WO2009041299A1 - インク組成物 - Google Patents
インク組成物 Download PDFInfo
- Publication number
- WO2009041299A1 WO2009041299A1 PCT/JP2008/066549 JP2008066549W WO2009041299A1 WO 2009041299 A1 WO2009041299 A1 WO 2009041299A1 JP 2008066549 W JP2008066549 W JP 2008066549W WO 2009041299 A1 WO2009041299 A1 WO 2009041299A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ink composition
- printing
- disclosed
- water
- formula
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Epoxy Resins (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009534281A JP5331004B2 (ja) | 2007-09-27 | 2008-09-12 | インク組成物 |
CN2008801057531A CN101796147B (zh) | 2007-09-27 | 2008-09-12 | 油墨组合物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007251637 | 2007-09-27 | ||
JP2007-251637 | 2007-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009041299A1 true WO2009041299A1 (ja) | 2009-04-02 |
Family
ID=40511186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/066549 WO2009041299A1 (ja) | 2007-09-27 | 2008-09-12 | インク組成物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5331004B2 (ja) |
CN (1) | CN101796147B (ja) |
TW (1) | TWI518147B (ja) |
WO (1) | WO2009041299A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103275614A (zh) * | 2013-05-30 | 2013-09-04 | 苏州艾特斯环保材料有限公司 | 一种含有聚酰亚胺改性有机硅树脂的耐高温防腐涂料 |
KR101440976B1 (ko) | 2012-05-31 | 2014-09-18 | 주식회사 엘지화학 | 잉크젯용 잉크 조성물, 이를 이용한 식각 마스크, 절연막 및 그 제조방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110229158B (zh) * | 2019-05-31 | 2022-06-07 | 西北工业大学 | 低熔体粘度、适用于rtm成型的热固性聚酰亚胺前驱体及制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03119071A (ja) * | 1989-10-02 | 1991-05-21 | Chisso Corp | 印刷用インキ組成物 |
JPH05301960A (ja) * | 1992-04-27 | 1993-11-16 | Kanegafuchi Chem Ind Co Ltd | 熱硬化性オリゴマー及びその製造方法 |
JPH10101795A (ja) * | 1996-07-18 | 1998-04-21 | Reitetsuku Kk | ポリイミド類の製法、組成物およびその製品 |
JPH11172181A (ja) * | 1997-12-10 | 1999-06-29 | Toshiba Chem Corp | 印刷用インキ組成物 |
JP2007137960A (ja) * | 2005-11-16 | 2007-06-07 | Amt Kenkyusho:Kk | ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物 |
WO2008044382A1 (fr) * | 2006-10-13 | 2008-04-17 | Manac Inc. | Carte de circuit imprimé et son procédé de production |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09328549A (ja) * | 1996-06-12 | 1997-12-22 | Central Glass Co Ltd | ポリイミド組成物 |
JP2007246556A (ja) * | 2006-03-13 | 2007-09-27 | Fujifilm Corp | インクジェット用油性インク、及びインクジェット記録方法 |
-
2008
- 2008-09-12 CN CN2008801057531A patent/CN101796147B/zh not_active Expired - Fee Related
- 2008-09-12 WO PCT/JP2008/066549 patent/WO2009041299A1/ja active Application Filing
- 2008-09-12 JP JP2009534281A patent/JP5331004B2/ja not_active Expired - Fee Related
- 2008-09-18 TW TW097135747A patent/TWI518147B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03119071A (ja) * | 1989-10-02 | 1991-05-21 | Chisso Corp | 印刷用インキ組成物 |
JPH05301960A (ja) * | 1992-04-27 | 1993-11-16 | Kanegafuchi Chem Ind Co Ltd | 熱硬化性オリゴマー及びその製造方法 |
JPH10101795A (ja) * | 1996-07-18 | 1998-04-21 | Reitetsuku Kk | ポリイミド類の製法、組成物およびその製品 |
JPH11172181A (ja) * | 1997-12-10 | 1999-06-29 | Toshiba Chem Corp | 印刷用インキ組成物 |
JP2007137960A (ja) * | 2005-11-16 | 2007-06-07 | Amt Kenkyusho:Kk | ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物 |
WO2008044382A1 (fr) * | 2006-10-13 | 2008-04-17 | Manac Inc. | Carte de circuit imprimé et son procédé de production |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101440976B1 (ko) | 2012-05-31 | 2014-09-18 | 주식회사 엘지화학 | 잉크젯용 잉크 조성물, 이를 이용한 식각 마스크, 절연막 및 그 제조방법 |
CN103275614A (zh) * | 2013-05-30 | 2013-09-04 | 苏州艾特斯环保材料有限公司 | 一种含有聚酰亚胺改性有机硅树脂的耐高温防腐涂料 |
CN103275614B (zh) * | 2013-05-30 | 2015-08-05 | 苏州艾特斯环保材料有限公司 | 一种含有聚酰亚胺改性有机硅树脂的耐高温防腐涂料 |
Also Published As
Publication number | Publication date |
---|---|
JP5331004B2 (ja) | 2013-10-30 |
CN101796147A (zh) | 2010-08-04 |
CN101796147B (zh) | 2012-09-05 |
TW200918616A (en) | 2009-05-01 |
TWI518147B (zh) | 2016-01-21 |
JPWO2009041299A1 (ja) | 2011-01-27 |
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