WO2009031415A1 - 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置 - Google Patents

電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置 Download PDF

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Publication number
WO2009031415A1
WO2009031415A1 PCT/JP2008/064970 JP2008064970W WO2009031415A1 WO 2009031415 A1 WO2009031415 A1 WO 2009031415A1 JP 2008064970 W JP2008064970 W JP 2008064970W WO 2009031415 A1 WO2009031415 A1 WO 2009031415A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
cooling apparatus
component cooling
test head
refrigerant
Prior art date
Application number
PCT/JP2008/064970
Other languages
English (en)
French (fr)
Inventor
Koei Nishiura
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Publication of WO2009031415A1 publication Critical patent/WO2009031415A1/ja

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

電子部品冷却装置（３０）は、冷媒を冷却する熱交換器（４１）及び冷媒を圧送する第１のポンプ（４２）を有するチラー（４０）と、ピンエレクトロニクスカード（２０）に装着され、冷媒が流通可能な通路（５１）を有するウォータジャケット（５０Ａ）と、通路（５１）に連通しており、通路（５１）内を流通している冷媒を昇圧する第２のポンプ（５９Ａ）と、を備えている。
PCT/JP2008/064970 2007-09-06 2008-08-22 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置 WO2009031415A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-231476 2007-09-06
JP2007231476 2007-09-06

Publications (1)

Publication Number Publication Date
WO2009031415A1 true WO2009031415A1 (ja) 2009-03-12

Family

ID=40428735

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064970 WO2009031415A1 (ja) 2007-09-06 2008-08-22 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置

Country Status (2)

Country Link
TW (1) TW200932096A (ja)
WO (1) WO2009031415A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06341782A (ja) * 1993-05-18 1994-12-13 Nec Corp 冷媒循環構造
JP2004246649A (ja) * 2003-02-14 2004-09-02 Hitachi Ltd ラックマウントサーバシステム、ラックキャビネット、サーバモジュール、ならびにラックマウントサーバシステムの冷却方法
WO2005004571A1 (ja) * 2003-06-30 2005-01-13 Advantest Corporation 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06341782A (ja) * 1993-05-18 1994-12-13 Nec Corp 冷媒循環構造
JP2004246649A (ja) * 2003-02-14 2004-09-02 Hitachi Ltd ラックマウントサーバシステム、ラックキャビネット、サーバモジュール、ならびにラックマウントサーバシステムの冷却方法
WO2005004571A1 (ja) * 2003-06-30 2005-01-13 Advantest Corporation 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド

Also Published As

Publication number Publication date
TW200932096A (en) 2009-07-16

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