WO2008138177A1 - An led lighting fixture with high-efficiency radiation effect - Google Patents

An led lighting fixture with high-efficiency radiation effect Download PDF

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Publication number
WO2008138177A1
WO2008138177A1 PCT/CN2007/001722 CN2007001722W WO2008138177A1 WO 2008138177 A1 WO2008138177 A1 WO 2008138177A1 CN 2007001722 W CN2007001722 W CN 2007001722W WO 2008138177 A1 WO2008138177 A1 WO 2008138177A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
cavity
heat sink
open
heat
Prior art date
Application number
PCT/CN2007/001722
Other languages
English (en)
French (fr)
Inventor
Jie Shi
Original Assignee
Jie Shi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jie Shi filed Critical Jie Shi
Publication of WO2008138177A1 publication Critical patent/WO2008138177A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40—Lighting for industrial, commercial, recreational or military use
    • F21W2131/406—Lighting for industrial, commercial, recreational or military use for theatres, stages or film studios
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention discloses a three-cavity structure design method for an LED lamp with high heat dissipation and a lamp with a three-cavity structure design method for efficiently dissipating an LED lamp, in particular, an array type high-power LED lamp.
  • LEDs have the advantages of low energy consumption, low heat generation and long service life, making them ideal for replacing traditional light sources. Considering the insufficient brightness of the single-chip LED, the LED lamp generally adopts the LED array structure, which causes the problem that the LED lamp is difficult to dissipate heat.
  • a heat dissipation scheme for an LED lamp in which the heat dissipation is to absorb the heat of the base connected to the LED through the connecting post in the lamp body, and then still dissipate heat in the lamp body, since it is Multiple indirect heat dissipation and heat dissipation in the enclosed lamp body, the effect is not good.
  • a heat pipe lamp heat dissipation scheme is disclosed.
  • the heat dissipation in the solution is to absorb the heat of the light-emitting device through one end of the super-heat pipe, and transfer the heat to the lamp body heat-dissipating member in contact with the air at the other end. Because it is still multiple indirect heat dissipation, the effect is still not good.
  • a heat dissipation scheme for an LED lamp in which the heat dissipation of the LED is transmitted through the light source panel to the thermally conductive insulating film and the thermal conductive insulating tape and then transmitted to the heat dissipation housing. Indirect heat dissipation, the effect is still not good.
  • a heat dissipation scheme for an LED spotlight is disclosed. In this solution, the heat dissipation is transmitted to the heat-dissipating casing of the air contact by the heat absorbed by the air or the filler in the lamp body, and is still indirectly dissipated. , still not working well.
  • an LED lamp heat dissipation scheme in which the heat dissipation is the heat of the LED (mainly the heat of the LED base portion) transmitted to the heat dissipation plate through the circuit board and the conductive heat transfer adhesive layer. , still indirect heat dissipation, still not effective.
  • the purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art, and to provide a high-efficiency heat-dissipating LED lamp with high heat dissipation effect, low energy consumption, long service life, and low light energy attenuation.
  • the object of the present invention is to achieve an efficient heat-dissipating LED lamp, comprising a lamp body and a PCB mounting plate mounted on the lamp body, a PCB circuit board (2), an LED light source and a lens, and the special feature is set on the lamp body.
  • the open heat-dissipating cavity is a space formed by a plurality of staggered grid-shaped heat-conducting ribs on the upper part of the open heat-dissipating body (6), and the LED heat-dissipating body on the lower surface of the open heat-dissipating body (6) 4) and LED receiving hole (5)
  • the LED lighting cavity is composed of open heat sink (6), LED light and lens (7), LED substrate (8), lamp cover plate (9), and lower cover plate (10)
  • the LED light source and the lens (7) are connected to the LED substrate (8), and the LED substrate (8) is closely attached to the LED receiving hole (5) on the lower surface of the open heat sink (6), and the LED wire passes through the opening.
  • the thermal contact is a thermal adhesive contact.
  • the upper cover (1), the open heat sink (6), and the lower cover (10) are all exposed to the air.
  • the LED electrical cavity (I) and the LED lighting cavity ( ⁇ ) of the LED lamp used for outdoor lighting must be sealed inside the cavity, and the waterproofing requirement of IP65 or above, the LED electrical cavity of the indoor lighting LED lamp (I), LED lighting cavity (m), the internal cavity of the cavity meets IP20 requirements.
  • the LED light source and the chip of the lens (7) are directly packaged in the open heat sink (6), and directly form heat conduction with the bottom surface of the open heat sink (6).
  • the invention has the advantages of reasonable and compact structure, easy production and manufacture, good heat dissipation effect and the like.
  • the three-cavity structure design of the LED lamp with high efficiency heat dissipation mainly includes three functional parts: LED electrical cavity part; open heat dissipation cavity part; LED illumination cavity part.
  • the three functional parts of the lamp body are connected in sequence.
