WO2009035089A1 - Cleaning agent for electronic material - Google Patents

Cleaning agent for electronic material Download PDF

Info

Publication number
WO2009035089A1
WO2009035089A1 PCT/JP2008/066558 JP2008066558W WO2009035089A1 WO 2009035089 A1 WO2009035089 A1 WO 2009035089A1 JP 2008066558 W JP2008066558 W JP 2008066558W WO 2009035089 A1 WO2009035089 A1 WO 2009035089A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
cleaning agent
cleaning
electronic materials
surfactant
Prior art date
Application number
PCT/JP2008/066558
Other languages
French (fr)
Japanese (ja)
Inventor
Kazumitsu Suzuki
Ayayo Sugiyama
Yoshitaka Katsukawa
Original Assignee
Sanyo Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Chemical Industries, Ltd. filed Critical Sanyo Chemical Industries, Ltd.
Priority to CN200880106471A priority Critical patent/CN101848987A/en
Publication of WO2009035089A1 publication Critical patent/WO2009035089A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Detergent Compositions (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

This invention provides a cleaning agent for electronic materials such as magnetic disk substrates, flat panel display substrates, and photomask substrates, which can realize excellent particle removing properties by imparting a suitable level of etching properties without sacrificing the flatness of the surface of electronic material substrates such as magnetic disk substrates, flat panel display substrates, and photomask substrates and enhancing the dispersibility of particles desorbed from the surface of the substrates with a surfactant, whereby a very efficient high level cleaning, which can realize an improvement in yield in the production of the electronic materials and cleaning in a short time. The cleaning agent for electronic materials contains a surfactant (A) and is characterized by satisfying formula (1): V ≤ -38.7 x pH + 550 (1) wherein pH represents the pH value of the cleaning agent at 25˚C at an effective component concentration for use as a cleaning liquid; and V represents the redox potential of the cleaning agent at 25˚C at an effective component concentration for use as the cleaning liquid, mV (vs. SHE).
PCT/JP2008/066558 2007-09-14 2008-09-12 Cleaning agent for electronic material WO2009035089A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880106471A CN101848987A (en) 2007-09-14 2008-09-12 Cleaning agent for electronic material

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-239356 2007-09-14
JP2007239474 2007-09-14
JP2007-239474 2007-09-14
JP2007239356 2007-09-14

Publications (1)

Publication Number Publication Date
WO2009035089A1 true WO2009035089A1 (en) 2009-03-19

Family

ID=40452095

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066558 WO2009035089A1 (en) 2007-09-14 2008-09-12 Cleaning agent for electronic material

Country Status (5)

Country Link
CN (1) CN101848987A (en)
MY (1) MY156414A (en)
SG (1) SG184735A1 (en)
TW (1) TWI398514B (en)
WO (1) WO2009035089A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010257510A (en) * 2009-04-22 2010-11-11 Kao Corp Detergent composition for substrate for hard disk
WO2012009968A1 (en) * 2010-07-23 2012-01-26 安集微电子（上海）有限公司 Photoresist cleaning solution
JP2012017420A (en) * 2010-07-08 2012-01-26 Neos Co Ltd Water-soluble detergent composition
CN102346383A (en) * 2010-08-06 2012-02-08 安集微电子（上海）有限公司 Photoresist cleaning solution
JP2012177055A (en) * 2011-02-28 2012-09-13 Sanyo Chem Ind Ltd Detergent for electronic material
JP2013533360A (en) * 2010-07-19 2013-08-22 ビーエーエスエフ ソシエタス・ヨーロピア Aqueous alkaline cleaning compositions and methods of using them
CN108499963A (en) * 2017-05-18 2018-09-07 苏州权素船舶电子有限公司 A kind of electronic material ground and cleaned method

