WO2009025190A1 - 反応性カルボキシレート化合物、それを用いた活性エネルギー線硬化型樹脂組成物、およびその用途 - Google Patents

反応性カルボキシレート化合物、それを用いた活性エネルギー線硬化型樹脂組成物、およびその用途 Download PDF

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Publication number
WO2009025190A1
WO2009025190A1 PCT/JP2008/064283 JP2008064283W WO2009025190A1 WO 2009025190 A1 WO2009025190 A1 WO 2009025190A1 JP 2008064283 W JP2008064283 W JP 2008064283W WO 2009025190 A1 WO2009025190 A1 WO 2009025190A1
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Prior art keywords
same
resin composition
curable resin
ray
compound
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PCT/JP2008/064283
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English (en)
French (fr)
Inventor
Kazuyoshi Yamamoto
Toru Kurihashi
Naofumi Horiguchi
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Nippon Kayaku Kabushiki Kaisha
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Priority claimed from JP2007214733A external-priority patent/JP5279214B2/ja
Priority claimed from JP2007274912A external-priority patent/JP5473208B2/ja
Priority claimed from JP2008129547A external-priority patent/JP2009275167A/ja
Application filed by Nippon Kayaku Kabushiki Kaisha filed Critical Nippon Kayaku Kabushiki Kaisha
Priority to KR1020107001101A priority Critical patent/KR101482028B1/ko
Priority to CN2008801035867A priority patent/CN101784578B/zh
Priority to KR1020137010162A priority patent/KR101484661B1/ko
Publication of WO2009025190A1 publication Critical patent/WO2009025190A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)

Abstract

【課題】紫外線等の活性エネルギー線等により硬化し、強靭な皮膜、若しくは成形材料を得ることが出来る樹脂組成物を提供することを目的とする。 【解決手段】分子中に特定構造を含むフェノール型エポキシ樹脂に、分子中に一個以上の重合可能なエチレン性不飽和基と一個以上のカルボキシル基を併せ持つ化合物と一分子中に一個以上の水酸基と一個以上のカルボキシル基を併せ持つ化合物とから誘導される反応性化合物。さらにそれを用いた硬化型樹脂組成物から強靭な硬化物が得られる。さらに、この反応性化合物は良好な顔料分散性を発揮する。
PCT/JP2008/064283 2007-08-21 2008-08-08 反応性カルボキシレート化合物、それを用いた活性エネルギー線硬化型樹脂組成物、およびその用途 WO2009025190A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107001101A KR101482028B1 (ko) 2007-08-21 2008-08-08 반응성 카르복실레이트 화합물, 이를 이용한 활성 에너지선 경화형 수지 조성물 및 그 용도
CN2008801035867A CN101784578B (zh) 2007-08-21 2008-08-08 反应性羧酸酯化合物、使用该反应性羧酸酯化合物的活性能量射线固化型树脂组合物及其用途
KR1020137010162A KR101484661B1 (ko) 2007-08-21 2008-08-08 반응성 카르복실레이트 화합물, 이를 이용한 활성 에너지선 경화형 수지 조성물 및 그 용도

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007214733A JP5279214B2 (ja) 2007-08-21 2007-08-21 反応性カルボキシレート化合物、それを用いた活性エネルギー線硬化型樹脂組成物、およびその用途
JP2007-214733 2007-08-21
JP2007-274912 2007-10-23
JP2007274912A JP5473208B2 (ja) 2007-10-23 2007-10-23 新規エポキシカルボキシレート化合物、その誘導体、それを含有する活性エネルギー線硬化型樹脂組成物及びその硬化物
JP2008-129547 2008-05-16
JP2008129547A JP2009275167A (ja) 2008-05-16 2008-05-16 反応性カルボキシレート化合物、それを用いた活性エネルギー線硬化型樹脂組成物、およびその用途

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WO2009025190A1 true WO2009025190A1 (ja) 2009-02-26

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KR (2) KR101484661B1 (ja)
CN (2) CN103224609B (ja)
TW (2) TWI421270B (ja)
WO (1) WO2009025190A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013172009A1 (ja) * 2012-05-15 2013-11-21 日本化薬株式会社 反応性ポリエステル化合物及び活性エネルギー線硬化型樹脂組成物
CN105968001A (zh) * 2015-03-13 2016-09-28 日本化药株式会社 含有羧基的反应性化合物、使用该化合物的硬化型树脂组合物及硬化物
JP2017128671A (ja) * 2016-01-14 2017-07-27 日本化薬株式会社 エポキシ樹脂、反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途
WO2018173679A1 (ja) * 2017-03-22 2018-09-27 Dic株式会社 酸基含有（メタ）アクリレート樹脂及びソルダーレジスト用樹脂材料
WO2023218876A1 (ja) * 2022-05-13 2023-11-16 株式会社日本触媒 アルカリ可溶性樹脂、感光性樹脂組成物及びその硬化物