  • the LED electrical cavity part is composed of an upper cover (1), a PCB, a circuit board and corresponding electronic components (2), and a PCB mounting plate (3);
  • the open heat dissipation cavity portion is an open heat sink (6) a space formed by a plurality of staggered grid-shaped heat conducting ribs in the upper portion, and a LED wire perforation on the lower surface of the open heat sink (6)
  • LED lighting cavity part consists of open heat sink (6), LED light source and lens (7), LED substrate (8), lamp cover board (9), lower cover ( 10) Five parts.
  • the LED light source and the lens (7) are connected to the LED substrate (8), and the LED substrate (8) is closely attached to the LED receiving hole (5) on the lower surface of the open heat sink, and the LED wire passes through the open heat sink.
  • the LED wire perforation (4) and the corresponding hole on the PCB mounting plate (3) are then electrically connected to the PCB circuit board (2); the LED substrate (8) is in thermal contact with the bottom surface of the open heat sink (6), and the LED light source is And the lens (7) heat is transferred into the open heat sink (6), the open heat sink (6) is exposed to the air, and the outside natural wind passes through the open heat sink (6) and a plurality of staggered grid-like heat conduction
  • the gap between the ribs realizes the convection of the hot air in the open heat dissipation chamber and the cold air outside, which will quickly
  • the heat generated by the LED light source (7) is maximally dissipated, thereby achieving an efficient heat dissipation effect.
  • the LED lamp designed by using the three-cavity structure design method realizes spatial isolation between the LED electrical cavity portion and the LED illumination cavity portion, so that the working environments of the two cavity bodies do not affect each other, and the LED electrical cavity
  • the heat generated by the body part and the LED illumination cavity part does not form a superposition, so the cooling effect is realized by the reasonable arrangement of the space structure, further prolonging the service life of the LED lamp and maintaining the constant luminous effect.
  • the PCB mounting plate, the upper cover, the open heat sink, the LED substrate, and the lower cover are made of a heat conductive material, and the heat conductive material is an aluminum alloy or a copper alloy or other heat conductive metal alloy.
  • the PCB circuit board (2) is separately provided; the circuit can be directly printed on the upper surface of the open heat sink (6) by a thick film process; or the PCB circuit board (2) and the thick film process are not used. It is a working voltage that directly supplies the LED light source and the lens (7) by using a battery pack, a battery or other power supply device.
  • the LED substrate and the LED heat dissipation hole on the lower surface of the open heat sink are closely adhered by a thermal conductive adhesive or other heat conductive material; or the open heat sink
  • the LED receiving hole (5) on the lower surface can also be omitted, and the LED light source and lens are
  • the upper cover, the open heat sink, and the lower cover are all exposed to the air.
  • the LED electrical cavity portion and the LED illumination cavity portion of the LED lamp when used for outdoor lighting, must be sealed inside the cavity, and it is required to meet the waterproof requirement of IP65 or higher; When the LED electrical cavity portion of the LED lamp and the LED illumination cavity portion are required to meet the requirements of IP20, Yes.
  • the LED light source and the lens may be provided with other devices for managing light.
  • Figure 1 is a schematic view of the structure of the present invention
  • FIG. 2 is a schematic view showing the structure of a cross section of the LED street lamp of the present invention.
  • Figure 3 is a schematic view showing the principle of the exploded structure of the components in Figure 2;
  • Figure 4 is a schematic view showing the structure of a cross section of an LED tunnel lamp of the present invention.
  • Figure 5 is a schematic cross-sectional view showing the structure of the LED spotlight of the present invention.
  • FIG. 6 is a schematic structural view showing the structure of a LED floodlight of the present invention.
  • FIG. 7 is a schematic view showing the structure of a cross-sectional structure of an LED wall washer according to the present invention.
  • Figure 8 is a schematic view showing the structure of the LED embedded lamp of the present invention.
  • Figure 9 is a schematic view showing the structure of the LED chandelier of the present invention.
  • Figure 10 is a schematic cross-sectional view showing the structure of the LED ceiling lamp of the present invention.
  • Figure 11 is a schematic view showing the structure of the LED cup lamp of the present invention.
  • Fig. 12 is a schematic view showing the structure of a cross section of an LED automobile headlight according to the present invention.
  • 1 is the upper cover
  • 2 is the PCB circuit board
  • 3 is the PCB mounting board
  • 4 is the LED wire perforation
  • 5 is the LED receiving hole
  • 6 is the open heat sink
  • 7 is the LED light source and lens
  • 8 is The LED substrate
  • 9 is a lamp cover plate
  • 10 is a lower cover plate
  • 11 is a wind deflector.
  • Embodiment 1 as shown in Fig. 2 and Fig. 3.
  • the LED street lamp has a long strip shape, and the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source and lens (7) are attached to the LED substrate (8) through the LED substrate (8).
