WO2009037820A1 - Curable resin composition and cured product - Google Patents

Curable resin composition and cured product Download PDF

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Publication number
WO2009037820A1
WO2009037820A1 PCT/JP2008/002530 JP2008002530W WO2009037820A1 WO 2009037820 A1 WO2009037820 A1 WO 2009037820A1 JP 2008002530 W JP2008002530 W JP 2008002530W WO 2009037820 A1 WO2009037820 A1 WO 2009037820A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
curable resin
carbon atoms
group
cured product
Prior art date
Application number
PCT/JP2008/002530
Other languages
French (fr)
Japanese (ja)
Inventor
Yasunobu Nakagawa
Toshihiko Nijukken
Misao Mori
Original Assignee
Daicel Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries, Ltd. filed Critical Daicel Chemical Industries, Ltd.
Priority to CN200880025268.3A priority Critical patent/CN101755008B/en
Publication of WO2009037820A1 publication Critical patent/WO2009037820A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/81—Unsaturated isocyanates or isothiocyanates
    • C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
    • C08G18/8116—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3209—Epoxy compounds containing three or more epoxy groups obtained by polymerisation of unsaturated mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

Disclosed is a curable resin composition characterized by containing a polymer A which contains at least an epoxy group-containing vinyl monomer a1 as a monomer component, and a polymer B which contains at least an alkoxysilyl group-containing vinyl monomer represented by the formula (I) below as a monomer component. This curable resin composition enables to form a cured product which is excellent in hardness, solvent resistance, heat resistance and adhesion to a base. (I) (In the formula (I), R1 represents a hydrogen atom of an alkyl group having 1-7 carbon atoms; E represents a single bond or a divalent hydrocarbon group; R2 and R3 may be the same or different and each represents an alkyl group having 1-6 carbon atoms or an alkoxyl group having 1-6 carbon atoms; R4 represents an alkyl group having 1-6 carbon atoms; x represents 0 or 1; and y represents an integer of 1-10.)
PCT/JP2008/002530 2007-09-19 2008-09-12 Curable resin composition and cured product WO2009037820A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880025268.3A CN101755008B (en) 2007-09-19 2008-09-12 Curable resin composition and cured product

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-243133 2007-09-19
JP2007243133 2007-09-19

Publications (1)

Publication Number Publication Date
WO2009037820A1 true WO2009037820A1 (en) 2009-03-26

Family

ID=40467648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002530 WO2009037820A1 (en) 2007-09-19 2008-09-12 Curable resin composition and cured product

Country Status (5)

Country Link
JP (1) JP2009091564A (en)
KR (1) KR20100065330A (en)
CN (1) CN101755008B (en)
TW (1) TW200923014A (en)
WO (1) WO2009037820A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2320467A1 (en) * 2008-08-28 2011-05-11 Sumitomo Chemical Company, Limited Resin composition, gate insulating layer and organic thin film transistor
WO2017141933A1 (en) * 2016-02-18 2017-08-24 住友化学株式会社 Polymer compound, composition, and organic thin-film transistor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974110A (en) * 1982-10-19 1984-04-26 Mitsubishi Rayon Co Ltd Production of new polymer composition
JPH07138491A (en) * 1993-11-12 1995-05-30 Dainippon Ink & Chem Inc Cold-curable resin composition
WO1995035336A1 (en) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Thermosetting composition and method of forming topcoating film
JPH11323198A (en) * 1998-05-08 1999-11-26 Kanegafuchi Chem Ind Co Ltd Novel resin composition for powder coating material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3380065D1 (en) * 1982-10-19 1989-07-20 Mitsubishi Rayon Co Novel polymer composition
JP4816372B2 (en) * 2006-09-27 2011-11-16 日油株式会社 Thermosetting resin composition for color filter protective film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974110A (en) * 1982-10-19 1984-04-26 Mitsubishi Rayon Co Ltd Production of new polymer composition
JPH07138491A (en) * 1993-11-12 1995-05-30 Dainippon Ink & Chem Inc Cold-curable resin composition
WO1995035336A1 (en) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Thermosetting composition and method of forming topcoating film
JPH11323198A (en) * 1998-05-08 1999-11-26 Kanegafuchi Chem Ind Co Ltd Novel resin composition for powder coating material

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2320467A1 (en) * 2008-08-28 2011-05-11 Sumitomo Chemical Company, Limited Resin composition, gate insulating layer and organic thin film transistor
EP2320467A4 (en) * 2008-08-28 2012-03-14 Sumitomo Chemical Co Resin composition, gate insulating layer and organic thin film transistor
US8476621B2 (en) 2008-08-28 2013-07-02 Sumitomo Chemical Company, Limited Resin composition, gate insulating layer, and organic thin film transistor
WO2017141933A1 (en) * 2016-02-18 2017-08-24 住友化学株式会社 Polymer compound, composition, and organic thin-film transistor

Also Published As

Publication number Publication date
CN101755008B (en) 2013-01-16
JP2009091564A (en) 2009-04-30
CN101755008A (en) 2010-06-23
KR20100065330A (en) 2010-06-16
TW200923014A (en) 2009-06-01

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