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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JP6021621B2 (ja) * 2012-12-07 2016-11-09 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用スペーサー及び／またはカラーフィルター保護膜
JP6184087B2 (ja) * 2012-12-07 2017-08-23 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用スペーサー及び／またはカラーフィルター保護膜
JP6095104B2 (ja) * 2012-12-26 2017-03-15 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、表示素子用着色スペーサー及びブラックマトリックス
JP5866061B2 (ja) * 2013-07-19 2016-02-17 Dic株式会社 活性エネルギー線硬化性組成物、それを用いた活性エネルギー線硬化性印刷インキ、及び印刷物
KR102327347B1 (ko) * 2014-08-22 2021-11-16 닛뽄 가야쿠 가부시키가이샤 에폭시(메타)아크릴레이트 화합물 및 그것을 함유하는 수지 조성물 그리고 그의 경화물, 컬러 필터 및 표시 소자
KR102286273B1 (ko) * 2014-08-25 2021-08-04 닛뽄 가야쿠 가부시키가이샤 신규 반응성 에폭시카복실레이트 화합물, 그의 유도체, 그것을 함유하는 수지 조성물, 그의 경화물, 및 물품
JP6556735B2 (ja) * 2014-08-26 2019-08-07 日本化薬株式会社 反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物
JP6275620B2 (ja) * 2014-10-17 2018-02-07 日本化薬株式会社 感光性樹脂組成物及びその硬化物
JP6685813B2 (ja) * 2016-04-14 2020-04-22 日本化薬株式会社 エポキシ樹脂、反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、及びその用途
KR102324899B1 (ko) * 2016-06-29 2021-11-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치
JP6798811B2 (ja) * 2016-07-22 2020-12-09 日本化薬株式会社 エポキシカルボキシレート化合物、ポリカルボン酸化合物、それを含有するエネルギー線硬化型樹脂組成物及びその硬化物
JP7236813B2 (ja) * 2017-04-28 2023-03-10 日本化薬株式会社 反応性ポリカルボン酸化合物、それを用いた活性エネルギー線硬化型樹脂組成物、その硬化物及びその用途
JP7236817B2 (ja) * 2017-06-19 2023-03-10 日本化薬株式会社 反応性ポリカルボン酸化合物、それを用いた活性エネルギー線硬化型樹脂組成物、その硬化物及びその用途

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JPH11140145A (ja) * 1997-11-07 1999-05-25 Nippon Kayaku Co Ltd 樹脂組成物、永久レジスト樹脂組成物及びその硬化物
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JP2004151456A (ja) * 2002-10-31 2004-05-27 Dainippon Ink & Chem Inc アルカリ現像型感光性樹脂組成物
JP2005352472A (ja) * 2004-05-14 2005-12-22 Mitsubishi Chemicals Corp 液晶パネル用樹脂組成物、硬化物、液晶パネル、及び液晶表示装置
JP2007161878A (ja) * 2005-12-14 2007-06-28 Nippon Kayaku Co Ltd ポリカルボン酸樹脂、感光性樹脂組成物及びその硬化物

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KR100589067B1 (ko) * 2001-10-30 2006-06-14 가부시키가이샤 가네카 감광성 수지 조성물, 이것을 이용한 감광성 필름 및 적층체
JP4986059B2 (ja) * 2005-04-07 2012-07-25 日本化薬株式会社 反応性エポキシカルボキシレート化合物及びそれを用いた活性エネルギー線硬化性樹脂組成物

Patent Citations (5)

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JPH11140145A (ja) * 1997-11-07 1999-05-25 Nippon Kayaku Co Ltd 樹脂組成物、永久レジスト樹脂組成物及びその硬化物
JPH11242332A (ja) * 1998-02-24 1999-09-07 Nippon Kayaku Co Ltd 樹脂組成物、その硬化物及びプリント配線板
JP2004151456A (ja) * 2002-10-31 2004-05-27 Dainippon Ink & Chem Inc アルカリ現像型感光性樹脂組成物
JP2005352472A (ja) * 2004-05-14 2005-12-22 Mitsubishi Chemicals Corp 液晶パネル用樹脂組成物、硬化物、液晶パネル、及び液晶表示装置
JP2007161878A (ja) * 2005-12-14 2007-06-28 Nippon Kayaku Co Ltd ポリカルボン酸樹脂、感光性樹脂組成物及びその硬化物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013172009A1 (ja) * 2012-05-15 2013-11-21 日本化薬株式会社 反応性ポリエステル化合物及び活性エネルギー線硬化型樹脂組成物
CN105968001A (zh) * 2015-03-13 2016-09-28 日本化药株式会社 含有羧基的反应性化合物、使用该化合物的硬化型树脂组合物及硬化物
CN105968001B (zh) * 2015-03-13 2020-05-08 日本化药株式会社 含有羧基的反应性化合物、使用该化合物的硬化型树脂组合物及硬化物
JP2017128671A (ja) * 2016-01-14 2017-07-27 日本化薬株式会社 エポキシ樹脂、反応性カルボキシレート化合物、それを用いた硬化型樹脂組成物、およびその用途
WO2018173679A1 (ja) * 2017-03-22 2018-09-27 Dic株式会社 酸基含有（メタ）アクリレート樹脂及びソルダーレジスト用樹脂材料
JPWO2018173679A1 (ja) * 2017-03-22 2019-06-27 Dic株式会社 酸基含有（メタ）アクリレート樹脂及びソルダーレジスト用樹脂材料
WO2023218876A1 (ja) * 2022-05-13 2023-11-16 株式会社日本触媒 アルカリ可溶性樹脂、感光性樹脂組成物及びその硬化物

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Publication number Publication date
TWI421270B (zh) 2014-01-01
TW200920760A (en) 2009-05-16
KR101482028B1 (ko) 2015-01-13
CN103224609A (zh) 2013-07-31
TW201333065A (zh) 2013-08-16
CN101784578B (zh) 2013-04-17
CN103224609B (zh) 2016-03-09
KR20100044177A (ko) 2010-04-29
TWI468430B (zh) 2015-01-11
KR101484661B1 (ko) 2015-01-20
KR20130059445A (ko) 2013-06-05
CN101784578A (zh) 2010-07-21

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