  • Embodiment 2 is as shown in FIG. LED tunnel light, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source and lens (7) is attached to the open heat sink through the LED substrate (8) (6) Inside the lower surface LED receiving hole (5), the LED light source and the lens (7) wire pass through the LED wire through hole (4) to realize the circuit connection with the PCB circuit board and the corresponding electronic component (2), LED light source (7) The vast majority of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a portion of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity portion of the lamp (II) Directly exposed to the outside air, the outside natural wind passes through the gap between the plurality of staggered grid-like heat-conducting ribs on the open heat sink (6) to realize the cold air in the open heat-dissipating cavity
  • Embodiment 3 is as shown in FIG. LED spotlights, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source and lens (7) is attached to the open heat sink through the LED substrate (8) (6) Inside the lower surface LED receiving hole (5), the LED light source and the lens (7) wire pass through the LED wire through hole (4) to realize circuit connection with the PCB circuit board and the corresponding electronic component (2), LED light source (7) The vast majority of the heat generated is directly conducted into the lower surface of the open heat sink (6) until open heat dissipation
  • the upper part of the body (6) has a plurality of staggered grid-shaped heat conducting ribs.
  • the open heat radiating cavity part ( ⁇ ) of the lamp Since the open heat radiating cavity part ( ⁇ ) of the lamp is directly exposed to the outside air, the outside natural wind passes through the upper part of the open heat sink (6).
  • the gap between the plurality of grid-like heat-conducting ribs causes the convection of the hot air in the open heat-dissipating cavity and the cold air outside, and quickly turns the LED light source
  • Embodiment 4 is as shown in FIG. 6.
  • LED flood light the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source (7) is attached to the open heat sink through the LED substrate (8) ( 6)
  • the LED light source (7) wire passes through the LED wire through hole (4) to realize circuit connection with the PCB circuit board and the corresponding electronic component (2), and the LED light source (7) generates Most of the heat is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity portion of the lamp
  • Embodiment 5 is as shown in FIG. LED wall washer, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) along the length direction of the lamp; each LED light source and lens (7) is attached to the open type through the LED substrate (8)
  • the LED light receiving hole (5), the LED light source and the lens (7) lead through the LED wire through hole (4) and the PCB circuit board and the corresponding electronic components (2) to achieve circuit connection, LED light source (7)
  • Most of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity of the lamp
  • the body part (II) is directly exposed to the outside air, and the outside natural wind passes through the gap between the plurality of staggered grid-shaped heat conducting ribs on the open heat sink (6).
  • Embodiment 6 is as shown in FIG. LED embedded lamp, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) in the longitudinal and lateral directions; each LED light source and lens (7) is attached to the open heat sink through the LED substrate (8) (6) In the lower surface LED receiving hole (5), the LED light source and the lens (7) wire pass through the LED wire through hole (4) to connect with the PCB circuit board and the corresponding electronic component (2), LED light source (7) The vast majority of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a portion of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity portion of the lamp ( ⁇ ) Directly exposed to the outside air, the outside natural wind passes through the gap between the plurality of staggered grid-like heat-conducting ribs on the open heat sink (6) to realize the hot air in the open heat-dissipating cavity and the outside.
  • Embodiment 7 as shown in FIG. LED chandelier, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) along the longitudinal direction of the luminaire; each LED light source and lens (7) is attached to the open heat sink through the LED substrate (8) (6)
  • the LED light source and the lens (7) wire pass through the LED wire through hole (4) to realize circuit connection with the PCB circuit board and the corresponding electronic component (2), LED light source (7)
  • the majority of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity portion of the lamp ( ⁇ ) Directly exposed to the outside air, the outside natural wind passes through the gap between the plurality of staggered grid-like heat-conducting ribs on the open heat sink (6) to realize the hot air in the open heat-dissipating cavity and the outside.
  • Air Air
  • Embodiment 8 is as shown in FIG. LED ceiling lamp, the lower surface of the open heat sink (6) is arranged with a plurality of LED light sources and lenses (7) respectively along the longitudinal and lateral directions (the lamp is elongated) or around the center of the circle (the lamp is circular); each LED light source And the lens (7) is attached to the lower surface LED receiving hole (5) of the floating heat sink (6) through the LED substrate (8), and the LED light source and the lens (7) wire pass through the LED wire through hole (4) and the PCB
  • the circuit board and the corresponding electronic component (2) realize the circuit connection, and most of the heat generated by the LED light source (7) is directly transmitted into the lower surface of the open heat sink (6) until the upper part of the open heat sink (6) is staggered.
  • the grid-like heat-conducting ribs of the luminaire because the open heat-dissipating cavity part (II) of the luminaire is directly exposed to the outside air, the outside natural wind passes through the open heat-dissipating body (6), and a plurality of staggered grid-like heat conduction
  • the air between the ribs realizes the convection of the hot air in the open heat dissipation cavity and the cold air outside, and quickly dissipates the heat generated by the LED light source (7) to the maximum extent, thereby achieving an efficient heat dissipation effect.