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101673589B1 (en) * 2009-10-30 2016-11-07 동우 화인켐 주식회사 A detergent composition for a glass substrate of flat panel display device
JP5401359B2 (en) * 2010-02-16 2014-01-29 花王株式会社 Alkali detergent composition for hard surface
CN102653706A (en) * 2011-03-03 2012-09-05 宁波市鄞州声光电子有限公司 Nonmetallic element cleaner
JPWO2012161270A1 (en) * 2011-05-24 2014-07-31 株式会社パーカーコーポレーション Cleaning agent and glass substrate cleaning method
CN102981376A (en) * 2011-09-05 2013-03-20 安集微电子（上海）有限公司 Photoresist cleaning solution
CN102604751B (en) * 2012-01-20 2013-06-19 深圳市飞世尔实业有限公司 Cleaning agent for optical glass
SG11201501492YA (en) * 2012-09-20 2015-05-28 Hoya Corp Method for manufacturing glass substrate for information recording medium
KR20150087224A (en) * 2012-11-22 2015-07-29 아사히 가라스 가부시키가이샤 Glass substrate cleaning method
CN104673540A (en) * 2013-11-30 2015-06-03 天津晶美微纳科技有限公司 Water-soluble liquid crystal glass substrate detergent and preparation method thereof
CN103668144B (en) * 2013-12-24 2016-01-20 淮南天力生物工程开发有限公司 A kind of environment-friendly type organo-metallic treatment solution and preparation method thereof
CN104710608B (en) * 2015-02-09 2016-11-23 上海金兆节能科技有限公司 Alcohol ether phosphate and preparation method thereof and prepare environment protection metal abluent with this ester
KR102045370B1 (en) * 2015-05-13 2019-11-15 반도 카가쿠 가부시키가이샤 Abrasive pad and manufacturing method of abrasive pad
CN104894593A (en) * 2015-07-02 2015-09-09 傅宇晓 Cold rolled tube cleaning fluid
CN105838507B (en) * 2016-05-16 2019-02-01 深圳市路维光电股份有限公司 Optical enclosure cleaning agent and cleaning method
CN106811347A (en) * 2016-11-29 2017-06-09 洛阳新巨能高热技术有限公司 A kind of washing agent for electronic materials
JP6495230B2 (en) * 2016-12-22 2019-04-03 花王株式会社 Rinse agent composition for silicon wafer
CN108004049A (en) * 2017-12-28 2018-05-08 广州云普电子科技有限公司 A kind of washing agent for electronic materials for possessing antiseptic and rustproof function
KR102625498B1 (en) 2018-12-21 2024-01-17 엔테그리스, 아이엔씨. Compositions and methods for post-CMP cleaning of cobalt substrates

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161672A (en) * 1993-12-10 1995-06-23 Tadahiro Omi Substrate surface cleaning method and surface cleaning agent
JP2001070898A (en) * 1999-09-06 2001-03-21 Shin Etsu Chem Co Ltd Washing liquid for precision substrate and washing method therefor
JP2002069495A (en) * 2000-06-16 2002-03-08 Kao Corp Detergent composition
JP2003119494A (en) * 2001-10-05 2003-04-23 Nec Corp Washing composition, and washing method and washing device using the same
JP2003142441A (en) * 2001-11-02 2003-05-16 Nec Electronics Corp Washing method and cleaning liquid
JP2004217814A (en) * 2003-01-16 2004-08-05 Nec Corp Washing composition for device substrate and washing method and washing apparatus each using the same composition
WO2007125634A1 (en) * 2006-03-31 2007-11-08 Sanyo Chemical Industries, Ltd. Cleaning agent for copper wiring

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107825B2 (en) * 2001-10-16 2008-06-25 電気化学工業株式会社 Slug injection slurry

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161672A (en) * 1993-12-10 1995-06-23 Tadahiro Omi Substrate surface cleaning method and surface cleaning agent
JP2001070898A (en) * 1999-09-06 2001-03-21 Shin Etsu Chem Co Ltd Washing liquid for precision substrate and washing method therefor
JP2002069495A (en) * 2000-06-16 2002-03-08 Kao Corp Detergent composition
JP2003119494A (en) * 2001-10-05 2003-04-23 Nec Corp Washing composition, and washing method and washing device using the same
JP2003142441A (en) * 2001-11-02 2003-05-16 Nec Electronics Corp Washing method and cleaning liquid
JP2004217814A (en) * 2003-01-16 2004-08-05 Nec Corp Washing composition for device substrate and washing method and washing apparatus each using the same composition
WO2007125634A1 (en) * 2006-03-31 2007-11-08 Sanyo Chemical Industries, Ltd. Cleaning agent for copper wiring

