WO2009034770A1 - 密着露光の方法及びその装置 - Google Patents
密着露光の方法及びその装置 Download PDFInfo
- Publication number
- WO2009034770A1 WO2009034770A1 PCT/JP2008/062385 JP2008062385W WO2009034770A1 WO 2009034770 A1 WO2009034770 A1 WO 2009034770A1 JP 2008062385 W JP2008062385 W JP 2008062385W WO 2009034770 A1 WO2009034770 A1 WO 2009034770A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mask
- contact
- work
- close contact
- exposure method
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
密着誤差を最小限に抑制しつつ、密着面略中心の真空引きを効果的に行い密着不良を防止した、真空密着露光方法を提供すること。 ワーク(120)を載置したテーブル(140)の端縁部に装備されたパッキン(130)により、パッキン(130)をテーブル(140)に配設したマスク(110)に密着させる工程、初期設定圧力値まで真空引きを行い、マスク(110)を凸状にたわませてマスク(110)の略中心からワーク(120)に密着させる工程、更に真空引きを行うと共にマスク(110)の端縁部を保持するマスクホルダー(170)を上昇させ、マスク(110)のたわみを増大させつつマスク(110)の端縁部に向かって更にワーク(120)に密着させる工程、及びマスク(110)がワーク(120) の略端縁部まで密着したことに応じて、マスクホルダー(170)の上昇を停止させる工程を含む真空密着方法による。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-236421 | 2007-09-12 | ||
JP2007236421A JP4651648B2 (ja) | 2007-09-12 | 2007-09-12 | 密着露光の方法及びその装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009034770A1 true WO2009034770A1 (ja) | 2009-03-19 |
Family
ID=40451782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/062385 WO2009034770A1 (ja) | 2007-09-12 | 2008-07-09 | 密着露光の方法及びその装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4651648B2 (ja) |
WO (1) | WO2009034770A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016218117A (ja) * | 2015-05-15 | 2016-12-22 | 株式会社ブイ・テクノロジー | 密着露光装置における密着方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101451094B1 (ko) * | 2013-10-04 | 2014-10-15 | 주식회사 옵티레이 | 밀착형 노광 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000235266A (ja) * | 1998-12-18 | 2000-08-29 | Nsk Ltd | 密着露光装置における密着方法 |
JP2004133302A (ja) * | 2002-10-11 | 2004-04-30 | Toshiba Corp | フォトマスク密着方法およびその装置 |
JP2006258929A (ja) * | 2005-03-15 | 2006-09-28 | Nsk Ltd | 露光装置のマスク密着方法 |
JP2007171621A (ja) * | 2005-12-22 | 2007-07-05 | Adtec Engineeng Co Ltd | 密着型露光装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59123229A (ja) * | 1982-12-28 | 1984-07-17 | Yamagata Nippon Denki Kk | 半導体装置の製造方法 |
JPH07219234A (ja) * | 1994-01-27 | 1995-08-18 | Ono Sokki Co Ltd | 露光機の密着装置 |
JP4420507B2 (ja) * | 2000-01-24 | 2010-02-24 | 株式会社オーク製作所 | 基板露光方法および装置 |
-
2007
- 2007-09-12 JP JP2007236421A patent/JP4651648B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-09 WO PCT/JP2008/062385 patent/WO2009034770A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000235266A (ja) * | 1998-12-18 | 2000-08-29 | Nsk Ltd | 密着露光装置における密着方法 |
JP2004133302A (ja) * | 2002-10-11 | 2004-04-30 | Toshiba Corp | フォトマスク密着方法およびその装置 |
JP2006258929A (ja) * | 2005-03-15 | 2006-09-28 | Nsk Ltd | 露光装置のマスク密着方法 |
JP2007171621A (ja) * | 2005-12-22 | 2007-07-05 | Adtec Engineeng Co Ltd | 密着型露光装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016218117A (ja) * | 2015-05-15 | 2016-12-22 | 株式会社ブイ・テクノロジー | 密着露光装置における密着方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4651648B2 (ja) | 2011-03-16 |
JP2009069362A (ja) | 2009-04-02 |
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