  • Embodiment 9 as shown in FIG. LED cup lamp, its open heat sink (6) is arranged on the lower surface of a single or a plurality of LED light sources and lenses (7) around the center of the circle; each LED light source and lens (7) is attached to the open type through the LED substrate (8)
  • the LED light receiving hole (5), the LED light source and the lens (7) wire pass through the LED wire through hole (4) to realize circuit connection with the PCB circuit board and the corresponding electronic component (2), the LED light source (7)
  • the majority of the generated heat is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, due to the open heat dissipation cavity of the lamp
  • the body part ( ⁇ ) is directly exposed to the outside air, and the outside natural wind passes through the gap between the plurality of staggered grid-shaped heat conducting ribs on the open heat sink (6) to realize the hot air and the outside of the open heat
  • Embodiment 10 is as shown in FIG. LED car headlights, the open heat sink (6) is arranged on the lower surface of a single or a plurality of LED light sources and lenses (7) around the center; each LED light source and lens (7) is attached to the open through the LED substrate (8) In the lower surface of the LED (6) receiving hole (5), the LED light source and the lens (7) lead through the LED wire perforation (4) and the PCB circuit board and the corresponding electronic components (2) to achieve circuit connection, Most of the heat generated by the LED light source (7) is directly transmitted into the lower surface of the open heat sink (6) until a part of the open heat sink (6) has a plurality of staggered grid-like heat conductive ribs, since the lamp is open The heat dissipating cavity portion ( ⁇ ) is directly exposed to the outside air, and the external natural wind is opened through the gap between the air guiding plate (11) and the open heat radiating body (6), and a plurality of staggered grid-like heat conducting ribs The hot air in the heat dis
  • the LED light source (7) is in contact with the open heat sink (6) via the LED base plate (8), and in other examples the LED light source can be brought into direct contact with the open heat sink (6).
  • the PCB circuit board (2) carrying the circuit is separately provided.
