WO2008156020A1 - Substrat et appareil d'éclairage - Google Patents

Substrat et appareil d'éclairage Download PDF

Info

Publication number
WO2008156020A1
WO2008156020A1 PCT/JP2008/060681 JP2008060681W WO2008156020A1 WO 2008156020 A1 WO2008156020 A1 WO 2008156020A1 JP 2008060681 W JP2008060681 W JP 2008060681W WO 2008156020 A1 WO2008156020 A1 WO 2008156020A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
area
mounting region
heat conductive
chip leds
Prior art date
Application number
PCT/JP2008/060681
Other languages
English (en)
Japanese (ja)
Inventor
Shinya Sakaida
Kiyoaki Tanaka
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007161814A external-priority patent/JP4969332B2/ja
Priority claimed from JP2007174629A external-priority patent/JP4996998B2/ja
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2008156020A1 publication Critical patent/WO2008156020A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un substrat permettant de dissiper la chaleur générée par un élément semi-conducteur électroluminescent et de supprimer l'augmentation de la température. La présente invention concerne également un appareil d'éclairage. La surface avant d'un substrat (1) permet d'effectuer le montage en surface de nombreuses DEL pour puce et des zones de montage des DELS pour puce sont prévues à intervalles d'une taille prédéfinie. La surface de la zone de montage est équivalente à une surface à occuper par la DEL pour puce sur le substrat (1). Sur la surface arrière du substrat (1), une pluralité de films thermoconducteurs (3, etc.) est disposée aux intervalles de la taille prédéfinie, pour dissiper la chaleur générée par les DEL pour puce vers l'extérieur du substrat (1). La surface du film thermoconducteur (3) est supérieure à celle de la zone de montage, et est prévue pour comprendre la plage de la zone de montage. Les films thermoconducteurs (3, etc.) peuvent être formés, par exemple, par la formation de motifs sur une feuille de cuivre formée sur la totalité de la surface arrière du substrat (1).
PCT/JP2008/060681 2007-06-19 2008-06-11 Substrat et appareil d'éclairage WO2008156020A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007161814A JP4969332B2 (ja) 2007-06-19 2007-06-19 基板及び照明装置
JP2007-161814 2007-06-19
JP2007174629A JP4996998B2 (ja) 2007-07-02 2007-07-02 照明装置
JP2007-174629 2007-07-02

Publications (1)

Publication Number Publication Date
WO2008156020A1 true WO2008156020A1 (fr) 2008-12-24

Family

ID=40156177

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060681 WO2008156020A1 (fr) 2007-06-19 2008-06-11 Substrat et appareil d'éclairage

Country Status (1)