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010257510A (en) * 2009-04-22 2010-11-11 Kao Corp Detergent composition for substrate for hard disk
JP2012017420A (en) * 2010-07-08 2012-01-26 Neos Co Ltd Water-soluble detergent composition
JP2013533360A (en) * 2010-07-19 2013-08-22 ビーエーエスエフ ソシエタス・ヨーロピア Aqueous alkaline cleaning compositions and methods of using them
KR101855538B1 (en) 2010-07-19 2018-05-04 바스프 에스이 Aqueous alkaline cleaning compositions and methods of their use
WO2012009968A1 (en) * 2010-07-23 2012-01-26 安集微电子（上海）有限公司 Photoresist cleaning solution
CN102346383A (en) * 2010-08-06 2012-02-08 安集微电子（上海）有限公司 Photoresist cleaning solution
WO2012016425A1 (en) * 2010-08-06 2012-02-09 安集微电子（上海）有限公司 Photo-resist washing fluid
JP2012177055A (en) * 2011-02-28 2012-09-13 Sanyo Chem Ind Ltd Detergent for electronic material
CN108499963A (en) * 2017-05-18 2018-09-07 苏州权素船舶电子有限公司 A kind of electronic material ground and cleaned method

Also Published As

Publication number Publication date
TWI398514B (en) 2013-06-11
SG184735A1 (en) 2012-10-30
MY156414A (en) 2016-02-26
CN101848987A (en) 2010-09-29
TW200923072A (en) 2009-06-01

Similar Documents

Publication Publication Date Title
WO2009035089A1 (en) Cleaning agent for electronic material
MY149975A (en) Polishing composition and method utilizing abrasive particles treated with an aminosilane
Wiesner et al. Meditations on the ubiquity and mutability of nano-sized materials in the environment
WO2009023387A3 (en) Compositions and methods for modifying a surface suited for semiconductor fabrication
TW200517478A (en) Polishing liquid for CMP process and polishing method
MXPA06000251A (en) Abrasive particles for chemical mechanical polishing.
WO2009031345A1 (en) Charged particles used in electrophoretic display medium
Kang et al. Low Fe (II) concentrations catalyze the dissolution of various Fe (III)(hydr) oxide minerals in the presence of diverse ligands and over a broad pH range
JP2014521123A5 (en)
WO2006078293A3 (en) Method of making an applicator liquid for electronics fabrication process
WO2007038321A3 (en) Ultrapure colloidal silica for use in chemical mechanical polishing applications
MX2008016381A (en) Coated molecular sieve.
WO2013006750A3 (en) Surface flaw modification for strengthening of glass articles
TW200703719A (en) Nitride-based compound semiconductor, method of cleaning a compound semiconductor, method of producing the same, and substrate
IN2014CN01603A (en)
MY153666A (en) Cmp method for metal-containing substrates
WO2009072529A1 (en) Method and solution for washing substrate for semiconductor device
WO2009049608A3 (en) Encoder element for displaying an adjustment or movement of a bearing constituent
WO2009054370A1 (en) Cmp polishing liquid and method for polishing substrate using the same
TW200714709A (en) Polymer-stripping composition
MY154309A (en) Polishing composition for hard disk substrate
WO2010132371A3 (en) Multi-stage substrate cleaning method and apparatus
MY164185A (en) Manufacturing method of a glass substrate for a magnetic disk
MY176178A (en) Method for manufacturing a glass substrate, method for manufacturing a magnetic disk, and polishing liquid composition for a glass substrate
WO2007008921A3 (en) Method and apparatus for forming multi-dimensional colloidal structures using holographic optical tweezers

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880106471.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08830568

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 12010500565

Country of ref document: PH

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: PI 2010001118

Country of ref document: MY

122 Ep: pct application non-entry in european phase

Ref document number: 08830568

Country of ref document: EP

Kind code of ref document: A1