WO2009054461A1 - Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification - Google Patents
Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification Download PDFInfo
- Publication number
- WO2009054461A1 WO2009054461A1 PCT/JP2008/069248 JP2008069248W WO2009054461A1 WO 2009054461 A1 WO2009054461 A1 WO 2009054461A1 JP 2008069248 W JP2008069248 W JP 2008069248W WO 2009054461 A1 WO2009054461 A1 WO 2009054461A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- production
- ceramic filter
- radiation structure
- susceptor
- heat radiation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D39/00—Filtering material for liquid or gaseous fluids
- B01D39/14—Other self-supporting filtering material ; Other filtering material
- B01D39/20—Other self-supporting filtering material ; Other filtering material of inorganic material, e.g. asbestos paper, metallic filtering material of non-woven wires
- B01D39/2068—Other inorganic materials, e.g. ceramics
- B01D39/2093—Ceramic foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
- H05B3/50—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material heating conductor arranged in metal tubes, the radiating surface having heat-conducting fins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
- F01N3/021—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
- H01C17/06546—Oxides of zinc or cadmium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention aims to provide a heat radiation structure which has high heat conductivity and can come into close contact even with recesses and projections present in the surface of a heating element; and a heat sink, a susceptor and a diesel particulate filter which are made by utilizing the structure. The invention relates to a heat radiation structure which comprises a substrate and a layer made of a heat-conducting whisker-like substance grown from at least part of the surface of the substrate. It is particularly preferable that the whisker-like substance be any of ZnO, TiO2 or carbon nanotube and be grown nearly perpendicularly to the surface of the substrate for the growth of the substance.
Applications Claiming Priority (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007274610 | 2007-10-23 | ||
JP2007-274610 | 2007-10-23 | ||
JP2008-018730 | 2008-01-30 | ||
JP2008018730 | 2008-01-30 | ||
JP2008020168 | 2008-01-31 | ||
JP2008-020165 | 2008-01-31 | ||
JP2008020166 | 2008-01-31 | ||
JP2008-020166 | 2008-01-31 | ||
JP2008-020167 | 2008-01-31 | ||
JP2008020165 | 2008-01-31 | ||
JP2008-020168 | 2008-01-31 | ||
JP2008020167 | 2008-01-31 | ||
JP2008047140 | 2008-02-28 | ||
JP2008-047140 | 2008-02-28 | ||
JP2008079986 | 2008-03-26 | ||
JP2008-079986 | 2008-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009054461A1 true WO2009054461A1 (en) | 2009-04-30 |
Family
ID=40579563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/069248 WO2009054461A1 (en) | 2007-10-23 | 2008-10-23 | Heat radiation structure and process for production thereof, heat sink and radiator, heater and susceptor, ceramic filter and process for production thereof, and ceramic filter and diesel particulate filter for exhaust gas purification |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009054461A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010038793A1 (en) * | 2008-09-30 | 2010-04-08 | 凸版印刷株式会社 | Nano-carbon material composite substrate and method for manufacturing same |
CN101826494A (en) * | 2010-04-13 | 2010-09-08 | 北京大学 | Heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and preparation method |
JP2011051888A (en) * | 2009-08-25 | 2011-03-17 | Qinghua Univ | Structure and method for manufacturing carbon nanotube heat dissipating device |
WO2011095854A1 (en) * | 2010-02-08 | 2011-08-11 | Sony Ericsson Mobile Communications Ab | Touchscreen displays for an electronic device that include separate carbon nanotube layers for determining location and force, respectively |
WO2011147283A1 (en) * | 2010-05-25 | 2011-12-01 | 方方 | Heat radiation dissipation film structure and method for making the same |
JP2011256100A (en) * | 2010-06-07 | 2011-12-22 | Inst Technologii Materialow Elektronicznych | Method for manufacturing graphene |
JP2013133262A (en) * | 2011-12-27 | 2013-07-08 | Fujikura Ltd | Carbon nanofiber structure, carbon nanofiber electrode, and method for manufacturing the carbon nanofiber structure |
CN106211711A (en) * | 2016-07-15 | 2016-12-07 | 中国空间技术研究院 | A kind of radiator with high performance based on aligned carbon nanotube film and preparation method |
JP2017126697A (en) * | 2016-01-15 | 2017-07-20 | 日東電工株式会社 | Holder member |
JP2018174195A (en) * | 2017-03-31 | 2018-11-08 | 富士通株式会社 | Heat dissipator, method of manufacturing heat dissipator, and electronic device |
JP7441046B2 (en) | 2020-01-10 | 2024-02-29 | 日本特殊陶業株式会社 | holding device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007182352A (en) * | 2006-01-06 | 2007-07-19 | National Institute Of Advanced Industrial & Technology | Bulk assembly of oriented carbon nanotube, method of manufacturing the same and application thereof |
-
2008
- 2008-10-23 WO PCT/JP2008/069248 patent/WO2009054461A1/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007182352A (en) * | 2006-01-06 | 2007-07-19 | National Institute Of Advanced Industrial & Technology | Bulk assembly of oriented carbon nanotube, method of manufacturing the same and application thereof |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8741419B2 (en) | 2008-09-30 | 2014-06-03 | Toppan Printing Co., Ltd. | Nanocarbon material-composite substrate and manufacturing method thereof |
WO2010038793A1 (en) * | 2008-09-30 | 2010-04-08 | 凸版印刷株式会社 | Nano-carbon material composite substrate and method for manufacturing same |
JP2011051888A (en) * | 2009-08-25 | 2011-03-17 | Qinghua Univ | Structure and method for manufacturing carbon nanotube heat dissipating device |
WO2011095854A1 (en) * | 2010-02-08 | 2011-08-11 | Sony Ericsson Mobile Communications Ab | Touchscreen displays for an electronic device that include separate carbon nanotube layers for determining location and force, respectively |
CN101826494A (en) * | 2010-04-13 | 2010-09-08 | 北京大学 | Heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and preparation method |
WO2011147283A1 (en) * | 2010-05-25 | 2011-12-01 | 方方 | Heat radiation dissipation film structure and method for making the same |
JP2011256100A (en) * | 2010-06-07 | 2011-12-22 | Inst Technologii Materialow Elektronicznych | Method for manufacturing graphene |
JP2013133262A (en) * | 2011-12-27 | 2013-07-08 | Fujikura Ltd | Carbon nanofiber structure, carbon nanofiber electrode, and method for manufacturing the carbon nanofiber structure |
JP2017126697A (en) * | 2016-01-15 | 2017-07-20 | 日東電工株式会社 | Holder member |
WO2017122622A1 (en) * | 2016-01-15 | 2017-07-20 | 日東電工株式会社 | Mounting member |
US10879103B2 (en) | 2016-01-15 | 2020-12-29 | Nitto Denko Corporation | Mounting member |
CN106211711A (en) * | 2016-07-15 | 2016-12-07 | 中国空间技术研究院 | A kind of radiator with high performance based on aligned carbon nanotube film and preparation method |
JP2018174195A (en) * | 2017-03-31 | 2018-11-08 | 富士通株式会社 | Heat dissipator, method of manufacturing heat dissipator, and electronic device |
JP7441046B2 (en) | 2020-01-10 | 2024-02-29 | 日本特殊陶業株式会社 | holding device |
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