WO2008140007A1 - 導電性基板、プラズマディスプレイ用電磁波シールド基板および導電性基板の製造方法 - Google Patents

導電性基板、プラズマディスプレイ用電磁波シールド基板および導電性基板の製造方法 Download PDF

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Publication number
WO2008140007A1
WO2008140007A1 PCT/JP2008/058526 JP2008058526W WO2008140007A1 WO 2008140007 A1 WO2008140007 A1 WO 2008140007A1 JP 2008058526 W JP2008058526 W JP 2008058526W WO 2008140007 A1 WO2008140007 A1 WO 2008140007A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
layer
laminated
electromagnetic shielding
fine particle
Prior art date
Application number
PCT/JP2008/058526
Other languages
English (en)
French (fr)
Inventor
Shotaro Tanaka
Junpei Ohashi
Yasushi Takada
Original Assignee
Toray Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries, Inc. filed Critical Toray Industries, Inc.
Priority to CN2008800152971A priority Critical patent/CN101683022B/zh
Priority to EP08752417A priority patent/EP2154940A4/en
Priority to JP2008528270A priority patent/JP5029609B2/ja
Priority to US12/598,094 priority patent/US20100136288A1/en
Publication of WO2008140007A1 publication Critical patent/WO2008140007A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/44—Optical arrangements or shielding arrangements, e.g. filters, black matrices, light reflecting means or electromagnetic shielding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J2211/44—Optical arrangements or shielding arrangements, e.g. filters or lenses
    • H01J2211/446—Electromagnetic shielding means; Antistatic means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

基板（２）の少なくとも片面に、ランダムな網目状に積層された金属微粒子層（３）と、金属微粒子層（３）の網目の開口部分に、金属微粒子層（３）と接するように積層された樹脂層（４）と、金属微粒子層（３）の上に、樹脂層（４）と接するように積層されためっき金属層（５）とで構成され、樹脂層（４）を形成する樹脂がアニオン型イオン性基を有する樹脂である金属層積層基板。本発明は、高レベルの透明性、導電性を、広い面積にわたって均一に達成し、モアレ現象を発生しにくく、さらに電磁波シールド性、各層の接着性に優れた導電性基板およびプラズマディスプレイ用電磁波シールド基板を提供する。
PCT/JP2008/058526 2007-05-09 2008-05-08 導電性基板、プラズマディスプレイ用電磁波シールド基板および導電性基板の製造方法 WO2008140007A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800152971A CN101683022B (zh) 2007-05-09 2008-05-08 导电性基板、等离子显示器用电磁波屏蔽基板以及导电性基板的制造方法
EP08752417A EP2154940A4 (en) 2007-05-09 2008-05-08 CONDUCTIVE PLATE, ELECTROMAGNETIC SHIELD FOR A PLASMADIS PLAY AND METHOD FOR PRODUCING A CONDUCTIVE PLATE
JP2008528270A JP5029609B2 (ja) 2007-05-09 2008-05-08 導電性基板、プラズマディスプレイ用電磁波シールド基板および導電性基板の製造方法
US12/598,094 US20100136288A1 (en) 2007-05-09 2008-05-08 Conductive substrate, electromagnetic wave shielding substrate for plasma display and method for manufacturing conductive substrate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-124339 2007-05-09
JP2007124339 2007-05-09
JP2007193107 2007-07-25
JP2007-193107 2007-07-25

Publications (1)

Publication Number Publication Date
WO2008140007A1 true WO2008140007A1 (ja) 2008-11-20

Family

ID=40002207

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058526 WO2008140007A1 (ja) 2007-05-09 2008-05-08 導電性基板、プラズマディスプレイ用電磁波シールド基板および導電性基板の製造方法

Country Status (7)

Country Link
US (1) US20100136288A1 (ja)
EP (1) EP2154940A4 (ja)
JP (1) JP5029609B2 (ja)
KR (1) KR20100014844A (ja)
CN (1) CN101683022B (ja)
TW (1) TW200904319A (ja)
WO (1) WO2008140007A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011124535A (ja) * 2008-12-02 2011-06-23 Dainippon Printing Co Ltd 電磁波シールド材、及びその製造方法
JP2014510395A (ja) * 2011-02-02 2014-04-24 スリーエム イノベイティブ プロパティズ カンパニー 非直線導電体トレースを有するパターン化された基材
US8970515B2 (en) 2009-02-26 2015-03-03 3M Innovative Properties Company Touch screen sensor and patterned substrate having overlaid micropatterns with low visibility
WO2022181570A1 (ja) * 2021-02-24 2022-09-01 タツタ電線株式会社 電磁波シールドフィルム