  • the circuit can be directly printed on the upper surface of the open heat sink (6) by a thick film process, so that the PCB circuit board and corresponding The heat generated by the electronic component (2) is conducted in the same manner to a plurality of staggered grid-like heat conducting ribs of the open heat sink (6), and then the air is self-convolating to achieve efficient heat dissipation.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

高效散热的 LED灯具 技术领域
本发明公开了高效散热的 LED灯具三腔体结构设计方法及采用 了高效散热的 LED灯具三腔体结构设计方法的灯具，特别是一种阵列 式大功率 LED灯具。
背景技术
LED具有能耗低， 发热量较低和使用寿命长的优点， 完全可以替 代传统光源。考虑到单片 LED发光亮度不足， LED灯一般采用 LED阵 列式结构， 由此产生了 LED灯具散热难的问题。
在中国专利申请公开号 CN1277665A文献中， 公开了一种 LED灯 散热方案，该方案中其散热是通过灯体内的连接柱吸收连接 LED的基 座的热量， 然后仍在灯体内散热， 由于其是多次间接散热，且在封闭 灯体内散热， 效果不佳。
在中国专利申请公开号 CN1359137A文献中， 公开了一种热管灯 散热方案， 该方案中其散热是通过超导热管一端吸收发光装置的热 量，在另一端传送热量至与空气接触的灯体散热件， 由于其仍是多次 间接散热， 效果仍不佳。
在中国专利授权公告号 CN2557805Y文献中， 公开了一种大功率 LED灯散热方案， 该方案中其散热是通过灯体内空气吸收 LED的热量 传送至与空气接触的灯体接触的灯体散热件，仍然属于间接散热，效 果亦不佳。
在中国专利申请公幵号 CN1594962A文献中， 公开了一种 LED灯 散热方案，该方案中其散热是 LED的热量透过光源板传至导热绝缘胶 片和导热绝缘胶布再传至散热外壳， 亦是间接散热， 效果仍不佳。 在中国专利申请公开号 CN1605794A文献中， 公开了一种 LED射 灯的散热方案， 该方案中其散热是通过灯体内空气或填充料吸收 LED 的热量传送至空气接触的散热外壳， 仍是间接散热， 仍然效果不佳。
在中国专利申请公开号 CN1603679A文献中， 公开了一种 LED灯 散热方案，该方案中其散热是 LED的热量（主要是 LED基底部的热量） 透过线路板和导散热胶层传送至散热板，依然是间接散热，依然效果 不佳。
发明内容
本发明专利的目的是克服上述现有技术的缺点，提供一种具有高 效散热效果的， 能耗低的，使用寿命长的， 光能衰减小的大功率的高 效散热的 LED灯具。
本发明的目的是这样实现的，高效散热的 LED灯具，包括灯体及 灯体上安装的 PCB安装板、 PCB电路板（2)、 LED光源及透镜， 其特 '、 征是灯体上设有按顺序连成一体的 LED电器腔（ I )、 开放式散热腔 ( Π )、 LED照明腔（ΠΙ)， LED电器腔由上盖板（1)、 PCB电路板（2)、 PCB安装板 (3)三部分组成， 开放式散热腔为开放式散热体（6)上 部有多根错落有致的格栅状导热筋条形成的空间，开放式散热体（6) 下表面有 LED导线穿孔（4)及 LED容置孔（5)， LED照明腔由开放 式散热体（6)、 LED光 及透镜 （7)、 LED基板（8)、 灯罩板（9)、 下盖板（10)组成， LED光源及透镜 (7)连接接于 LED基板（8) 上， LED基板（8)紧密附着于开放式散热体（6)下表面的 LED容置 孔（5) 内， LED导线穿过开放式散热体（6)上的 LED导线穿孔（4) 和 PCB安装板（3)上的孔与 PCB电路板（2)连接； LED基板（8) 与开放式散热体（6)底面热接触。
所述的热接触为导热胶接触。 所述的上盖板（1)、 开放式散热体（6)、 下盖板（10)均裸露于 空气中。
所述的于户外照明使用的 LED灯具的 LED电器腔（ I )、 LED照 明腔（ΠΙ)， 其腔体内部必须是密闭的， 达到 IP65以上防水要求， 户 内照明的 LED灯具的 LED电器腔（ I )、 LED照明腔（m)， 其腔体内 部达到 IP20要求。
所述的的 LED光源及透镜 (7) 的芯片是直接封装在开放式散热 体（6) 内， 与开放式散热体（6)底面直接形成热传导。
本发明具有结构合理紧凑， 生产制造容易， 散热效果好等优点。 高效散热的 LED灯具三腔体结构设计主要包括三个功能部分： LED 电器腔体部分； 开放式散热腔体部分； LED照明腔体部分。 灯体的 这三个功能部分按顺序连成一体。 LED电器腔体部分由上盖板（1)、 PCB.电路板及相应电子元器件（2)、 PCB安装板（3)三部分组成； 开 放式散热腔体部分为开放式散热体（6) 上部分多根错落有致的格栅 状导热筋条形成的空间， 开放式散热体（6)下表面有 LED导线穿孔