Country Link
WO (1) WO2008156020A1 (fr)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161026A (ja) * 2009-01-09 2010-07-22 Toshiba Lighting & Technology Corp 照明装置
WO2011067989A1 (fr) * 2009-12-02 2011-06-09 シャープ株式会社 Dispositif d'éclairage et dispositif d'affichage
JP2012022977A (ja) * 2010-07-16 2012-02-02 Opt Design:Kk 照明装置
JP2012517115A (ja) * 2009-02-05 2012-07-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄの組み合わせの改良された実装
JP2013058467A (ja) * 2011-09-08 2013-03-28 In-Kyu Ahn Ｌｅｄ型照明モジュール
US8408724B2 (en) 2008-12-26 2013-04-02 Toshiba Lighting & Technology Corporation Light source module and lighting apparatus
WO2013058377A1 (fr) * 2011-10-21 2013-04-25 サンケン電気株式会社 Luminaire
WO2013076910A1 (fr) * 2011-11-21 2013-05-30 パナソニック株式会社 Appareil émetteur de lumière et appareil d'éclairage
EP2750212A1 (fr) * 2012-12-29 2014-07-02 Nichia Corporation Boîtier de dispositif électroluminescent, dispositif électroluminescent utilisant cet emballage et dispositif d'éclairage utilisant les dispositifs électroluminescents
JP2014157800A (ja) * 2013-02-18 2014-08-28 Toshiba Lighting & Technology Corp 照明器具
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
US9281460B2 (en) 2012-10-31 2016-03-08 Nichia Corporation Light emitting device package and light emitting device having lead-frames
US9406856B2 (en) 2013-06-28 2016-08-02 Nichia Corporation Package for light emitting apparatus and light emitting apparatus including the same
JP2016170988A (ja) * 2015-03-12 2016-09-23 パナソニックＩｐマネジメント株式会社 照明器具
JPWO2014115443A1 (ja) * 2013-01-24 2017-01-26 シャープ株式会社 発光装置およびその製造方法
CN107830430A (zh) * 2017-11-21 2018-03-23 浙江阳光美加照明有限公司 一种led灯条的基板及led灯条
EP3346320A4 (fr) * 2015-09-01 2018-10-24 Panasonic Intellectual Property Management Co., Ltd. Dispositif d'affichage d'image
US10490143B2 (en) 2015-09-01 2019-11-26 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10643556B2 (en) 2015-09-01 2020-05-05 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10642097B2 (en) 2015-09-01 2020-05-05 Panasonic Intellectual Property Management Co., Ltd. Image display device including multiple light source substrates
US10809569B2 (en) 2015-09-01 2020-10-20 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10976601B2 (en) 2015-09-01 2021-04-13 Panasonic Intellectual Property Management Co., Ltd. Video display device
CN116772131A (zh) * 2023-06-26 2023-09-19 惠科股份有限公司 灯板、灯板的制备方法及显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148082A (fr) * 1974-05-20 1975-11-27
JP2003092011A (ja) * 2001-09-18 2003-03-28 Matsushita Electric Ind Co Ltd 照明装置
JP2005109228A (ja) * 2003-09-30 2005-04-21 Toshiba Lighting & Technology Corp Ｌｅｄ装置およびｌｅｄ照明装置
JP2006310874A (ja) * 2005-04-29 2006-11-09 Philips Lumileds Lightng Co Llc Ｒｇｂ熱隔離基板
JP2007059894A (ja) * 2005-07-27 2007-03-08 Showa Denko Kk 発光ダイオード素子搭載光源

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148082A (fr) * 1974-05-20 1975-11-27
JP2003092011A (ja) * 2001-09-18 2003-03-28 Matsushita Electric Ind Co Ltd 照明装置
JP2005109228A (ja) * 2003-09-30 2005-04-21 Toshiba Lighting & Technology Corp Ｌｅｄ装置およびｌｅｄ照明装置
JP2006310874A (ja) * 2005-04-29 2006-11-09 Philips Lumileds Lightng Co Llc Ｒｇｂ熱隔離基板
JP2007059894A (ja) * 2005-07-27 2007-03-08 Showa Denko Kk 発光ダイオード素子搭載光源