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8503123B2 (en) * 2008-12-30 2013-08-06 Samsung Sdi Co., Ltd. Optical filter and flat display panel comprising the same
KR101360867B1 (ko) * 2010-04-23 2014-02-13 코오롱인더스트리 주식회사 태양광모듈용 백 시트 및 이의 제조방법
TWI397353B (zh) * 2010-04-28 2013-05-21 Zhen Ding Technology Co Ltd 電路板及其製作方法
EP2671438A4 (en) * 2011-02-02 2017-06-14 3M Innovative Properties Company Patterned substrates with darkened conductor traces
WO2012134173A2 (ko) 2011-03-28 2012-10-04 주식회사 엘지화학 전도성 기판 및 이를 포함하는 터치스크린
KR101555411B1 (ko) * 2012-10-12 2015-09-23 닛토덴코 가부시키가이샤 투명 도전성 필름 및 그 용도
FR3008903B1 (fr) * 2013-07-29 2015-07-31 Commissariat Energie Atomique Depot par enduction centrifuge d'une couche mince structuree sur un substrat
CN103826428B (zh) * 2014-02-14 2015-07-29 哈尔滨工业大学 基于三角及正交混合分布圆环及子圆环阵列的电磁屏蔽光窗
CN103763897B (zh) * 2014-02-14 2015-06-17 哈尔滨工业大学 具有同心圆环的多周期主从嵌套圆环阵列电磁屏蔽光窗
CN109641417A (zh) * 2016-08-31 2019-04-16 柯尼卡美能达株式会社 带功能性细线的基材及功能性细线的形成方法
JP7044203B2 (ja) * 2019-10-10 2022-03-30 Dic株式会社 積層体、成形品、プリント配線板及び電磁波シールド
TWI761870B (zh) * 2020-06-24 2022-04-21 香港商南京矽力微電子（香港）有限公司 具無線轉能功能的電磁波屏蔽膜

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217397A (ja) * 1990-03-06 1992-08-07 Chomerics Inc モアレのない遮へい窓
JP2001343520A (ja) * 2000-06-01 2001-12-14 Fuji Photo Film Co Ltd 光学フィルターおよびそれを用いたプラズマディスプレイパネル
JP2006032197A (ja) * 2004-07-20 2006-02-02 Sumitomo Metal Mining Co Ltd 透明２層膜とその製造方法
WO2006040989A1 (ja) * 2004-10-08 2006-04-20 Toray Industries, Inc. 導電性フィルム
JP2006127929A (ja) * 2004-10-29 2006-05-18 Mitsubishi Chemicals Corp 透明導電膜付き基板、塗布液及びその製造方法
JP2006313891A (ja) * 2005-04-05 2006-11-16 Toray Ind Inc 導電性基板の製造方法および導電性基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6188174B1 (en) * 1996-10-01 2001-02-13 Nisshinbo Insustries, Inc. Electromagnetic radiation shield panel and method of producing the same
US20060194020A1 (en) * 2003-09-01 2006-08-31 Dai Nippon Printing Co., Ltd Electromagnetic shielding film for plasma display
EP1895828B1 (en) * 2005-06-03 2013-06-26 DIC Corporation Electromagnetic shielding material and method for producing same
JP2007030284A (ja) * 2005-07-26 2007-02-08 Mitsubishi Plastics Ind Ltd 脂肪族ポリエステル系樹脂反射フィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217397A (ja) * 1990-03-06 1992-08-07 Chomerics Inc モアレのない遮へい窓
JP2001343520A (ja) * 2000-06-01 2001-12-14 Fuji Photo Film Co Ltd 光学フィルターおよびそれを用いたプラズマディスプレイパネル
JP2006032197A (ja) * 2004-07-20 2006-02-02 Sumitomo Metal Mining Co Ltd 透明２層膜とその製造方法
WO2006040989A1 (ja) * 2004-10-08 2006-04-20 Toray Industries, Inc. 導電性フィルム
JP2006127929A (ja) * 2004-10-29 2006-05-18 Mitsubishi Chemicals Corp 透明導電膜付き基板、塗布液及びその製造方法
JP2006313891A (ja) * 2005-04-05 2006-11-16 Toray Ind Inc 導電性基板の製造方法および導電性基板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2154940A4 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011124535A (ja) * 2008-12-02 2011-06-23 Dainippon Printing Co Ltd 電磁波シールド材、及びその製造方法
US8970515B2 (en) 2009-02-26 2015-03-03 3M Innovative Properties Company Touch screen sensor and patterned substrate having overlaid micropatterns with low visibility
JP2014510395A (ja) * 2011-02-02 2014-04-24 スリーエム イノベイティブ プロパティズ カンパニー 非直線導電体トレースを有するパターン化された基材
JP2017107223A (ja) * 2011-02-02 2017-06-15 スリーエム イノベイティブ プロパティズ カンパニー 非直線導電体トレースを有するパターン化された基材
WO2022181570A1 (ja) * 2021-02-24 2022-09-01 タツタ電線株式会社 電磁波シールドフィルム
JP7206441B1 (ja) * 2021-02-24 2023-01-17 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
EP2154940A4 (en) 2012-01-25
CN101683022B (zh) 2012-07-04
US20100136288A1 (en) 2010-06-03
TW200904319A (en) 2009-01-16
JPWO2008140007A1 (ja) 2010-08-05
JP5029609B2 (ja) 2012-09-19
EP2154940A1 (en) 2010-02-17
KR20100014844A (ko) 2010-02-11
CN101683022A (zh) 2010-03-24

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