(4)及 LED容置孔（5); LED照明腔体部分由开放式散热体（6)、 LED光源及透镜 （7)、 LED基板（8)、 灯罩板（9)、 下盖板 (10) 五 部分组成。 LED光源及透镜（7)连接接于 LED基板 (8)上， LED基 板（8)紧密附着于开放式散热体下表面的 LED容置孔（5) 内， LED 导线穿过开放式散热体上的 LED导线穿孔（4)和 PCB安装板（3)上 相应的孔然后与 PCB电路板（2) 实现电路连接； LED基板 (8)与开 放式散热体（6)底面热接触， 将 LED光源及透镜 (7)热量传导入开 放式散热体（6)， 开放式散热体（6)裸露于空气中， 外界自然风通 过开放式散热体（6)上部分多根错落有致的格栅状导热筋条间的空 隙实现开放式散热腔体内的热空气与外界的冷空气对流， 迅速的将 LED光源（7)产生的热量最大限度的散发出去， 从而实现了高效的 散热效果。 另外， 运用该三腔体结构设计方法设计的 LED灯具， 使 LED电器腔体部分与 LED照明腔体部分实现空间上的隔离， 使这两个 腔体各自的工作环境互不影响， LED电器腔体部分与 LED照明腔体部 分工作时所产生热量不会形成叠加，因而通过空间结构的合理配置实 现了降温效果，进一步延长了 LED灯具的使用寿命和保持了发光效果 的恒定。
作为 LED灯具的 PCB安装板、上盖板、开放式散热体、 LED基板、 下盖板是由导热材料制成，导热材料为铝合金或铜合金或其他导热金 属合金。
所述的 PCB电路板（2) 为单独设置的； 也可以采用厚膜工艺将 电路直接印刷在开放式散热体（6)上表面； 或者不采用 PCB电路板 (2)跟厚膜工艺， 而是采用电池组、 蓄电池或其它供电装置直接提 供 LED光源及透镜 (7)工作所濡的工作电压。
以及，所述灯体的上盖板、开放式散热体、下盖板均裸露于空气 中。
此外，所述的 LED基板与开放式散热体下表面 LED容置孔之间通 过导热胶或其它导热材料实现紧密附着；或者，所述的开放式散热体
(6)下表面的 LED容置孔（5)也可以不要， 而将 LED光源及透镜
(7)直接附着于开放式散热体（6)底面。
并且， 所述的上盖板、 开放式散热体、 下盖板均裸露于空气中。 再且，在使用于户外照明时，所述的 LED灯具的 LED电器腔体部 分、 LED照明腔体部分， 其腔体内部必须是密闭的， 要求达到 IP65 以上防水要求；在使用于户内照明时，所述的 LED灯具的 LED电器腔 体部分、 LED照明腔体部分， 其腔体内部要求达到 IP20左右要求即 可。
另外，所述的 LED光源及透镜也可以采用在其上再附加其他对光 有管理作用的装置。
附图说明
图 1是本发明的结构原理示意图；
图 2是本发明的 LED路灯灯头剖视结构原理示意图；
图 3是图 2中的零部件的分解结构原理示意图；
. 图 4是本发明的 LED隧道灯剖视结构原理示意图；
图 5是本发明的 LED射灯剖视结构原理示意图；
图 6是本发明的 LED投光灯剖视结构原理示意图；
图 7是本发明的 LED洗墙灯剖视结构原理示意图；
图 8是本发明的 LED嵌入灯剖视结构原理示意图；
图 9是本发明的 LED吊灯剖视结构原理示意图；
图 10是本发明的 LED吸顶灯剖视结构原理示意图；
图 11是本发明的 LED杯灯剖视结构原理示意图。
图 12是本发明的 LED汽车大灯剖视结构原理示意图。
图中： 1是上盖板， 2是 PCB电路板， 3是 PCB安装板， 4是 LED 导线穿孔， 5是 LED容置孔， 6是开放式散热体， 7是 LED光源及透 镜， 8是 LED基板， 9是灯罩板， 10是下盖板， 11是风导流板。
具体实施方式
实施例 1， 如图 2、 图 3所示。 LED路灯灯头呈长条状， 其开放 式散热体（6)下表面沿纵横方向分别布置多颗 LED光源及透镜（7); 每颗 LED光源及透镜（7)通过 LED基板（8)附着于开放式散热体（6) 下表面 LED容置孔（5) 内， LED光源及透镜 (7)导线穿过 LED导线 穿孔（4)与 PCB电路板及相应电子元器件 （2)实现电路连接， LED 光源（7)产生的绝大部分热量直接传导入开放式散热体（6)下表面 直至开放式散热体（6)上部分多根错落有致的格栅状导热筋条， 由 于本灯具开放式散热腔体部分（Π )直接裸露于外界空气中， 外界自 然风通过开放式散热体（6)上部分多根错落有致的格栅状导热筋条 间的空隙实现开放式散热腔体内的热空气与外界的冷空气对流，迅速 的将 LED光源 (7)产生的热量最大限度的散发出去， 从而实现了高 效的散热效果。
实施例 2， 如图 4所示。 LED隧道灯， 其开放式散热体（6)下表 面沿纵横方向分别布置多颗 LED光源及透镜 (7)；每颗 LED光源及透 镜（7)通过 LED基板（8) 附着于开放式散热体（6)下表面 LED容 置孔（5) 内， LED光源及透镜 (7) 导线穿过 LED导线穿孔（4) 与 PCB电路板及相应电子元器件 (2)实现电路连接， LED光源 (7)产 生的绝大部分热量直接传导入开放式散热体（6)下表面直至开放式 散热体（6)上部分多根错落有致的格栅状导热筋条， 由于本灯具开 放式散热腔体部分（II )直接裸露于外界空气中， 外界自然风通过开 放式散热体（6) 上部分多根错落有致的格栅状导热筋条间的空隙实 现开放式散热腔体内的热空气与外界的冷空气对流，迅速的将 LED光 源（7)产生的热量最大限度的散发出去， 从而实现了高效的散热效 果。
