WO2009019963A1 - Shield film for printed wiring board, and printed wiring board - Google Patents

Shield film for printed wiring board, and printed wiring board Download PDF

Info

Publication number
WO2009019963A1
WO2009019963A1 PCT/JP2008/062844 JP2008062844W WO2009019963A1 WO 2009019963 A1 WO2009019963 A1 WO 2009019963A1 JP 2008062844 W JP2008062844 W JP 2008062844W WO 2009019963 A1 WO2009019963 A1 WO 2009019963A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
shield film
insulating layer
metal layer
Prior art date
Application number
PCT/JP2008/062844
Other languages
French (fr)
Japanese (ja)
Inventor
Masayuki Totouge
Kenji Kamino
Syohei Morimoto
Yoshinori Kawakami
Original Assignee
Tatsuta System Electronics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40341200&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2009019963(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tatsuta System Electronics Co., Ltd. filed Critical Tatsuta System Electronics Co., Ltd.
Priority to KR1020107004573A priority Critical patent/KR101510173B1/en
Priority to KR1020147017354A priority patent/KR101561132B1/en
Priority to CN2008801017197A priority patent/CN101772996B/en
Priority to KR1020147027932A priority patent/KR101553282B1/en
Publication of WO2009019963A1 publication Critical patent/WO2009019963A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Abstract

Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0μm, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). The printed wiring board is provided by attaching the shield film (10) to a base film.
PCT/JP2008/062844 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board WO2009019963A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107004573A KR101510173B1 (en) 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board
KR1020147017354A KR101561132B1 (en) 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board
CN2008801017197A CN101772996B (en) 2007-08-03 2008-07-16 Shielding film for printed wiring board and printed wiring board
KR1020147027932A KR101553282B1 (en) 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007202709A JP4974803B2 (en) 2007-08-03 2007-08-03 Shield film for printed wiring board and printed wiring board
JP2007-202709 2007-08-03

Publications (1)

Publication Number Publication Date
WO2009019963A1 true WO2009019963A1 (en) 2009-02-12

Family

ID=40341200

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062844 WO2009019963A1 (en) 2007-08-03 2008-07-16 Shield film for printed wiring board, and printed wiring board

Country Status (5)

Country Link
JP (1) JP4974803B2 (en)
KR (3) KR101561132B1 (en)
CN (1) CN101772996B (en)
TW (4) TWI477229B (en)
WO (1) WO2009019963A1 (en)

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WO2010100931A1 (en) * 2009-03-06 2010-09-10 信越ポリマー株式会社 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
US20110247863A1 (en) * 2010-04-07 2011-10-13 Fujikura Ltd. Flexible printed board and method of manufacturing same
US20110284268A1 (en) * 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
JP2014109445A (en) * 2012-11-30 2014-06-12 National Institute Of Advanced Industrial & Technology Flexible power sensor
JPWO2013077108A1 (en) * 2011-11-24 2015-04-27 タツタ電線株式会社 Shield film, shield printed wiring board, and method of manufacturing shield film
JP2015088658A (en) * 2013-10-31 2015-05-07 積水ナノコートテクノロジー株式会社 Sheet-like electromagnetic wave shield material
WO2015186624A1 (en) * 2014-06-02 2015-12-10 タツタ電線株式会社 Electroconductive adhesive film, printed circuit board, and electronic device
WO2017111158A1 (en) * 2015-12-25 2017-06-29 タツタ電線株式会社 Electromagnetic wave shielding film and method for manufacturing same
KR20170091576A (en) 2014-12-05 2017-08-09 다츠다 덴센 가부시키가이샤 Electromagnetic wave shielding film
JP2017212274A (en) * 2016-05-24 2017-11-30 タツタ電線株式会社 Electromagnetic wave shielding film and shielded printed wiring board including the same
KR20180122597A (en) 2016-03-23 2018-11-13 타츠타 전선 주식회사 EMI shielding film
CN108990403A (en) * 2018-08-13 2018-12-11 北京梦之墨科技有限公司 A kind of electromagnetic armouring structure
CN110268812A (en) * 2017-07-10 2019-09-20 拓自达电线株式会社 Electromagnetic shielding film and the shielding printed wiring board for having the electromagnetic shielding film
CN110769666A (en) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
JP2020524415A (en) * 2018-03-14 2020-08-13 グアンジョウ ファン バン エレクトロニクス カンパニー，リミテッドＧｕａｎｇｚｈｏｕ Ｆａｎｇ Ｂａｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． Electromagnetic shield film, circuit board, and method for manufacturing electromagnetic shield film
CN116709759A (en) * 2023-07-03 2023-09-05 广州方邦电子股份有限公司 Electromagnetic shielding film and circuit board

