WO2009022461A1 - 回路装置及びその製造方法、携帯機器 - Google Patents
回路装置及びその製造方法、携帯機器 Download PDFInfo
- Publication number
- WO2009022461A1 WO2009022461A1 PCT/JP2008/002186 JP2008002186W WO2009022461A1 WO 2009022461 A1 WO2009022461 A1 WO 2009022461A1 JP 2008002186 W JP2008002186 W JP 2008002186W WO 2009022461 A1 WO2009022461 A1 WO 2009022461A1
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- Prior art keywords
- circuit device
- insulating base
- base material
- underfill
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 6
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
本発明の回路装置1は、繊維状充填材35が充填された樹脂層36から成る絶縁基材4と、絶縁基材4に設けられて接続用の電極として機能する突出部11、12、13、14と、フリップチップ実装される半導体素子2と、半導体素子2と絶縁基材4との間に充填されるアンダーフィル29とを具備する。そして、樹脂層36の上面から突出する繊維状充填材35がアンダーフィル29に接触することにより、アンダーフィル29と絶縁基材4との密着力が向上されている。
Priority Applications (1)
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US12/673,409 US8258620B2 (en) | 2007-08-10 | 2008-08-08 | Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module |
Applications Claiming Priority (4)
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JP2007-210246 | 2007-08-10 | ||
JP2007210246A JP5439713B2 (ja) | 2007-08-10 | 2007-08-10 | 回路装置及びその製造方法、携帯機器 |
JP2007254714A JP5442192B2 (ja) | 2007-09-28 | 2007-09-28 | 素子搭載用基板、半導体モジュール、および、素子搭載用基板の製造方法 |
JP2007-254714 | 2007-09-28 |
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WO2009022461A1 true WO2009022461A1 (ja) | 2009-02-19 |
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WO (1) | WO2009022461A1 (ja) |
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US20100264552A1 (en) | 2010-10-21 |
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