实施例 3, 如图 5所示。 LED射灯， 其开放式散热体（6)下表面 沿纵横方向分别布置多颗 LED光源及透镜 (7)；每颗 LED光源及透镜 (7)通过 LED基板（8) 附着于开放式散热体（6)下表面 LED容置 孔（5) 内， LED光源及透镜（7)导线穿过 LED导线穿孔（4)与 PCB 电路板及相应电子元器件（2)实现电路连接， LED光源（7)产生的 绝大部分热量直接传导入开放式散热体（6)下表面直至开放式散热 体（6)上部分多根错落有致的格栅状导热筋条， 由于本灯具开放式 散热腔体部分（Π )直接裸露于外界空气中， 外界自然风通过开放式 散热体（6)上部分多根错落有致的格栅状导热筋条间的空隙实现开 放式散热腔体内的热空气与外界的冷空气对流， 迅速的将 LED光源
(7)产生的热量最大限度的散发出去，从而实现了高效的散热效果。
实施例 4， 如图 6所示。 LED投光灯， 其开放式散热体（6)下表 面沿纵横方向分别布置多颗 LED光源及透镜 (7)； 每颗 LED光源 (7) 通过 LED基板 (8)附着于开放式散热体（6)下表面 LED容置孔（5) 内， LED光源 (7)导线穿过 LED导线穿孔（4)与 PCB电路板及相应 电子元器件 (2)实现电路连接， LED光源 (7)产生的绝大部分热量 直接传导入开放式散热体（6)下表面直至开放式散热体（6)上部分 多根错落有致的格栅状导热筋条， 由于本灯具开放式散热腔体部分
( II )直接裸露于外界空气中， 外界自然风通过开放式散热体（6) 上部分多根错落有致的格栅状导热筋条间的空隙实现开放式散热腔 体内的热空气与外界的冷空气对流， 迅速的将 LED光源（7)产生的 热量最大限度的散发出去， 从而实现了高效的散热效果。
实施例 5， 如图 7所示。 LED洗墙灯， 其开放式散热体（6)下表 面沿灯具长度方向分别布置多颗 LED光源及透镜 (7)；每颗 LED光源 及透镜（7)通过 LED基板（8)附着于开放式散热体（6)下表面 LED 容置孔（5) 内， LED光源及透镜 （7)导线穿过 LED导线穿孔（4) 与 PCB电路板及相应电子元器件（2) 实现电路连接， LED光源 (7) 产生的绝大部分热量直接传导入开放式散热体（6)下表面直至开放 式散热体（6)上部分多根错落有致的格栅状导热筋条， 由于本灯具 开放式散热腔体部分（ II )直接裸露于外界空气中， 外界自然风通过 开放式散热体（6)上部分多根错落有致的格栅状导热筋条间的空隙 实现开放式散热腔体内的热空气与外界的冷空气对流， 迅速的将 LED 光源（7)产生的热量最大限度的散发出去， 从而实现了高效的散热 效果。
实施例 6， 如图 8所示。 LED嵌入灯， 其开放式散热体（6)下表 面沿纵横方向分别布置多颗 LED光源及透镜（7);每颗 LED光源及透 镜（7)通过 LED基板（8) 附着于开放式散热体（6) 下表面 LED容 置孔（5) 内， LED光源及透镜（7) 导线穿过 LED导线穿孔（4) 与 PCB电路板及相应电子元器件（2) 实现电路连接， LED光源 (7)产 生的绝大部分热量直接传导入开放式散热体（6)下表面直至开放式 散热体（6)上部分多根错落有致的格栅状导热筋条， 由于本灯具开 放式散热腔体部分（Π )直接裸露于外界空气中， 外界自然风通过开 放式散热体（6)上部分多根错落有致的格栅状导热筋条间的空隙实 现开放式散热腔体内的热空气与外界的冷空气对流，迅速的将 LED光 源 <7)产生的热量最大限度的散发出去， 从而实现了高效的散热效 果。
实施例 7， 如图 9所示。 LED吊灯， 其开放式散热体（6)下表面 沿灯具长度方向分别布置多颗 LED光源及透镜 (7)；每颗 LED光源及 透镜（7)通过 LED基板（8) 附着于开放式散热体（6)下表面 LED 容置孔（5) 内， LED光源及透镜（7)导线穿过 LED导线穿孔（4) 与 PCB电路板及相应电子元器件 (2)实现电路连接， LED光源 (7) 产生的绝大部分热量直接传导入开放式散热体 （6) 下表面直至开放 式散热体（6) 上部分多根错落有致的格栅状导热筋条， 由于本灯具 开放式散热腔体部分（Π )直接裸露于外界空气中， 外界自然风通过 开放式散热体（6)上部分多根错落有致的格栅状导热筋条间的空隙 实现开放式散热腔体内的热空气与外界的冷空气对流， 迅速的将 LED 光源（7)产生的热量最大限度的散发出去， 从而实现了高效的散热 效果。
实施例 8， 如图 10所示。 LED吸顶灯， 其开放式散热体（6)下 表面沿沿纵横方向（灯具为长条形）或围绕圆心（灯具为圆形）分别 布置多颗 LED光源及透镜 （7); 每颗 LED光源及透镜 (7)通过 LED 基板（8)附着于幵放式散热体（6)下表面 LED容置孔（5) 内， LED 光源及透镜 (7)导线穿过 LED导线穿孔（4)与 PCB电路板及相应电 子元器件 (2)实现电路连接， LED光源 (7)产生的绝大部分热量直 接传导入开放式散热体（6)下表面直至开放式散热体（6)上部分多 根错落有致的格栅状导热筋条，由于本灯具开放式散热腔体部分（ II ) 直接裸露于外界空气中， 外界自然风通过开放式散热体（6)上部分 多根错落有致的格栅状导热筋条间的空滕实现开放式散热腔体内的 热空气与外界的冷空气对流， 迅速的将 LED光源 (7)产生的热量最 大限度的散发出去， 从而实现了高效的散热效果。
