WO2009041299A1 - インク組成物 - Google Patents

インク組成物 Download PDF

Info

Publication number
WO2009041299A1
WO2009041299A1 PCT/JP2008/066549 JP2008066549W WO2009041299A1 WO 2009041299 A1 WO2009041299 A1 WO 2009041299A1 JP 2008066549 W JP2008066549 W JP 2008066549W WO 2009041299 A1 WO2009041299 A1 WO 2009041299A1
Authority
WO
WIPO (PCT)
Prior art keywords
ink composition
printing
disclosed
water
formula
Prior art date
Application number
PCT/JP2008/066549
Other languages
English (en)
French (fr)
Inventor
Hiroyasu Inagaki
Noriyuki Kawanishi
Original Assignee
Manac Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Manac Inc. filed Critical Manac Inc.
Priority to JP2009534281A priority Critical patent/JP5331004B2/ja
Priority to CN2008801057531A priority patent/CN101796147B/zh
Publication of WO2009041299A1 publication Critical patent/WO2009041299A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　エポキシ樹脂の低温加工性とポリイミド樹脂の優れた物性とを兼ね備えた印刷用インク組成物及びこれを用いて形成された絶縁層を備える多層印刷配線板を提供する。 　一般式（１）： 式中、ｎ、Ａｒ１、Ａｒ２、Ｒ１、及びＲ２は、明細書に定義したとおりである で表される、熱硬化性イミドオリゴマー、及び （ii）水、水溶性有機溶剤またはそれらの混合物を含む印刷用インク組成物。
PCT/JP2008/066549 2007-09-27 2008-09-12 インク組成物 WO2009041299A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009534281A JP5331004B2 (ja) 2007-09-27 2008-09-12 インク組成物
CN2008801057531A CN101796147B (zh) 2007-09-27 2008-09-12 油墨组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007251637 2007-09-27
JP2007-251637 2007-09-27

Publications (1)

Publication Number Publication Date
WO2009041299A1 true WO2009041299A1 (ja) 2009-04-02

Family

ID=40511186

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066549 WO2009041299A1 (ja) 2007-09-27 2008-09-12 インク組成物

Country Status (4)

Country Link
JP (1) JP5331004B2 (ja)
CN (1) CN101796147B (ja)
TW (1) TWI518147B (ja)
WO (1) WO2009041299A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103275614A (zh) * 2013-05-30 2013-09-04 苏州艾特斯环保材料有限公司 一种含有聚酰亚胺改性有机硅树脂的耐高温防腐涂料
KR101440976B1 (ko) 2012-05-31 2014-09-18 주식회사 엘지화학 잉크젯용 잉크 조성물, 이를 이용한 식각 마스크, 절연막 및 그 제조방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110229158B (zh) * 2019-05-31 2022-06-07 西北工业大学 低熔体粘度、适用于rtm成型的热固性聚酰亚胺前驱体及制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119071A (ja) * 1989-10-02 1991-05-21 Chisso Corp 印刷用インキ組成物
JPH05301960A (ja) * 1992-04-27 1993-11-16 Kanegafuchi Chem Ind Co Ltd 熱硬化性オリゴマー及びその製造方法
JPH10101795A (ja) * 1996-07-18 1998-04-21 Reitetsuku Kk ポリイミド類の製法、組成物およびその製品
JPH11172181A (ja) * 1997-12-10 1999-06-29 Toshiba Chem Corp 印刷用インキ組成物
JP2007137960A (ja) * 2005-11-16 2007-06-07 Amt Kenkyusho:Kk ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物
WO2008044382A1 (fr) * 2006-10-13 2008-04-17 Manac Inc. Carte de circuit imprimé et son procédé de production

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09328549A (ja) * 1996-06-12 1997-12-22 Central Glass Co Ltd ポリイミド組成物
JP2007246556A (ja) * 2006-03-13 2007-09-27 Fujifilm Corp インクジェット用油性インク、及びインクジェット記録方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119071A (ja) * 1989-10-02 1991-05-21 Chisso Corp 印刷用インキ組成物
JPH05301960A (ja) * 1992-04-27 1993-11-16 Kanegafuchi Chem Ind Co Ltd 熱硬化性オリゴマー及びその製造方法
JPH10101795A (ja) * 1996-07-18 1998-04-21 Reitetsuku Kk ポリイミド類の製法、組成物およびその製品
JPH11172181A (ja) * 1997-12-10 1999-06-29 Toshiba Chem Corp 印刷用インキ組成物
JP2007137960A (ja) * 2005-11-16 2007-06-07 Amt Kenkyusho:Kk ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物
WO2008044382A1 (fr) * 2006-10-13 2008-04-17 Manac Inc. Carte de circuit imprimé et son procédé de production

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101440976B1 (ko) 2012-05-31 2014-09-18 주식회사 엘지화학 잉크젯용 잉크 조성물, 이를 이용한 식각 마스크, 절연막 및 그 제조방법
CN103275614A (zh) * 2013-05-30 2013-09-04 苏州艾特斯环保材料有限公司 一种含有聚酰亚胺改性有机硅树脂的耐高温防腐涂料
CN103275614B (zh) * 2013-05-30 2015-08-05 苏州艾特斯环保材料有限公司 一种含有聚酰亚胺改性有机硅树脂的耐高温防腐涂料

Also Published As

Publication number Publication date
JP5331004B2 (ja) 2013-10-30
CN101796147A (zh) 2010-08-04
CN101796147B (zh) 2012-09-05
TW200918616A (en) 2009-05-01
TWI518147B (zh) 2016-01-21
JPWO2009041299A1 (ja) 2011-01-27

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