectromechanical (MEMS) switch. The method utilizes four masks, each configured through photolithography process at different stages that resulted in substantially planar silicon dioxide, critical in providing better mechanical performance of the RF MEMS switch. The steps include, among others, depositing silicon on glass liquid to fill small holes for a smooth silicon oxide surface, employing back etch process and performing wet etching by using chemical solution called Pad Etch. An RF MEMS switch that comprise of a lower electrode (30) formed on the surface of a silicon substrate (31), an aluminum membrane (32) suspended over the electrode and a dielectric layer (33) covering the lower electrode fabricated through the process is also disclosed.
PCT/MY2008/000122 2007-10-31 2008-10-22 Radio frequency mems switch WO2009057988A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI20071873 2007-10-31
MYPI20071873A MY146154A (en) 2007-10-31 2007-10-31 Radio frequency mems switch

Publications (2)

Publication Number Publication Date
WO2009057988A2 WO2009057988A2 (en) 2009-05-07
WO2009057988A3 true WO2009057988A3 (en) 2009-07-16

Family

ID=40591676

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/MY2008/000122 WO2009057988A2 (en) 2007-10-31 2008-10-22 Radio frequency mems switch

Country Status (2)

Country Link
MY (1) MY146154A (en)
WO (1) WO2009057988A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102205942B (en) * 2011-05-13 2015-11-04 上海集成电路研发中心有限公司 MEMS sacrificial layer structure making process
EP2725595A1 (en) 2012-10-25 2014-04-30 Delfmems MEMS fixed capacitor comprising a gas-containing gap and process for manufacturing said capacitor
CN103345057B (en) * 2013-05-31 2016-06-01 华中科技大学 A kind of miniature bridge architecture and its preparation method
CN113670994A (en) * 2021-08-26 2021-11-19 南京高华科技股份有限公司 MEMS humidity sensor based on phase detection principle and preparation method thereof
CN117097361B (en) * 2023-07-20 2024-04-30 湖北九峰山实验室 Device integrating multi-band antenna and radio frequency switch and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621387B1 (en) * 2001-02-23 2003-09-16 Analatom Incorporated Micro-electro-mechanical systems switch
KR20040048026A (en) * 2002-12-02 2004-06-07 삼성전자주식회사 Stiction free RF MEMS switch and method thereof
KR20050068584A (en) * 2003-12-30 2005-07-05 매그나칩 반도체 유한회사 Method of switch in radio frequency integrated circuits
US7265647B2 (en) * 2004-03-12 2007-09-04 The Regents Of The University Of California High isolation tunable MEMS capacitive switch

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621387B1 (en) * 2001-02-23 2003-09-16 Analatom Incorporated Micro-electro-mechanical systems switch
KR20040048026A (en) * 2002-12-02 2004-06-07 삼성전자주식회사 Stiction free RF MEMS switch and method thereof
KR20050068584A (en) * 2003-12-30 2005-07-05 매그나칩 반도체 유한회사 Method of switch in radio frequency integrated circuits
US7265647B2 (en) * 2004-03-12 2007-09-04 The Regents Of The University Of California High isolation tunable MEMS capacitive switch

Also Published As

Publication number Publication date
WO2009057988A2 (en) 2009-05-07
MY146154A (en) 2012-06-29

Similar Documents

Publication Publication Date Title
US9458009B2 (en) Semiconductor devices and methods of forming thereof
US9938138B2 (en) MEMS device structure with a capping structure
KR101455454B1 (en) Semiconductor devices and methods of fabrication thereof
US8003422B2 (en) Micro-electro-mechanical system device and method for making same
TWI404671B (en) Mems device
US7919006B2 (en) Method of anti-stiction dimple formation under MEMS
WO2005017972A3 (en) Method for microfabricating structures using silicon-on-insulator material
US20140252508A1 (en) MEMS Device with a Capping Substrate
CA2433738A1 (en) Method for microfabricating structures using silicon-on-insulator material
WO2009057988A3 (en) Radio frequency mems switch
US6930366B2 (en) Method for forming a cavity structure on SOI substrate and cavity structure formed on SOI substrate
CN104003348A (en) Method for mems structure with dual-level structural layer and acoustic port
JP6151541B2 (en) MEMS device and manufacturing method thereof
US8710601B2 (en) MEMS structure and method for making the same
US7138672B2 (en) Apparatus and method for making a tensile diaphragm with an insert
US9505612B2 (en) Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereof
CN113314822B (en) MEMS filter device back hole manufacturing process and MEMS filter
US9527729B2 (en) Process for fabrication of a micromechanical and/or nanomechanical structure comprising a porous surface
CN108923765B (en) MEMS film bulk acoustic resonator
US20050069687A1 (en) Apparatus and method for making a tensile diaphragm with a compressive region
CN111107473B (en) Integrated structure and method of MIC and pressure sensor
CN116730277B (en) MEMS gas sensor and manufacturing method thereof
Wu et al. Self-assembly and transfer of photoresist suspended over trenches for microbeam fabrication in MEMS
WO2004017371A3 (en) Method for microfabricating structures using silicon-on-insulator material
WO2014008819A1 (en) Micro-electro-mechanical systems structure and sacrificial layer wet etching method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08843599

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08843599

Country of ref document: EP

Kind code of ref document: A2