实施例 9， 如图 11所示。 LED杯灯， 其开放式散热体（6)下表 面布置单颗或围绕圆心布置多颗 LED光源及透镜 (7)；每颗 LED光源 及透镜（7)通过 LED基板（8)附着于开放式散热体（6)下表面 LED 容置孔（5) 内， LED光源及透镜（7)导线穿过 LED导线穿孔（4) 与 PCB电路板及相应电子元器件 (2)实现电路连接， LED光源 (7) 产生的绝大部分热量直接传导入开放式散热体 (6) 下表面直至开放 式散热体（6) 上部分多根错落有致的格栅状导热筋条， 由于本灯具 开放式散热腔体部分（Π )直接裸露于外界空气中， 外界自然风通过 开放式散热体（6)上部分多根错落有致的格栅状导热筋条间的空隙 实现开放式散热腔体内的热空气与外界的冷空气对流， 迅速的将 LED 光源（7)产生的热量最大限度的散发出去， 从而实现了高效的散热 效果。
实施例 10， 如图 12所示。 LED汽车大灯， 其开放式散热体（6) 下表面布置单颗或围绕圆心布置多颗 LED光源及透镜 (7);每颗 LED 光源及透镜 (7)通过 LED基板（8)附着于开放式散热体（6)下表 面 LED.容置孔（5) 内， LED光源及透镜 (7)导线穿过 LED导线穿 孔 （4)与 PCB电路板及相应电子元器件（2) 实现电路连接， LED 光源 (7)产生的绝大部分热量直接传导入开放式散热体（6)下表面 直至开放式散热体（6)上部分多根错落有致的格栅状导热筋条， 由 于本灯具开放式散热腔体部分（Π )直接裸露于外界空气中， 外界自 然风通过导风流板（11 )及开放式散热体（6)上部分多根错落有致 的格栅状导热筋条间的空隙实现开放式散热腔体内的热空气与外界 的冷空气对流， 迅速的将 LED光源（7)产生的热量最大限度的散发 出去， 从而实现了高效的散热效果
上述实施例是本发明的典型实施方式， 在其他不同的实施例中， 可以对技术方案作不同的调整。 在上述实例中， LED光源（7) 是通 过 LED基盘 (8)实现与开放式散热体（6)的接触， 在其他实例中可 以使 LED光源直接与开放式散热体（6)实现接触。
在上述实施例中，单独设置了承载电路的 PCB电路板（2),在其 他实施例中可以用厚膜工艺将电路直接印刷在开放式散热体 （6) 上 表面， 使 PCB电路板及相应电子元器件（2)产生的热量以同样方式 传导至开放式散热体（6) 的多根错落有致的格栅状导热筋条上， 然 后通过空气自对流方式实现高效散热效果。

Claims

极利 要求书
1、 一种高效散热的 LED灯具， 包括灯体及灯体上安装的 PCB安 装板、 PCB电路板（2)、 LED光源及透镜， 其特征是灯体上设有按顺 序连成一体的 LED电器腔（ I )、开放式散热腔（ II ).LED照明腔（ΠΙ)， LED电器腔由上盖板（1)、 PCB电路板（2)、 PCB安装板（3)三部分 组成， 开放式散热腔为开放式散热体（6)上部有多根错落有致的格 栅状导热筋条形成的空间， 开放式散热体（6)下表面有 LED导线穿 孔（4)及 LED容置孔（5)， LED照明腔由开放式散热体（6)、 LED光 源及透镜（7)、 LED基板（8)、灯罩板（9)、下盖板（10)组成， LED 光源及透镜 (7)连接接于 LED基板（8)上， LED基板（8) 紧密附 着于开放式散热体（6)下表面的 LED容置孔（5) 内， LED导线穿过 开放式散热体（6)上的 LED导线穿孔（4)和 PCB安装板（3)上的 孔与 PCB电路板（2)连接； LED基板（8)与开放式散热体 ）底 面热接触。
2、 根据权利要求 1所述的高效散热的 LED灯具， 其特征是所述 的热接触为导热胶接触。
3、 根据权利要求 2所述的高效散热的 LED灯具， 其特征是所述 的上盖板（1)、 开放式散热体（6)、 下盖板（10)均裸露于空气中。
4、 根据权利要求 3所述的高效散热的 LED灯具， 其特征是所述 的于户外照明使用的 LED灯具的 LED电器腔（ I )、 LED照明腔（ΠΙ)， 其腔体内部必须是密闭的，达到 ΙΡ65以上防水要求，户内照明的 LED 灯具的 LED电器腔 ( I )、 LED照明腔（m)， 其腔体内部达到 IP20 要求。
5、 根据权利要求 1或 2或 3或 4所述的高效散热的 LED灯具， 其特征晕所述的的 LED光源及透镜 (7) 的芯片是直接封装在开放式 散热体（6) 内， 与开放式散热体（6)底面直接形成热传导。
6、 根据权利要求 5所述的高效散热的 LED灯具， 其特征是所述 的 PCB电路板 (2)为单独设置的； 也可以采用厚膜工艺将电路直接 印刷在开放式散热体（6)上表面；.或者不采用 PCB电路板 （2)跟 厚膜工艺， 而是采用电池组、 蓄电池或其它供电装置直接提供 LED 光源及透镜（7)工作所需的工作电压。
7、 根据权利要求 6所述的高效散热的 LED灯具， 其特征是所述 的 LED光源及透镜 (7)所附着的开放式散热体（6)底面是平面、 曲面或其它形状的曲面。
8、 根据权利要求 7所述的高效散热的 LED灯具， 其特征是所述 的开放式散热体（6) 下表面的 LED容置孔（5)也可以不要， 而将 LfiD光源及透镜（7)直接附着于开放式散热体（6)底面。
PCT/CN2007/001722 2007-05-16 2007-05-28 An led lighting fixture with high-efficiency radiation effect WO2008138177A1 (en)

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