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8408724B2 (en) 2008-12-26 2013-04-02 Toshiba Lighting & Technology Corporation Light source module and lighting apparatus
JP2010161026A (ja) * 2009-01-09 2010-07-22 Toshiba Lighting & Technology Corp 照明装置
JP2012517115A (ja) * 2009-02-05 2012-07-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Ｌｅｄの組み合わせの改良された実装
JP5276722B2 (ja) * 2009-12-02 2013-08-28 シャープ株式会社 照明装置および表示装置
WO2011067989A1 (fr) * 2009-12-02 2011-06-09 シャープ株式会社 Dispositif d'éclairage et dispositif d'affichage
CN102639926A (zh) * 2009-12-02 2012-08-15 夏普株式会社 照明装置和显示装置
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
JP2012022977A (ja) * 2010-07-16 2012-02-02 Opt Design:Kk 照明装置
JP2013058467A (ja) * 2011-09-08 2013-03-28 In-Kyu Ahn Ｌｅｄ型照明モジュール
WO2013058377A1 (fr) * 2011-10-21 2013-04-25 サンケン電気株式会社 Luminaire
JP2013089557A (ja) * 2011-10-21 2013-05-13 Sanken Electric Co Ltd 灯具
US8950897B2 (en) 2011-11-21 2015-02-10 Panasonic Corporation Light-emitting device and lighting apparatus
EP2634480A4 (fr) * 2011-11-21 2014-08-13 Panasonic Corp Appareil émetteur de lumière et appareil d'éclairage
JP5250162B1 (ja) * 2011-11-21 2013-07-31 パナソニック株式会社 発光装置及び照明装置
WO2013076910A1 (fr) * 2011-11-21 2013-05-30 パナソニック株式会社 Appareil émetteur de lumière et appareil d'éclairage
EP2634480A1 (fr) * 2011-11-21 2013-09-04 Panasonic Corporation Appareil émetteur de lumière et appareil d'éclairage
US9281460B2 (en) 2012-10-31 2016-03-08 Nichia Corporation Light emitting device package and light emitting device having lead-frames
EP2750212A1 (fr) * 2012-12-29 2014-07-02 Nichia Corporation Boîtier de dispositif électroluminescent, dispositif électroluminescent utilisant cet emballage et dispositif d'éclairage utilisant les dispositifs électroluminescents
CN103915542A (zh) * 2012-12-29 2014-07-09 日亚化学工业株式会社 发光装置用封装体、具备其的发光装置及具备该发光装置的照明装置
US9257417B2 (en) 2012-12-29 2016-02-09 Nichia Corporation Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
USRE47504E1 (en) 2012-12-29 2019-07-09 Nichia Corporation Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
JPWO2014115443A1 (ja) * 2013-01-24 2017-01-26 シャープ株式会社 発光装置およびその製造方法
JP2014157800A (ja) * 2013-02-18 2014-08-28 Toshiba Lighting & Technology Corp 照明器具
US9647190B2 (en) 2013-06-28 2017-05-09 Nichia Corporation Package for light emitting apparatus and light emitting apparatus including the same
US10305011B2 (en) 2013-06-28 2019-05-28 Nichia Corporation Light emitting apparatus
US9991432B2 (en) 2013-06-28 2018-06-05 Nichia Corporation Light emitting apparatus
US9406856B2 (en) 2013-06-28 2016-08-02 Nichia Corporation Package for light emitting apparatus and light emitting apparatus including the same
JP2016170988A (ja) * 2015-03-12 2016-09-23 パナソニックＩｐマネジメント株式会社 照明器具
US10490143B2 (en) 2015-09-01 2019-11-26 Panasonic Intellectual Property Management Co., Ltd. Video display device
EP3346320A4 (fr) * 2015-09-01 2018-10-24 Panasonic Intellectual Property Management Co., Ltd. Dispositif d'affichage d'image
US10643556B2 (en) 2015-09-01 2020-05-05 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10642097B2 (en) 2015-09-01 2020-05-05 Panasonic Intellectual Property Management Co., Ltd. Image display device including multiple light source substrates
US10663793B2 (en) 2015-09-01 2020-05-26 Panasonic Intellectual Property Management Co., Ltd. Image display device
US10809569B2 (en) 2015-09-01 2020-10-20 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10976601B2 (en) 2015-09-01 2021-04-13 Panasonic Intellectual Property Management Co., Ltd. Video display device
CN107830430A (zh) * 2017-11-21 2018-03-23 浙江阳光美加照明有限公司 一种led灯条的基板及led灯条
CN107830430B (zh) * 2017-11-21 2023-10-03 浙江阳光美加照明有限公司 一种led灯条的基板及led灯条
CN116772131A (zh) * 2023-06-26 2023-09-19 惠科股份有限公司 灯板、灯板的制备方法及显示装置

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