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JP2014123630A (en) * 2012-12-20 2014-07-03 Tatsuta Electric Wire & Cable Co Ltd Method for manufacturing shielding printed wiring board, shielding film, and shielding printed wiring board
US9820376B2 (en) * 2013-05-28 2017-11-14 Tatsuta Electric Wire & Cable Co., Ltd. Shape-retaining film, and shape-retaining-type flexible circuit board provided with same shape-retaining film
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CN105101761A (en) * 2014-05-06 2015-11-25 昆山雅森电子材料科技有限公司 High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof
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CN106393882A (en) * 2016-08-30 2017-02-15 联泓(江苏)新材料研究院有限公司 Electromagnetic radiation-resistant insulating functional film and production method thereof
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WO2018147426A1 (en) * 2017-02-13 2018-08-16 タツタ電線株式会社 Shield film, shielded printed circuit board, and method for manufacturing shielded printed circuit board
KR20190115020A (en) * 2017-02-13 2019-10-10 타츠타 전선 주식회사 Printed wiring board
WO2018147423A1 (en) * 2017-02-13 2018-08-16 タツタ電線株式会社 Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board
JP2017212472A (en) * 2017-09-12 2017-11-30 タツタ電線株式会社 Shield film and shield printed wiring board
CN107592783A (en) * 2017-09-15 2018-01-16 中山国安火炬科技发展有限公司 A kind of electromagnetic shielding film and preparation method thereof
CN108323140A (en) * 2018-01-24 2018-07-24 中山国安火炬科技发展有限公司 A kind of electromagnetic shielding film and its preparation method and application
CN108323145A (en) 2018-03-14 2018-07-24 广州方邦电子股份有限公司 The preparation method of electromagnetic shielding film, wiring board and electromagnetic shielding film
CN110691502B (en) * 2018-07-06 2024-04-26 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137577U (en) * 1979-03-20 1980-09-30
JPS63305598A (en) * 1987-06-05 1988-12-13 Riken Corp Electromagnetic shield material
JPH06132694A (en) * 1992-10-15 1994-05-13 Mitsubishi Materials Corp Electromagnetic wave shielding bellows
JPH08139483A (en) * 1994-11-09 1996-05-31 Asahi Chem Ind Co Ltd Electromagnetic wave shielding cover and manufacture thereof
JP2000269632A (en) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd Shield flexible printed wiring board, manufacture thereof and reinforcing shield film therefor
JP2005327853A (en) * 2004-05-13 2005-11-24 Shin Etsu Polymer Co Ltd Electromagnetic wave noise suppressor and its manufacturing method
JP2006100541A (en) * 2004-09-29 2006-04-13 Toshiba Corp Shield type flexible circuit board
JP2006297714A (en) * 2005-04-19 2006-11-02 Seiren Co Ltd Metal thin film sheet for transfer

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62256489A (en) * 1986-04-30 1987-11-09 Hitachi Ltd Semiconductor laser device
JP2970297B2 (en) * 1993-02-26 1999-11-02 三菱マテリアル株式会社 High resistance magnetic shield material
JPH07202481A (en) * 1993-12-28 1995-08-04 Mitsubishi Materials Corp Method for manufacturing magnetic shield material
JPH0883994A (en) * 1994-07-11 1996-03-26 Nippon Paint Co Ltd Wideband electromagnetic-wave-absorbing material
JPH11502973A (en) * 1995-03-29 1999-03-09 ミネソタ マイニング アンド マニュファクチャリング カンパニー Electromagnetic force absorbing composite
JPH09116293A (en) * 1995-10-23 1997-05-02 Nippon Plast Kogyo Kk Electromagnetic wave shielding material, its manufacture, and its application method
JP3706440B2 (en) * 1996-08-30 2005-10-12 三洋電機株式会社 Motor drive circuit
JPH10173392A (en) * 1996-12-09 1998-06-26 Daido Steel Co Ltd Electromagnetic wave shielding sheet
JP3854103B2 (en) * 2001-06-28 2006-12-06 住友ベークライト株式会社 Conductive paste and semiconductor device using the paste
JP4201548B2 (en) * 2002-07-08 2008-12-24 タツタ電線株式会社 SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM
JP2005277262A (en) * 2004-03-26 2005-10-06 Toray Ind Inc Electromagnetic wave shield film
CN100546438C (en) * 2004-03-31 2009-09-30 大见忠弘 Circuit substrate and manufacture method thereof
JP2006060008A (en) * 2004-08-20 2006-03-02 Tdk Corp Sheet-like composite magnetic substance and sheet article
JP4611700B2 (en) * 2004-09-24 2011-01-12 信越ポリマー株式会社 Electromagnetic wave noise suppression sheet and method of using the same
JP4319167B2 (en) * 2005-05-13 2009-08-26 タツタ システム・エレクトロニクス株式会社 Shield film, shield printed wiring board, shield flexible printed wiring board, shield film manufacturing method, and shield printed wiring board manufacturing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55137577U (en) * 1979-03-20 1980-09-30
JPS63305598A (en) * 1987-06-05 1988-12-13 Riken Corp Electromagnetic shield material
JPH06132694A (en) * 1992-10-15 1994-05-13 Mitsubishi Materials Corp Electromagnetic wave shielding bellows
JPH08139483A (en) * 1994-11-09 1996-05-31 Asahi Chem Ind Co Ltd Electromagnetic wave shielding cover and manufacture thereof
JP2000269632A (en) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd Shield flexible printed wiring board, manufacture thereof and reinforcing shield film therefor
JP2005327853A (en) * 2004-05-13 2005-11-24 Shin Etsu Polymer Co Ltd Electromagnetic wave noise suppressor and its manufacturing method
JP2006100541A (en) * 2004-09-29 2006-04-13 Toshiba Corp Shield type flexible circuit board
JP2006297714A (en) * 2005-04-19 2006-11-02 Seiren Co Ltd Metal thin film sheet for transfer

