WO2009004868A1 - Method for sucking component and surface mounting machine - Google Patents

Method for sucking component and surface mounting machine Download PDF

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Publication number
WO2009004868A1
WO2009004868A1 PCT/JP2008/059443 JP2008059443W WO2009004868A1 WO 2009004868 A1 WO2009004868 A1 WO 2009004868A1 JP 2008059443 W JP2008059443 W JP 2008059443W WO 2009004868 A1 WO2009004868 A1 WO 2009004868A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
nozzle
negative pressure
sucking
time
Prior art date
Application number
PCT/JP2008/059443
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroaki Katai
Original Assignee
Yamaha Motor Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co., Ltd. filed Critical Yamaha Motor Co., Ltd.
Priority to CN2008800231437A priority Critical patent/CN101690444B/en
Publication of WO2009004868A1 publication Critical patent/WO2009004868A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

In the method for sucking a component by means of a nozzle (21) of a surface mounting machine having a movable mounting head (20) equipped with the nozzle (21) for sucking a component, sucking a component from a component feeding section by negative pressure supplied to the nozzle (21), carrying the component above a substrate and mounting the component thereon, the time elapsing before the nozzle (21) arrives at the position for sucking the component is calculated, and negative pressure supply is started at the time retroacted from the arriving time by the settling time of negative pressure, i.e. the time (actual measurement value measured beforehand) required for settling the negative pressure after starting negative pressure supply to the nozzle (21).
PCT/JP2008/059443 2007-07-03 2008-05-22 Method for sucking component and surface mounting machine WO2009004868A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800231437A CN101690444B (en) 2007-07-03 2008-05-22 Method for sucking component and surface mounting machine

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-175434 2007-07-03
JP2007175434A JP2009016498A (en) 2007-07-03 2007-07-03 Component suction method, and surface mounting machine

Publications (1)

Publication Number Publication Date
WO2009004868A1 true WO2009004868A1 (en) 2009-01-08

Family

ID=40225925

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059443 WO2009004868A1 (en) 2007-07-03 2008-05-22 Method for sucking component and surface mounting machine

Country Status (3)

Country Link
JP (1) JP2009016498A (en)
CN (1) CN101690444B (en)
WO (1) WO2009004868A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5410864B2 (en) * 2009-07-06 2014-02-05 Ｊｕｋｉ株式会社 Electronic component mounting equipment
JP6046362B2 (en) * 2012-03-29 2016-12-14 ヤマハ発動機株式会社 Electronic component mounting device
CN105794333B (en) * 2013-10-21 2018-12-21 株式会社富士 The method and electronic components mounting machine that electronic component is installed on substrate
JP6207758B2 (en) * 2014-09-26 2017-10-04 ヤマハ発動機株式会社 Component mounting apparatus, surface mounter, and suction height position detection method
JP6574953B2 (en) * 2014-09-30 2019-09-18 ハンファ精密機械株式会社 Component adsorption head
JP6906158B2 (en) * 2017-02-15 2021-07-21 パナソニックＩｐマネジメント株式会社 Parts mounting device and parts mounting method
JP7193062B2 (en) * 2018-08-01 2022-12-20 Thk株式会社 Actuator sensing device and actuator control system
CN110099558A (en) * 2019-05-07 2019-08-06 深圳市路远智能装备有限公司 A kind of chip mounter picks up and attachment action plate grade implementation method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03206698A (en) * 1990-01-08 1991-09-10 Matsushita Electric Ind Co Ltd Electronic parts mount device
JPH08298395A (en) * 1995-04-26 1996-11-12 Matsushita Electric Ind Co Ltd Method and apparatus for mounting electronic device
JPH1140989A (en) * 1997-07-22 1999-02-12 Matsushita Electric Ind Co Ltd Electronic component mounting device
JP2001135991A (en) * 1999-11-01 2001-05-18 Juki Corp Apparatus and method for attaching electronic component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1091341C (en) * 1995-02-17 2002-09-18 松下电器产业株式会社 Method and device for assambling electronic components
JP3339344B2 (en) * 1997-01-17 2002-10-28 松下電器産業株式会社 Electronic component mounting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03206698A (en) * 1990-01-08 1991-09-10 Matsushita Electric Ind Co Ltd Electronic parts mount device
JPH08298395A (en) * 1995-04-26 1996-11-12 Matsushita Electric Ind Co Ltd Method and apparatus for mounting electronic device
JPH1140989A (en) * 1997-07-22 1999-02-12 Matsushita Electric Ind Co Ltd Electronic component mounting device
JP2001135991A (en) * 1999-11-01 2001-05-18 Juki Corp Apparatus and method for attaching electronic component

Also Published As

Publication number Publication date
CN101690444A (en) 2010-03-31
JP2009016498A (en) 2009-01-22
CN101690444B (en) 2012-03-14

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