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JP2010212300A (en) * 2009-03-06 2010-09-24 Shin Etsu Polymer Co Ltd Coverlay film, method for manufacturing the coverlay film and flexible printed wiring board
WO2010100931A1 (en) * 2009-03-06 2010-09-10 信越ポリマー株式会社 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
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US9018533B2 (en) 2009-03-06 2015-04-28 Shin-Etsu Polymer Co., Ltd. Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
KR101242919B1 (en) 2009-03-06 2013-03-12 신에츠 폴리머 가부시키가이샤 Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board
US8809687B2 (en) * 2010-04-07 2014-08-19 Fujikura Ltd. Flexible printed board and method of manufacturing same
US20110247863A1 (en) * 2010-04-07 2011-10-13 Fujikura Ltd. Flexible printed board and method of manufacturing same
US20110284268A1 (en) * 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
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JPWO2013077108A1 (en) * 2011-11-24 2015-04-27 タツタ電線株式会社 Shield film, shield printed wiring board, and method of manufacturing shield film
US10015915B2 (en) 2011-11-24 2018-07-03 Tatsuta Electric Wire & Cable Co., Ltd. Shield film, shielded printed wiring board, and method for manufacturing shield film
US10051765B2 (en) 2011-11-24 2018-08-14 Tatsuta Electric Wire & Cable Co., Ltd. Shield film, shielded printed wiring board, and method for manufacturing shield film
JP2014109445A (en) * 2012-11-30 2014-06-12 National Institute Of Advanced Industrial & Technology Flexible power sensor
JP2015088658A (en) * 2013-10-31 2015-05-07 積水ナノコートテクノロジー株式会社 Sheet-like electromagnetic wave shield material
WO2015186624A1 (en) * 2014-06-02 2015-12-10 タツタ電線株式会社 Electroconductive adhesive film, printed circuit board, and electronic device
KR20170091576A (en) 2014-12-05 2017-08-09 다츠다 덴센 가부시키가이샤 Electromagnetic wave shielding film
WO2017111158A1 (en) * 2015-12-25 2017-06-29 タツタ電線株式会社 Electromagnetic wave shielding film and method for manufacturing same
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KR20180122597A (en) 2016-03-23 2018-11-13 타츠타 전선 주식회사 EMI shielding film
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KR20200024121A (en) 2017-07-10 2020-03-06 타츠타 전선 주식회사 Electromagnetic shielding film, and shielded printed wiring board having the same
JP2020524415A (en) * 2018-03-14 2020-08-13 グアンジョウ ファン バン エレクトロニクス カンパニー，リミテッドＧｕａｎｇｚｈｏｕ Ｆａｎｇ Ｂａｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． Electromagnetic shield film, circuit board, and method for manufacturing electromagnetic shield film
CN110769666A (en) * 2018-07-27 2020-02-07 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
CN108990403A (en) * 2018-08-13 2018-12-11 北京梦之墨科技有限公司 A kind of electromagnetic armouring structure
CN108990403B (en) * 2018-08-13 2024-02-23 北京梦之墨科技有限公司 Electromagnetic shielding structure
CN116709759A (en) * 2023-07-03 2023-09-05 广州方邦电子股份有限公司 Electromagnetic shielding film and circuit board

Also Published As

Publication number Publication date
TWI477229B (en) 2015-03-11
KR20140125458A (en) 2014-10-28
JP2009038278A (en) 2009-02-19
TWI700984B (en) 2020-08-01
CN101772996B (en) 2012-11-28
KR101561132B1 (en) 2015-10-19
KR101553282B1 (en) 2015-09-15
TWI700983B (en) 2020-08-01
KR20140093738A (en) 2014-07-28
CN101772996A (en) 2010-07-07
KR101510173B1 (en) 2015-04-08
TW201742544A (en) 2017-12-01
JP4974803B2 (en) 2012-07-11
TW201438560A (en) 2014-10-01
KR20100051699A (en) 2010-05-17
TW201844077A (en) 2018-12-16
TW200922456A (en) 2009-05-16

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